JPH06331681A - Substrate inspection equipment and method for inspecting substrate - Google Patents

Abstract

PURPOSE:To perform detection in accordance with the deteriorated state of a probe by providing a probe short circuit plate, and providing a registering process, an offset resistance measuring process, a comparing process, and a defective stopping process. CONSTITUTION:NC data, an inspection reference resistance and a probe criterion resistance are registered in a controller 9. Next, a first 1 and second 4 contact head portion are positioned by means of a first 3 and second 6 XY robot, respectively, and a first 2 and second 5 probe are lowered and contacted with a probe short circuit plate 10 and the offset resistance of the probe is calculated using the controller 9. Then the preregistered probe criteria resistance and the offset resistance of the probe are compared with each other. When the offset resistance is greater than the criteria, the probe is regarded as being defective with advanced wear and deterioration, and it is displayed in the controller 9 to stop equipment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is designed for conducting and insulating a substrate.
The present invention relates to a board inspection machine and an inspection method for inspecting using the above-mentioned probes.

[0002]

2. Description of the Related Art In recent years, a board inspector has been designed to increase the speed of inspection, improve the accuracy of probe positioning, and increase the accuracy of inspection results in response to the miniaturization and high density of the land of the board, the miniaturization and thinning of the board size. Reliability is improving, and we are pursuing improved inspection efficiency.

Under the circumstances, in order to improve the reliability of the inspection result, a board inspection machine has been developed which is provided with a method of detecting deterioration of the probe and exchanging it.

An example of the above-described conventional board inspection machine will be described below with reference to the drawings. 4 is a schematic view of a conventional board inspection machine, FIG. 5 is a principle diagram of resistance measurement of the board inspection machine,
FIG. 6 shows an inspection flow chart in a conventional board inspection machine.

In FIG. 4, reference numeral 1 is a first contact head portion for moving the first probe up and down, 2 is a first probe, 3 is a first XY robot for positioning the first contact head portion based on a command from a controller, and 4 is a first robot. 2 probes 5
Second XY robot for positioning the second contact head portion based on a command from the controller, 7 a substrate holding portion for holding a substrate to be inspected, 8 a substrate, and 9 a first 1XY robot, second
It is a controller that operates and inspects the XY robot, the first contact head portion, and the second contact head portion.

In FIG. 5, 11 is a DC constant voltage power supply built in the controller, 12 is an ammeter also built in, 13 is the specific resistance of the first probe and the second probe (hereinafter, offset resistance r and Reference numeral 14 denotes a substrate pattern (having a resistance value R; hereinafter, this resistance is referred to as a pattern resistance R), and 15 denotes a substrate insulator. Reference numeral 2 indicates a first probe, and 5 indicates a second probe, which correspond to 2 and 5 in FIG. 4, respectively.

In FIG. 6, # 1-2 registers the NC data probe replacement frequency that determines the positioning points of the first XY robot and the second XY robot required for the substrate inspection, the offset resistance r of the probe, and the inspection reference resistance value R ₀ . Registration process,
# 2 is a start-up process for starting the inspection of the equipment, # 9 is positioning the first XY robot and the second XY robot,
A pattern resistance measuring step of lowering the probe and the second probe to bring them into contact with the substrate and applying a voltage V to measure a current I to obtain a resistance R. # 10 is a comparing step of comparing an inspection reference resistance value R _o with the pattern resistance R. , # 11 is a pass output step of outputting OK as a measurement result, # 12 is a fail output step of outputting NG, # 13 is a probe raising step of raising the first probe and the second probe, and # 14 is provided in the controller. The probe up / down counting step of adding 1 to the up / down counter of the existing probe, # 15 is a counter comparing step of comparing the value of the probe up / down counter with the probe replacement frequency registered in the registration step of # 1-2, and # 16 is a counter. A warning that displays a probe replacement warning on the controller when the probe up / down counter value exceeds the probe replacement count in the comparison process The display step, # 7, is an inspection end determination step of determining whether or not all the inspection points on the board have been inspected.

The operation of the board inspecting apparatus having the above structure will be described below.

The conventional board inspecting machine inspects according to the flowchart of FIG. First, in the # 1-2 registration process, as shown in FIG.
To the controller 9 of NC data, the number of probe replacements,
The offset resistance r of the probe and the inspection reference resistance value R _o are registered, and the inspection of the substrate inspection machine is started in the # 2 starting step.

In the # 9 pattern resistance measuring step, the first contact head portion 1 and the second contact head portion 2 of FIG.
The XY robot 6 positions the first probe 2 and the second probe 5 on the substrate 8 fixed to the substrate holder 7.
To make contact. Then, the DC constant voltage power supply 11 and the ammeter 12 built in the controller form the closed circuit shown in FIG. 5, so the current I (A) measured by the ammeter
Then, the substrate pattern resistance R (Ω) is calculated by the voltage V (v) of the DC constant voltage power supply and the offset resistance r (Ω) of the registered probe.

[0011]

[Equation 1]

Is calculated by the controller according to Note that the offset resistance r of the probe is previously registered in the # 1-2 registration step with a value measured by another means.

Then, in the comparison step # 10, the inspection reference resistance value R _o and the substrate pattern resistance R are compared. If the inspection is to check the continuity of the pattern, go to the # 11 pass output step with R _o ≧ R. If the check is to check the registration between the patterns, go to the # 11 pass output step with R _o ≦ R, and measure. As a result, OK is output from the controller. If the conditions are not met, the process proceeds to # 12 reject output step, and NG is output from the controller as the measurement result. Then # 1
In the 3 probe raising step, the probe 1 and the probe 2 are raised to complete the inspection at one inspection point having NC data.

Next, since the probe 1 and the probe 2 are moved up and down in the step of measuring the # 9 pattern resistance and the step of raising the probe of # 13, the probe up / down counter provided in the controller is set to 1 in the step of # 14 probe up / down counting.
In addition, the probe up / down counter value is compared with the probe replacement count in the # 15 counter comparison step, and when the probe up / down counter value reaches the probe replacement count, the # 16 warning display step displays the probe replacement warning on the controller. And stop the equipment. If it has not reached, it is determined in the # 7 inspection end determination step whether all the NC data have been inspected, and the processing from the # 9 pattern resistance measurement step is executed again until the inspection is completed.

[0015]

However, the above-mentioned structure has the following problems.

The number of probe replacements registered in the registration step of FIG. 6 # 1-2 is a value based on an experiment or a conventional result, that is, a planned number, and therefore does not necessarily match an actual probe state. Therefore, when the probe replacement number is reached, The probe may not be worn or deteriorated enough to replace it, or the probe may already be deteriorated.

The offset resistance r of the probe registered in the registration process of # 1-2 in FIG. 6 is a value measured and registered in advance by another means, but the offset resistance r changes as the probe wears and deteriorates. However, the error of the pattern resistance R increases as it affects the formula 1 used in the pattern resistance measurement step of # 9 in FIG.

In order to solve the above problem, in the configuration of the conventional board inspection machine, it is necessary to measure the offset resistance r by regularly inspecting the probe, which leads to an increase in maintenance man-hours.

In view of the above problems, the present invention provides a probe short-circuit plate in equipment and measures the offset resistance of the probe before inspecting the substrate to detect the wear and deterioration of the probe in accordance with the current situation and replace the probe. By providing a warning and feeding back the offset resistance of the probe, the measurement error of the pattern resistance R is reduced, the reliability of the inspection is improved, and the number of maintenance steps is reduced.

[0020]

In order to solve the above problems, the substrate inspection machine of the present invention has a probe short circuit plate for measuring the offset resistance of the probe,
Further, before performing the registration process of registering the resistance value for probe quality judgment and the inspection of the substrate to be measured, the probe is positioned on the probe short-circuit plate, the first plane robot and the second plane robot are positioned, the probe is lowered, and the first probe, the second probe Voltage is applied to the probe to measure the current, offset resistance measurement process to determine the offset resistance and comparison process to compare the measured offset resistance and the probe pass / fail judgment resistance value, and if it fails, stop the equipment and control the probe failure To display,
It has a defective stopping step.

[0021]

According to the present invention, by the configuration described above, the probe pass / fail judgment resistance value is registered in the registration process, and the offset resistance of the probe is measured in the offset resistance measurement process by the probe short-circuit plate provided in the equipment before the board inspection. In the comparison step, compare the probe pass / fail judgment resistance value with the offset resistance, and if the offset resistance is larger than the probe pass / fail judgment resistance value,
By displaying the probe failure in the failure stop process and stopping the equipment, the worn or deteriorated probe is replaced.

If the offset resistance is equal to or lower than the probe quality determination resistance value in the comparison step, the probe offset resistance measured in the offset resistance measuring step is used as a new offset resistance in the offset resistance updating step before the substrate inspection. By registering, the measurement error of the pattern resistance is reduced, and the measurement of the offset resistance by the periodic inspection of the probe becomes unnecessary.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate inspection machine according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view of a substrate inspection machine according to an embodiment of the present invention. In FIG. 1, items 1 to 9 are the same as those in FIG. 4 in the conventional technique, and therefore detailed description will be omitted. 10 is the first probe before board inspection,
It is a probe short-circuit plate used when measuring the offset resistance of the probe by bringing the second probe into descending contact.

The operation of the substrate inspecting apparatus constructed as above will be described below with reference to the first embodiment with reference to FIGS. FIG. 2 shows an inspection flow chart of the substrate inspection machine in the first embodiment of the present invention. # 1-1 is a registration process of registering NC data for determining the positioning points of the first XY robot and the second XY robot required for the board inspection, the inspection reference resistance value R _o , and the probe pass / fail judgment resistance value r _o ; In the start-up process of starting the inspection, # 3 positions the first XY robot and the second robot at the position of the probe short-circuit plate, lowers the first probe and the second probe to bring them into contact with the probe short-circuit plate, apply the voltage V, and apply the current I. Is measured to obtain the offset resistance r of the probe, # 4 is a comparison step of comparing the probe pass / fail judgment resistance value r _o with the offset resistance r of the probe, and # 5 is the controller that the probe is defective. Defect stopping step for displaying and stopping the equipment, # 6 is an inspection step for inspecting the measurement target board, and # 7 is an inspection step for judging whether or not all the inspection points of the board are inspected This is the inspection end determination step. The # 6 inspection step is the conventional # 9 pattern resistance measurement step in FIG. 6, the # 10 comparison step,
The process is the same as the process surrounded by the dotted line up to the # 11 pass output process, the # 12 fail output process, and the # 13 probe raising process.

The board inspection is performed according to FIG. First,
In the # -1 registration process, NC to the controller 9 in FIG.
The data, the inspection reference resistance value R _o , and the probe pass / fail judgment resistance value r _o are registered. The probe pass / fail judgment resistance value r _o registered here is the offset resistance of the probe that is reached when the probe is worn and deteriorated. Normally, the probe is oxidized, blackened, and abraded as it is used, so the value becomes larger than the initial offset resistance. Next, in the # 2 starting step, the inspection of the board inspection machine is started. In the # 3 offset resistance measuring step, the first contact head portion 1 and the second contact head portion 2 in FIG.
The Y-robot 6 positions the first probe 2 and the second probe 2 on the probe short-circuit plate 10 fixed to the substrate holder 7.
The probe 5 is brought into descending contact. Then, the closed circuit shown in FIG. 5 of the prior art is formed. Since the probe short circuit plate uses a copper plate, its own resistance becomes almost zero. Therefore, the voltage V (v) of the DC constant voltage power supply and the current I measured by the ammeter
The offset resistance r (Ω) of the probe in (A) is

[0027]

[Equation 2]

Is calculated in the controller by The first probe and the second probe are raised, and the probe pass / fail judgment resistance value r _o and the probe offset resistance r are compared in the # 4 comparison step. If r _o ≤r, the probe is regarded as a non-defective product in which wear and deterioration have not progressed, and the # 6 inspection process is performed.
In the # 7 inspection end determination step, it is determined that all points of the NC data have been inspected, and the inspection is performed. If r _o > r, the probe is considered to be defective due to wear and deterioration, and the equipment is stopped by displaying on the controller that the probe is defective in step # 5 failure stop.

As described above, according to the first embodiment, the probe inspecting device is provided with the substrate inspecting device, and the registration process is performed as a process.
By providing the offset resistance measuring step, the comparing step, and the failure stopping step, it is possible to detect the wear and deterioration of the probe in accordance with the current situation and replace the probe.

The second embodiment of the present invention will be described below with reference to FIG. FIG. 3 is a flow chart in the first embodiment, in which the offset resistance r of the probe measured in the # 3 offset resistance measuring step after the process in which the probe is determined to be non-defective in the # 4 comparing step of FIG. 2 is used as a new offset resistance r. The offset resistance updating process to be registered is provided.

As a result, the offset resistance r of the probe used in the # 6 inspection step becomes a value in accordance with the current state of wear and deterioration of the probe, and the measurement error of the pattern resistance R can be reduced.

In this embodiment, the probe short-circuit plate is provided in the substrate inspection machine. However, when the quality of the substrate to be measured is stable, a part of the pattern on the substrate is used as a substitute for the probe short-circuit plate. be able to.

[0033]

As described above, according to the present invention, the probe short-circuit plate is provided, and the registration step, the offset resistance measuring step, the comparing step, and the defective stopping step are provided as the processing, so that the wear and deterioration of the probe can be detected according to the current situation. However, the probe can be replaced.

Further, by providing the offset resistance updating step, the measurement error of the pattern resistance can be reduced and the inspection reliability can be improved.

Further, since it is not necessary to manually measure the offset resistance of the probe, it is possible to reduce the number of maintenance steps.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a substrate inspection machine according to an embodiment of the present invention.

FIG. 2 is an inspection flowchart diagram of a substrate inspection method according to the first embodiment of the present invention.

FIG. 3 is an inspection flowchart diagram of a substrate inspection method according to a second embodiment of the present invention.

FIG. 4 is a schematic perspective view of a conventional board inspection machine.

FIG. 5: Principle diagram of resistance measurement of board inspection machine

FIG. 6 is an inspection flowchart diagram in a conventional board inspection method.

[Explanation of symbols]

 1 1st contact head part 2 1st probe 3 1st XY robot 4 2nd contact head part 5 2nd probe 6 2nd XY robot 7 Substrate holding part 8 Substrate 9 Controller 10 Probe short-circuit board

Claims (3)

[Claims] 1. A substrate inspection machine having a probe short-circuit plate for measuring an offset resistance of a probe. 2. A registration step of registering a resistance value for probe quality judgment, positioning the first plane robot and the second plane robot on the probe short-circuit plate before inspecting the substrate to be measured, and lowering the probe first. The voltage is applied to the probe and the second probe to measure the current, and the offset resistance measurement process for obtaining the offset resistance, the comparison process for comparing the measured offset resistance and the probe pass / fail judgment resistance value, and in the case of failure, the equipment is stopped. A board inspection method comprising: a failure stopping step of displaying a probe failure on a controller. 3. An offset resistance updating step of registering the offset resistance measured in the offset resistance measuring step as a new offset resistance, and an inspection for inspecting a substrate to be measured using the updated offset resistance, if the result is acceptable after the comparison step. 3. The substrate inspection method according to claim 2, further comprising a step and an inspection end determination step of determining the inspection end.