JPH0636231U - Chip type jumper element - Google Patents

Abstract

(57) [Summary] [Objective] An object of the present invention is to provide a chip type jumper element which does not require an adhesive and improves productivity. [Structure] At least one end of an electrode is fitted or pierced and fixed to at least a part of an electrically insulating substrate without using an adhesive. [Effect] The bending process is simple and the productivity can be improved.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip type jumper element in which an electrode is fixed to an electrically insulating substrate by fitting or puncturing without using an adhesive.

[0002]

[Prior art]

 As a conventional chip-type jumper element, as shown in, for example, FIGS. 4 to 6, an outer periphery of a base body (eg, a substantially rectangular parallelepiped shape having a convex portion) formed of a synthetic resin or the like having an electric insulating property is used. A chip type jumper element in which electrodes are fixed via an adhesive is known.

[0003]

[Problems to be solved by the device]

 However, in the case of fixing with an adhesive as in the above-mentioned conventional technique, the process of applying the adhesive and the steps such as baking thereof are complicated, and at least several tens of minutes are required. Also, when it is used as a surface mount component, it is immersed in solder, so a material with good heat resistance must be selected for the adhesive. In addition, there is a problem that the adhesive strength deteriorates due to long-term use or leaving, and the electrode falls off from the substrate when it penetrates into solder.

[0004]

[Means for Solving the Problems]

 The present invention has been made for the purpose of solving the above problems, and has the following configuration as one means for solving the above problems. That is, in the chip type jumper element according to claim 1, at least one end is fitted into or pierced into the hole of the electrically insulating base, and the remaining part of the one end is bent substantially along the outer surface of the base. And the base body having at least the hole portion into which the electrode is fitted.

[0005]

With the above structure, in the chip-type jumper element of the present invention, by bending the electrode, one end of the electrode is inserted into the hole formed in a part of the base or the base itself, or Alternatively, since it is fixed by piercing, it is not necessary to use the conventional steps such as adhesive application and baking (it takes several tens of minutes to cure when an adhesive is used), and the adhesive deteriorates. This makes it possible to prevent the electrode from falling off from the base body when permeating into the solder.

[0006]

【Example】

First Embodiment An embodiment of the chip type jumper device of the present invention will be described below with reference to FIGS.

FIG. 1 is a perspective view of a base 1 having electrical insulation and two holes according to the present invention. The base 1 is made of PPS (polyphenylene sulfide). Here, the material of the substrate 1 may be another synthetic resin, for example, a material having good heat resistance such as liquid crystal polymer or rubber, or ceramics. The base 1 has two kinds of holes. A part of the lower surface 2 has two holes 4 into which an electrode 6 having a shape as shown in FIG. A recess 5 is formed on the upper surface 3 of the base 1. Here, the shape of the substrate 1 is not limited to a rectangular parallelepiped, and may be a cube, a cylinder, or the like.

FIG. 2 is a perspective view of the electrode 6 according to the present invention, which is made of copper (solder plated). Here, the electrode 6 may be nickel silver, stainless steel (all of which are plated with solder), or the like. The external appearance of the electrode 6 is formed in a symmetrical L-shaped combined shape, and is processed to a size corresponding to the base body 1 (bending of the electrode 6 is performed, for example, by pressing). Both ends 7, 7 of the electrode 6 formed in a left-right symmetrical substantially L-shaped combination are convex so as to fit into the holes 4, 4 formed in the base 1. Therefore, each ridge line 8 of the electrode 6 has some curved surface or curvature.

FIG. 3 is an overall perspective view of the chip type jumper device of the present invention. In FIG. 3, the electrode 6 is assembled so as to cover and fit into the upper surface 3 of the base 1, for example. Then, the convex end portions 7, 7 of the electrode 6 are fitted and fixed in the hole portions 4, 4 of the base 1.

An example of a state in which the chip type jumper element of the present invention is mounted on a printed board is as shown in FIGS. 7 and 8.

[0011]

Second Embodiment In FIG. 9, one concave portion 5 is provided in the base body 1, and the electrode 6 is fitted into the concave portion 5 so as to cover the upper surface 3 of the base body 1 as in the first embodiment. Each ridge line 8 of the electrode 6 has some curved surface or curvature, as in the first embodiment.

[0012]

[Effect of device]

 According to the chip type jumper element of the invention of claim 1, since the fixing of the electrode to the base body is the fixing by the fitting or the piercing without using the adhesive, the step of applying the adhesive and the step of baking the same. Is unnecessary, and productivity can be improved. It is also possible to prevent the electrode from falling off the substrate (due to the deterioration of the adhesive) when the solder permeates.

[Brief description of drawings]

FIG. 1 is a perspective view of a base body showing an embodiment of the present invention.

FIG. 2 is a perspective view of the same electrode.

FIG. 3 is a perspective view of a chip type jumper device of the present invention.

FIG. 4 is a vertical cross-sectional view of a conventional base body.

FIG. 5 is a vertical cross-sectional view of a conventional chip type jumper element.

FIG. 6 is a perspective view of a conventional chip type jumper element.

FIG. 7 is a plan view showing a state in which the chip type jumper device of the present invention is mounted on a printed circuit board.

8 is a vertical cross-sectional view taken along the line AA of FIG.

FIG. 9 is a vertical cross-sectional view of a chip type jumper element showing a second embodiment of the present invention.

[Explanation of symbols]

 1. Base 2. Bottom surface 3. Top surface 4. Hole 5. Recessed portion 6. Electrode 7. Edge 8. Ridge 9. Adhesive 10. Chip type jumper element 11. Wiring pattern 12. Solder 13. Printed board

Claims (1)

[Scope of utility model registration request] 1. An electrode, at least one end of which is fitted into a hole of an electrically insulating base or pierced into the base, and the remaining part of the one end is bent substantially along an outer surface of the base, and at least the electrode is fitted. A chip-type jumper element comprising the base having the hole for inserting.