JPH0639888Y2 - Slicing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a slicing device for cutting a material such as a semiconductor wafer from a work ingot into slices.

(Prior Art) When manufacturing a semiconductor wafer or the like, an ingot containing predetermined components such as silicon and germanium is cut into sliced semi-finished products with a predetermined thickness using a slicing device, and then predetermined processing is performed to obtain a product. I'm supposed to get it.

Such a slicing device is disclosed in, for example, Japanese Patent Laid-Open No. 49-6.
It is disclosed in Japanese Patent No. 590.

In the disclosed structure, the outer peripheral edge portion of the disk-shaped blade is sandwiched by the pulling means in a tensioned state between the rotary support having the annular tip portion and the annular member associated with the annular tip portion. ing.

The rotary support descends while rotating while supporting the disk-shaped blade.

As a result, the ingot as a semiconductor material introduced into the opening formed in the central portion of the blade is made of a hard material such as diamond provided in a ring shape on the inner peripheral edge portion that defines the opening of the disk-shaped blade. It is cut into slices of a given thickness in contact with the configured cutting edge.

Then, the cut semi-finished product of the semiconductor wafer is removed by applying an adsorption device or the like from the side opposite to the cutting side, that is, from the rotation support side through the opening of the blade.

(Problems to be solved) By the way, since the sliced semi-finished product cut out as described above is extremely thin, if in-plane deformation occurs due to residual stress during ingot formation or stress during cutting, etc. In such a case, a removal device such as an adsorption device cannot be successfully adapted, and the semi-finished sliced product may not be properly removed from the slicing device. However, if the removal of the sliced semi-finished product fails, the semi-finished product comes into contact with the side surface of the blade and collides with the inner surface of the rotating support due to its centrifugal force and is damaged, resulting in powder on the rotating support and the blade mating surface. It enters into a shape and promotes the vibration of the blade, or it collides with the blade and damages it.

(Means for Solving Problems) The present invention is configured in view of the above circumstances, and prevents an unexpected situation even when removal of a semi-finished product of a sliced semiconductor wafer fails to be removed. It is an object of the present invention to provide a structure of a slicing device capable of

An object of the present invention is to provide a rotary support having a ring-shaped tip portion that is rotatably supported so as to be movable in a direction orthogonal to the rotation axis thereof and protrudes in the rotation axis direction, and is attached to the tip portion of the rotation support body. An annular member, and a disk-shaped blade supported between the rotary support and the annular member at the outer peripheral edge having an inner peripheral edge with a cutting edge for cutting on the slice of the tip of the work while rotating, A slicing device comprising a semi-finished product that is cut into a slice by the cutting blade in a tip portion of a workpiece that is projected inside the blade, and a capturing means arranged to capture inside the blade, This can be achieved by a slicing device characterized in that an elastic member is arranged at the inner peripheral edge of the mating portion between the tip of the rotary support and the inner surface of the blade.

(Operation) In the slicing device, the sliced semi-finished product cut by the disc-shaped blade supported between the rotary support and the annular member is captured by the capturing means and removed from the slicing device. However, if this removal cannot be carried out properly, the sliced semi-finished product will be left in the space formed by the blade of the slicing device and the rotary support.

In this case, the sliced semi-finished product is blown outward by the centrifugal force of the blade in the radial direction of the blade, that is, in the direction of the inner peripheral surface of the rotary support. Conventionally, the blown semi-finished product collides with the inner surface of the rotary support and is damaged, and this debris destroys the blade or increases blade vibration, which adversely affects the proper operation of the slicing device. It was

The present inventor arrived at the present invention as a result of various studies on the behavior of the sliced semi-finished product remaining in the slicing device.

The present inventors have found that the above problem can be solved by disposing an elastic body at the inner peripheral edge portion near the mating portion of the rotary support with the inner surface of the blade.

According to the study by the present inventors, the sliced semi-finished product cut out from the ingot is blown toward the inner peripheral surface of the rotary support as described above, but the elastic body is arranged on the inner peripheral surface. It was found that the semi-finished product was not damaged by being received by the elastic body, and remained in the slicing device in the cut state.

This elastic body may be arranged on the entire inner peripheral surface of the rotary support, but in the study by the present inventors, the range in which the semi-finished slice products collide is not so wide, and therefore, for example, at the joint with the blade, , O-rings may be arranged.

According to the present invention, even if the sliced semi-finished product cut out from the ingot remains on the inner surface of the blade in the slicing device without being removed, the semi-finished product will not be damaged. Or damage the rotating support,
There is no problem of penetrating into the mating surface between the rotary support and the inner surface of the blade, which adversely affects the proper operation of the device.

Further, through the blade side surface, it is possible to suppress as much as possible the invasion of the cutting chips of the work into the mating portion of the rotary support and the blade inner side surface, and solve the problems such as an increase in blade vibration resulting from this. You can

(Description of Embodiments) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows a slicing device 1 according to an embodiment of the present invention.
The whole slicing device 1 is shown in FIG.
It is installed on the base 2.

The slicing apparatus 1 includes a supply mechanism 4 for supplying a work 3, that is, an ingot 3 as a material for manufacturing a semiconductor wafer, and a slicing mechanism 5 for cutting a semi-finished semiconductor wafer product having a predetermined thickness from the ingot 3. Composed of.

The ingot 3 of this example is a cylindrical semiconductor wafer material composed of a semiconductor such as silicon or germanium, and is placed on the supply mechanism 4 so as to be horizontally movable in the figure. One end of the ingot 3 is supported by a gantry 6 of the supply mechanism 4, and the gantry 6 is connected to a fixed underframe 7 extending in the horizontal direction. Also, the pedestal 6 is
An output shaft of a first servomotor 9 for controlling the horizontal movement of the ingot 3 is coupled to the tip of the screw rod 8 extending in parallel with the fixed underframe 7. ing.

Therefore, when the first servomotor 9 rotates forward and backward, the screw rod 8 rotates, and accordingly, the pedestal 6 is displaced in the horizontal direction. Then, the ingot 3 moves forward or backward according to the displacement of the gantry 6 as shown by the arrow in the figure.

Further, the slicing mechanism 5 is provided with a disk-shaped blade 10 for cutting the end of the ingot 3 on a slice, and this blade 10 is provided at the tip of a substantially disk-shaped tension disk 11 which is rotatable at the outer peripheral edge. Top ring
Attached by 12.

A circular opening 10a is formed in the center of the blade 10, and the inner edge of the blade 10 forming the opening 10a constitutes a cutting edge 13. In this case, the cutting edge 13 is composed of a grindstone made of a hard material such as diamond.

The base portion, that is, the central portion, of the tension disk 11 is fixed to the rotary drum 14, and the rotary shaft 14a of the rotary drum 14 is connected to the rotary shaft of the rotary transmission 15.

In the structure of this example, the drive motor 16 is provided close to the rotary transmission 15.
Is arranged, and a belt 19 is stretched between the output pulley 17 of the drive motor 16 and the input pulley 18 of the rotary transmission 15, whereby the rotational force of the drive motor 16 is increased. To be transmitted to.

Drive motor 16, rotary transmission 15, tension disk 11,
The support portion of the slicing mechanism 5 including the top ring 12 and the blade 10 is coupled to the elevating frame 20 so as to be vertically movable.

A screw block 21 is attached to the supporting portion of the slicing mechanism 5, and the screw block 21 is screwed into a screw rod 22 extending in the vertical direction.

The screw rod 22 is connected to the output shaft of the second servo motor 23, so that the slicing mechanism 5 including the drive motor 16 and the rotary transmission 15 responds to the forward and reverse rotation of the second servo motor 23. Thus, the lifting operation can be performed while rotating the blade 10.

A counterweight 25 is attached to the slicing mechanism 5 via a wire 24. The counterweight 25 is a pulley so as to balance with the weight of the slicing mechanism 5.
Suspended through 26.

Further, the apparatus of this example is equipped with a suction and take-out mechanism 27 for picking up the semi-finished product of the semiconductor wafer cut off by the blade 10 from the back surface and taking it out of the apparatus.

The arm 28 of the suction and take-out mechanism 27 extends upward from below the tip of the ingot 3 into the opening 10a of the blade 10 and further into the space formed by the blade 10 and the tension disk 11 to slice into half a slice. Reach the back side of the product.

At the tip of the arm 28, a suction pad 29 for sucking the cut sliced semi-finished product is provided.

In the device of this example, the first servomotor 9 and the second servomotor
An NC controller 30 is provided to control the operations of the servo motor 23 and the suction / pickup mechanism 27.

Referring to FIG. 2, details of the structure of the mounting portion of the blade 10 are shown in cross section.

The ring-shaped end surface 11a of the tension disk 11 is provided with a plurality of screw holes 31 circumferentially spaced near the outer peripheral edge. Then, the blade 10 and the top ring 12 combined with this are provided with through holes 32, 33, and a tightening bolt 34 is inserted so as to penetrate them, and the blade 10 is tightened by tightening the bolt 34. It is clamped and fixed between the tension disk 11 and the top ring 12.

A groove 35 extending in the circumferential direction is formed inside the screw hole 31 of the end surface 11a of the tension disk 11.

A recess 36 is also formed in the top ring 12 at a position facing the groove 35 and extends in the circumferential direction, and a tension ring 37 is inserted into the recess 36. At the tip of this tension ring 37, the tension disc 11
The groove 35 has a shape complementary to that of the groove 35 and slightly protrudes into the groove 35. Further, the top ring 12 is provided with a plurality of screw holes 38 reaching the recesses 36, and tension bolts 39 are respectively screwed into the screw holes 38.

When the tension bolt 39 is tightened, the blade 10 is deformed so as to be pushed into the groove 35 of the tension disk 11 by the tension ring 37 as shown in the figure. As a result, tension can be generated on the blade 10 and the blade 10 can be attached to the tension disk 11 in a tensioned state.

Further, in the structure of this example, the end surface 11 of the tension disk 11 is
A peripheral groove 40 is formed at the inner peripheral edge of a.
An O-ring 41 is arranged in the.

The operation of the device having the above structure will be described.

When the ingot 3 is installed at a predetermined position on the supply mechanism 4, the drive motor 16 is activated to rotate the tension disk 11 via the rotary transmission 15. As a result, the blade 10 attached to the tension disk 11 starts to rotate. Next, the first servomotor 9 is activated to move the ingot 3 into the opening 10 of the blade 10 of the slicing mechanism 5.
It is advanced toward a, and the forward motion is stopped at the position where the tip of the ingot 3 projects by the thickness of the sliced semi-finished product cut out into the opening 10a. Next, the second servo motor 23
Is activated, and the slicing mechanism 5 starts descending. By this descending operation, when the cutting edge 13 of the blade 10 contacts the ingot 3, the cutting work is started. That is, as the blade 10 rotates and descends, the tip of the ingot 3 is cut into slices. When the cutting work is nearing completion, a negative pressure is introduced to the suction pad 29 of the suction and take-out mechanism 27, and the suction is applied to the back surface side of the sliced semifinished product.

When the cutting work is completed, the first servomotor 9
Is activated to retract the ingot 3 to a predetermined position, and the arm 28 of the suction / pickup mechanism 27 operates to take out the cut sliced semifinished product from the slicing apparatus 1.

Although not shown, the coolant is sprayed toward the cutting edge 13 of the blade 10 at a predetermined position during the cutting operation.

In the above operation, the sliced semi-finished product to be cut may be deformed in-plane as a result of residual stress at the time of manufacturing the ingot 3 or various stresses related to cutting work.

If this deformation is large, the suction and take-out mechanism
Occasionally, a semi-finished product sliced by 27 cannot be captured.

In such a case, the sliced semi-finished product is subjected to the centrifugal force due to the rotation of the blade 10 and is blown outward, that is, in the direction of the tension disk 11. Conventionally, the sliced semi-finished product thus blown collides with the inner surface of the tension disc 11 and damages the tension disc 11, or the collision damages itself and damages the blade 10 or damages the blade 10. Enter the mating surface between the tension disk 11 and the blade 10 and
There was a problem of increasing the rotational vibration of the.

However, in the structure of this example, since the O-ring made of an elastic material is arranged at the joint between the tension disk 11 and the blade 10, the cut semi-finished product can be captured by the suction and extraction mechanism 27. Even if it did not exist, this sliced semi-finished product collides with the flexible O-ring, so it does not break even if it collides,
Therefore, it is possible to prevent the occurrence of such an unexpected situation.

Moreover, since the adhesion of the mating surface between the tension disk 11 and the blade 10 can be improved by arranging the O-ring, the cutting dust generated at the time of cutting enters this mating surface to perform an appropriate cutting operation. It is effective for the problem of inhibiting

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a slicing device according to an embodiment of the present invention, and FIG. 2 is a detailed diagram of a blade mounting portion. 1 ... Slicing device, 2 ... Base, 3 ... Ingot, 4 ... Supply mechanism, 5 ... Slicing mechanism, 6 ... Stand, 7 ... Fixed underframe, 8 ... Screw rod 8, 9 ... … 1st servomotor, 10 …… blade, 11 …… tension disk, 12 …… top ring, 13 …… cutting blade, 14 …… rotating drum, 14a …… rotating shaft, 15 …… rotary transmission, 16… … Drive motor, 17 …… Second servo motor, 18 …… Input pulley, 19 …… Belt, 20 …… Lift frame, 21 …… Screw block, 22 …… Screw rod, 23 …… Second servo motor, 24 ...... Wire, 25 ...... Counterweight, 26 ...... Pulley, 27 …… Suction removal mechanism, 28 …… Arm, 29 …… Suction pad, 30 …… NC controller, 31 …… Screw hole, 32,33 …… Through hole, 34 …… tightening bolt, 35 …… groove, 36 …… recess, 37 …… tension ring, 38 …… J hole, 39 …… tension bolt, 40 …… circumferential groove, 41 …… O-ring.

Claims (1)

[Scope of utility model registration request] 1. A rotation support body having an annular tip end portion that is rotatably supported so as to be movable in a direction orthogonal to the rotation axis and protrudes in the rotation axis direction, and an annular shape attached to the tip end portion of the rotation support body. A member, a disk-shaped blade supported between the rotary support and the annular member at the outer peripheral edge portion having an inner peripheral edge portion having a cutting edge for cutting the tip end portion of the workpiece on the slice while rotating, A slicing device comprising a semi-finished product, which is a slice of a work piece that is projected inwardly of a blade and is cut into slices by the cutting blade, and a capturing means arranged to capture the inside of the blade, A slicing device, wherein an elastic member is disposed at an inner peripheral edge of a mating portion between the tip of the rotary support and the inner surface of the blade.