JPS62136358A - Duplex bevelling device for wafer - Google Patents

Abstract

PURPOSE:To enable the automatic bevelling of many wafers with the improvement of a machining yield by providing a pair of guide members for retaining many wafers vertically and forming many divisional grooves on feed and grinding rollers. CONSTITUTION:A semi-conductor wafer 11 is fed from upper side to a space between a pair of guide members A and B having a deep groove 4 and comes in contact with a lower grinding roller 2 having many bevel type grinders thereon and a feed roller 3 having many divisional grooves and is retained approximately vertically. And a large number of wafers 1 is postured with the deep grooves of both guide members A and B rotating in a direction opposite to each other, turns with the rotation of the feed roller 3 and comes in contact with the bevel type grinding roller 2 due to the own weight, for the concurrent machining of the periphery. According to the aforesaid constitution, a large number of wafers can be automatically bevelled and a fracture including a cut, a crack and a chip is restrained, thereby improving a machining yield.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a beveling device used for finishing the peripheral edge of a wafer such as a silicon wafer used in semiconductor manufacturing.

BACKGROUND OF THE INVENTION Conventionally, beveling equipment has been used to fix wafers one by one with a chuck and then rotate the wafers in the radial direction, using a bevel grindstone that rotates and is attached to a rotating shaft parallel to the wafer's rotating axis. The structure is such that the periphery of the blade is ground.

It was wanted.

Means for Solving the Problems A plurality of guide members having a plurality of dividing grooves, a plurality of wafers held approximately perpendicularly between the corresponding dividing grooves of the guide members, and a plurality of wafers located below the wafers. and a grindstone roller having a plurality of grinding type grindstone parts arranged in a row having a common plane with the guide member segmentation groove, and the wafer placed between the guide member segmentation groove and the bevel type grindstone part. This is a wafer dual beveling device that has a feed roller having a large number of segmented grooves that impart rotation to the feed roller.

According to the present invention, sliced wafers are fed in rows from above to below between a plurality of partition grooves respectively formed in a plurality of guide members. Each wafer comes into contact with a bevel-shaped grindstone formed on a grindstone roller, and as the grindstone roller rotates, the periphery of the wafer is subjected to force measurement. Since the plurality of wafers are each held in an unfixed state by the segmented grooves of the guide member, during contact grinding by the beveled grinding wheel part of the grinding wheel roller, the pressure is always constant due to the force III due to the pressurization of only its own weight. Prevents constant and forced grinding. Since there are guide members with corresponding dividing grooves on the left and right sides of the wafer, the wafer is held in the grooves of each roller. In this way, the wafer is held between the guide member having left and right dividing grooves, the lower beveled grindstone part and the feed roller part, and the wafers are rotated. , can be processed at the same time.

Embodiment In FIG. 1, a wafer 1 is fed from above between guide members A5B, and is held substantially vertically against a bevel grindstone roller 2 and a feed roller 3 located below.

The wafer 1 has a guide member ABC having a large number of dividing grooves 4.
The group 1fftll is rotated by the feed roller 3. Guide member A rotates clockwise, and guide member B rotates counterclockwise. As shown in Fig. 2, the grindstone section has a number of bevel-type grindstones arranged in series to measure the force at the edge of the wafer to form a grindstone roller 2, and the feed roller 3 is made of, for example, special rubber that does not easily slip, and uses frictional force to create a grindstone roller 2. Here, the wafer 1 is rotated clockwise. The wafer 1 is held by guide members A and B and comes into contact with the grinding wheel 2', and is smoothly ground. Since the dividing grooves 4 corresponding to the guide members A and B share the force passing plane X with the corresponding bevel grinding wheel 2, a mistake in the west Gl cannot occur when arranging a large number of wafers 1, and the grinding wheel The wafer 1 is ground by contacting the roller 2 at a distance B. Since the wafer 1 is held by the guide members A and H by the feed roller 3 by its own weight, even if there are irregularities such as OF on the periphery, the wafer 1
It is possible to avoid receiving excessive force according to the shape of the

As a result, cracks, chips, etc. that were conventionally seen occur on the periphery and become uneven.

FIG. 3 shows a part 1 of the bevel tension mechanism assembled into a housing. The motor 5 moves the guide member A clockwise.
Rotate guide member B counterclockwise. The motor 6 is
Rotate the bevel type grindstone roller 2 clockwise. The motor 7 rotates the feed roller 3 counterclockwise. The combination of rotation directions can be changed in various ways.

Effects of the Invention In the processing process of semiconductor wafers, the wafer was fixed during beveling finishing, which resulted in damaged products such as chips and breakable chips.However, this invention automatically attaches many chips at the same time. Hehering is possible, and on the other hand, the grinding residue droplets automatically fall, thereby greatly improving the grinding L processing yield without damaging the wafer surface. The efficiency is shown below.

Capacity of carrier (renewal) 25 pieces Guide shoulder material O B 50-70 rpm Guide St O A 50-70 rpm Bevel type grindstone roller 2500-3500 rpm One-time grinding VS Required time of the present invention 40% bevel grinding yield 9
9.6%

[Brief explanation of drawings]

Figure 1: The wafer and guide member installed in the position of number 1,
Fig. 2 is a cross-sectional explanatory diagram showing the correlation with the grindstone roller.
This is an explanatory plan view with a portion cut away, and FIG. 3 is a partially sectional front view showing the shuttle after the bevel force mechanism is assembled to the housing. 1. Guide that rotates counterclockwise for wafer A0 @ guide member that rotates clockwise for wafer B0 2, bevel type grindstone roller 3, feed roller 4, dividing groove

Claims (1)

[Claims] a plurality of guide members each having a plurality of dividing grooves; a plurality of wafers each held approximately perpendicularly between the corresponding dividing grooves of the guide member; a grindstone roller having a plurality of bevel-shaped grindstone parts arranged in a row having a common plane between them; and a plurality of grindstone rollers arranged in a row between the dividing grooves of the guide member and the bevel-shaped grindstone parts, which contact the wafer and rotate it. A wafer double beveling device having a feed roller with a segmented groove of