JPH0639572Y2 - 移植機におけるマルチ膜体の孔明け装置 - Google Patents

移植機におけるマルチ膜体の孔明け装置

Info

Publication number
JPH0639572Y2
JPH0639572Y2 JP1987028972U JP2897287U JPH0639572Y2 JP H0639572 Y2 JPH0639572 Y2 JP H0639572Y2 JP 1987028972 U JP1987028972 U JP 1987028972U JP 2897287 U JP2897287 U JP 2897287U JP H0639572 Y2 JPH0639572 Y2 JP H0639572Y2
Authority
JP
Japan
Prior art keywords
membrane
cylinder
membrane body
machine frame
seedlings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987028972U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63134619U (en, 2012
Inventor
基 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kubota Corp
Original Assignee
Kubota Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kubota Corp filed Critical Kubota Corp
Priority to JP1987028972U priority Critical patent/JPH0639572Y2/ja
Publication of JPS63134619U publication Critical patent/JPS63134619U/ja
Application granted granted Critical
Publication of JPH0639572Y2 publication Critical patent/JPH0639572Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Transplanting Machines (AREA)
JP1987028972U 1987-02-27 1987-02-27 移植機におけるマルチ膜体の孔明け装置 Expired - Lifetime JPH0639572Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987028972U JPH0639572Y2 (ja) 1987-02-27 1987-02-27 移植機におけるマルチ膜体の孔明け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987028972U JPH0639572Y2 (ja) 1987-02-27 1987-02-27 移植機におけるマルチ膜体の孔明け装置

Publications (2)

Publication Number Publication Date
JPS63134619U JPS63134619U (en, 2012) 1988-09-02
JPH0639572Y2 true JPH0639572Y2 (ja) 1994-10-19

Family

ID=30832433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987028972U Expired - Lifetime JPH0639572Y2 (ja) 1987-02-27 1987-02-27 移植機におけるマルチ膜体の孔明け装置

Country Status (1)

Country Link
JP (1) JPH0639572Y2 (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE43487E1 (en) 2000-09-20 2012-06-26 Electro Scientific Industries, Inc. Laser segmented cutting
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114145104B (zh) * 2021-11-30 2023-07-25 山东理工大学 一种基于定量定点施肥的玉米播种施肥协同作业一体机

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3994290A (en) * 1975-09-29 1976-11-30 Clairol Incorporated Massage device
JPH0411453Y2 (en, 2012) * 1985-05-30 1992-03-23

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8933369B2 (en) 2000-09-13 2015-01-13 Hamamatsu Photonics K.K. Method of cutting a substrate and method of manufacturing a semiconductor device
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US8969761B2 (en) 2000-09-13 2015-03-03 Hamamatsu Photonics K.K. Method of cutting a wafer-like object and semiconductor chip
USRE43487E1 (en) 2000-09-20 2012-06-26 Electro Scientific Industries, Inc. Laser segmented cutting
USRE43605E1 (en) 2000-09-20 2012-08-28 Electro Scientific Industries, Inc. Laser segmented cutting, multi-step cutting, or both
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

Also Published As

Publication number Publication date
JPS63134619U (en, 2012) 1988-09-02

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