JPH0648370Y2 - 半導体圧力センサ - Google Patents
半導体圧力センサInfo
- Publication number
- JPH0648370Y2 JPH0648370Y2 JP1988052217U JP5221788U JPH0648370Y2 JP H0648370 Y2 JPH0648370 Y2 JP H0648370Y2 JP 1988052217 U JP1988052217 U JP 1988052217U JP 5221788 U JP5221788 U JP 5221788U JP H0648370 Y2 JPH0648370 Y2 JP H0648370Y2
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- case
- semiconductor pressure
- wiring board
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052217U JPH0648370Y2 (ja) | 1988-04-20 | 1988-04-20 | 半導体圧力センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988052217U JPH0648370Y2 (ja) | 1988-04-20 | 1988-04-20 | 半導体圧力センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01156438U JPH01156438U (enExample) | 1989-10-27 |
| JPH0648370Y2 true JPH0648370Y2 (ja) | 1994-12-12 |
Family
ID=31278224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988052217U Expired - Lifetime JPH0648370Y2 (ja) | 1988-04-20 | 1988-04-20 | 半導体圧力センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648370Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4998689B2 (ja) * | 2006-09-30 | 2012-08-15 | 日本ケミコン株式会社 | 光学機器モジュール |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6196346U (enExample) * | 1984-11-30 | 1986-06-20 | ||
| JPS62106141U (enExample) * | 1985-12-24 | 1987-07-07 | ||
| JPS6381238A (ja) * | 1986-09-24 | 1988-04-12 | Aisin Seiki Co Ltd | 圧力検出器 |
-
1988
- 1988-04-20 JP JP1988052217U patent/JPH0648370Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01156438U (enExample) | 1989-10-27 |
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