JPH0641133U - Substrate automatic processing equipment - Google Patents

Abstract

(57) [Summary] [Object] To provide an automatic processing apparatus for immersing a substrate in a processing solution in a processing tank and performing a cleaning process, wherein the processing solution is completely prevented from adhering to the substrate. thing. [Structure] A plurality of sets of substrate holding members 72-75, 102- capable of holding a substrate 22 and holding the substrate 22 to convey the substrate 22 around a processing tank by holding the substrate 22 by one set.
105 is provided, and when the substrate 22 is carried out of the processing liquid, the opening and closing operations are alternately performed so that the substrate holding members of each set do not come into contact with the substrate, and the above effects are obtained. .

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an automatic substrate processing apparatus for collectively cleaning a plurality of silicon wafers, glass substrates, etc. by immersing them in a processing solution in a processing tank.

[0002]

[Prior art]

 Conventionally, this type of substrate automatic processing apparatus has the following configuration. This conventional device is disclosed in, for example, Japanese Patent Application Laid-Open No. 57-52138.

The substrate automatic processing apparatus is provided with, for example, three processing tanks in which different processing liquids are stored, and a plurality of substrates are held together with a holding mechanism for holding them, and each processing is carried out by a carrying means. It is carried along a predetermined route that sequentially goes through the tank. The substrates are held by the holding mechanism so that the principal surfaces thereof are parallel to each other and are aligned upright at regular intervals.

By the way, in the above-described substrate automatic processing apparatus, when the substrate is carried out of the processing bath, it is very slowly pulled out from the processing liquid. By doing so, the treatment liquid is in a state of being peeled off from the substrate as the substrate is pulled up due to the surface tension, and at the same time as the pulling up, the drying of the substrate is completed.

[0005]

[Problems to be solved by the device]

 In the conventional apparatus described above, when the substrate is immersed in the processing liquid, the holding mechanism is also immersed in the processing liquid. Therefore, the substrate is pulled up while the processing liquid is attached to the mutual contact portion between the holding mechanism and the substrate. As a result, the treatment liquid attached to the substrate remains as a stain.

Therefore, the present invention has been made in view of the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide an automatic substrate processing apparatus which completely prevents the processing liquid from adhering to the substrate.

[0007]

[Means for Solving the Problems]

 The present invention has a transporting means for transporting a plurality of substrates held along a predetermined path by a holding mechanism in a state where the main surfaces are parallel to each other and each of them is upright. An automatic substrate processing apparatus for immersing and cleaning the substrate with a processing liquid stored in a processing bath in the predetermined path, wherein the holding mechanism includes a base portion transferred by the transfer means, A plurality of sets of substrate holding members that are movably attached to the base portion and can hold the base plate in pairs in a direction parallel to the main surface, and each of the base plate holding members can be driven separately for each set. And a driving means.

[0008]

【Example】

 Next, an embodiment of the automatic substrate processing apparatus according to the present invention will be described.

As shown in FIGS. 1 and 2, the automatic substrate processing apparatus includes a frame 1 made of shaped steel or the like and a panel (not provided with a reference numeral) provided over the frame 1. The housing 3 is formed in a rectangular parallelepiped shape as a whole.

As shown in FIG. 1, a substrate supply means 8 and four processing tanks 9 to 12 are sequentially arranged in the housing 3.

In the treatment tank 9, a treatment liquid 9a, which is made by mixing ammonia water, hydrogen peroxide water and pure water and is heated to a predetermined temperature, is stored. In addition, hot deionized water (hot deionized water) 10a and 12a, which are heated pure water, are stored in the processing tanks 10 and 12, respectively. A heated treatment liquid 11a, which is formed by mixing hydrogen oxide water, is stored. Further, vibrators 15 and 16 are attached to the bottoms of the processing tanks 9 and 10. Each of the vibrators 15 and 16 is driven by an ultrasonic oscillator (not shown) arranged at a predetermined position in the housing 3 to excite both processing tanks 9 and 10.

As shown in FIG. 1, a drainage unit 18 for rapidly draining the processing liquid 10 a in the processing tank 10 is provided below the processing tank 10. The drainage from the other treatment tanks 9, 11 and 12 is performed through a drainage tube (not shown) connected to each treatment tank. Further, a stock tank 20 for stocking each processing liquid to be supplied to each of the processing tanks 9 to 13 is arranged below the processing tank 11, and each processing tank is provided from the stock tank 20 via a supply tube (not shown). Various processing liquids are supplied to.

The substrate automatic processing apparatus automatically cleans and dries a substrate 22 such as a silicon wafer or a glass substrate. For example, 50 substrates are processed at a time in a series of steps described below. The washing and drying of 22 can be completed. The substrate 22 is circular and has a diameter of about 200 m / m. These 50 substrates 22 are held by the holding mechanism 24 shown in FIGS. 1 and 2, and the holding mechanism 24 is carried along a predetermined path by the carrying means 25 shown in FIG. Go around the tank. The holding mechanism 24 holds the substrates 22 so that the main surfaces of the substrates 22 are parallel to each other and is aligned at regular intervals in an upright state.

As shown in FIG. 2, the transfer means 25 includes a rail 27 extending along a direction in which the processing tanks 9 to 12 are arranged, that is, a horizontal direction, and a bracket 28 with respect to the rail 27. And a movable base 29 that is slidably attached via the.

The movable base 29 is mounted in a state of being suspended and supported by a rail 27 near the upper end thereof, and a pair of rollers 33 is provided on the lower end of the movable base 29 via a bracket 32. Has been. The rollers 33 sandwich a guide plate 34, which is disposed in the lower portion of the housing 3 in parallel with the rail 27, from the left and right. With this configuration, the movable base 29 can move smoothly.

Although not shown, a long rack is fixed in parallel with the rail 27. On the other hand, on the movable base 29, a deceleration mechanism 37 including a gear that meshes with the rack and a motor 38 that applies a torque to the reduction mechanism 37 are attached. That is, the movable base 29 reciprocates along the rail 27 by rotating the motor 38 forward and backward.

As shown in FIG. 2, a movable pole 45 is attached to the movable base 29 so as to be movable back and forth in the vertical direction. A long worm 46 is arranged in parallel with the movable pole 45, and is rotatably attached to the movable base 29. A nut (not shown) that is screwed into the worm 46 is provided, and the nut is fixed to the movable pole 45.

A geared motor (not shown) is provided on the movable base 29. When the geared motor rotates forward and backward, the worm 46 rotates forward and backward, and the movable pole 45 moves up and down. Is configured to do.

The rail 27, the movable base 29, the roller 33, the guide plate 34, the rack (not shown), the reduction mechanism 37, the motor 38, the movable pole 45, the worm 46, and By the geared motor (not shown) and related members around them, the holding mechanism 24 described above is passed through the dipping position of the holding tank 24 and the processing liquid in the processing tanks 9 to 12 and the processing tanks. Conveying means 25 for conveying along a predetermined path (described later) to the outside is configured.

Next, the holding mechanism 24 that holds the substrate 22 and is carried by the carrying means 25 will be described in detail.

As is clear from FIGS. 2 to 5, the holding mechanism 24 is formed into a rectangular parallelepiped shape and is fixed to the upper end portion of the movable pole 45 in a vertically stacked state. It has bases 57 and 58.

Two linear and columnar arm members 59 and 60 are attached to the upper base portion 57 at one end thereof in a cantilevered manner, and the arm members 59 and 60 are attached to the side portion of the base portion 57. They extend parallel to each other. As shown in FIGS. 6 and 7, the base 57 includes a bottom plate 57a and side plates 57b. Further, as is apparent from the figure, two bearings 62a and 62b are provided in the base portion 57, and both arm members 59 and 60 are rotatable about their shaft centers by these bearings. Supported by.

As shown in FIGS. 4 and 5, hanger members 63 and 64 are attached to the free ends of the arm members 59 and 60, respectively, via attachment blocks 65 in a suspended state. There is. One hanger member 63 includes a plate-shaped intermediate member 63a, a horizontal plate 63b fixed to the lower end of the intermediate member 63a, and, for example, three vertical plates 63c attached to the lower surface of the horizontal plate 63b. Consists of. The other hanger member 64 is also formed of an intermediate member 64a, a horizontal plate 64b, and a vertical plate 64c, which are similar to these. As shown in FIG. 3, the mounting block 65 includes two divided bodies 65b and 65c formed so as to sandwich the arm members 59 and 60, bolts and nuts for fastening the divided bodies. Fastening member (not shown) and the like.

At the other end of each of the arm members 59 and 60, that is, at the tip end, there is provided a connecting means 70 that is pivotally attached to the tip end and connects the tip end portions to each other. By providing the connecting means 70, it is possible to prevent the tips of the two arm members 59 and 60 from being separated or too close to each other.

As shown in FIGS. 4 and 5, two vertical plates 63c are provided at the lower ends of the vertical plates 63c and 64c, which are the constituent members of the above-mentioned hanger members 63 and 64, and in the vicinity thereof. A total of four substantially columnar substrate holding members 72 to 75 are attached to the other vertical plate 64c via the small brackets 72a to 75a. These substrate holding members 72 to 75 hold two substrates each (72 and 74 and 73 and 75) as a set to sandwich the substrate 22 in a direction parallel to the main surface of the substrate 22.

The arm members 59 and 60, the hanger members 63 and 64, the mounting block 65, and related members related thereto as described above movably support the substrate holding members 72 to 75 with respect to the base portion 57. Means for constructing, and collectively referred to as supporting means.

Here, the structure of each substrate holding member 72 to 75 itself will be described in detail. Since the substrate holding members 72 to 75 have the same shape, the substrate holding member 72 will be described in detail as a representative.

As shown in FIGS. 8 and 9, the substrate holding member 72 is formed in a substantially columnar shape as a whole, as described above. The board holding member 72 is provided with holding grooves 72b which can be engaged with the outer peripheral portion of the board 22 and are arranged in parallel at, for example, 50 rows. The holding groove 72b has a V-shaped cross section. The substrate holding member 72 has a circular cross section perpendicular to the direction in which the holding grooves 72b are arranged. Further, as is apparent from FIG. 9, each holding groove 72b is formed by cutting out a part of the substrate holding member 72, and the bottom surface of each holding groove 72b of the substrate 22 engaged with this. It has a radius of curvature equal to the radius (about 100 m / m).

As shown in FIGS. 6 and 7, a solenoid 78 is provided in the base portion 57 that is a component of the holding mechanism 24. The output shaft 78a of the solenoid 78 is connected to the above-mentioned two arm members 59 and 60 via a link mechanism 80. The link mechanism 80 has two link members 80a and 80b fitted at one end to the arm members 59 and 60, respectively, and the other ends of both link members are pivotally connected to each other, and the output shaft is It consists of a pin 80c pivotally attached to a small bracket 78b fixed to the upper end of 78a. The link members 80a and 80b are respectively locked to the arm members 59 and 60 by a lock pin 80d. An annular spacer 62c is provided between the bearings 62a and 62b pivotally supporting the arm members 59 and 60 and the link members 80a and 80b.

That is, when the solenoid 78 is operated and stopped, both arm members 59 and 60 are rotated through the link mechanism 80, and the board holding members 72 to 75 hold and release the board 22. It is configured to operate.

The solenoid 78 and the link mechanism 80 constitute a driving force applying means for applying a driving force to the board holding members 72 to 75.

On the other hand, as shown in FIGS. 2, 4 and 5, the other two straight lines are also attached to the other base portion 58 below the base portion 57 holding the arm members 59 and 60. -Shaped and columnar arm members 89 and 90 are attached in a cantilever shape at one end thereof, and extend laterally of the base portion 58 in parallel with the arm members 59 and 60. Both arm members 59 and 60 are supported by bearings (not shown) provided in the base portion 58 so as to be rotatable about their axial centers.

As shown in FIGS. 4 and 5, hanger members 93 and 94 are attached to the free ends of the arm members 89 and 90, respectively, via attachment blocks 95 in a suspended state. There is. The hanger member 93 is composed of a rectangular plate-shaped intermediate member 93a and a frame member 93b formed in a U shape and fixed to the lower end of the intermediate member 93a, and the other hanger member 94 is a rectangular plate-shaped member. And an U-shaped frame member 94b. The mounting block 95 includes two split bodies 95b and 95c formed to sandwich the arm members 89 and 90 from each other, and fastening members (not shown) such as bolts and nuts that fasten the split bodies. And so on.

The other end of each of the arm members 89 and 90, that is, the tip portion, is provided with a connecting means 100 that is pivotally attached to the both tip portions and connects the tip portions to each other. By providing the connecting means 100, the tips of the two arm members 89 and 90 are prevented from being separated from each other or too close to each other.

As shown in FIGS. 4 and 5, at the lower end portions of the frame members 93b and 94b, which are the constituent members of the hanger members 93 and 94 described above, and in the vicinity thereof, two frame members 93b are provided. Substantially columnar substrate holding members 102 to 105, which are four in total, are attached to each of the other frame members 94b. Also with respect to these substrate clamping members 102 to 105, two substrates (102 and 104 and 103 and 105) are paired and the substrate 22 is sandwiched by each pair in a direction parallel to the main surface of the substrate 22. . The substrate holding members 102 to 105 have the same shape and dimensions as the other four substrate holding members 72 to 75 described above, and therefore detailed description thereof will be omitted.

By the arm members 89 and 90, the hanger members 93 and 94, the mounting block 95, and the peripheral related members related to these, the above-mentioned board holding members 102 to 105 are attached to the base portion 58. Supporting means for movably supporting it is configured. In addition, a drive force applying means (not shown) for applying a drive force to the substrate holding members 102 to 105 is provided in the base portion 58. The driving force applying means is configured in the same manner as the driving force applying means (solenoid 78 and link mechanism 80) provided in the base portion 57 for driving the other substrate holding members 72 to 75 described above. By using both of these driving force applying means and a control circuit (not shown) that controls the operation of each driving force applying means, the respective substrate holding members 72 to 75 and 102 to 105 are formed. A driving unit is configured to be driven so as to perform the clamping and releasing. As is apparent, this driving means applies torque to the arm members 59, 60, 89, and 90 which suspend and support the substrate holding members, etc., to rotate them.

As described above, in the substrate automatic processing apparatus, two substrates (72 and 74, 73 and 75, 102 and 104, 103 and 105) are set as one set, and each substrate 22 is set by one set. Although a plurality of sets of substrate sandwiching members capable of sandwiching, in this case, four sets of substrate sandwiching members are provided, the drive means can drive these separately. Further, these substrate holding members are arranged side by side with a predetermined gap in the vertical direction for each of the above groups, and as will be described later, the driving means carries out each substrate 22 to the outside of each processing tank 9-12. In doing so, the substrate holding members of each of the groups are operated in order from the upper one to the lower one. By operating each substrate holding member in such a form, when each semiconductor substrate 22 is carried out of the processing bath, each substrate holding member 72 to 75, 102 to 105 and each substrate 22 held by them. It is possible to prevent the processing liquid from being attached to

Next, the operation of the substrate automatic processing apparatus having the above configuration will be briefly described. The following operation is performed under the control of a control circuit (not shown) including a microcomputer and the like.

First, a box or carrier (not shown) accommodating 50 substrates 22 is placed on the substrate supply means 8 shown in FIG. 1 by a robot or a human hand not shown. The substrates 22 in the carrier are arranged at regular intervals in such a manner that the principal surfaces thereof are parallel to each other and the substrates 22 are upright.

When the carrier is placed on the substrate supply means 8, the substrate supply means 8 operates. As a result, the 50 substrates 22 accommodated in the carrier are lifted and pushed out above the carrier, and brought to a position where the holding mechanism 24 can hold them. At this time, the holding mechanism 24 stands by immediately above the carrier.

In this state, the board holding members 72 to 75 and 102 to 105 are operated to hold each board 22.

Subsequently, the motor 38 and the geared motor (not shown) shown in FIG. 2 are appropriately rotated to horizontally move the movable base 29 and move the movable pole 45 up and down. With the holding mechanism 24 held, the path Z shown in FIG.₃→ X₆→ Z _Four Along the substrate pedestal 85 (which is also provided in the other processing baths 10 to 12) in the processing bath 9 and is stored in the processing bath 9a. It is immersed. Then, the holding state of each substrate 22 by the holding mechanism 24 is released, and the processing of each substrate 22 by the processing liquid 9a, that is, the cleaning is performed. During this cleaning, the vibrator 15 attached to the lower portion of the processing tank 9 is activated to excite the processing liquid 9a inside the processing tank 9 and the cleaning is effectively performed.

The substrate pedestal 85 provided in each of the processing tanks 9 to 12 extends in the alignment direction of the substrates 22 held by the holding mechanism 24 and receives the substrates 22. These are supported while maintaining an aligned state.

When the cleaning operation in the processing bath 9 is completed, the holding mechanism 24 holds each substrate 22 again. Then, each substrate 22 is transported along the path Z ₃ → X ₇ → Z ₄ shown in FIG. 1 in the same manner as described above, and is placed on the substrate pedestal 85 in the processing tank 10 to process the treatment liquid. Cleaning with 10a is performed. During this cleaning, the vibrator 16 attached to the processing tank 10 operates.

After that, each substrate 22 is conveyed by sequentially following the path Z ₃ → X ₈ → Z ₄ shown in FIG. 1 and the path Z ₃ → X ₉ → Z ₄ following the path Z ₃ , → X ₈ → Z _4, and the processing tanks 11 and 12 are processed. It is washed with the processing liquids 11a and 12a. Thus, the cleaning of each substrate is completed. After that, the holding mechanism 24 is returned to the standby position immediately above the substrate supply means 8 again through the path Z ₃ → X ₁₀ → Z ₄ shown in FIG.

After that, the series of operations described above is repeated, and a large number of substrates sequentially supplied by the substrate supply means 8 are cleaned.

Here, the operation when the substrate 22 processed in each of the processing tanks 9 to 12 is held by the holding mechanism 24 and carried out of the processing tank will be described in detail. However, since the operation at the time of carrying out described here is similarly performed in each of the processing tanks 9 to 12, the operation in the processing tank 11 will be described as an example.

When carrying out each substrate 22, the holding mechanism 24 holds the substrate 22 by all of the four sets, that is, the eight substrate holding members 72 to 75 and 102 to 105, which the holding mechanism 24 has. Then, as the movable pole 45 rises, it is pulled upward at an extremely slow predetermined speed. By slowly pulling up the substrate 22 in this way, the treatment liquid is brought into a state of being peeled off from the substrate 22 as the substrate 22 is pulled up due to its surface tension, and at the same time as the pulling up, the drying of the substrate 22 is completed.

With this ascending operation, as is apparent from FIG. 5, first, one set of the substrate holding members 103 and 105 located at the uppermost position among the four substrate holding members arranged in the upper and lower sides is processed by the processing tank. The liquid level position 111 of the treatment liquid 11a in 11 (indicated by a one-dot chain line: this liquid level position indicates a relative position with respect to the holding mechanism 24 and does not actually change. As a fixed example, the liquid level position is shown to be lowered to indicate the raising operation of the holding mechanism 24. The same applies to liquid level positions denoted by reference numerals 112 to 114, and these are all the same liquid level. (Representing the surface position), the substrate holding members 103 and 105 are released from the holding state and separated from the base plate 22. However, in FIG. 5, in order to avoid complication of the drawing, only one substrate holding member 103 is shown as being separated from the substrate 22. In addition, at this time, the third pair of substrate holding members 102 and 104 from the top are also integrally connected to the first pair of substrate holding members 103 and 105 via the hanger members 93 and 94. Separated from the substrate 22.

The ascending operation is performed while maintaining the above state, the first set of substrate holding members 103, 105 reach above the liquid level position 111 while being separated from each substrate 22, and the second set from the top. When the substrate clamping members 73 and 75 of No. 1 are located in the vicinity of the liquid surface position indicated by reference numeral 112, the substrate clamping members 103 and 105 of the first set are again clamped together with the substrate clamping members 102 and 104 of the third set. The second set of substrate holding members 73 and 75 are released from the holding state and separated from the substrate 22. At this time, the fourth set from the top, that is, the substrate holding members 72, 74 in the lowermost set, are also integrally connected via the second set of substrate holding members 73, 75 and the hanger members 63, 64. Therefore, it is separated from the substrate 22 at the same time.

In the state where the ascending operation is provided in the above state, the substrate clamping members 73, 75 of the second set reach above the liquid surface position 112 in a state of being separated from each substrate 22, and the third set from the top. When the substrate clamping members 102, 104 of No. 2 reach the vicinity of the liquid surface position indicated by reference numeral 113, the second pair of substrate clamping members 73, 75 are clamped together with the fourth group of substrate clamping members 72, 74. The third set of substrate holding members 102, 104 is released from the substrate 22 by releasing the holding state together with the first set of substrate holding members 103, 105.

Then, the ascending operation is continued and the third set of substrate holding members 102, 104 reaches above the liquid surface position 113 while being separated from each substrate 22, and the fourth set of substrate holding members 72, 74 is referred to. When reaching the vicinity of the liquid surface position indicated by reference numeral 114, the third set of substrate holding members 102, 104 is brought into a holding state together with the first set of substrate holding members 103, 105, and the fourth set of substrate holding members 72, 74. Is released from the substrate 22 by releasing the sandwiched state together with the second set of substrate sandwiching members 73 and 75.

After that, the ascending operation is further continued, and when the fourth pair of substrate holding members 72 and 74 reach above the liquid surface position 114 while keeping the state of being separated from the base plate 22, the fourth pair of substrates are held. The board holding members 72, 74 and the second set of board holding members 73, 75 are held, and each board 22 is held by all of the first to fourth sets of board holding members. Thereafter, the substrate 22 is transported to the outside of the processing bath 11.

As described above, when the substrates 22 are carried out of the processing bath, the substrate holding members 72 to 75 and 102 to 105 are held by appropriately performing the holding operation and the releasing operation of each set of the substrate holding members. Is always separated from the substrate 22 when it comes out of the processing liquid, and the processing liquid may adhere between the substrate holding member and the substrate 22, particularly in the holding groove formed in each substrate holding member. rare.

The substrate 22 that has been cleaned through the processing tanks 9 to 12 as described above is transported and collected by another substrate transport means (not shown), and is transported to the next step.

In the present embodiment, four sets of substrate holding members capable of holding the substrate 22 by one set are provided, but the number of sets to be provided is not limited to this and may be set as appropriate. Needless to say. Further, in the present embodiment, two sets of substrate holding members are simultaneously operated integrally, but it is also possible to configure each set of substrate holding members to be operated independently. Further, although the base plate 22 handled in this embodiment is a circular silicon wafer, it is also possible to handle, for example, a rectangular liquid crystal substrate 120 as shown in FIG. However, in this case, as shown in the same drawing, it is preferable that the bottom surface of the holding groove formed in the substrate holding member is linear.

[0057]

[Effect of device]

 As described above, in the substrate automatic processing apparatus according to the present invention, when the substrate is carried out of the processing liquid, each substrate holding member is carried out of the processing liquid in a non-contact state with the substrate. This has the effect of completely preventing the processing liquid from adhering to the substrate.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an entire substrate automatic processing apparatus according to the present invention.

2 is a cross-sectional view taken along the line AA of FIG.

FIG. 3 is a plan view of a holding mechanism included in the substrate automatic processing apparatus shown in FIG.

FIG. 4 is a view taken along the line BB in FIG.

5 is a view on arrow CC of FIG. 4;

FIG. 6 is a plan view including a cross section of a base portion included in the holding mechanism shown in FIGS. 3 to 5 and a mechanism inside thereof.

FIG. 7 is a cross-sectional view taken along line DD of FIG.

8 is a plan view of a substrate holding member included in the holding mechanism shown in FIGS. 3 to 5. FIG.

9 is a sectional view taken along line EE in FIG.

FIG. 10 is a front view including a partial cross section showing a modified example of a substrate to be handled and a substrate holding member that holds the substrate.

[Explanation of symbols]

9, 10, 11, 12 Treatment tank 9a, 10a, 11a, 12a Treatment liquid 22, 120 Substrate 24 Holding mechanism 25 Conveying means 45 Movable pole 57, 58 Base portion 59, 60, 89, 90 Arm member 63, 64, 93 , 94 Hanger member 65, 95 Mounting block 72, 73, 74, 75, 102, 103, 104, 1
05 Board clamping member

Claims (3)

[Scope of utility model registration request] 1. A transporting means for transporting a plurality of substrates held along a predetermined path by a holding mechanism so that the main surfaces are parallel to each other and each of them is upright. A substrate automatic processing apparatus for dipping and cleaning the substrate with a processing liquid stored in a processing tank in the predetermined path, wherein the holding mechanism includes a base portion conveyed by the conveying means, and the base portion. A plurality of sets of substrate holding members that are movably attached to each other and can hold the substrates in a set in a direction parallel to the main surface, and a driving unit that can drive each of the substrate holding members separately for each set. An automatic substrate processing apparatus characterized by the above. 2. The substrate automatic processing apparatus according to claim 1, wherein each of the substrate holding members is provided with a plurality of holding grooves arranged to be engaged with the substrate. 3. The substrate holding members are arranged side by side with a predetermined gap in the vertical direction for each group, and the driving unit moves the substrate holding members of each group when the substrate is carried out of the processing bath. The substrate automatic processing apparatus according to claim 1, wherein the automatic substrate processing apparatus is operated in order from an upper one to a lower one.