JPH06349881A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPH06349881A
JPH06349881A JP5133627A JP13362793A JPH06349881A JP H06349881 A JPH06349881 A JP H06349881A JP 5133627 A JP5133627 A JP 5133627A JP 13362793 A JP13362793 A JP 13362793A JP H06349881 A JPH06349881 A JP H06349881A
Authority
JP
Japan
Prior art keywords
lead frame
lead
wire bonding
presser foot
plate springs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5133627A
Other languages
Japanese (ja)
Inventor
Yukihiro Okuhara
幸弘 奥原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP5133627A priority Critical patent/JPH06349881A/en
Publication of JPH06349881A publication Critical patent/JPH06349881A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Abstract

PURPOSE:To simply uniformly press inner leads of a lead frame, and maintain wire bonding of high quality, in a wire bonder. CONSTITUTION:A lead frame support 8 under a lead frame 2 and a lead frame presser foot 1 press a lead frame 2. Plate springs 9 are fixed to contact parts of the presser foot 1 with the lead frame 2 by using fastening screws 10. When the lead frame support 8 and the lead frame presser foot 1 are a little out of parallelism, this deviation is absorbed by the plate springs 9, and inner leads 4 can be uniformly pressed. Another lead frame contact part is formed on the lead frame presser foot 1 via the plate springs, and the frame contact parts and the plate springs are fixed by using fastening screws. By making the fixing size of the fastening screws common, the kinds of lead frames can be changed only by exchanging the lead frame contact parts.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、半導体チップと外部に
信号を入出力する為のリードフレームとを接続するワイ
ヤーボンディング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus for connecting a semiconductor chip and a lead frame for inputting / outputting signals to / from the outside.

【０００２】[0002]

【従来の技術】従来の技術を図３に示す。リードフレー
ム２のアイランド部５の上に接着剤６を介し半導体チッ
プ７が搭載されている。半導体チップ７の電極とリード
フレーム２のインナーリード４をワイヤーボンディング
する際、全てのインナーリード４をしっかり固定するこ
とが不可欠となる。インナーリード４の固定には、リー
ドフレーム２の下側にあるリードフレーム受け台８と、
金属製のリードフレーム押さえ１の凸部３がリードフレ
ーム２を押さえていた。2. Description of the Related Art A conventional technique is shown in FIG. A semiconductor chip 7 is mounted on the island portion 5 of the lead frame 2 via an adhesive agent 6. When wire-bonding the electrodes of the semiconductor chip 7 and the inner leads 4 of the lead frame 2, it is essential to firmly fix all the inner leads 4. To fix the inner lead 4, a lead frame pedestal 8 below the lead frame 2
The convex portion 3 of the metal lead frame holder 1 held the lead frame 2.

【０００３】また、図４に示すようにリードフレーム押
さえ１のリードフレーム２との接触箇所に樹脂１２を用
いている例もある。リードフレーム受け台８とリードフ
レーム押さえ１の平行度が若干ずれていても、そのずれ
を樹脂１２が吸収し均一にインナーリード４を押さえる
目的である。Further, as shown in FIG. 4, there is an example in which a resin 12 is used at a contact portion of the lead frame holder 1 with the lead frame 2. Even if the parallelism between the lead frame cradle 8 and the lead frame holder 1 is slightly deviated, the resin 12 absorbs the deviation and uniformly presses the inner lead 4.

【０００４】[0004]

【発明が解決しようとする課題】しかし、図３のように
リードフレーム押さえ１のリードフレーム２を固定する
箇所が凸部３の金属の場合は、リードフレーム押さえ１
とリードフレーム２の下側のリードフレーム受け台８の
平行がでていないと全インナーリード４を押さえる事が
できなくなってしまう。インナーリード４の押さえが弱
い場合は、ワイヤーボンディングの接合強度不足等の品
質異常の元となる。全インナーリード４を均一にしっか
り固定するには、リードフレーム押さえ１とリードフレ
ーム受け台８を平行に調整しなければいけない。近年、
半導体パッケージの多ピン化が進み半導体チップの大型
化からリードフレーム押さえ１も大型化しており、リー
ドフレーム押さえ１とリードフレーム受け台８の平行調
整にかなりの時間がかかるという課題を有していた。However, as shown in FIG. 3, when the lead frame holder 1 is fixed to the lead frame 2 by a metal having a convex portion 3, the lead frame holder 1 is attached.
If the lead frame cradle 8 on the lower side of the lead frame 2 is not parallel, it becomes impossible to hold all the inner leads 4. If the inner lead 4 is pressed down weakly, it may cause a quality abnormality such as insufficient bonding strength of wire bonding. In order to uniformly and firmly fix all the inner leads 4, the lead frame retainer 1 and the lead frame pedestal 8 must be adjusted in parallel. recent years,
Since the number of pins of the semiconductor package has been increased and the size of the semiconductor chip has been increased, the lead frame holder 1 has also been enlarged, and there has been a problem that parallel adjustment of the lead frame holder 1 and the lead frame holder 8 takes a considerable amount of time. .

【０００５】また、図４に示すようにリードフレーム押
さえ１のリードフレーム２との接触箇所に、樹脂１２を
用いている例もあるが、３００℃付近の高温で長期間の
使用には耐えられ無かったり、樹脂１２のインナーリー
ド４を押さえている所が変形してしまうため３カ月以上
に渡った長期使用ができず、定期交換が必要という課題
も有していた。As shown in FIG. 4, there is also an example in which the resin 12 is used at the contact portion of the lead frame holder 1 with the lead frame 2, but it cannot withstand long-term use at a high temperature of about 300 ° C. There is also a problem that it cannot be used for a long period of more than 3 months because it is not present or the place holding the inner lead 4 of the resin 12 is deformed, and that it needs to be replaced regularly.

【０００６】そこで本発明は、従来のこのような課題を
解決するために、リードフレーム押さえに板バネを用い
る事で、リードフレーム押さえとリードフレーム受け台
との平行が若干ずれていても板バネがそのずれを吸収し
インナーリード全体をしっかり固定することが可能とな
る。つまり、リードフレーム押さえのセッティングが短
時間で容易にでき、かつ金属製とする事で長期に渡り使
用できる事を目的としている。Therefore, in the present invention, in order to solve such a conventional problem, a leaf spring is used for the lead frame retainer, so that the leaf spring is slightly deviated from the parallelism between the lead frame retainer and the lead frame cradle. However, it is possible to absorb the deviation and firmly fix the entire inner lead. In other words, the purpose is to set the lead frame holder easily in a short time, and to use it over a long period of time because it is made of metal.

【０００７】[0007]

【課題を解決するための手段】前述の課題を解決するた
め、本発明のワイヤーボンディング装置は、半導体チッ
プと外部に信号を入出力する為のリードフレームとを接
続するワイヤーボンディング装置に於て、ワイヤーボン
ディングの際に前記リードフレームを固定するリードフ
レーム押さえに板バネを設ける手段を取る。In order to solve the above-mentioned problems, a wire bonding apparatus of the present invention is a wire bonding apparatus for connecting a semiconductor chip and a lead frame for inputting and outputting a signal to the outside. A means for providing a leaf spring on the lead frame holder for fixing the lead frame at the time of wire bonding is taken.

【０００８】[0008]

【実施例】以下に本発明の実施例を図面にもとづいて説
明する。Embodiments of the present invention will be described below with reference to the drawings.

【０００９】図１に於て、リードフレーム２のアイラン
ド部５の上に接着剤６を介し半導体チップ７が搭載され
ている。リードフレーム２の下側にあるリードフレーム
受け台８と、リードフレーム押さえ１がリードフレーム
２を押さえている。このリードフレーム２を固定した状
態でワイヤーボンディングを行なう。In FIG. 1, a semiconductor chip 7 is mounted on the island portion 5 of the lead frame 2 with an adhesive 6 interposed therebetween. The lead frame pedestal 8 below the lead frame 2 and the lead frame retainer 1 retain the lead frame 2. Wire bonding is performed with the lead frame 2 fixed.

【００１０】半導体チップ７の電極とリードフレーム２
のインナーリード４を安定してワイヤーボンディングす
る為に、インナーリード４と半導体チップ７の確実な固
定が不可欠となる。インナーリード４の固定を確実にで
きれば、リードフレーム２を介し半導体チップ７の固定
も確実となる。Electrodes of semiconductor chip 7 and lead frame 2
In order to stably wire-bond the inner lead 4 of the above, it is indispensable to securely fix the inner lead 4 and the semiconductor chip 7. If the inner lead 4 can be securely fixed, the semiconductor chip 7 can be surely fixed via the lead frame 2.

【００１１】リードフレーム押さえ１のリードフレーム
２との接触箇所には、板バネ９が止めネジ１０で固定さ
れている。板バネ９は、耐熱性を持たせるため金属製と
する。A leaf spring 9 is fixed by a set screw 10 at a contact portion of the lead frame holder 1 with the lead frame 2. The leaf spring 9 is made of metal so as to have heat resistance.

【００１２】リードフレーム２の搬送時に於いて、板バ
ネ９とリードフレーム２が接触して傷つけないように板
バネ９の先端を曲げている。板バネ９は４辺に分かれる
事によって、リードフレーム受け台８とリードフレーム
押さえ１の平行が若干ずれていても、インナーリード４
の辺毎に独立して押さえる事が可能となる。従来は、リ
ードフレーム受け台８とリードフレーム押さえ１の平行
を完全に調整しないと、インナーリード４の２辺は押さ
えられても、残り２辺が押さえられないとか、１辺の中
でも押さえられている所と押さえられない所の差が発生
してしまう。この調整には、時間が掛かり、熟練を必要
とする作業であった。また、平行を調整する時に無理な
力をかけたり、長期の使用によってリードフレーム押さ
え１が変形し、インナーリード４の全辺を押さえる事が
不可能になる場合もある。When the lead frame 2 is conveyed, the tip of the leaf spring 9 is bent so that the leaf spring 9 and the lead frame 2 do not come into contact with each other and are damaged. Since the leaf spring 9 is divided into four sides, even if the parallelism between the lead frame receiving base 8 and the lead frame retainer 1 is slightly deviated, the inner lead 4
It is possible to hold down each side independently. Conventionally, unless the parallelism between the lead frame cradle 8 and the lead frame holder 1 is completely adjusted, the inner lead 4 may be held on two sides, but the remaining two sides may not be held, or even on one side. There will be a difference between where you are and where you cannot hold it. This adjustment was time-consuming and required skill. In addition, it may be impossible to press all the sides of the inner lead 4 by applying an unreasonable force when adjusting the parallelism or deforming the lead frame holder 1 due to long-term use.

【００１３】図２に、別の実施例を示す。FIG. 2 shows another embodiment.

【００１４】リードフレーム接触部１１は、板バネ９を
介し、リードフレーム押さえ１に接続されている。リー
ドフレーム受け台８とリードフレーム押さえ１の平行が
若干ずれていても、板バネ９が吸収し、全てのインナー
リード４を均一に固定する事が可能である。The lead frame contact portion 11 is connected to the lead frame retainer 1 via a leaf spring 9. Even if the lead frame cradle 8 and the lead frame retainer 1 are slightly deviated from each other in parallel, the leaf springs 9 absorb them and all the inner leads 4 can be fixed uniformly.

【００１５】リードフレーム接触部１１と板バネ９は止
めネジ１０で固定され、この止めネジ１０の取付寸法を
共通化すれば、リードフレーム２の機種切り替え時に
は、リードフレーム接触部１１のみの交換で機種切り替
えができる。The lead frame contact portion 11 and the leaf spring 9 are fixed by a set screw 10. If the mounting dimensions of the set screw 10 are made common, only the lead frame contact portion 11 can be replaced when the lead frame 2 is switched to another model. You can switch models.

【００１６】図１の実施例の場合は、機種切り替えの
際、リードフレーム押さえ１と板バネ９の両方の交換が
必要になるのに対し、図２の実施例ではリードフレーム
接触部１１の交換のみで可能で、コスト低減及び機種切
り替え工数の削減につながる。図１、２の両方の実施例
とも従来のワイヤーボンディング装置において、機構の
改造をせず、リードフレーム押さえ部のみの変更で実現
でき、非常に有効な手段である。In the case of the embodiment shown in FIG. 1, both the lead frame retainer 1 and the leaf spring 9 need to be replaced when the model is changed, whereas in the embodiment shown in FIG. 2, the lead frame contact portion 11 is replaced. This is possible only by reducing costs and man-hours for changing models. Both of the embodiments shown in FIGS. 1 and 2 are very effective means that can be realized by modifying only the lead frame pressing portion without modifying the mechanism in the conventional wire bonding apparatus.

【００１７】また、本実施例では板バネを使用したが、
これに限るものではなく、板バネと同様の機能を有する
もので有れば何でも良い。Although a leaf spring is used in this embodiment,
The invention is not limited to this, and may be anything as long as it has a function similar to that of a leaf spring.

【００１８】[0018]

【発明の効果】本発明のワイヤーボンディング装置は、
以上説明したようにワイヤーボンディングの際にリード
フレームを固定するリードフレーム押さえに板バネを設
けるといった簡単な構造によって、リードフレーム受け
台とリードフレーム押さえの平行度を正確に調整しなく
ても、簡単にリードフレームのインナーリードを均一に
固定することが可能となり、高品質のワイヤーボンディ
ングを長期に渡り維持できるという効果がある。The wire bonding apparatus of the present invention is
As explained above, the simple structure of providing a leaf spring to the lead frame retainer that fixes the lead frame during wire bonding makes it easy to adjust the parallelism between the lead frame cradle and the lead frame retainer easily. Moreover, it is possible to fix the inner leads of the lead frame uniformly, and it is possible to maintain high-quality wire bonding for a long period of time.

【図面の簡単な説明】[Brief description of drawings]

【図１】 本発明の実施例を示す平面図、及び縦断面
図。FIG. 1 is a plan view and a vertical sectional view showing an embodiment of the present invention.

【図２】 本発明の別の実施例を示す平面図、及び縦断
面図。FIG. 2 is a plan view and a vertical sectional view showing another embodiment of the present invention.

【図３】 従来のワイヤーボンディング装置を示す平面
図、及び縦断面図。3A and 3B are a plan view and a vertical sectional view showing a conventional wire bonding apparatus.

【図４】 従来の別のワイヤーボンディング装置を示す
平面図、及び縦断面図。FIG. 4 is a plan view and a vertical cross-sectional view showing another conventional wire bonding device.

【符号の説明】[Explanation of symbols]

１ リードフレーム押さえ ２ リードフレーム ３ 凸部 ４ インナーリード ５ アイランド部 ６ 接着剤 ７ 半導体チップ ８ リードフレーム受け台 ９ 板バネ １０ 止めネジ １１ リードフレーム接触部 １２ 樹脂 1 Lead frame holder 2 Lead frame 3 Convex part 4 Inner lead 5 Island part 6 Adhesive 7 Semiconductor chip 8 Lead frame pedestal 9 Leaf spring 10 Set screw 11 Lead frame contact part 12 Resin

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】半導体チップと外部に信号を入出力する為
のリードフレームとを接続するワイヤーボンディング装
置に於て、ワイヤーボンディングの際に前記リードフレ
ームを固定するリードフレーム押さえに板バネを設けた
事を特徴としたワイヤーボンディング装置。1. A wire bonding apparatus for connecting a semiconductor chip and a lead frame for inputting / outputting signals to / from the outside, wherein a leaf spring is provided on a lead frame retainer for fixing the lead frame during wire bonding. A wire bonding device that features things.
JP5133627A 1993-06-03 1993-06-03 Wire bonder Pending JPH06349881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5133627A JPH06349881A (en) 1993-06-03 1993-06-03 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5133627A JPH06349881A (en) 1993-06-03 1993-06-03 Wire bonder

Publications (1)

Publication Number Publication Date
JPH06349881A true JPH06349881A (en) 1994-12-22

Family

ID=15109245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5133627A Pending JPH06349881A (en) 1993-06-03 1993-06-03 Wire bonder

Country Status (1)

Country Link
JP (1) JPH06349881A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020069885A (en) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 Clamp for semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020069885A (en) * 2001-02-28 2002-09-05 앰코 테크놀로지 코리아 주식회사 Clamp for semiconductor package

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