JPH0636590Y2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an improved structure of a semiconductor device in which external terminals are arranged on a pellet storage cup in which semiconductor pellets are stored.

[Prior Art] FIG. 3 shows a schematic structure of a resin-sealed electronic device of this type.

In the figure, reference numeral 1 denotes a copper heat dissipation board, which has a structure that can be fixed to a heat dissipation body (not shown).

A pellet storage cup 2 is soldered and fixed on the heat dissipation board 1, and a semiconductor pellet 3 is soldered and fixed together with the internal conductor 4 in the pellet storage cup 2. Further, the bent leg portion 5b of the plate-shaped outer conductor 5 is fixed to the upper end portion of the inner conductor 4, and the rising portion 5d of the plate-shaped outer terminal 5 is
A part of the insulating lid 7 that closes the opening of the insulating case 6 is led out to the outside, and its tip is bent at a substantially right angle along the surface of the insulating lid 7. A screw hole 5a is provided at the tip of the plate-shaped external terminal 5 for connection to an external circuit.

The insulating case 6 is fixed on the heat dissipation board 1 with an adhesive (not shown), and the insulating cover 7 is removed, and then the inside of the insulating case 6 is filled with a sealing resin (not shown). The body 7 closes the opening. afterwards,
With the curing of the sealing resin, the heat dissipation substrate 1, the insulating case 6, and the insulating lid 7 are integrally fixed.

A soft coating agent, for example, silicone rubber 8 is filled inside the pellet storage cup 2 which is soldered onto the heat dissipation substrate 1 and has the semiconductor pellet 3 stored therein so as to cover the S-shaped bent portion 4a of the internal conductor 4. -It is hardened. The above-mentioned coating agent is filled in the pellet storage cup 2 after each component is soldered and fixed. That is, the coating agent is filled in the pellet storage cup 2 by utilizing the slight gap formed between the plate-shaped external terminal 5 connected to the upper end of the inner lead 4 and the upper end of the pellet storage cup 2.

[Problems to be Solved by the Invention] In this type of semiconductor device, it is necessary to reduce the total height H shown in FIG. 3 in order to miniaturize the entire device as much as possible. Therefore, the height of the pellet storage cup 2, the height of the inner leads 4, the height of the plate-shaped external terminals 5, etc. are designed to be as small as possible. The gap S formed between the upper end opening and the plate-shaped external terminal 5 is also extremely small. When the coating agent is injected using this slight gap S, a thin nozzle is inserted into the gap S, but since the injection amount is very small and the inside of the pellet storage cup cannot be directly viewed, the coating agent There was a problem to be solved, such as it took time to confirm whether or not the inside was fully filled.

[Object of the Invention] The present invention has been made in order to solve the above problems, and facilitates the work of injecting the coating agent into the pellet storage cup and fully filling the inside of the storage cup. An object of the present invention is to provide a semiconductor device capable of achieving complete protection coating.

[Means for Solving the Problems] In the semiconductor device of the present invention, a plate-shaped external terminal connected to one end of the internal lead is provided with an opening for injecting a coating agent.

[Operation] In the semiconductor device of the present invention, since the plate-shaped external terminal provided in the vicinity of the opening of the pellet storage cup is provided with the opening for injecting the coating agent, the opening is used to store the pellet. The coating agent can be easily injected into the cup, and in this case, the inside of the storage cup can be directly viewed through the opening, so that the filling amount and the filling state in the inside can be found at a glance. Therefore, uncertain filling of the semiconductor pellet with the coating agent can be avoided, and the protective coating on the semiconductor pellet can be completed.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an external view showing a semiconductor device of the present invention, and FIG. 2 is an assembly drawing thereof. In these figures, the same parts as those of the conventional semiconductor device shown in FIG. 3 are designated by the same reference numerals.

In the present invention, the opening 51 for injecting the coating agent is formed at the center position of the bent leg portion 5b of the plate-shaped external terminal 5 arranged in the vicinity thereof so as to close the upper end opening portion of the pellet storage cup 2.
Is provided. This opening 51
Has a size necessary and sufficient for the tip of a nozzle for injecting the coating agent to enter. Also, this opening 51
Is one circular hole in this embodiment, but the shape and the number thereof are not limited to those in this embodiment. In short, it is sufficient that the coating agent can be easily injected into the pellet storage cup 2 and that the filling state inside the pellet storage cup 2 can be visually confirmed.

Using the plate-shaped external terminal 5 having the above-described structure, a semiconductor device is assembled in the same manner as the conventional one. That is, as shown in FIG. 2, the semiconductor pellet 3 and the internal lead 4 are bent to the upper end opening of the pellet storage cup 2 solder-fixed to the inner bottom surface of the bent external leg 5b of the plate-shaped external terminal 5. Face each other,
The tip portions of the inner leads 4 are inserted into the through holes 5c formed in the bent leg portions 5b, and fixed by soldering. In this way, after assembling in the state shown in FIG. 1, a nozzle (not shown) is inserted into the opening 51 formed in the plate-shaped external terminal 5, and the coating agent is injected into the pellet storage cup 2. In this case, there is no need to be restricted to a thin nozzle that can be inserted into a slight gap formed between the upper end opening of the pellet storage cup 2 and the bent leg portion 5b of the plate-shaped external terminal 5, unlike the conventional case. It is possible to use a nozzle with good workability.
Further, the filling state of the coating agent into the pellet storage cup 2 can be visually confirmed through the opening 51.

The above-described filling operation of the coating agent is repeated for the number of pellet storage cups 2 soldered to the heat dissipation board 1 shown in FIG. 3, and mass production is performed as the number of storage cups increases. It is effective and improves workability.

[Advantages of the Invention] According to the present invention, as described above, the plate-shaped external terminal connected to one end of the inner lead is provided with the opening for injecting the coating agent. The coating agent can be easily injected into the inside, and in this case, the inside of the storage cup can be directly viewed through the opening, so that the filling amount and the filling state into the inside can be found at a glance. Therefore, it is possible to avoid the uncertain filling of the semiconductor pellets with the coating agent and to complete the protective coating.

[Brief description of drawings]

FIG. 1 is an external view of a semiconductor device of the present invention, FIG. 2 is an assembly diagram thereof, and FIG. 3 is a sectional view showing a schematic structure of a conventional semiconductor device of this type. 1 ... Heat dissipation board 2 ... Pellet storage cup 3 ... Semiconductor pellet 4 ... Internal lead 5 ... Plate-shaped external terminal 8 ... Silicone rubber 51 ... Opening

Claims (1)

[Scope of utility model registration request] 1. A semiconductor pellet, an inner lead, an upper opening pellet storage cup soldered to the inner bottom surface of the semiconductor lead, and an upper end of the inner lead connected to the upper end of the pellet storage cup. In a semiconductor device having a arranged plate-shaped external terminal and part of the semiconductor pellets and internal leads in the pellet storage cup covered with a coating agent, an opening for injecting a coating agent to the plate-shaped external terminal. A semiconductor device having a section.