JPH0637128A - Manufacture of resin sealed semiconductor device - Google Patents

Abstract

PURPOSE:To make thin burrs of a resin, generated during the course of a resin sealing process, not to fall down until a semiconductor device is set to a resin burr removing process so as to prevent the environment from getting worse and the burrs from obstructing the transportation of lead frames after sealing the device with the resin by making the resin to flow out into a space surrounded by a package and the lead frame by a fixed amount. CONSTITUTION:A resin sealed semiconductor device is manufactured in such a way that a lead frame 2 mounted with semiconductor elements is set in a resin sealing mold composed of a top force and bottom force and the mold is filled with a resin 3 after the top force is put on the bottom force. A recessed section is provided to either the top force or bottom force so that a gap having a fixed thickness can be formed in the section surrounded by the frame 2 and packages 1 when the top force is put on the bottom force so that the resin 3 can flow out by a fixed thickness. For example, the recessed section is provided in the resin sealing mold so that formed resin burrs 3 can have thicknesses of about 0.2mm at which the burrs do not fall down until the package is sent to a resin burr removing process after the resin sealing process and can be easily removed by means of a resin burr removing mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a resin-encapsulated semiconductor device in which resin burrs do not fall off after the resin encapsulation process until the resin deburring process.

[0002]

2. Description of the Related Art As a conventional method of manufacturing a semiconductor device of this type, as shown in FIG. The shallow groove air vent 4 was arranged in the resin-sealed mold from the space surrounded by the lead frame 2.

However, when the resin sealing mold is worn or the parallelism between the upper mold and the lower mold is poor, the resin flows into the package 1 and then flows out to the air vent 4 to make a very thin resin. Thin burr 7 had occurred. In the resin encapsulation process, the thick burr 6 having the same thickness as the lead frame 2 is formed on the lead frame 2. Therefore, the thick burr 6 and the thin burr 7 are used as a resin deburring mold in the resin deburring process of the subsequent process. Had been separated and removed. However, the thin burr 7 fell off in the middle of the process, which deteriorated the environment,
There have been various problems such as obstacles during lead frame transportation after resin sealing. (2)

FIG. 2 shows a conventional manufacturing method, (a) is a resin sealing state diagram, (b) is a sectional perspective view of (a), 1 is a package, 2 is a lead frame, 4 is an air vent, 5 Is a resin inflow port, 6 is a thick burr, and 7 is a thin burr.

[0005]

The thin burr of the resin generated in the resin sealing process does not fall off to the resin deburring process after the resin sealing process, the environment is not deteriorated, and the lead frame is transported after the resin sealing. To provide a resin sealing technology that does not become an obstacle to time.

[0006]

[Means for Solving the Problems] A resin having a certain thickness, which can be easily separated in a resin deburring process, is caused to flow into a space surrounded by a package and a lead frame, and an air vent is provided on a lead frame facing the resin inlet. Is formed by forming a shallow groove in the resin sealing mold.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of the present invention. The main part of the present invention is to let a resin burr 3 having a constant thickness flow out into a space surrounded by a package 1 and a lead frame 2 and to let an air vent 4 be made of resin. It is characterized in that it is formed by providing a shallow groove in the resin sealing mold from above the lead frame facing the inflow port.

The structure of the resin encapsulation mold is such that a resin burr having a constant thickness does not fall off after the resin encapsulation process until the resin deburring process, and the resin deburring mold is easy to separate and remove. For example, the thickness is set to about 0.2 mm, and a recess is provided in the resin-sealing mold so that the gap between the package 1 and the lead frame 2 of the resin-sealing mold has the above-described thickness when the resin is sealed. or,
The air vent 4 is provided on the lead frame 2 facing the resin inlet 5 with a groove having a depth of, for example, about 0.03 mm in the resin sealing mold so that the resin does not flow out. (3)

When the lead frame 2 is placed in the resin sealing mold and the resin is flown into the package 1 through the resin inlet 5, first, the gas in the package 1 is separated by a gap between the package 1 and the lead frame 2. And is discharged from the air vent 4 to the outside of the resin sealing mold. Further, when the resin is filled in the package 1, the excess resin flows out into the gap between the package 1 and the lead frame 2 to form a resin burr having a constant thickness.

FIG. 1 shows an embodiment of the present invention. (A) is a resin sealing state diagram, (b) is a sectional perspective view of (a), and 3 is a resin burr having a constant thickness.

[0011]

According to the present invention, since the resin burr does not fall off to the resin burr removing step in the subsequent step, the environment is not deteriorated, and it does not become an obstacle during transportation. As mentioned above, the industrial applicability is great.

[Brief description of drawings]

1A is an embodiment of the present invention, and FIG. 1B is a sectional perspective view of FIG.

FIG. 2A is a conventional manufacturing method, and FIG. 2B is a sectional perspective view of FIG.

[Explanation of symbols]

 1 Package 2 Lead frame 3 Resin burr with constant thickness 4 Air vent 5 Resin inlet 6 Resin burr with lead frame thickness 7 Thin burr

Claims (1)

[Claims] 1. A lead frame having a semiconductor element mounted thereon,
In the method for manufacturing a resin-sealed semiconductor device, which is disposed in a resin-sealed mold composed of an upper mold and a lower mold, and the upper mold and the lower mold are combined and filled with resin, the upper mold and the lower mold are combined. A recess is provided in one of the upper mold and the lower mold so that a gap of a certain thickness is created in the part surrounded by the lead frame and the package when the molds are combined, and the resin of a certain thickness is allowed to flow out. A method for manufacturing a resin-encapsulated semiconductor device, comprising: