JPH064217B2 - Wafer compound beveling device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a beveling device used for finishing a peripheral edge of a wafer such as a silicon wafer used for semiconductors. 2. Description of the Related Art Conventionally, a beveling device rotates a wafer in a radial direction while fixing each wafer by a chuck, and grinds a peripheral edge of the wafer by a rotating bevel grindstone attached to a rotating shaft parallel to the rotating shaft of the wafer. It is structured. Problems to be Solved by the Invention For this reason, processing efficiency is low, and improvement in processing efficiency has been demanded. Means for Solving the Problems The present invention has a plurality of circumferentially provided dividing grooves for holding a plurality of wafers in a substantially vertical direction so that the axes are horizontal and parallel to each other. At least a pair of rotatably provided substantially cylindrical guide members provided, and a rotatably provided whetstone roller having a plurality of bevel-type whetstone grooves provided below the guide member in the circumferential direction. A feed roller rotatably provided with a plurality of circumferentially-provided dividing grooves for contacting and imparting rotation to the wafer, the dividing groove of the guide member and the bevel-type grindstone groove and feeding The division grooves of the rollers are provided so as to share the same plane in order to hold the wafer to be processed in a substantially vertical direction. It was configured to perform processing and gist wafer double beveling apparatus according to claim. Operation According to the present invention, the sliced wafer is supplied, for example, from above to below between the corresponding plurality of dividing grooves formed in the plurality of guide members. Each wafer comes into contact with a bevel-type grindstone formed on the grindstone roller, and the periphery of the wafer is processed as the grindstone roller rotates. Since multiple wafers are held in the non-fixed state by the dividing groove of the guide member, the pressure is always constant during the contact grinding by the bevel type grindstone part of the grindstone roller, because the processing is performed by only the self-weight. To prevent excessive grinding. Since there are guide members on the left and right of the wafer that correspond to the dividing grooves,
The wafer is held in the groove of each roller. In this way, the wafer is processed at the peripheral edge of the wafer while being held between the guide member having the left and right dividing grooves of the wafer and the lower bevel grindstone portion and the descending roller portion, thereby simultaneously processing a plurality of wafers such as 12 wafers and 24 wafers. it can. In FIG. 1 of the embodiment, a wafer 1 is fed between the guide members A and B from above and hits a bevel grindstone roller 2 and a feed roller 3 below and is held substantially vertically. The wafer 1 is in contact with a guide member AB having a large number of dividing grooves 4 at any time, and is rotated by a feed roller 3. The guide member A rotates clockwise, and the guide member B rotates counterclockwise. As shown in FIG. 2, the grindstone portion is made up of a large number of bevel type grindstones for processing the edge of the wafer to form the grindstone roller 2, and the feed roller 3 is made of, for example, a special rubber that is hard to slip, and the wafer is applied with a frictional force. Here, 1 is rotated clockwise.
The wafer 1 is held by the guide members A and B, contacts the bevel grindstone portion 2 ′, and is smoothly ground. The dividing groove 4 corresponding to the guide members A and B further shares the common plane X with the corresponding bevel grindstone 2 ', so that the wafer 1
No error occurs in the arrangement when a large number of wafers are arranged, and the wafer 1 is ground by accurately contacting the grindstone roller 2. Since the wafer 1 is held by the feed rollers 3 on the guide members A and B by the weight of the wafer, even if there are irregularities such as OF on the periphery, force can be forcibly applied according to the shape of the wafer 1. can avoid. As a result, the cracks seen in the past,
Chips are less likely to occur on the periphery. FIG. 3 shows an example in which the beveling mechanism is assembled in a housing. The motor 5 rotates the guide member A clockwise and the guide member B counterclockwise. The motor 6 rotates the bevel type grindstone roller 2 in the clockwise direction. Motor 7
Rotates the feed roller 3 counterclockwise. The combination of the rotation directions can be variously changed. Effect of the Invention In the semiconductor wafer processing step, because the wafer was fixed for the beveling finishing, chips, cracks, chips, and other damaged products were generated, but the present invention automatically and simultaneously Beveling is possible, while the grinding residual drops automatically grind without damaging the surface of the wafer, and the processing yield is greatly improved. The efficiency is shown below. Carrier capacity (quantity) 25 sheets Guide member B 50 to 70 rpm Guide member A 50 to 70 rpm Bevel type grindstone roller 2500 to 3500 rpm One grinding VS Time required for the present invention 40% Bevel processing yield 99,6%

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a wafer and a guide member installed at a processing position,
FIG. 2 is a cross-sectional explanatory view showing the correlation with the grindstone roller, and FIG.
FIG. 3 is a partially cutaway plan view, and FIG. 3 is a partial sectional front view showing an example in which the bevel processing mechanism is assembled to a housing. 1. Wafer A. Guide member that rotates counterclockwise B. Guide member that rotates clockwise 1. Bevel type whetstone roller 3. Feed roller 4. Division groove

Claims (1)

What is claimed is: 1. At least a pair of shafts, which have a plurality of circumferentially arranged dividing grooves for holding a plurality of wafers in a substantially vertical direction and whose axes are horizontal and parallel to each other. A substantially cylindrical guide member rotatably provided, and a grindstone roller rotatably provided below the guide member and having a plurality of beveled grindstone grooves provided in the circumferential direction, in contact with the wafer. A feed roller rotatably provided with a plurality of circumferentially provided dividing grooves for imparting rotation, wherein the guide member dividing groove and the bevel type grindstone groove and the feeding roller dividing groove are processed. In order to hold the wafer to be
A compound wafer beveling device, which is provided so as to share the same plane and is configured to perform grinding processing by the weight of the wafer without contacting the surface of the wafer to be processed.