JPH0637780U - Burn-in board for semiconductor devices - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a burn-in board for a semiconductor device, which enables accurate testing during the burn-in process. [Structure] In a semiconductor device burn-in board to which a plurality of semiconductor devices to be subjected to a burn-in process can be detachably mounted, a test signal is applied in parallel to the same type of terminals of the mounted semiconductor devices. It has a common wiring for extracting test signals from the same type of terminals in parallel, and the common wiring connected to the input / output terminals of the common wiring has a protective resistor connected between each input / output terminal. Each of the protection resistors is connected to a switch element that is selectively closed so as to short-circuit the protection resistor. [Effect] During the burn-in process, individual semiconductor devices can be tested without being distorted in the waveform due to the protective resistance until they are mounted on the burn-in board. Therefore, the labor of the test is very simple, and a very accurate test result can be obtained.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a so-called DUT board, which is a burn-in board for semiconductor devices, on which a plurality of semiconductor devices to be subjected to a burn-in process can be detachably mounted.

[0002]

[Prior art]

 It is well known that some semiconductor devices such as semiconductor integrated circuit elements (IC) have an initial failure, and in order to eliminate this, each semiconductor device is subjected to a burn-in process at the stage of manufacturing completion. Is being done. When performing such burn-in, a so-called DUT board, which is a burn-in board for semiconductor devices as shown in the schematic plan view of FIG. 2 of the accompanying drawings, is used in order to improve the mass production effect.

As shown in FIG. 2, the conventional burn-in board 1 for a semiconductor device is constituted by, for example, a printed circuit board, and a large number of semiconductor devices 2 can be detachably mounted. There is. In the example shown in FIG. 2, 8 × 22 = 176 semiconductor devices 2 can be mounted and burn-in can be performed at one time. Usually, 100 to 300 semiconductor devices can be mounted on one burn-in board for semiconductor devices.

FIG. 3 is an enlarged plan view of a portion of the wiring provided on the burn-in board 1 for a semiconductor device of FIG. As shown in a partially enlarged view in FIG. 3, terminals of the same type among terminals (pins) of a large number of semiconductor devices 2 mounted on a conventional burn-in board 1 for a semiconductor device are connected in parallel. Common wirings 31, 32, 33, 34, 35, 36 and the like are provided. These common wirings are for applying test signals in parallel to the terminals of the same type among the terminals of the semiconductor device mounted on the board and for extracting test signals from the terminals of the same type in parallel. is there. Among these common wirings, the common wirings 31, 32, 33, 34 connected to the input / output terminals (I / O pins) have protection resistors R1, R2, R3, R4 between them. Are connected. When four protection resistors R1 to R4 are provided as in the example shown in FIG. 3, one semiconductor device has four outputs such as x4 in the semiconductor device 2. In the case of a semiconductor device of × 8, each protection pin is necessary because it enters each output pin. The purpose of inserting these protection resistors R1 to R4 is to suppress the influence on the output terminals of other semiconductor devices as much as possible when the output of one semiconductor device is short-circuited.

[0005]

[Problems to be solved by the device]

 When only the burn-in is performed in such a conventional burn-in board for semiconductor devices, these protection resistors R1 to R4 are required to fulfill the original purpose of protection. When testing individual semiconductor devices during the burn-in process, the existence of these protective resistors was rather an obstacle.

That is, the test signal must be read through these protection resistors, and the test signal is distorted due to this protection resistor, and the test signal cannot be read accurately. Therefore, in the past, in order to test each semiconductor device 2, each semiconductor device 2 was removed from the semiconductor device burn-in board 1 and put on a tester one by one. This is a problem because it takes too much time to test a large number of semiconductor devices.

An object of the present invention is to provide a burn-in board for a semiconductor device, which can solve the above-mentioned conventional problems.

[0008]

[Means for Solving the Problems]

 According to the present invention, in a burn-in board for a semiconductor device in which a plurality of semiconductor devices to be subjected to a burn-in process can be detachably mounted, a test signal is applied to the same type of terminals of each of the mounted semiconductor devices. Common wiring for applying parallel or extracting test signals from the same type of terminals in parallel is provided.The common wiring connected to the input / output terminals of the common wiring should be connected to each input / output terminal. A protection resistor is connected, and each of the protection resistors is connected with a switch element that is selectively closed to short the protection resistor.

[0009]

【Example】

 The invention will now be described in more detail with reference to an embodiment of the invention, in particular with reference to the accompanying drawings.

FIG. 3 is an enlarged plan view showing a part of the common wiring provided on the burn-in board for semiconductor devices as one embodiment of the present invention. 3, the same components as those of the conventional example of FIG. 3 are designated by the same reference numerals. According to the present invention, the switch element SW1 is connected to both ends of the protection resistor R1 connected between the input / output terminal (I / O 0) of the semiconductor device 2 and the common wiring 31 therefor. Although not shown in FIG. 1, according to the present invention, switching elements are similarly connected to all the other protection resistors.

According to the structure of the burn-in board for a semiconductor device of the present invention, each switch element SW1 is turned off during the burn-in process, and the protection resistors R1 to R4 serve as protection resistors for each input / output terminal. It can fulfill its original function. On the other hand, if you want to test the semiconductor device 2 during the burn-in process, turn on only the switch element SW1 corresponding to the semiconductor device you want to test, and turn off the other switch elements. It is possible to short-circuit the protective resistance connected to the input / output terminals of the semiconductor device that performs the above, and remove the protective resistance, and connect the protective resistance to the input / output terminals of other semiconductor devices. In this state, the output of the semiconductor device under test is read without being distorted by the protective resistance.

Then, wiring terminals for connection with a tester are provided on such a burn-in board for semiconductor devices, and each switch element is scanned in the ON state during the burn-in process in the state of being connected to the tester. This makes it possible to test all the semiconductor devices mounted on the burn-in board one by one. In this case, it is not necessary to remove each semiconductor device from the burn-in board for the test.

[0013]

[Effect of device]

 As described above, according to the present invention, during the burn-in process, individual semiconductor devices can be tested without being distorted in the waveform due to the protective resistance until they are mounted on the burn-in board. Therefore, the labor of the test becomes very easy, and the very accurate test result can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic view showing a part of a wiring circuit on a burn-in board for a semiconductor device as an embodiment of the present invention.

FIG. 2 is a schematic plan view generally showing a conventional example of a burn-in board for a semiconductor device.

FIG. 3 is a schematic diagram showing one semiconductor device on the burn-in board for semiconductor devices of FIG. 2 and a portion of a wiring circuit related thereto.

[Explanation of symbols]

 1 Burn-in board for semiconductor devices 2 Semiconductor devices R1 to R4 Protection resistors SW1 switches 31 to 36 Common wiring

Claims (1)

[Scope of utility model registration request] 1. A burn-in board for a semiconductor device in which a plurality of semiconductor devices to be subjected to a burn-in process can be detachably mounted, and a test signal is connected in parallel to the same type of terminals of each of the mounted semiconductor devices. A common wire for applying or extracting test signals from the same type of terminals in parallel is provided. Among the common wires, the common wire connected to the input / output terminal has a protective resistance between each A burn-in board for a semiconductor device, wherein a switch element that is selectively closed so as to short-circuit the protective resistance is connected to each of the protective resistances.