JPS6092815A - Resin sealing mold - Google Patents
Resin sealing moldInfo
- Publication number
- JPS6092815A JPS6092815A JP58201315A JP20131583A JPS6092815A JP S6092815 A JPS6092815 A JP S6092815A JP 58201315 A JP58201315 A JP 58201315A JP 20131583 A JP20131583 A JP 20131583A JP S6092815 A JPS6092815 A JP S6092815A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- gate
- cavity
- mold
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、樹脂封止金型に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a resin-sealed mold.
従来、第１図に示す如く、レンズ部１を有する発光素子
（ＬＥＤ）等のレンズ付光半導体装置２は、例えば第２
図に示すような樹脂封止金型３を使用して熱硬化性樹脂
の樹脂封止処理を行うことにより製造されている。而し
て、従来の樹脂封止金型３は、樹脂封止処理の際に素子
４の近傍の領域に損傷を発生させないように、上屋キャ
ビティ５にレンズ部形成部６がある。また、ゲート７の
向きは上向きであり、レンズ部１の位置、大きさに関係
な（設定されていた・〔背景技術の問題点〕
このため従来の樹脂封止金型３には、次の問題があった
。Conventionally, as shown in FIG.
It is manufactured by performing a resin sealing process on a thermosetting resin using a resin sealing mold 3 as shown in the figure. The conventional resin sealing mold 3 has a lens forming portion 6 in the shed cavity 5 so as not to damage the area near the element 4 during the resin sealing process. In addition, the gate 7 faces upward, and is not related to the position and size of the lens portion 1 (problems in the background art). There was a problem.
（１） 樹脂封止製品のレンズ部１に気泡８による巣が
発生するのを防止するために、エアーベント量を太き（
する必要がある。しかし、レンズ部ｌを形成する透明樹
脂は、シリカなどの結晶物が入っていないため、数ミク
ロン（３〜５μ）程度の隙間でも、樹脂が流出し、ばり
が発生する・
（２） 樹脂封止製品のレンズ部１に気泡８による巣が
発生するのを防止するために、樹脂溜りを設ける必要が
ある。その結果、無駄になる量の樹脂が多いため、製造
コストを高くする。(1) In order to prevent the formation of nests due to air bubbles 8 in the lens part 1 of the resin-sealed product, the amount of air vent is increased (
There is a need to. However, since the transparent resin that forms the lens part l does not contain crystals such as silica, the resin will leak out even in gaps of a few microns (3 to 5 μ), causing burrs. (2) Resin sealing In order to prevent the formation of nests due to air bubbles 8 in the lens portion 1 of the fixed product, it is necessary to provide a resin reservoir. As a result, a large amount of resin is wasted, increasing manufacturing costs.
本発明は、レンズ部に気泡がない高品質の樹脂封止製品
を容易に得ることができる樹脂封止金型を提供すること
をその目的とするものである。 “
〔発明の概要〕
本発明は、レンズ部形成部を下型キャビティに形成し、
ゲート及びランナーを上屋キャビティーに形成すると共
罠、ゲート角をゲートの先端部がレンズ部形成部の入口
部に対向するように設けて、レンズ部に気泡がない高品
質の樹脂封止製品を容易に得ることができる樹脂封止金
型である。An object of the present invention is to provide a resin-sealing mold that can easily produce a high-quality resin-sealed product without air bubbles in the lens portion. “ [Summary of the Invention] The present invention provides a method in which a lens portion forming portion is formed in a lower mold cavity,
When the gate and runner are formed in the shed cavity, the gate angle is set so that the tip of the gate faces the entrance of the lens part forming part, resulting in a high quality resin-sealed product with no air bubbles in the lens part. This is a resin-sealed mold that can be easily obtained.
以下、本発明の実施例について図面を参照して説明する
。Embodiments of the present invention will be described below with reference to the drawings.
第３図は、本発明の一実施例の要部を示す断面図である
。図中１０は、下型であり、１１はこの下型１０に衝合
された上型である。上型１１と下型ｌθの衝合部には、
樹脂封止製品の外形に略等しい中空部からなるキャビテ
ィ１２が形成されている。キャビティノ２の下型ｌ。FIG. 3 is a sectional view showing essential parts of an embodiment of the present invention. In the figure, 10 is a lower mold, and 11 is an upper mold abutted against this lower mold 10. At the abutting part between the upper die 11 and the lower die lθ,
A cavity 12 is formed, which is a hollow portion having approximately the same external shape as the resin-sealed product. Cavitino 2 lower mold l.
の部分には、樹脂封止製品のレンズ部を形成するための
レンズ成形部１３が設けられている。A lens molding section 13 for forming a lens section of a resin-sealed product is provided in the section.
また、上屋１１には、ゲート１４を介してキャビティ１
２に連通ずるランナー１５が形成されている。ゲート１
４は、その樹脂流出口部がレンズ成形部１３に対向する
ようにして形成されている。In addition, a cavity 1 is connected to the shed 11 through a gate 14.
A runner 15 communicating with 2 is formed. gate 1
4 is formed such that its resin outlet portion faces the lens molding portion 13.
このように構成された樹脂封止金量２ｏによれば、キャ
ビティ１２内に被封止体である素子１６を装着したリー
ドフレーム１７を収容し、ランナー１５からゲート１４
を経てキャビティ１２内に溶融した樹脂１８を供給する
。ゲートト４の流田口の部分は、レンズ成形部１３に対
向して設けられているので、樹脂１８は、レンズ成形部
１３から埋めるようにしてキャビティ１２内に充満され
る。その結果、レンズ部に気泡による果がない高品質の
樹脂封止製品を容易に得ることができる。また、レンズ
成形部１３内の気泡を容易に抜くことができるので、エ
アーベントの容量を小さくしてばつの発生を抑制できる
。更に、樹脂溜り部を不要とし、樹脂の有効利用を図り
製造コストを低減できる。According to the amount of resin sealing metal 2o configured in this way, the lead frame 17 on which the element 16, which is the object to be sealed, is mounted is accommodated in the cavity 12, and the gate 14 is connected from the runner 15.
The molten resin 18 is supplied into the cavity 12 through. Since the flow field opening portion of the gate 4 is provided facing the lens molding section 13, the resin 18 is filled into the cavity 12 starting from the lens molding section 13. As a result, a high-quality resin-sealed product with no bubbles in the lens portion can be easily obtained. Further, since air bubbles in the lens molding part 13 can be easily removed, the capacity of the air vent can be reduced and the occurrence of rash can be suppressed. Furthermore, a resin reservoir is not required, and the resin can be used effectively and manufacturing costs can be reduced.
なお、実施例では、１つのゲート１４に１つのキャビテ
ィ１２が接続されたものについて説明したが、この他に
も第４図に示す如く、１つのゲート１４に２以上の複数
のキャビティ１２・・・１２を接続し、キャビティ１２
・・・１２の相互間をスルーゲート１９で連結するよう
にした樹脂封止金型２１としても良い。In the embodiment, one cavity 12 is connected to one gate 14. However, as shown in FIG. 4, two or more cavities 12 are connected to one gate 14.・Connect 12 and connect cavity 12
... 12 may be connected to each other by a through gate 19 as a resin sealing mold 21.
以上説明した如く、本発明に係る樹脂封止金型によれば
、レンズ部に気泡がない高品質の樹脂封止製品を容易に
得ることができるものである。As explained above, according to the resin-sealed mold according to the present invention, a high-quality resin-sealed product without air bubbles in the lens portion can be easily obtained.
第１図は、樹脂制止製品の斜視図、第２図は。
従来の樹脂封止金型の要部を示す断面図、第３図は、本
発明の一実施例の要部を示す断面図。
第４図は１本発明の他実添例の要部を示す断面図である
。
１０・・・下型、１１・・・上ｔｉｓ１２・・・キャビ
ティ、１３・・・レンズ成形部、１４・・・ゲート、１
５・・・ランナー、１６・・・素子、１７・・・リード
フレーム、１８・・・樹脂、１９・・・スルーゲート、
２０．２Ｊ・・・樹脂封止金型。Figure 1 is a perspective view of the resin restraint product, and Figure 2 is a perspective view of the resin restraint product. FIG. 3 is a cross-sectional view showing the main parts of a conventional resin-sealed mold; FIG. 3 is a cross-sectional view showing the main parts of an embodiment of the present invention. FIG. 4 is a sectional view showing a main part of another practical example of the present invention. DESCRIPTION OF SYMBOLS 10... Lower mold, 11... Upper tis12... Cavity, 13... Lens molding part, 14... Gate, 1
5... Runner, 16... Element, 17... Lead frame, 18... Resin, 19... Through gate,
20.2J...Resin sealing mold.
Claims (1)
形状の中空部からなるキャビティを有し、かつ、該キャ
ビティにゲートを介して連通ずるランナーを形成した樹
脂封止金型にお（・て、樹脂封止製品のレンズ部を形成
するレンズ部形成部を下凰に設け、かつ、該レンズ部形
成部にゲートを対向するように設けたことを特徴とする
樹脂封止金型０A resin sealing mold having a cavity consisting of a hollow part having a shape approximately equal to the outer shape of a resin-sealed product at the abutting part of an upper mold and a lower mold, and a runner formed in the cavity communicating with the mold through a gate. A resin seal characterized in that a lens part forming part for forming a lens part of a resin sealed product is provided at the bottom of the mold, and a gate is provided to face the lens part forming part. Stopper mold 0
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58201315A JPS6092815A (en) | 1983-10-27 | 1983-10-27 | Resin sealing mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58201315A JPS6092815A (en) | 1983-10-27 | 1983-10-27 | Resin sealing mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6092815A true JPS6092815A (en) | 1985-05-24 |
Family
ID=16438969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58201315A Pending JPS6092815A (en) | 1983-10-27 | 1983-10-27 | Resin sealing mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6092815A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141253A (en) * | 1987-09-18 | 1989-06-02 | General Electric Co <Ge> | Drive |
| JP2008295173A (en) * | 2007-05-23 | 2008-12-04 | Honda Motor Co Ltd | Power device |
| JP2009144757A (en) * | 2007-12-12 | 2009-07-02 | Fuji Heavy Ind Ltd | Driving force distributing apparatus and vehicle control arrangement |
-
1983
- 1983-10-27 JP JP58201315A patent/JPS6092815A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141253A (en) * | 1987-09-18 | 1989-06-02 | General Electric Co <Ge> | Drive |
| JP2008295173A (en) * | 2007-05-23 | 2008-12-04 | Honda Motor Co Ltd | Power device |
| JP2009144757A (en) * | 2007-12-12 | 2009-07-02 | Fuji Heavy Ind Ltd | Driving force distributing apparatus and vehicle control arrangement |
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