JPH0636221Y2 - 建物用セラミックス部材の接合装置 - Google Patents
建物用セラミックス部材の接合装置Info
- Publication number
- JPH0636221Y2 JPH0636221Y2 JP9713589U JP9713589U JPH0636221Y2 JP H0636221 Y2 JPH0636221 Y2 JP H0636221Y2 JP 9713589 U JP9713589 U JP 9713589U JP 9713589 U JP9713589 U JP 9713589U JP H0636221 Y2 JPH0636221 Y2 JP H0636221Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- joint
- metal solder
- ceramic
- buildings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000011247 coating layer Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Landscapes
- Joining Of Corner Units Of Frames Or Wings (AREA)
- Joining Of Building Structures In Genera (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9713589U JPH0636221Y2 (ja) | 1989-08-22 | 1989-08-22 | 建物用セラミックス部材の接合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9713589U JPH0636221Y2 (ja) | 1989-08-22 | 1989-08-22 | 建物用セラミックス部材の接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0337184U JPH0337184U (cs) | 1991-04-10 |
| JPH0636221Y2 true JPH0636221Y2 (ja) | 1994-09-21 |
Family
ID=31646285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9713589U Expired - Fee Related JPH0636221Y2 (ja) | 1989-08-22 | 1989-08-22 | 建物用セラミックス部材の接合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636221Y2 (cs) |
-
1989
- 1989-08-22 JP JP9713589U patent/JPH0636221Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337184U (cs) | 1991-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69707283D1 (de) | Verfahren zur zusammenfügung von werkstoffteilen auf basis von siliciumcarbid mit hilfe einer dicken verbindungsschicht durch feuerfeste hartlötung und so erhaltener verbund | |
| EP0187025A3 (en) | Direct liquid phase bonding of ceramics | |
| JPH0613860B2 (ja) | 機関部品 | |
| CA2106399A1 (fr) | Element de protection thermique constitue par un alliage d'aluminium quasi-cristallin | |
| JPH0636221Y2 (ja) | 建物用セラミックス部材の接合装置 | |
| JPS58120578A (ja) | 無機質基材の選択性鑞付け方法 | |
| JPS59152031A (ja) | セラミツクス部品の装着法 | |
| JPH06131934A (ja) | 絶縁碍子 | |
| JP2858773B2 (ja) | セラミックスと金属の接合材および接合方法 | |
| JPH029253B2 (cs) | ||
| JPS61121489A (ja) | 基板製造用Cu配線シ−ト | |
| DE59506282D1 (de) | Verfahren zur veränderung der durchbiegung von anodisch gebondeten flächigen verbundkörpern aus glas und metall oder halbleitermaterialien | |
| Weise et al. | Active brazing alloys make strong, economical joints | |
| JPS61119878A (ja) | 断熱ガスケット | |
| JPS6236603B2 (cs) | ||
| JPS6030572A (ja) | 三次元網目状金属体のろう付け方法 | |
| JPH061571U (ja) | 複合建築用板の止着構造 | |
| JPS61130333U (cs) | ||
| JP2659272B2 (ja) | セラミックヒータのリード端子接続構造 | |
| JPH0286194U (cs) | ||
| JP2808898B2 (ja) | チップ部品の実装方法 | |
| JPS6133843U (ja) | セラミツクスの接合構造 | |
| Madsen | Bonding of Metallic Glass to Crystalline Metal | |
| JPS5832879U (ja) | 出窓装置 | |
| JPS61201677A (ja) | セラミツクスと金属との接合方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |