JPS56134743A - Semiconductor device of film carrier type - Google Patents

Semiconductor device of film carrier type

Info

Publication number
JPS56134743A
JPS56134743A JP3954680A JP3954680A JPS56134743A JP S56134743 A JPS56134743 A JP S56134743A JP 3954680 A JP3954680 A JP 3954680A JP 3954680 A JP3954680 A JP 3954680A JP S56134743 A JPS56134743 A JP S56134743A
Authority
JP
Japan
Prior art keywords
hole
pin
soldered
lead
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3954680A
Other languages
Japanese (ja)
Other versions
JPS6057222B2 (en
Inventor
Masao Hayakawa
Takamichi Maeda
Masao Kumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP3954680A priority Critical patent/JPS6057222B2/en
Publication of JPS56134743A publication Critical patent/JPS56134743A/en
Publication of JPS6057222B2 publication Critical patent/JPS6057222B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To simplify taking-out and assembling operations of an external electrode by a method wherein an opening is formed at one end of an inner lead wire on a flexible insulating film, a land for soldering being formed around the opening and a pin being inserted therein to be soldered. CONSTITUTION:The inner lead means 7a is projected around a chip hole 6 of the flexible insulating film 4 and the other end thereof reaches a hole 8 through which the lead pin is passed. A hole diameter 9 is made almost same as the lead pin and formed with the soldered land in a large area. A solder resist 11 is formed near the hole 9 to prevent a solder bridge-circuit between the patterns. A test pad 12 is provided to make serve for a test. The inner lead is joined with a semiconductor chip 8 and resin-sealed. Desired type elements A, B are punched from the film 4, the pin 16 being passed through the hole 9 of the lead to be shortened and the elements are soldered in sequency, and sealed in a resin case as required. With this construction, a large number of memory elements can be piled up in an occupied area as large as a part for one memory element, the device enabling to be made small-size and to easily be assembled.
JP3954680A 1980-03-26 1980-03-26 Film carrier type semiconductor device Expired JPS6057222B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3954680A JPS6057222B2 (en) 1980-03-26 1980-03-26 Film carrier type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3954680A JPS6057222B2 (en) 1980-03-26 1980-03-26 Film carrier type semiconductor device

Publications (2)

Publication Number Publication Date
JPS56134743A true JPS56134743A (en) 1981-10-21
JPS6057222B2 JPS6057222B2 (en) 1985-12-13

Family

ID=12556045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3954680A Expired JPS6057222B2 (en) 1980-03-26 1980-03-26 Film carrier type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6057222B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216258A (en) * 1986-03-17 1987-09-22 Agency Of Ind Science & Technol Three-dimensional built-up integrated circuit
JPH0888245A (en) * 1994-09-14 1996-04-02 Nec Corp Semiconductor device
EP0704897A3 (en) * 1994-09-30 1997-07-16 Nec Corp Semiconductor device
FR2743666A1 (en) * 1996-01-17 1997-07-18 Nec Corp Support structure for large scale integrated circuit mounted in stack formation
CN105789166A (en) * 2015-01-12 2016-07-20 迈克纳斯公司 Integrated Circuit Housing

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216258A (en) * 1986-03-17 1987-09-22 Agency Of Ind Science & Technol Three-dimensional built-up integrated circuit
JPH0358543B2 (en) * 1986-03-17 1991-09-05 Kogyo Gijutsu Incho
JPH0888245A (en) * 1994-09-14 1996-04-02 Nec Corp Semiconductor device
EP0702404A3 (en) * 1994-09-14 1997-11-05 Nec Corporation Semiconductor device
EP0704897A3 (en) * 1994-09-30 1997-07-16 Nec Corp Semiconductor device
FR2743666A1 (en) * 1996-01-17 1997-07-18 Nec Corp Support structure for large scale integrated circuit mounted in stack formation
CN105789166A (en) * 2015-01-12 2016-07-20 迈克纳斯公司 Integrated Circuit Housing
EP3057129A1 (en) * 2015-01-12 2016-08-17 Micronas GmbH Integrated circuit housing
US9893005B2 (en) 2015-01-12 2018-02-13 Tdk-Micronas Gmbh IC package
US10026684B2 (en) 2015-01-12 2018-07-17 Tdk-Micronas Gmbh IC package
CN105789166B (en) * 2015-01-12 2018-11-09 Tdk-迈克纳斯有限责任公司 Integrated circuit shell

Also Published As

Publication number Publication date
JPS6057222B2 (en) 1985-12-13

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