JPH0639508Y2 - Printed circuit board shield structure - Google Patents

Printed circuit board shield structure

Info

Publication number
JPH0639508Y2
JPH0639508Y2 JP8905389U JP8905389U JPH0639508Y2 JP H0639508 Y2 JPH0639508 Y2 JP H0639508Y2 JP 8905389 U JP8905389 U JP 8905389U JP 8905389 U JP8905389 U JP 8905389U JP H0639508 Y2 JPH0639508 Y2 JP H0639508Y2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
conductive member
rib
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8905389U
Other languages
Japanese (ja)
Other versions
JPH0328797U (en
Inventor
信昭 横尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP8905389U priority Critical patent/JPH0639508Y2/en
Publication of JPH0328797U publication Critical patent/JPH0328797U/ja
Application granted granted Critical
Publication of JPH0639508Y2 publication Critical patent/JPH0639508Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【考案の詳細な説明】 〔考案の概要〕 本考案はシャーシのリブおよびプリント基板の間に挾ま
れ、かつ弾性を有する導電性部材を備えさらに該導電性
部材には前記プリント基板に設けられた孔を介して該プ
リント基板に固定される複数の突出部を備えるプリント
基板のシールド構造であって、プリント基板の各回路部
分のシールドを可能にしさらに組立・分解点検を容易に
する。
DETAILED DESCRIPTION OF THE INVENTION [Outline of the Invention] The present invention includes an elastic conductive member sandwiched between a rib of a chassis and a printed circuit board, and the conductive member is provided on the printed circuit board. A shield structure for a printed circuit board having a plurality of protrusions fixed to the printed circuit board through holes, which enables shielding of each circuit portion of the printed circuit board and facilitates assembly / disassembly inspection.

〔産業上の利用分野〕[Industrial application field]

本考案はプリント基板に関する。特に、本考案ではプリ
ント基板への電子部品の高密度化に伴う回路相互のプリ
ント基板のシールド構造に言及する。
The present invention relates to a printed circuit board. In particular, the present invention refers to the shield structure of the printed circuit boards between the circuits as the density of electronic components on the printed circuit boards increases.

〔従来の技術〕[Conventional technology]

電子機器は小形化、高性能化等に伴い、高密度化実装が
進んでいる。例えば無線通信機の移動機は送信機、受信
機等が共通のシャーシ内に収容さる。第7図はシャーシ
の内の移動機の回路ブロック化を説明する図である。以
下に本図の構成を説明する。なお、全図を通じて同様の
構成要素については同一の参照番号または記号をもって
表す。本図のプリント基板3は一例として4つの回路ブ
ロックに区分され、その上面に移動機の受信回路部11、
送信回路部12、信号処理回路部13および電源回路部14を
構成する電子部品を搭載している。このように電子部品
を区分するのは各回路部が相互間で電磁波による妨害を
及ぼさないようにそのシールドをするためである。その
シールド法を説明する前にさらに第7図の補足説明を行
う。第8図は第7図の移動機の回路ブロックを補足説明
する図である。本図において受信回路部11および送信回
路部はその周波数が相互に干渉すると正常な通話ができ
なくなるので相互にしゃへいする必要がある。信号処理
部13を構成する制御部16は図示しない無線基地局との間
の無線チャンネルの設定制御およびハンドセット10の制
御を行う。さらに局部発信回路17が多チャンネル切替え
機能を回路であり、送受共用器は1つのアンテナ15で同
時送受話を行うための共用機である。これらから構成さ
れる信号処理部13はマイコンで構成されるので受信回路
部11および送信回路部12からの電磁波妨害を受けやすい
ので、これらからしゃへいする必要がある。電源回路部
14は、他の回路部と近接して設けられると、該他の回路
部への電磁波妨害を及ぼしやすいので、これからしゃへ
いする必要がある。
As electronic equipment becomes smaller and higher in performance, high-density mounting is progressing. For example, in a mobile device of a wireless communication device, a transmitter and a receiver are housed in a common chassis. FIG. 7 is a diagram for explaining circuit block formation of a mobile device in the chassis. The configuration of this figure will be described below. In addition, the same reference number or symbol is used to represent the same component throughout the drawings. The printed circuit board 3 of this figure is divided into four circuit blocks as an example, and the receiving circuit section 11 of the mobile device is provided on the upper surface thereof.
Electronic components that constitute the transmission circuit unit 12, the signal processing circuit unit 13, and the power supply circuit unit 14 are mounted. The reason why the electronic parts are divided in this way is that the respective circuit parts are shielded so as not to interfere with each other by electromagnetic waves. Before explaining the shield method, a supplementary explanation of FIG. 7 will be given. FIG. 8 is a diagram for supplementarily explaining the circuit block of the mobile device in FIG. In the figure, the reception circuit section 11 and the transmission circuit section need to be shielded from each other because normal calls cannot be made if their frequencies interfere with each other. The control unit 16 included in the signal processing unit 13 controls setting of a wireless channel with a wireless base station (not shown) and control of the handset 10. Further, the local transmission circuit 17 is a circuit having a multi-channel switching function, and the transmission / reception duplexer is a shared machine for performing simultaneous transmission / reception with one antenna 15. Since the signal processing unit 13 composed of these components is composed of a microcomputer, it is susceptible to electromagnetic interference from the receiving circuit unit 11 and the transmitting circuit unit 12, and therefore it is necessary to shield from them. Power circuit section
If 14 is provided in the vicinity of the other circuit section, it is likely to cause electromagnetic interference to the other circuit section, so it is necessary to shield it from now on.

第9図は第7図の移動機の各回路部のシールド構造を説
明する図である。本図において、移動機はシャーシ1お
よび該シャーシ1に内蔵されるプリント基板3を含む。
該シャーシ1は導電性を有し、その内側には一体成型の
リブ2を有し、例えばアルミのダイキャストにより製造
される。該リブ2はその上面に後述するプリント基板3
の各回路部分(11,12,13,14)の周縁部のアースパター
ン6を密着させるように成型される。プリント基板3
は、その上面に各回路部(11,12,13,14)の電子部品を
搭載し、その下面には該電子部品相互を接続するプリン
ト配線を備えかつ各回路部(11,12,13,14)の周縁部に
はアースパターン6を有する。プリント基板3がシャー
シ1のリブ2の上面に置かれたらプリント基板3および
リブ2のネジ穴7にネジ4を入れてネジ止めする。これ
によって、プリント基板3のアースパターン6とシャー
シ1のリブ2の上面は密着する。
FIG. 9 is a diagram for explaining the shield structure of each circuit section of the mobile device of FIG. In the figure, the mobile device includes a chassis 1 and a printed circuit board 3 built in the chassis 1.
The chassis 1 is electrically conductive, has an integrally molded rib 2 inside, and is manufactured by die casting of aluminum, for example. The rib 2 has a printed circuit board 3 described below on its upper surface.
Are molded so that the ground patterns 6 on the peripheral portions of the respective circuit portions (11, 12, 13, 14) are brought into close contact with each other. Printed circuit board 3
Is an electronic component of each circuit portion (11, 12, 13, 14) mounted on the upper surface thereof, and a printed wiring for connecting the electronic components to each other is provided on the lower surface of each circuit portion (11, 12, 13, 14). A ground pattern 6 is provided on the peripheral edge of 14). When the printed circuit board 3 is placed on the upper surface of the rib 2 of the chassis 1, the screw 4 is inserted into the screw holes 7 of the printed circuit board 3 and the rib 2 and fixed. As a result, the ground pattern 6 of the printed board 3 and the upper surface of the rib 2 of the chassis 1 are brought into close contact with each other.

次にプリント基板のシールドについて説明する。プリン
ト基板1の下面の各回路部(11,12,13,14)の電子部品
を接続するプリント配線等はアンテナとなり、電磁波を
発生し該電磁波は直線的に隣接部へ進行する。前記アー
スパターン6に密着するリブ2は該電波の進行を妨げ
る。他方プリント基板3の上面にある電子部品から直接
に発生する電磁波は前述の場合と比較すると少なく、ま
たプリント基板の下面から上方につき出る電磁波は構造
材の吸収、反射により他の回路部へ達するものが少な
い。ただしこのような電磁波の影響が強い場合にはプリ
ント基板3の上面に各回路部に図示しないシールドケー
スを取り付けてその影響を除去してもよい。かくして区
分された各回路部からの電磁波を適切にシールドして電
子部品の高密度実装を図って、電子機器の小形化、高性
能化を図っている。
Next, the shield of the printed circuit board will be described. The printed wiring or the like connecting the electronic components of the respective circuit parts (11, 12, 13, 14) on the lower surface of the printed board 1 serves as an antenna, generates an electromagnetic wave, and the electromagnetic wave travels linearly to an adjacent part. The rib 2 that is in close contact with the earth pattern 6 prevents the propagation of the radio wave. On the other hand, electromagnetic waves directly generated from the electronic components on the upper surface of the printed circuit board 3 are smaller than those in the above-mentioned case, and electromagnetic waves that go upward from the lower surface of the printed circuit board reach other circuit parts by absorption and reflection of the structural material. Less is. However, when such an influence of electromagnetic waves is strong, a shield case (not shown) may be attached to each circuit portion on the upper surface of the printed circuit board 3 to remove the influence. Thus, electromagnetic waves from each of the divided circuit parts are appropriately shielded to achieve high-density mounting of electronic parts, and miniaturization and high performance of electronic devices are achieved.

〔考案が解決しようとする課題〕[Problems to be solved by the device]

しかしながら、リブ2、製作の寸法精度およびプリント
基板3の材質の柔軟性から次のような問題が生ずる。第
10図はプリント基板をリブに取り付けた状態を説明する
図である。本図において、リブ2のネジ4止めの穴7間
隔がプリント基板3のものよりも小さくなる方向にずれ
ている。この場合、プリント基板3をリブ2へネジ4で
締め付けるとプリント基板3の材料の柔軟性により中央
部が持ち上がってそりが生ずる。このためプリント基板
3のアースパターン6の面とリブ2の面との密着性がな
くなる。この密着性を失うと、アースパターン6とリブ
2の間のすき間から電磁波が漏れることになり各回路部
(11,12,13,14)のシールドが保てなくなる。例えばプ
リント基板3の中央部が持ち上がる主な原因として製作
の寸法精度によるものであるけれども上記とは逆にリブ
2のネジ穴7間隔がプリント基板3のものよりも大きい
場合には取り付け不能となり歩留りが悪くなったり、再
度の穴あけをしなければならない。よってこの歩留り等
をなくしかつこの中央部での持ち上がりをなくすにはダ
イキャスト製のリブおよびプリント基板の穴あけの精度
を向上しなければならず、製作上のコスト高に至るとい
う高密度化実装上の問題がある。
However, the following problems occur due to the dimensional accuracy of the ribs 2, the manufacturing precision, and the flexibility of the material of the printed circuit board 3. First
FIG. 10 is a diagram illustrating a state where the printed circuit board is attached to the rib. In the figure, the distance between the holes 7 for fixing the screws 4 of the rib 2 is displaced in a direction smaller than that of the printed circuit board 3. In this case, when the printed circuit board 3 is fastened to the ribs 2 with the screws 4, the flexibility of the material of the printed circuit board 3 causes the central portion to be lifted and warpage occurs. Therefore, the adhesion between the surface of the ground pattern 6 of the printed circuit board 3 and the surface of the rib 2 is lost. If this adhesion is lost, electromagnetic waves will leak from the gap between the ground pattern 6 and the rib 2, and the shield of each circuit part (11, 12, 13, 14) cannot be maintained. For example, the main cause of the central portion of the printed circuit board 3 being lifted is due to the dimensional accuracy of the manufacturing, but conversely to the above, if the distance between the screw holes 7 of the rib 2 is larger than that of the printed circuit board 3, the mounting becomes impossible and the yield is increased. It becomes worse and you have to re-drill. Therefore, in order to eliminate this yield, etc., and to eliminate the lifting at the center, it is necessary to improve the accuracy of the die-cast ribs and the holes in the printed circuit board, which leads to high manufacturing costs. I have a problem.

したがって本考案は上記問題点に鑑み、密着性がよく、
さらに低コストのシールド構造を提供することを目的と
する。
Therefore, in consideration of the above problems, the present invention has good adhesion,
It is another object of the present invention to provide a shield structure with low cost.

〔課題を解決するための手段〕[Means for Solving the Problems]

第1図は本考案の原理構成を示す部分断面図である。本
考案は導電性部材5を有する。該導電性部材5はシャー
シ1と一体に形成されているリブ2およびプリント基板
3の間に挾まれかつ導電性および弾性を有する。さらに
該導電性部材は前記プリント基板3に設けられた孔8を
介してプリント基板3に固定される複数の突出部9を備
える。
FIG. 1 is a partial sectional view showing the principle configuration of the present invention. The present invention has a conductive member 5. The conductive member 5 is sandwiched between the rib 2 formed integrally with the chassis 1 and the printed circuit board 3 and has conductivity and elasticity. Further, the conductive member has a plurality of protrusions 9 fixed to the printed circuit board 3 through holes 8 formed in the printed circuit board 3.

〔作用〕[Action]

第1図において、リブ2およびプリント基板3の間の導
電性部材5は、導電性を有するためリブ2と共にプリン
ト基板3に搭載される回路相互のシールドを行う。リブ
2およびプリント基板3の間の中央部にネジ止めを原因
として、プリント基板3が持ち上がっても、その間で挾
まれ圧縮されている導電性部材5は弾性を有するため膨
張してリブ2とプリント基板との間に形成されるはずの
すき間を埋めて回路相互のシールドが不完全になるのを
防止する。さらに導電性部材5に形成される突出部9に
よって、導電性部材5はプリント基板3に固定されるの
で組立・分解点検が容易になる。
In FIG. 1, since the conductive member 5 between the rib 2 and the printed circuit board 3 has conductivity, it shields the circuits mounted on the printed circuit board 3 together with the rib 2 from each other. Even if the printed circuit board 3 is lifted up due to the screwing at the central portion between the rib 2 and the printed circuit board 3, the conductive member 5 that is sandwiched and compressed between the ribs 2 and the printed circuit board 3 has elasticity and expands so that the rib 2 and the printed circuit board 3 are printed. The gap that should be formed between the circuit board and the circuit board is filled to prevent incomplete shielding between the circuits. Further, since the conductive member 5 is fixed to the printed circuit board 3 by the protrusion 9 formed on the conductive member 5, the assembly / disassembly inspection is facilitated.

〔実施例〕〔Example〕

以下、本考案の実施例について図面を参照して説明す
る。第2図は本考案の第1の実施例であるシールド構造
を説明する図である。本図において第9図と異なる構成
要素は導電性部材5である。導電性部材5は市場で入手
可能な導電性でかつ弾性を有する部材であり、容易に成
型加工をすることができる導電性ゴムである。該導電性
部材5はその断面が円形状であり、リブ2またはアース
パターン6の形状に合せて加工され、複数の突出部9を
備える。さらに第9図と異なる構成要素は導電性部材5
を固定するために前記突出部9に対応してプリント基板
3のアースパターン6に設けられた複数の孔8であり、
また前記導電性部材5を密着させるためにシャーシ1の
リブ2の上面に設けられたリブ溝10である。第4A図は第
2図の導電性部材のプリント基板への固定を示す部分断
面図である。本図において、突出部9は導電性部材5上
に柱部9-1を形成し、その先に段部を有しかつ先細の先
端部9-2を有する。プリント基板3の孔8は前記柱部9-1
と同じ形状を有する。先端部9-2を孔8へ当接して押し
込むと、先端部9-2はその弾性により収縮して孔8を通
過し、通過後元の形状に戻る。先端部9-2の段部の寸法
は孔8のものより大きいので、突出部9はプリント基板
3へ挿着され、押し込むときと同程度の逆の力が加えら
れない限り外れない。このようにして導電性部材5はプ
リント基板3へ固定される。第4B図は第2図の導電性部
材リブへの密着を示す部分断面図である。本図におい
て、リブ2の上面には導電性部材5の形状に合せたリブ
溝10が設けられている。導電性部材5はこのリブ溝10に
当接し、ネジ4で締め付けられるとプリント基板3およ
びリブ2によって圧縮力が加えられ、プリント基板3の
アースパターン6およびリブ2に密着する。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a view for explaining the shield structure which is the first embodiment of the present invention. In this figure, a component different from that shown in FIG. 9 is a conductive member 5. The conductive member 5 is a commercially available conductive and elastic member, and is a conductive rubber that can be easily molded. The conductive member 5 has a circular cross section, is processed according to the shape of the rib 2 or the ground pattern 6, and is provided with a plurality of protrusions 9. Furthermore, the component different from that of FIG. 9 is the conductive member 5.
A plurality of holes 8 provided in the ground pattern 6 of the printed circuit board 3 in order to fix the
Further, a rib groove 10 is provided on the upper surface of the rib 2 of the chassis 1 for closely contacting the conductive member 5. FIG. 4A is a partial sectional view showing fixing of the conductive member of FIG. 2 to a printed circuit board. In this figure, the projecting portion 9 has a pillar portion 9-1 formed on the conductive member 5, and has a stepped portion at the tip thereof and a tapered tip portion 9-2. The hole 8 of the printed circuit board 3 has the pillar portion 9-1.
Has the same shape as. When the tip portion 9-2 abuts against the hole 8 and is pushed in, the tip portion 9-2 contracts due to its elasticity, passes through the hole 8, and returns to its original shape after passing. Since the dimension of the stepped portion of the tip portion 9-2 is larger than that of the hole 8, the projecting portion 9 cannot be removed unless it is inserted into the printed circuit board 3 and a force of the same degree as when pushing is applied. In this way, the conductive member 5 is fixed to the printed board 3. FIG. 4B is a partial sectional view showing the close contact with the conductive member rib of FIG. In the figure, a rib groove 10 matching the shape of the conductive member 5 is provided on the upper surface of the rib 2. The conductive member 5 is brought into contact with the rib groove 10 and when tightened with the screw 4, a compressive force is applied by the printed circuit board 3 and the rib 2, and the conductive member 5 is brought into close contact with the ground pattern 6 and the rib 2 of the printed circuit board 3.

次に導電性部材のシールド機能を説明する。第6図は導
電性部材のシールドを示す図である。本図において、導
電性部材5はネジ4とネジ4との間の中央部にすき間が
生ずると、その形状に合せて変形し、すき間を埋めてし
まう。また導電性部材5は、その弾性によりネジがゆる
むこともなく、従来、ネジがゆるむことによって密着性
が破れていたのを防止できるようになる。このようにし
て弾性を有する導電性部材5を介してリブ2とプリント
基板3のアースパターン6は密着することになる。この
導電性部材5は導電性を有するので、各回路部(11,1
2、13,14)で形成される前記すき間部分を通過しようと
する電磁波をシールドする。したがって、このようにシ
ールドの問題が解決できるのでリブ2のダイキャスト製
造ではその穴7の間隔をプリント基板3のものよりも少
し小さくなるように製造しておけばよく、高精度が要求
されるということはなくなる。さらに、導電性部材5の
突出部9により、導電性部材5の取り付けが容易になり
組立の迅速化が図れる。また無線通信機は定期検査、故
障等により電子部品を搭載したプリント基板3をシャー
シ1から取りはずすことを必要とされる場合がある。こ
の場合、導電性部材5がプリント基板3に固定されてい
るので、プリント基板3を検査後、修理後にシャーシに
戻すときに従来のように取りはずした導電性部材5をリ
ブ2の溝に沿ってはめこんでもとに戻す工程が省略でき
る。また取りはずした導電性部材5を紛失するのを防止
する管理工程が省略できる。多数の無線通信機の分解点
検が容易になり、工数の大幅な削減となる。
Next, the shield function of the conductive member will be described. FIG. 6 is a diagram showing a shield of a conductive member. In the figure, when a gap is formed in the central portion between the screws 4 and the conductive member 5, the conductive member 5 is deformed according to the shape and fills the gap. Further, the elastic property of the conductive member 5 prevents the screw from loosening, and it is possible to prevent the adhesiveness from being broken due to the loosening of the screw in the past. In this way, the rib 2 and the ground pattern 6 of the printed circuit board 3 are brought into close contact with each other via the elastic conductive member 5. Since this conductive member 5 has conductivity, each circuit portion (11, 1
2, 13 and 14) to shield electromagnetic waves that try to pass through the gap. Therefore, since the problem of the shield can be solved in this way, in the die-cast manufacturing of the rib 2, it is sufficient to manufacture the ribs 7 so that the distance between the holes 7 is slightly smaller than that of the printed board 3, and high precision is required. That will disappear. Furthermore, the protruding portion 9 of the conductive member 5 facilitates attachment of the conductive member 5 and speeds up assembly. Further, the wireless communication device may be required to remove the printed circuit board 3 on which the electronic component is mounted from the chassis 1 due to a periodic inspection, a failure, or the like. In this case, since the conductive member 5 is fixed to the printed circuit board 3, when the printed circuit board 3 is inspected and then returned to the chassis after repair, the conductive member 5 removed in the conventional manner along the groove of the rib 2. It is possible to omit the step of fitting and returning. Further, the management step of preventing the removed conductive member 5 from being lost can be omitted. This makes it easier to disassemble and inspect a large number of wireless communication devices, resulting in a significant reduction in man-hours.

第3図は本考案の第2の実施例であるシールド構造を示
す図である。本図において第2図と異なる構成要素は導
電性部材5′である。導電性部材5′はシート状である
点を除き第2図の導電性部材5と同じである。また導電
性部材5がシート状をなすからリブ2の上面は導電性部
材5と密着させるため、平坦にする。第5A図は第3図の
導電性部材のプリント基板への固定を示す部分断面図、
および第5B図は第3図の導電性部材へのリブへの密着を
示す部分断面図である。第5A図において導電性部材5′
のプリント基板3への固定は第4A図の場合と全く同様で
ある。第5B図において、導電性部材5′はシート状であ
るけれど第4B図と同様の効果で、リブ2と密着する。第
2図と比較すると、リブ2の溝を省略できる点で有利で
ある。本実施例によるシールドの効果、製作上、組立の
効果は第1の実施例と重複するので説明を省略する。
FIG. 3 is a diagram showing a shield structure according to a second embodiment of the present invention. In this figure, a component different from that shown in FIG. 2 is a conductive member 5 '. The conductive member 5'is the same as the conductive member 5 of FIG. 2 except that it is a sheet. Further, since the conductive member 5 has a sheet shape, the upper surface of the rib 2 is brought into close contact with the conductive member 5 and is therefore flat. FIG. 5A is a partial sectional view showing fixing of the conductive member of FIG. 3 to a printed circuit board,
And FIG. 5B is a partial cross-sectional view showing the adhesion of the rib to the conductive member of FIG. Conductive member 5'in FIG. 5A
The fixing to the printed circuit board 3 is exactly the same as in the case of FIG. 4A. In FIG. 5B, the conductive member 5'is in the form of a sheet, but the conductive member 5'is in close contact with the rib 2 with the same effect as in FIG. 4B. Compared with FIG. 2, it is advantageous in that the groove of the rib 2 can be omitted. Since the effect of the shield according to the present embodiment and the effect of assembling in terms of manufacturing overlap with those of the first embodiment, the description thereof will be omitted.

〔考案の効果〕[Effect of device]

以上詳細に説明したように本考案によれば、リブおよび
プリント基板の間に挾まれ、かつ弾性を有する導電性部
材を備え、さらに該導電性部材にはプリント基板に設け
られた孔を介してプリント基板に固定される複数の突出
部を設けたのでプリント基板に区分された回路部分を相
互にシールドしさらに無線通信機の組立・分解点検を容
易にする。
As described in detail above, according to the present invention, an elastic conductive member sandwiched between the rib and the printed circuit board is provided, and the conductive member is further provided with a hole provided in the printed circuit board. Since the plurality of protrusions fixed to the printed circuit board are provided, the circuit portions sectioned on the printed circuit board are mutually shielded and the assembly / disassembly inspection of the wireless communication device is facilitated.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の原理構成を示す部分断面図、 第2図は本考案の第1の実施例であるシールド構造を示
す図、 第3図は本考案の第2の実施例であるシールド構造を示
す図、 第4A図は第2図の導電性部材のプリント基板への固定を
示す部分断面図、 第4B図は第2図の導電性部材のリブへの密着を示す部分
断面図、 第5A図は第3図の導電性部材のプリント基板への固定を
示す部分断面図、 第5B図は第3図の導電性部材のリブへの密着を示す部分
断面図、 第6図は導電性部材のシールドを示す図、 第7図はシャーシ内の移動機の回路ブロック化を説明す
る図、 第8図は第7図の回路ブロック化を補足説明する図、 第9図は第7図の移動機の各回路部のシールド構造を示
す図、 第10図はプリント基板をリブに取り付けた状態を示す図
である。 図において 1……シャーシ、2……リブ、 3……プリント基板、5……導電性部材、 8……導電部材の固定用のプリント基板孔、 9……突出部。
FIG. 1 is a partial sectional view showing the principle structure of the present invention, FIG. 2 is a view showing a shield structure which is a first embodiment of the present invention, and FIG. 3 is a shield which is a second embodiment of the present invention. FIG. 4A is a partial cross-sectional view showing the fixing of the conductive member of FIG. 2 to the printed circuit board, and FIG. 4B is a partial cross-sectional view showing the adhesion of the conductive member of FIG. 2 to the ribs. 5A is a partial cross-sectional view showing the fixing of the conductive member of FIG. 3 to the printed circuit board, FIG. 5B is a partial cross-sectional view showing the adhesion of the conductive member of FIG. 3 to the rib, and FIG. FIG. 7 is a diagram showing a shield of a flexible member, FIG. 7 is a diagram for explaining circuit block formation of a mobile device in a chassis, FIG. 8 is a diagram for additionally explaining the circuit block formation of FIG. 7, and FIG. 9 is FIG. FIG. 10 is a diagram showing a shield structure of each circuit portion of the mobile device, and FIG. 10 is a diagram showing a state in which a printed circuit board is attached to a rib. In the figure, 1 ... Chassis, 2 ... Rib, 3 ... Printed circuit board, 5 ... Conductive member, 8 ... Printed circuit board hole for fixing the conductive member, 9 ... Projection part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】シャーシ(1)と一体に形成されるリブ
(2)の上面部にプリント基板(3)を密着させてシー
ルドするプリント基板のシールド構造において、 前記リブ(2)およびプリント基板(3)の間に挾ま
れ、かつ弾性を有する導電性部材(5)を備え、さらに
該導電性部材(5)には前記プリント基板(3)に設け
られた孔(8)を介して該プリント基板(3)に固定さ
れる複数の突出部(9)を備えることを特徴とするプリ
ント基板のシールド構造。
1. A shield structure for a printed circuit board, wherein a printed circuit board (3) is closely adhered to the upper surface of a rib (2) formed integrally with a chassis (1) to shield the rib (2) and the printed circuit board (1). 3) is provided with a conductive member (5) sandwiched between them and having elasticity, and further, the conductive member (5) is provided with the print through a hole (8) provided in the printed board (3). A shield structure for a printed circuit board, comprising a plurality of protrusions (9) fixed to the substrate (3).
JP8905389U 1989-07-31 1989-07-31 Printed circuit board shield structure Expired - Lifetime JPH0639508Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8905389U JPH0639508Y2 (en) 1989-07-31 1989-07-31 Printed circuit board shield structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8905389U JPH0639508Y2 (en) 1989-07-31 1989-07-31 Printed circuit board shield structure

Publications (2)

Publication Number Publication Date
JPH0328797U JPH0328797U (en) 1991-03-22
JPH0639508Y2 true JPH0639508Y2 (en) 1994-10-12

Family

ID=31638645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8905389U Expired - Lifetime JPH0639508Y2 (en) 1989-07-31 1989-07-31 Printed circuit board shield structure

Country Status (1)

Country Link
JP (1) JPH0639508Y2 (en)

Also Published As

Publication number Publication date
JPH0328797U (en) 1991-03-22

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