JPH0637460A - Dust cleaner for print-circuit board - Google Patents

Abstract

PURPOSE:To improve more a dust filter effect, by making the direction of the line pattern provided on a print-circuit board parallel with the scanning direction of a dust filter head. CONSTITUTION:A print-circuit board is set on a board setting table 1, and the table 1 is so turned that the direction of the line pattern provided on the surface of the print-circuit board and the scanning direction of a dust filter head 2 are parallel with each other. Then, the print-circuit board is passed the place laid under the dust filter head 2 while moving the table 1 to the place shown by 1'. Thereby, the dust which is blown off by the very high-speed wind fed from a port 5 for blowing out the very high-speed wind is sucked by a port 4 for sucking a collected dust, and the dust filter of the one side of the print-circuit is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dust remover for dust adhering to the surface of a printed circuit board, and more particularly to a dust remover for an inner layer substrate of a multilayer printed circuit board having a signal line layer substrate having a fine line pattern on the surface. .

[0002]

2. Description of the Related Art With the progress of high integration of semiconductor elements, the density and the number of layers of a printed circuit board on which the semiconductor element is mounted have been increased, and as a result, a print having a structure in which an insulating gap of 0.1 mm or less can be obtained. Substrates are needed. In a printed circuit board having such a high-density structure, even if a small amount of dust is mixed in at the time of multi-layer adhesion, it causes a decrease in electric insulation and often induces an electric short circuit due to breakdown.

In order to prevent dust from entering during the multi-layer bonding, various methods have been conventionally proposed as a method for removing dust on the surface of the inner layer substrate before the multi-layer bonding. Among them, the simplest method is a dust collecting method using an electric vacuum cleaner method. In addition, a method has also been proposed in which the dust collecting brush is rotated and the splashed dust is collected by a suction device to enhance the dust removing effect. Further, there is also a method of rolling an adhesive roller on the surface of the substrate to remove dust (see, for example, JP-A-62-102882).

In any of the above methods, the dust removing head is brought into contact with the surface of the printed circuit board to remove dust. On the other hand, there is also a method of removing dust without contacting the dust removing head with the surface of the printed circuit board. In the case of this method, in order to temporarily remove the dust adhering to the substrate surface from the substrate surface, an air flow is used instead of using a bristle brush or an adhesive roller as in the above-mentioned example. That is, the ultra-high-speed air is blown onto the surface of the substrate to blow off the dust adhering to the surface of the printed circuit board, and the blown dust is sucked and collected by another suction port.

[0005]

In the above-mentioned conventional dust removing method, the following problems arise when the density of the target printed circuit board is increased as described above. That is, in both the vacuum cleaner system and the combination system with the rotary brush, there is a problem that it is difficult to prevent the bristles from remaining or adhering to the substrate surface due to the breaking of the bristles of the brush.
To avoid this, if the hair is thickened in order to increase the strength of the hair, the thickness of the hair becomes larger than the gap size of the fine pattern, and the dust removing effect is reduced. In addition, when a plastic brush is used to increase the strength of the bristles without increasing the thickness of the bristles, the risk of the fine printed wiring pattern being peeled off from the insulating base material increases.

On the other hand, the adhesive roller method does not have a problem that the broken hair of the brush is mixed in, but it is impossible to completely remove the dust caught in the gaps of the fine pattern, or conversely, the dust is pushed into the gaps of the fine pattern. There is a problem that it ends up.

Since the method utilizing ultra-high speed air is a non-contact method, there is no problem as described above, but a mechanism for firmly fixing the substrate is required in order to blow a strong air flow to the substrate, which complicates the apparatus. There is a problem of becoming. Further, if the blowing direction of the ultra-high speed air and the traveling direction of the printed wiring pattern are not parallel, there is a problem that the dust removing effect is significantly reduced.

An object of the present invention is to provide a dust removing device for a printed circuit board in which the line pattern direction of the substrate and the scanning direction of the dust removing head are parallel to each other to further enhance the dust removing effect.

[0009]

To achieve the above object, in the present invention, in a device for removing dust adhering to the surface of a printed circuit board, a table for adsorbing and fixing the board, the substrate surface and a predetermined surface are provided. A dust removing head arranged with a gap, means for scanning the dust removing head on the substrate surface, and rotating the table so that the direction of the line pattern on the substrate surface and the scanning direction of the dust removing head are parallel. Means and means for setting the substrate on the table by turning it over.

[0010]

1) Prior to setting the substrate, the surface of the substrate setting table is scanned by the dust removing head to remove the dust from the table surface. 2) Set the board on the board setting table. 3) The set table is rotated so that the direction of the set line pattern on the surface of the printed circuit board and the running direction of the dust removal head are parallel to each other. 4) The dust removing head is scanned while maintaining a slight gap with the substrate surface. 5) Remove the substrate from the set table and turn it over. 6) Dust the surface of the substrate setting table in the same manner as in 1) above. 7) Set the substrate turned upside down again on the table. 8) The substrate setting table is rotated in the same manner as 3) above so that the direction of the line pattern on the surface of the printed circuit board and the running direction of the dust removing head are parallel. 9) Scan the dust removal head as in 4) above. 10) Remove the board from the table. Hereinafter, the above 1) to 10) are repeated. As a result, dust is removed from the substrate set table in advance, so that the transfer of dust from the table to the substrate is prevented. Further, since no dust is transferred from the table, the substrate can be firmly fixed to the table by vacuum suction and the substrate can be turned upside down. Further, since the direction of the line pattern on the surface of the substrate and the running direction of the dust removing head are parallel to each other, it is possible to easily separate the adhering dust between the printed wiring patterns having a minute gap.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a view showing a side surface of the dust removing apparatus of the present invention, and FIG. 2 is a view showing an upper surface of the dust removing apparatus of the present invention. FIG. 3 is a diagram showing details of the substrate reversing unit. In FIGS. 1 and 2, reference numeral 1 (1 ′, 1 ″) is a substrate set table on which a substrate 3 is placed and adsorbed, 2 is a dust removing head, and a suction dust collecting port 4 and an ultra-high speed air blowing port 5 are adjacent to each other. 3 is a printed circuit board having a line pattern for dust removal, 6 (6 ') is a clamp plate, and 7 is a
Is a suction plate for sucking the substrate, 8 is a motor for rotating the clamp plate, 9 is a motor for vertically moving the suction plate, and 10 is a motor for moving the substrate set table.

The operation will be described with reference to the drawings. Prior to setting the substrate on the substrate setting table, the surface of the substrate setting table is scanned by the dust removing head to remove the dust from the table surface. As shown in FIG. 2, first, a substrate 3 for removing dust
Are set on the substrate setting table 1. Then, the substrate is vacuum-sucked to the substrate setting table 1 by a suction pump (not shown), and the substrate setting table 1 is rotated so that the line pattern of the substrate is parallel to the traveling direction (right to left in FIG. 1).

Next, by moving the motor 10 for moving the substrate set table, the substrate 3 passes under the dust removing head 2 from right to left. At this time, since the dust removal head 2 has the suction dust collection port 4 on the substrate entry side and the ultra-high-speed air blowing port 5 on the substrate exit side, the dust blown off by the ultra-high-speed air from the ultra-high-speed air blowing port 5 , Is sucked by the suction dust collecting port 4. By passing the substrate 3 under the dust removal head 2 in this manner, dust is removed from one side of the substrate 3 without scattering dust around the substrate.

When the substrate setting table 1 comes directly under the suction plate 7 (state 1'in FIG. 1), the suction plate vertical movement motor 9 is operated to lower the suction plate 7. And suction board 7
The substrate 3 on the substrate set table 1 is sucked by the suction cup of No. 2. The vacuum suction of the substrate set table 1 is stopped, the suction plate vertical movement motor 9 is driven, the suction plate 7 is raised, the substrate 3 is separated from the substrate set table 1, and the clamp plate 6
The substrate 3 is moved to the position.

Subsequently, the clamp plate 6 is advanced to the position of the substrate 3 by a cylinder (not shown), and the substrate 3 is held by the clamp plate 6 (in FIG. 3, the state where the clamp plate 6'is holding the substrate 3 is shown. ing). When the clamp plate 6 holds the substrate 3, the suction plate 7 stops sucking and the suction plate 7 is raised to the upper limit position. The clamp plate rotating motor 8 is rotated to invert the substrate 3 by 180 ° (FIG. 3). When the substrate 3 is inverted, the suction cup 7 is lowered and the substrate 3 is sucked by the suction cup. Clamp plate 6 when adsorption is completed
Open and retract by cylinder.

During such a substrate reversing operation, the substrate set table 1 is moved to the motor 1 for moving the substrate set table.
0 to retract to the entrance of the dust remover (ie
1'to the right to return to the original position 1), and again pass under the dust removal head 2 without setting the substrate 3 to remove the dust adhering from the substrate 3.

Next, the suction board 7 for sucking the substrate 3 is lowered onto the cleaned substrate set table 1,
Substrate 3 is again adsorbed with the substrate surface after dust removal facing down. When the substrate 3 is vacuum-sucked on the substrate set table 1, the suction plate 7 is raised again. Then, the substrate setting table 1 is retracted to the entrance of the dust removing device by the substrate setting table moving motor 10. After that, the motor 10 for moving the substrate set table is moved to allow the substrate 3 to pass under the dust removal head 2 again. This completes the dust removal on both sides of the substrate. Exit position of the dust remover (position 1 "in Fig. 1)
When the substrate set table 1 comes to the substrate, the dust-free substrate 3 is taken out.

[0018]

As described above, according to the present invention, since the dust is removed by the non-contact method, the dust can be removed even on the substrate on which the fine pattern is formed without damaging the surface thereof. it can. Further, when the substrate has a line pattern, the traveling direction of the substrate (scanning direction of the dust removing head) can be made parallel to the line pattern by rotating the substrate set table, so that the dust removing effect can be further enhanced. . Furthermore, since the dust removal head in which the ultra-high-speed air blow-out port and the dust suction port are paired is used, the blown-off dust can be immediately sucked, and the substrate can be removed without polluting the surroundings.

[Brief description of drawings]

FIG. 1 is a side view of a dust remover of the present invention.

FIG. 2 is a top view of the dust remover of the present invention.

FIG. 3 is a diagram showing details of a substrate reversing unit.

[Explanation of symbols]

 1 substrate set table 2 dust removal head 3 substrate 4 suction dust collection port 5 ultra-high speed air outlet 6 clamp plate 7 suction plate 8 rotation motor 9 suction plate vertical movement motor 10 substrate set table movement motor

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuaki Oki 1 Horiyamashita Horiyamashita, Hadano City, Kanagawa Prefecture

Claims (1)

[Claims] 1. A device for removing dust adhering to the surface of a printed circuit board, a table for adsorbing and fixing the substrate, a dust removing head arranged with a predetermined gap from the surface of the substrate, and the dust removing head for the substrate. Means for scanning the surface, means for rotating the table so that the direction of the line pattern on the surface of the substrate and the scanning direction of the dust removal head are parallel, and the substrate is set upside down on the table. A dust removing device for a printed circuit board, comprising: