JPH0641169U - Mounting structure for surface mount components - Google Patents

Abstract

(57) [Abstract] [Purpose] By interposing a connecting member, the thermal reliability of the solder connection part can be improved, and jumper wire connection can be made as it is when the circuit is changed, thereby reducing the mounting area. A chip component mounting structure on a circuit board is realized. [Structure] A thin metal plate having good electrical conductivity is bent to form an S-shaped connecting member 10. The upper electrode connecting portion 10a of the connecting member 10 is soldered and fixed to both electrodes 2 and 2 of the chip component 1, and the lower pad connecting portion 10b is connected to the circuit board 1.
Soldered and fixed to the second pad 13. Accordingly, when the circuit is changed, the circuit pattern connected to the pad 13 of the circuit board 12 is cut, and the bent portion 1 of the connecting member 10 is cut.
The other end of the jumper wire whose one end is soldered to the jumper wire connection hole 11 of 0c can be connected and fixed to a predetermined circuit pattern.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a mounting structure of surface-mounted components on a circuit board that constitutes an electronic circuit. Particularly, in the case of chip components, the reliability of the solder connection portion due to heat during reflow and the jumper accompanying the circuit change are improved. The present invention relates to a mounting structure of surface mounting components on a circuit board that enables wire connection.

[0002]

[Prior art]

 Conventionally, as for the mounting structure of this type of chip component, the configuration example shown in FIG. 3 has been known, and FIG. 3A is a side sectional view and FIG. 1B is a plan view. In the figure, reference numeral 1 designates a surface mounting electric component, and in this case, a chip component such as a resistor, a capacitor or a diode is shown. Reference numeral 2 is an electrode provided on both sides of the chip component 1 along the surface thereof, 3 is a circuit board, 4 is a pad provided on the circuit board 3 facing the electrode 2, and 5 is each pad 4 The pattern 6 is a through hole provided at the ends of the patterns 5 and 5. The pad 4 is connected to the circuit of the circuit board 3 through the pattern 5 and the through hole 6, and the chip component 1 is mounted on the pad 4 and soldered (7a) to the circuit board 3. It is implemented. Although the above structure is a normal circuit configuration, when the circuit is changed, as shown in FIG. 4, a discrete component 8 having leads 9 is mounted instead of the chip component 1 of FIG. Here, the discrete component 8 has the same function as the chip component 1. The lead terminal 9 is inserted into the through hole 6 of the circuit board 3 and the through hole 6 and the lead terminal 9 are soldered (7b). ) And is connected to a predetermined circuit pattern or the like on the circuit board 3 via a jumper wire (not shown).

[0003]

[Problems to be solved by the device]

 However, in the conventional mounting structure of the chip component on the circuit board as described above, the chip component 1 is directly soldered (7a) to the pads 4 and 4 by the electrodes 2 and 2 thereof. The difference in the coefficient of thermal expansion of the circuit board 3 may adversely affect the reliability of the connection after soldering.

Further, in order to change the circuit, in addition to the chip component 1, it is necessary to prepare a discrete component 8 having a different structure. Further, the circuit board 3 has a pad 4 for mounting the chip component 1 and a discrete component. Since the through hole 6 for mounting 8 must be provided, there is a problem that the mounting area per component increases and the overall cost rises.

The present invention has been made in order to solve the problems of these conventional techniques. Therefore, by enabling jumper wire connection by using the same chip component when changing the circuit, Through-holes on the circuit board can be omitted to reduce the mounting area per component, reducing the overall cost, and the mounting structure for surface-mounted components that maintains the reliability of the connection due to heat during soldering. The purpose is to realize.

[0006]

[Means for Solving the Problems]

 The structure of the present invention for achieving the above object will be described with reference to FIGS. 1 and 2 corresponding to an embodiment. The present invention shows that a conductive metal plate is bent in a mounting structure of a chip component on a circuit board. And a bent portion 10c between the electrode connecting portion 10a and the pad connecting portion 10b. A jumper wire connecting hole 11 is provided in the bent portion 10c. The connection member 10 is sandwiched between the electrode 2 of the chip component 1 and the pad 13 of the circuit board 12 and fixed by soldering.

[0007]

[Action]

 According to the present invention having the above-described structure, the connection member 10 formed by bending a conductive metal plate is soldered (7) to the lower portions of the electrodes 2 and 2 of the chip member 1 in advance by the electrode connection portion 10a, and then the pad connection portion is used. If 10b is connected to the pads 13 of the circuit board 12 facing each other by soldering, the thermal expansion and contraction caused by the difference in the expansion coefficient between the chip component 1 and the circuit board 3 at the time of soldering in the conventional structure is related to the present invention. It is absorbed by the working member 10. As a result, a highly reliable solder connection can be obtained. When the circuit is changed, the circuit pattern in contact with the pad 13 of the circuit board 12 is cut, and the jumper wire connection hole 11 provided in the bent portion 10c of the connection member 10 is provided with one end. Can be connected to a predetermined pattern position on the circuit board 12 via a jumper wire (not shown).

Therefore, according to the present invention, by interposing the connecting member between the chip component and the circuit board, the thermal reliability of the soldered portions of the both is improved. Further, even when the circuit is changed, it is not necessary to prepare discrete components as in the conventional case, and since it is not necessary to provide the through holes for mounting the discrete components on the circuit board, the mounting area per component is reduced. It can be downsized and the overall cost can be reduced. As a result, the above problem is eliminated.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing an embodiment of a mounting structure of a chip component as a surface mount component on a circuit board according to the present invention, and FIG. 2 is a perspective view of a connecting member used in this embodiment. 1 and 2, the same parts as those in FIG. 3 are designated by the same reference numerals. Reference numeral 10 is a connecting member, which is formed by bending a thin metal plate having good electrical conductivity into an S shape, 10a is a chip electrode connecting portion for mounting the electrode 2 of the chip component 1, and 10b is a pad 13 of the circuit board 12. The pad connecting portion 10c for connecting the above is a stepped bent portion. Reference numeral 11 denotes a jumper wire connection hole, which may be provided on either of the vertical portions of the bent portion 10c, or on both of them. Further, reference numeral 12 is a circuit board which does not have a through hole as in the prior art, and is provided with a pad 13 facing the electrode 2 of the chip component 1 and a circuit pattern (not shown). In the above configuration, when the chip component 1 is mounted on the circuit board 12, the connecting member 10 is prepared for each of the electrodes 2 and 2 of the chip component 1, and the connecting member 10 is connected in the state shown in FIG. The chip electrode connecting portion 10a is connected and fixed to the electrodes 2 and 2 of the chip component 1 by the solder 7, and each pad connecting portion 10b is placed on the pad 13 of the circuit board 12 and soldered with the solder 7. In addition to the illustrated state, the connecting member 10 may be interposed in an inverted state or a left-right interchanged state. As a result, the chip component 1 is mounted on the circuit board 12 via the connecting member 10. However, if the circuit needs to be changed thereafter, the circuit pattern connected to the pad 13 is cut. Then, it may be connected to a predetermined circuit pattern or the like on the circuit board 12 through a jumper wire (not shown) connected to the jumper wire connection hole 11 of each connection component 10.

In the above-described embodiment, the connection member 10 is previously connected and fixed to the electrode 2 of the chip component 1 with an adhesive such as solder, and then the connection is fixed on the pad 13 of the circuit board 12 with the solder 7. However, the present invention is not limited to this, and after the connecting member 10 is connected and fixed on the pad 13 of the circuit board 12 depending on the size of the assembling space, the chips are mounted on the two fixed connecting members 10. The component 1 may be placed and connected and fixed by the solder 7 or a conductive adhesive.

[0011]

[Effect of device]

 As described in detail above, according to this invention, the following effects can be obtained. Since the chip component is mounted on the pad of the circuit board through the connecting member formed by bending the thin metal plate of good electrical conductivity and flexibility into an S-shape, solder the chip component to the circuit board. The S-shaped connecting member absorbs the stress of the connecting portion caused by the difference in expansion coefficient between the two due to heat at the time. As a result, it is possible to improve the connection reliability of the connection portion by soldering or the like. Also, even if the circuit is changed and jumper wiring is required, it is not necessary to replace it with the conventional discrete parts, and only the jumper wire is soldered to the jumper wire connection hole of the S-shaped connecting member. In addition, since it is not necessary to provide through holes for mounting discrete components on the circuit board, the mounting area per component can be reduced, leading to a reduction in overall cost.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view of a connecting member used in the present invention.

FIG. 3 is a side sectional view and a plan view showing a conventional example.

FIG. 4 is a side sectional view showing a state after a circuit is changed in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 chip component 2 electrode 3 circuit board 4 pad 10 connecting member 10a electrode connecting portion 10b pad connecting portion 10c bent portion 11 jumper wire connecting hole 12 circuit board 13 pad

Claims (1)

[Scope of utility model registration request] 1. A mounting structure of a surface mount component on a circuit board, which is formed by bending a conductive metal plate, and comprises an electrode connecting portion, a pad connecting portion, and a bent portion between these portions, A mounting structure for a surface mount component, wherein a connecting member having a jumper wire connection hole in the bent portion is sandwiched between an electrode of the surface mount component and a pad of a circuit board to be fixedly connected.