CN114867225A

CN114867225A - Paster device for integrated circuit processing

Info

Publication number: CN114867225A
Application number: CN202110166157.1A
Authority: CN
Inventors: 李素叶; 李玉翠
Original assignee: Jinan vocational college
Current assignee: Jinan vocational college
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2022-08-05
Anticipated expiration: 2041-02-03
Also published as: CN114867225B

Abstract

The invention discloses a chip mounting device for integrated circuit processing, and belongs to the field of integrated circuit processing. A chip mounting device for integrated circuit processing comprises a working main body and a circuit board, wherein a supporting plate is fixedly connected to one side of the working main body, a plurality of groups of supporting legs are fixedly connected to the lower end of the supporting plate, a rotating piece is rotatably connected to the supporting plate, the rotating piece is partially rotated in the working main body, a plurality of groups of placing grooves are formed in the rotating piece, the circuit board is matched with the placing grooves, rubber pads are connected to the surfaces, contacted with the circuit board, of the placing grooves, and a plurality of groups of supporting balls are rotatably connected in the supporting plate and the working main body; according to the dust removal device, dust on the circuit board is conveniently absorbed through the working cavity, the rotating main shaft, the first rotating fan blade and the dust absorption port, and the circuit board is conveniently absorbed in the placing groove through the sliding rod, the stop block, the baffle plate, the sliding groove and the thrust spring, so that dust removal is conveniently carried out on the circuit board.

Description

Paster device for integrated circuit processing

Technical Field

The invention relates to the technical field of integrated circuit processing, in particular to a chip mounting device for integrated circuit processing.

Background

The integrated circuit is a miniature electronic device or part, adopt certain craft, interconnect elements such as transistor, resistance, electric capacity and inductance that a circuit needs together with the routing, make on a small or several small semiconductor wafers or medium substrates, then encapsulate in a tube, become the microstructure with necessary circuit function, wherein all elements have already made up a whole structurally, make the electronic component step forward towards microminiaturization, low-power consumption, intellectuality and high reliability;

at present, a chip mounter is needed to be used when the chip mounting operation is carried out on an integrated circuit board, but the cleanliness of the circuit board before the chip mounting possibly cannot meet the requirement, and the surface of the circuit board needs to be dedusted, but the existing technology lacks a structure for cleaning the dust on the surface of the integrated circuit board, so that a chip mounting device for integrated circuit processing is provided.

Disclosure of Invention

The invention aims to solve the problem that the prior art is lack of a structure for cleaning dust on the surface of an integrated circuit board, and provides a chip device for processing an integrated circuit.

In order to achieve the purpose, the invention adopts the following technical scheme:

a chip mounting device for integrated circuit processing comprises a working main body and a circuit board, wherein one side of the working main body is fixedly connected with a supporting plate, the lower end of the supporting plate is fixedly connected with a plurality of groups of supporting legs, a rotating part is rotatably connected onto the supporting plate, the rotating part is partially rotated in the working main body, a plurality of groups of placing grooves are arranged on the rotating part, the circuit board is matched with the placing grooves, the surface of the placing grooves, which is contacted with the circuit board, is connected with a rubber pad, a plurality of groups of supporting balls are rotatably connected into the supporting plate and the working main body, the supporting balls are attached to the rotating part, guide wheels are rotatably connected into the supporting plate and the working main body, annular grooves matched with the guide wheels are arranged on the rotating part, connectors are arranged on two sides of the working main body, the connectors are matched with the rotating part, and the upper ends of the connectors are connected with electrostatic plates, the electrostatic plate is used for adsorbing dust in the air, work main part upper end is connected with dust absorption part, dust absorption part is used for removing the dust on the circuit board, work main part lower extreme is connected with drive disk assembly, drive disk assembly is connected with dust absorption part, drive disk assembly is used for transmitting the rotation for rotating, it has fixed part to rotate the in-connection, fixed part is used for fixing the circuit board.

Preferably, the dust absorption part is including placing the case, it is connected with driving motor to place the incasement, driving motor output fixedly connected with rotates the main shaft, work main part upper end is equipped with the working chamber, it runs through the working chamber to rotate the main shaft, the first rotation flabellum of fixedly connected with multiunit on the rotation main shaft, the working chamber lower extreme is equipped with the dust absorption mouth, dust absorption mouth and circuit board phase-match.

Preferably, the transmission part comprises a rotating groove, one side of the rotating groove is connected with a main air pipe, and one end, far away from the rotating groove, of the main air pipe is matched with the working cavity.

Preferably, the rotation groove is connected with a first rotating shaft in a rotating mode, a second rotating fan blade is fixedly connected to the first rotating shaft, and the second rotating fan blade is matched with the rotation groove.

Preferably, the upper end of the first rotating shaft is rotatably connected with a second rotating shaft, the second rotating shaft is perpendicular to the first rotating shaft, the second rotating shaft is fixedly connected with a rotating gear and a second helical gear, one end of the first rotating shaft, which is close to the second rotating shaft, is fixedly connected with a first helical gear, and the first helical gear is meshed with the second helical gear.

Preferably, the lower end of the rotating part is connected with a transmission gear, and the transmission gear is meshed with the rotating gear.

Preferably, the fixing part comprises a sliding rod, a plurality of groups of air suction holes are formed in the lower end of the placing groove, air suction grooves are formed in the lower end of the air suction holes and communicated with the air suction holes, and the air suction grooves are perpendicular to the air suction holes.

Preferably, the slide bar runs through the slot of breathing in, fixedly connected with dog on the slide bar, dog and slot sliding connection of breathing in, just dog and suction hole phase-match, be equipped with in the work main part with slide bar assorted arc wall, be equipped with the sliding tray on the rotation piece, fixedly connected with baffle on the slide bar, the thrust spring has been cup jointed on the slide bar, the thrust spring both ends respectively with baffle, rotation piece fixed connection.

Preferably, one side of the rotating groove far away from the main air pipe is connected with an exhaust pipe, one side close to the exhaust pipe is provided with a water tank, the exhaust pipe is connected with the water tank, one side of the water tank far away from the exhaust pipe is connected with a connecting pipe, one end of the connecting pipe far away from the water tank is connected with a placing box, and the upper end of the placing box is connected with an air outlet pipe.

Compared with the prior art, the invention provides a chip mounting device for integrated circuit processing, which has the following beneficial effects:

1. the chip mounting device for integrated circuit processing comprises a placing groove, a plurality of groups of circuit boards are placed in the placing groove, the circuit boards can be placed in the placing groove at the same time, the device can work continuously, the working efficiency is improved, a first rotating fan blade rotates, air in a working cavity is blown out, the pressure in the working cavity is reduced, the air is sucked in through a dust suction port, and meanwhile dust on the circuit boards is sucked away simultaneously due to the effect of suction;

2. according to the chip mounting device for integrated circuit processing, gas blown out by a first rotating fan blade enters a rotating groove through a main gas pipe, a second rotating fan blade in the rotating groove is rotated under the pushing of the gas, the rotation is transmitted to a first rotating shaft through the second rotating fan blade, the rotation is transmitted to a second rotating shaft through a second helical gear due to the fact that the upper end of the first rotating shaft is connected with the first helical gear, the rotating gear is fixedly connected with the second rotating shaft and further rotates, and the rotating gear is connected with a rotating piece through fixed teeth and further transmits the rotation to the rotating piece so as to rotate the rotating piece;

3. the chip device for processing the integrated circuit is characterized in that when a rotating part rotates, a circuit board is sent into a working main body, when the circuit board passes through a connector, dust on the circuit board is subjected to preliminary adsorption and dust removal under the action of electrostatic adsorption of an electrostatic plate, meanwhile, the dust in the air of the electrostatic plate is adsorbed, the dust in the air is prevented from entering the working main body, the cleanness in the working main body is ensured, when the circuit board enters the working main body, a sliding rod slides under the blocking of an arc-shaped groove, the sliding rod slides, a stop block slides, the space of one side, close to an air suction hole, of the sliding groove is increased, the pressure is reduced, pressure difference is generated on the upper surface and the lower surface of the circuit board, the circuit board is tightly connected into a placing groove under the action of the pressure difference, the circuit board is conveniently fixed and prevented from moving when the circuit board is subjected to dust collection;

4. this paster device is used in integrated circuit processing, in gas got into the basin through rotating the groove, collected the dust in the gas, the combustion gas got into through the connecting pipe simultaneously and places the incasement, cools down driving motor, guarantees the work that driving motor can be normal.

The dust removing device is characterized in that the working cavity, the rotating main shaft, the first rotating fan blade and the dust suction port are arranged on the circuit board, the first rotating fan blade is arranged on the rotating main shaft, the second rotating fan blade is arranged on the dust suction port, and the sliding rod, the stop block, the baffle plate, the sliding groove and the thrust spring are arranged on the circuit board.

Drawings

FIG. 1 is a schematic side cross-sectional structural view of a chip mounting device for integrated circuit processing according to the present invention;

FIG. 2 is a schematic side view of a chip mounting device for integrated circuit processing according to the present invention;

FIG. 3 is a schematic top cross-sectional view of a chip mounting device for integrated circuit processing according to the present invention;

FIG. 4 is a schematic structural view of a first rotating blade of a chip mounting device for integrated circuit processing according to the present invention;

FIG. 5 is a schematic structural diagram of a portion A in FIG. 1 of a chip mounting device for integrated circuit processing according to the present invention;

fig. 6 is a schematic structural diagram of a portion B in fig. 1 of a chip mounting device for integrated circuit processing according to the present invention.

In the figure: 1. a working body; 101. a support plate; 102. supporting legs; 2. a circuit board; 3. a drive motor; 301. a working chamber; 302. rotating the main shaft; 303. a first rotating fan blade; 304. a main air pipe; 305. a dust suction port; 306. placing a box; 4. a rotating member; 401. a placement groove; 402. a suction hole; 403. a suction groove; 404. a slide bar; 405. a stopper; 407. a baffle plate; 408. a sliding groove; 409. a thrust spring; 5. a rotating groove; 501. a second rotating fan blade; 502. a first rotating shaft; 503. a second rotating shaft; 504. a rotating gear; 505. a first helical gear; 506. a second helical gear; 507. an exhaust pipe; 6. a water tank; 601. a connecting pipe; 602. an air outlet pipe; 7. supporting the balls; 8. a guide wheel; 9. a connection port; 901. an electrostatic plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Example 1:

referring to fig. 1-6, a chip mounting device for integrated circuit processing comprises a working body 1 and a circuit board 2, wherein one side of the working body 1 is fixedly connected with a supporting plate 101, the lower end of the supporting plate 101 is fixedly connected with a plurality of groups of supporting legs 102, the supporting plate 101 is rotatably connected with a rotating part 4, part of the rotating part 4 rotates in the working body 1, the rotating part 4 is provided with a plurality of groups of placing grooves 401, the circuit board 2 is matched with the placing grooves 401, the surface of the placing grooves 401, which is contacted with the circuit board 2, is connected with a rubber pad, the supporting plate 101 and the working body 1 are both rotatably connected with a plurality of groups of supporting balls 7, the supporting balls 7 are attached to the rotating part 4, the supporting plate 101 and the working body 1 are both rotatably connected with a guide wheel 8, the rotating part 4 is provided with an annular groove matched with the guide wheel 8, two sides of the working body 1 are provided with connectors 9, the connectors 9 are matched with the rotating part 4, the upper end of the connecting port 9 is connected with an electrostatic plate 901, the electrostatic plate 901 is used for adsorbing dust in the air, the upper end of the working main body 1 is connected with a dust collection component, the dust collection component is used for absorbing the dust on the circuit board 2, the lower end of the working main body 1 is connected with a transmission component, the transmission component is connected with the dust collection component, the transmission component is used for transmitting the rotation to the rotation piece 4, the rotation piece 4 is internally connected with a fixing component, and the fixing component is used for fixing the circuit board 2.

When the device is used, firstly, the circuit board 2 is placed in the placing groove 401, as the placing groove 401 is provided with a plurality of groups, a plurality of groups of circuit boards 2 can be placed at the same time, so that the device can continuously work, the working efficiency is improved, the driving motor 3 is started, the driving motor 3 rotates to drive the rotating main shaft 302 to rotate, as the rotating main shaft 302 is fixedly connected with a plurality of groups of first rotating blades 303, when the first rotating blades 303 rotate, air in the working cavity 301 is blown out, the pressure in the working cavity 301 is reduced, air is sucked in through the dust suction port 305, and meanwhile, dust on the circuit board 2 is sucked away simultaneously due to the action of suction;

the air blown out by the first rotating fan blade 303 enters the rotating groove 5 through the main air pipe 304, the second rotating fan blade 501 in the rotating groove 5 is rotated under the pushing of the air, the rotation is transmitted to the first rotating shaft 502 through the second rotating fan blade 501, the rotation is transmitted to the second rotating shaft 503 through the second helical gear 506 due to the first helical gear 505 connected to the upper end of the first rotating shaft 502, the rotating gear 504 is rotated due to the fixed connection of the rotating gear 504 and the second rotating shaft 503, and the rotation is transmitted to the rotating member 4 due to the connection of the rotating gear 504 and the rotating member 4 through the fixed teeth, so that the rotating member 4 is rotated;

the rotating member 4 feeds the circuit board 2 into the working body 1 as it rotates, and when the circuit board 2 passes through the connection port 9, the dust on the circuit board 2 is preliminarily adsorbed and dedusted under the action of the electrostatic adsorption of the electrostatic plate 901, meanwhile, dust in the air of the electrostatic plate 901 is adsorbed, so that the dust in the air is prevented from entering the working main body 1, the cleanness of the inside of the working main body 1 is ensured, and when the circuit board 2 enters the working main body 1, the slide bar 404 slides under the blocking of the arc-shaped groove, the slide bar 404 slides, and then the stopper 405 slides, so that the space of the side of the slide groove 408 close to the suction hole 402 is increased, the pressure is reduced, the pressure difference is generated on the upper surface and the lower surface of the circuit board 2, the circuit board 2 is tightly connected in the placing groove 401 under the action of pressure difference, so that the circuit board 2 is fixed and the circuit board 2 is prevented from moving when the circuit board 2 is subjected to dust collection;

in the gas got into basin 6 through rotating groove 5, collected the dust in the gas, the combustion gas got into through connecting pipe 601 and places the case 306 in simultaneously, cooled down driving motor 3, guaranteed that driving motor 3 can normal work.

Example 2:

referring to fig. 1 to 3, a chip mounting apparatus for integrated circuit processing, substantially the same as in embodiment 1, further comprising: dust absorption part is including placing case 306, places case 306 in-connection and is connected with driving motor 3, driving motor 3 output end fixedly connected with rotates

main shaft

302, and 1 upper end of work main part is equipped with working chamber 301, rotates main shaft 302 and runs through working chamber 301, rotates the first rotation flabellum 303 of fixedly connected with multiunit on the main shaft 302, and the working chamber 301 lower extreme is equipped with dust absorption mouth 305, and dust absorption mouth 305 and circuit board 2 phase-match are convenient for absorb the dust on the circuit board 2.

Example 3:

referring to fig. 1, a chip mounting apparatus for integrated circuit processing, substantially the same as in embodiment 1, further comprising: the transmission part comprises a rotating groove 5, one side of the rotating groove 5 is connected with a main air pipe 304, and one end, far away from the rotating groove 5, of the main air pipe 304 is matched with the working cavity 301, so that air can be conveniently introduced into the rotating groove 5.

Example 4:

referring to fig. 1 and 4, a chip mounting apparatus for processing an integrated circuit is substantially the same as that of embodiment 1, and further includes: a first rotating shaft 502 is rotatably connected in the rotating groove 5, a second rotating blade 501 is fixedly connected to the first rotating shaft 502, and the second rotating blade 501 is matched with the rotating groove 5, so that the first rotating shaft 502 can rotate conveniently.

Example 5:

referring to fig. 1, a chip mounting apparatus for integrated circuit processing, substantially the same as in embodiment 1, further comprising: the upper end of the first rotating shaft 502 is rotatably connected with a second rotating shaft 503, the second rotating shaft 503 is perpendicular to the first rotating shaft 502, the second rotating shaft 503 is fixedly connected with a rotating gear 504 and a second helical gear 506, one end of the first rotating shaft 502 close to the second rotating shaft 503 is fixedly connected with a first helical gear 505, and the first helical gear 505 is engaged with the second helical gear 506, so that the rotating gear 504 can rotate conveniently.

Example 6:

referring to fig. 1 and 6, a chip mounting apparatus for processing an integrated circuit is substantially the same as that of embodiment 1, and further includes: the lower end of the rotating member 4 is connected with a gear which is engaged with the rotating gear 504 so as to transmit the rotation to the rotating member 4.

Example 7:

referring to fig. 1-2, a chip mounting apparatus for integrated circuit processing, substantially the same as in embodiment 1, further comprising: the fixing part comprises a sliding rod 404, a plurality of groups of air suction holes 402 are arranged at the lower end of the placing groove 401, an air suction groove 403 is arranged at the lower end of the air suction hole 402, the air suction groove 403 is communicated with the air suction holes 402, and the air suction groove 403 is perpendicular to the air suction holes 402, so that the circuit board 2 is convenient to fix.

Example 8:

referring to fig. 1, 2 and 5, a chip mounting apparatus for processing an integrated circuit is substantially the same as in embodiment 1, and further includes: the slide bar 404 runs through the slot 403 of breathing in, fixedly connected with dog 405 on the slide bar 404, dog 405 and the slot 403 sliding connection of breathing in, and dog 405 and suction opening 402 phase-match, be equipped with on the work main part 1 with slide bar 404 assorted arc wall, be equipped with the sliding tray 408 on rotating 4, fixedly connected with baffle 407 on the slide bar 404, the last thrust spring 409 that has cup jointed of slide bar 404, thrust spring 409 both ends respectively with baffle 407, rotate 4 fixed connection of piece, be convenient for fix circuit board 2.

Example 9:

referring to fig. 1, a chip mounting apparatus for integrated circuit processing, substantially the same as in embodiment 1, further comprising: one side of rotating groove 5 far away from main trachea 304 is connected with blast pipe 507, and one side that is close to blast pipe 507 is equipped with basin 6, and blast pipe 507 is connected with basin 6, and one side that basin 6 kept away from blast pipe 507 is connected with connecting pipe 601, and the one end that basin 6 was kept away from to connecting pipe 601 is connected with placing case 306, and it is connected with outlet duct 602 to place case 306 upper end, is convenient for cool down driving motor 3.

According to the invention, dust on the circuit board 2 is conveniently sucked through the working cavity 301, the rotating main shaft 302, the first rotating fan blade 303 and the dust suction port 305, and the circuit board 2 is conveniently adsorbed in the placing groove 401 through the sliding rod 404, the stop block 405, the baffle 407, the sliding groove 408 and the thrust spring 409, so that dust removal is conveniently carried out on the circuit board 2.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. The utility model provides a paster device for integrated circuit processing, includes work main part (1), circuit board (2), its characterized in that, work main part (1) one side fixedly connected with backup pad (101), backup pad (101) lower extreme fixedly connected with multiunit supporting leg (102), it is connected with rotation piece (4) to rotate on backup pad (101), just it rotates in work main part (1) to rotate piece (4) part, be equipped with multiunit standing groove (401) on rotating piece (4), circuit board (2) and standing groove (401) phase-match, just standing groove (401) are connected with the rubber pad with the surface that circuit board (2) contacted, all rotate in backup pad (101), work main part (1) and be connected with multiunit support ball (7), support ball (7) and rotate piece (4) and paste mutually, backup pad (101), The working main body (1) is internally and rotatably connected with a guide wheel (8), the rotating piece (4) is provided with an annular groove matched with the guide wheel (8), the two sides of the working main body (1) are provided with connecting ports (9), the connecting ports (9) are matched with the rotating part (4), the upper end of the connecting port (9) is connected with an electrostatic plate (901), the electrostatic plate (901) is used for adsorbing dust in the air, the upper end of the working main body (1) is connected with a dust absorption part which is used for absorbing and removing dust on the circuit board (2), the lower end of the working main body (1) is connected with a transmission part which is connected with a dust absorption part, the transmission part is used for transmitting the rotation to the rotation part (4), the rotation part (4) is internally connected with a fixing part, and the fixing part is used for fixing the circuit board (2).

2. The chip device for integrated circuit processing according to claim 1, wherein the dust collection component comprises a placing box (306), a driving motor (3) is connected in the placing box (306), a rotating spindle (302) is fixedly connected to an output end of the driving motor (3), a working chamber (301) is arranged at an upper end of the working main body (1), the rotating spindle (302) penetrates through the working chamber (301), a plurality of groups of first rotating fan blades (303) are fixedly connected to the rotating spindle (302), a dust collection port (305) is arranged at a lower end of the working chamber (301), and the dust collection port (305) is matched with the circuit board (2).

3. The chip mounting device for integrated circuit processing according to claim 1, wherein the transmission component comprises a rotation groove (5), a main air pipe (304) is connected to one side of the rotation groove (5), and one end of the main air pipe (304) far away from the rotation groove (5) is matched with the working cavity (301).

4. The chip mounting device for integrated circuit processing according to claim 3, wherein a first rotating shaft (502) is rotatably connected to the rotating groove (5), a second rotating blade (501) is fixedly connected to the first rotating shaft (502), and the second rotating blade (501) is matched with the rotating groove (5).

5. The chip mounting device for processing the integrated circuit according to claim 4, wherein a second rotating shaft (503) is rotatably connected to an upper end of the first rotating shaft (502), the second rotating shaft (503) is perpendicular to the first rotating shaft (502), a rotating gear (504) and a second helical gear (506) are fixedly connected to the second rotating shaft (503), a first helical gear (505) is fixedly connected to one end of the first rotating shaft (502) close to the second rotating shaft (503), and the first helical gear (505) is engaged with the second helical gear (506).

6. The chip mounting apparatus for IC processing according to claim 5, wherein the lower end of the rotating member (4) is connected with a transmission gear, and the transmission gear is engaged with the rotating gear (504).

7. A die attachment apparatus for processing an integrated circuit according to claim 1, wherein the fixing member comprises a slide bar (404), a plurality of sets of suction holes (402) are formed at a lower end of the placement groove (401), a suction groove (403) is formed at a lower end of the suction holes (402), the suction groove (403) communicates with the suction holes (402), and the suction groove (403) and the suction holes (402) are perpendicular to each other.

8. The chip mounting device for integrated circuit processing according to claim 7, wherein the sliding rod (404) penetrates through the air suction groove (403), a stopper (405) is fixedly connected to the sliding rod (404), the stopper (405) is slidably connected to the air suction groove (403), the stopper (405) is matched with the air suction hole (402), an arc-shaped groove matched with the sliding rod (404) is formed in the working main body (1), a sliding groove (408) is formed in the rotating member (4), a baffle (407) is fixedly connected to the sliding rod (404), a thrust spring (409) is sleeved on the sliding rod (404), and two ends of the thrust spring (409) are respectively fixedly connected to the baffle (407) and the rotating member (4).

9. The chip mounting device for integrated circuit processing according to claim 3, wherein an exhaust pipe (507) is connected to a side of the rotary groove (5) away from the main gas pipe (304), a water tank (6) is disposed at a side close to the exhaust pipe (507), the exhaust pipe (507) is connected to the water tank (6), a connecting pipe (601) is connected to a side of the water tank (6) away from the exhaust pipe (507), one end of the connecting pipe (601) away from the water tank (6) is connected to the placing box (306), and an outlet pipe (602) is connected to an upper end of the placing box (306).