JPH0632382B2 - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH0632382B2 JPH0632382B2 JP60010143A JP1014385A JPH0632382B2 JP H0632382 B2 JPH0632382 B2 JP H0632382B2 JP 60010143 A JP60010143 A JP 60010143A JP 1014385 A JP1014385 A JP 1014385A JP H0632382 B2 JPH0632382 B2 JP H0632382B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- circuit board
- constant ceramic
- thick film
- dielectric constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子機器に用いることができる回路基板に関す
るものである。Description: TECHNICAL FIELD The present invention relates to a circuit board that can be used in electronic devices.
従来の技術 近年、電子機器にセラミック誘電体を応用した回路基板
が幅広く使用されている。2. Description of the Related Art In recent years, circuit boards using ceramic dielectrics have been widely used in electronic devices.
以下図面を参照しながら従来の回路基板の一例について
説明する。An example of a conventional circuit board will be described below with reference to the drawings.
第３図は従来の回路基板の側断面図を示すものであり、
第３図において、１は基板、２は電子部品、３は導体、
４は抵抗体、５はスルーホール、６は厚膜ガラス，樹脂
等のオーバーコート、８ははんだである。FIG. 3 is a side sectional view of a conventional circuit board,
In FIG. 3, 1 is a substrate, 2 is an electronic component, 3 is a conductor,
Reference numeral 4 is a resistor, 5 is a through hole, 6 is an overcoat of thick film glass, resin or the like, and 8 is a solder.
以上のように構成された回路基板について、以下その動
作を説明する。The operation of the circuit board configured as described above will be described below.
第３図の回路基板は厚膜ハイブリッドＩＣあって、一般
に基板１をアルミナにより構成しており、表面、裏面に
導体３を印刷法にて構成し、スルーホール５によって表
裏面の導体を結線し、抵抗体４を印刷法にて構成し、オ
ーバーコート６を印刷法にて構成した後、電子部品２を
搭載してはんだ８によって結線される。The circuit board shown in FIG. 3 is a thick film hybrid IC, and the board 1 is generally made of alumina. The conductors 3 are formed on the front surface and the back surface by a printing method, and the conductors on the front and back surfaces are connected by the through holes 5. After the resistor 4 is formed by the printing method and the overcoat 6 is formed by the printing method, the electronic component 2 is mounted and connected by the solder 8.
一方、第２図は一般的なラジオ受信機におけるＦＭ−Ａ
Ｍ中間周波増幅回路例であり、増幅素子ＩＣ１、コンデ
ンサＣ１−Ｃ１７、抵抗Ｒ１−Ｒ１１、中間周波トラン
スＴ１，Ｔ２、トランジスタＱ１，Ｑ２、コイルＬ１，
Ｌ２、バリコンＶＣ１により構成され、これらは第３図
のような従来の回路基板に搭載され結線されていた。On the other hand, FIG. 2 shows FM-A in a general radio receiver.
This is an example of an M intermediate frequency amplifier circuit, which is an amplifier element IC1, capacitors C1-C17, resistors R1-R11, intermediate frequency transformers T1, T2, transistors Q1, Q2, coils L1 ,.
It is composed of L2 and variable capacitor VC1, which are mounted and connected to a conventional circuit board as shown in FIG.
発明が解決しようとする問題点 しかしながら上記のような構成では、搭載する電子部品
２の数が多く機器の高密度化、小型化が困難であり、部
品の実装コストが多くなるとともに、電子部品の接続点
における信頼性が低下するという問題点を有していた。
一方、回路基板１は回路結線だけの単一機能にとどまり
多機能化が困難という問題点を有していた。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, with the above-described configuration, the number of electronic components 2 to be mounted is large, and it is difficult to increase the density and size of the device. There was a problem that the reliability at the connection point was reduced.
On the other hand, the circuit board 1 has a problem that it is difficult to realize multiple functions because it has only a single function of circuit connection.
本発明は上記問題点に鑑み、高密度、小型化を実現させ
部品実装コストを低減するとともに信頼性の高い、複合
機能を有する回路基板を提供するものである。In view of the above problems, the present invention provides a circuit board having a composite function, which realizes high density and miniaturization to reduce component mounting cost and has high reliability.
問題点を解決するための手段 上記問題点を解決するために本発明の回路基板は、高誘
電率セラミック基板内部に複数の積層コンデンサを設
け、そのコンデンサをスルーホールによって表面に引き
出すとともに表面に厚膜回路を構成して成る第１の複合
部品と、低誘電率セラミック基板内部に複数の積層コン
デンサを設け、そのコンデンサをスルーホールによって
表面に引き出すとともに表面に厚膜回路を構成して成る
第２の複合部品とを樹脂あるいは厚膜ガラス等によって
接着すると同時に対向する導体を接続し、さらに第１あ
るいは第２の複合部品の表面に他の電子部品を装着して
成るという構成を備えたものである。Means for Solving the Problems In order to solve the above problems, the circuit board of the present invention is provided with a plurality of multilayer capacitors inside a high dielectric constant ceramic substrate, and the capacitors are drawn out to the surface by through holes and formed on the surface. A first composite component that forms a film circuit, and a plurality of multilayer capacitors provided inside a low dielectric constant ceramic substrate, and the capacitors are drawn out to the surface by through holes and a thick film circuit is formed on the surface. The composite component is adhered with resin or thick-film glass or the like, and at the same time, opposing conductors are connected, and another electronic component is mounted on the surface of the first or second composite component. is there.
作 用 本発明は上記した構成によって、高誘電率セラミック基
板と、低誘電率セラミック基板の内部に各々複数の積層
コンデンサを設けるとともに、そのコンデンサをスルー
ホール、厚膜導体により接続することによって回路基板
内にコンデンサ回路を構成し、さらに前記回路基板の表
面に厚膜回路を構成することによって表面に搭載する電
子部品を大幅に削減させることができ、機器の高密度
化、小型化がはかれ、部品の実装コストを下げることが
できるとともに、電子部品の接続箇所が少なくなること
から信頼性を著しく向上させることができる。一方、回
路基板として回路結線だけの単一機能にとどまらずコン
デンサ、抵抗を複合した多機能回路基板が実現できる。Operation According to the present invention, the circuit board is constructed by providing a plurality of multilayer capacitors inside the high-dielectric-constant ceramic substrate and the low-dielectric-constant ceramic substrate, respectively, and connecting the capacitors by through holes and thick-film conductors. By configuring a capacitor circuit in the inside, and further by configuring a thick film circuit on the surface of the circuit board, it is possible to significantly reduce the electronic components mounted on the surface, the density of the equipment, downsizing is achieved, The mounting cost of components can be reduced, and the number of connecting points for electronic components can be reduced, so that reliability can be significantly improved. On the other hand, it is possible to realize not only a single function of circuit connection as a circuit board, but also a multifunctional circuit board in which capacitors and resistors are combined.
実施例 以下本発明の実施例の回路基板について、図面を参照し
ながら説明する。Example A circuit board according to an example of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例における回路基板の側断面図
である。第１図において、２は電子部品、３は導体、４
は抵抗体、５，７はスルーホール、６は厚膜ガラス，樹
脂等のオーバーコート、８ははんだ、９は高誘電率セラ
ミック基板、１０は低誘電率セラミック基板、１１はス
ルーホール５の表面部導体、１２は高誘電率セラミック
基板９と低誘電率セラミック基板１０とを接着する厚膜
ガラス、Ｃ１０，Ｃ１１は低誘電率セラミック基板１０
の内部に構成した積層コンデンサ、Ｃ１２，Ｃ１３は高
誘電率セラミック基板９の内部に構成した積層コンデン
サである。FIG. 1 is a side sectional view of a circuit board according to an embodiment of the present invention. In FIG. 1, 2 is an electronic component, 3 is a conductor, 4
Is a resistor, 5 and 7 are through holes, 6 is an overcoat of thick film glass, resin, etc., 8 is a solder, 9 is a high dielectric constant ceramic substrate, 10 is a low dielectric constant ceramic substrate, and 11 is the surface of the through hole 5. Part conductors, 12 is thick film glass for adhering the high dielectric constant ceramic substrate 9 and the low dielectric constant ceramic substrate 10, and C10 and C11 are the low dielectric constant ceramic substrate 10.
The multilayer capacitors C12 and C13 are inside the high dielectric constant ceramic substrate 9.
以上のように構成された回路基板について、以下第１
図，第２図を用いてその動作を説明する。コンデンサＣ
１０，Ｃ１１は低誘電率セラミック基板１０の内部に積
層法によって作られたコンデンサであり、コンデンサＣ
１２，Ｃ１３は高誘電率セラミック基板９の内部に積層
法によって作られたコンデンサを示してある。これらは
スルーホール５によって各々のセラミック基板９，１０
の表面に導出され、導体１１を前記コンデンサの端子電
極としており、高誘電率セラミック基板９にあっては表
面に構成した導体３、抵抗体４との接続によりネットワ
ークを構成し、低誘電率セラミック基板１０にあっては
表面に構成した導体３との接続により電子部品２との結
線導体としている。一方、前記高誘電率セラミック基板
９、低誘電率セラミック基板１０は厚膜ガラス１２によ
り接着するとともに、高誘電率セラミック基板９と低誘
電率セラミック基板１０との結線を必要とする導体１１
および導体３は各々の箇所で対向させ、厚膜ガラスによ
る接着時に同時に厚膜導体により接続できる。Regarding the circuit board configured as described above, the first
The operation will be described with reference to FIGS. Capacitor C
Reference numerals 10 and C11 denote capacitors formed inside the low dielectric constant ceramic substrate 10 by a lamination method.
Reference numerals 12 and 13 denote capacitors formed inside the high dielectric constant ceramic substrate 9 by a laminating method. These are formed by the through holes 5 to the respective ceramic substrates 9, 10
Of the high dielectric constant ceramic substrate 9 is connected to the conductor 3 and the resistor 4 formed on the surface of the high dielectric constant ceramic substrate 9 to form a network. The board 10 is connected to the conductor 3 formed on the surface of the board 10 to form a connection conductor with the electronic component 2. On the other hand, the high-dielectric-constant ceramic substrate 9 and the low-dielectric-constant ceramic substrate 10 are bonded by a thick film glass 12, and a conductor 11 that requires connection between the high-dielectric-constant ceramic substrate 9 and the low-dielectric-constant ceramic substrate 10.
The conductor 3 and the conductor 3 can be made to face each other and can be simultaneously connected by the thick film conductor at the time of bonding by the thick film glass.
なお、スルーホール７は低誘電率セラミック基板あるい
は高誘電率セラミック基板の表裏面を結線するためのも
のである。The through holes 7 are for connecting the front and back surfaces of the low dielectric constant ceramic substrate or the high dielectric constant ceramic substrate.
以上のように本実施例によれば、第２図におけるＣ１，
Ｃ２，Ｃ３，Ｃ４，Ｃ６，Ｃ７，Ｃ８，Ｃ９，Ｃ１２，
Ｃ１３のコンデンサを高誘電率セラミック基板９の内部
に設け、それらのコンデンサをスルーホール５によって
各々表面に引き出すとともに、表面に第２図におけるＲ
１−Ｒ１１の抵抗体４を構成した第１の複合部品と、第
２図におけるＣ５，Ｃ１０，Ｃ１１のコンデンサを低誘
電率セラミック基板１０の内部に設け、それらのコンデ
ンサをスルーホール５によって表面に引き出すととも
に、表面に厚膜回路を構成した第２の複合部品とを厚膜
ガラス等によって接着すると同時に、対向する導体を接
着面で厚膜導体により接続して回路を構成することによ
り、表面に搭載する他の電子部品２を大幅に削減でき
（第２図においては部品数３８個が１０個になる。）、
実装密度を著しく向上させ、機器の高密度化、小型化が
はかれ、部品の実装コストを下げることができるととも
に、電子部品の接続箇所が少なくなることから信頼性を
著しく向上させることができる回路基板を提供できる。
また、回路基板として回路結線だけの単一機能にとどま
らずコンデンサ、抵抗を複合した多機能回路基板が実現
できる。As described above, according to this embodiment, C1,
C2, C3, C4, C6, C7, C8, C9, C12,
Capacitors of C13 are provided inside the high-dielectric-constant ceramic substrate 9, and those capacitors are drawn to the surface by through holes 5, respectively, and at the surface, R in FIG.
The first composite component constituting the resistor 4 of 1-R11 and the capacitors C5, C10 and C11 in FIG. 2 are provided inside the low dielectric constant ceramic substrate 10, and those capacitors are provided on the surface by the through holes 5. At the same time as pulling out and adhering the second composite component having a thick film circuit formed on the surface thereof with thick film glass or the like, at the same time, the opposing conductors are connected by the thick film conductor at the adhering surface to form a circuit. The number of other electronic components 2 to be mounted can be greatly reduced (the number of components is 38 in FIG. 2, which is 10),
A circuit that can significantly improve the mounting density, increase the density and downsizing of equipment, reduce the mounting cost of components, and significantly improve the reliability because the number of connecting points for electronic components is reduced. A substrate can be provided.
Further, the circuit board is not limited to the single function of circuit connection, and a multifunctional circuit board in which capacitors and resistors are combined can be realized.
発明の効果 以上のように本発明は高誘電率セラミック基板内部に複
数の積層コンデンサを設け、そのコンデンサをスルーホ
ールによって表面に引き出すとともに表面に厚膜回路を
構成して成る第１の複合部品と、低誘電率セラミック基
板内部に複数の積層コンデンサを設け、そのコンデンサ
をスルーホールによって表面に引き出すとともに表面に
厚膜回路を構成して成る第２の複合部品とを樹脂あるい
は厚膜ガラス等によって接着すると同時に、対向する導
体を接続し回路を構成することにより、第１あるいは第
２の複合部品の表面に搭載する他の電子部品を大幅に削
減でき、実装密度を著しく向上させ、機器の高密度化、
小型化がはかれ、部品の実装コストを下げることができ
るとともに、電子部品の接続箇所が少なくなることから
信頼性を著しく向上させることができる。一方、回路基
板として回路結線だけの単一機能にとどまらずコンデン
サ、抵抗を複合した多機能回路基板が実現できる。As described above, according to the present invention, a plurality of laminated capacitors are provided inside a high dielectric constant ceramic substrate, and the capacitors are pulled out to the surface by through holes and a thick film circuit is formed on the surface. , A plurality of laminated capacitors are provided inside the low dielectric constant ceramic substrate, and the capacitors are pulled out to the surface by through holes, and the second composite component formed by forming a thick film circuit on the surface is bonded by resin or thick film glass or the like. At the same time, by connecting opposing conductors to form a circuit, it is possible to significantly reduce other electronic components mounted on the surface of the first or second composite component, significantly improve the packaging density, and increase the device density. Becoming
The size can be reduced, the mounting cost of components can be reduced, and the number of connection points of electronic components can be reduced, so that the reliability can be significantly improved. On the other hand, it is possible to realize not only a single function of circuit connection as a circuit board, but also a multifunctional circuit board in which capacitors and resistors are combined.
第１図は本発明の一実施例における回路基板の側断面
図、第２図は一般的なＦＭ／ＡＭ中間周波増幅回路図、
第３図は従来の回路基板の側断面図である。 ２……電子部品、３……導体、４……抵抗体、５，７…
…スルーホール、６……厚膜ガラス、樹脂等のオーバー
コート、８……はんだ、９……高誘電率セラミック基
板、１０……低誘電率セラミック基板、１１……スルー
ホール５の表面部導体、１２……高誘電率セラミック基
板９と低誘電率セラミック基板１０とを接着する厚膜ガ
ラスまたは樹脂、Ｃ１０，Ｃ１１……低誘電率セラミッ
ク基板１０の内部に構成した積層コンデンサ、Ｃ１２，
Ｃ１３……高誘電率セラミック基板９の内部に構成した
積層コンデンサ。FIG. 1 is a side sectional view of a circuit board in an embodiment of the present invention, FIG. 2 is a general FM / AM intermediate frequency amplifier circuit diagram,
FIG. 3 is a side sectional view of a conventional circuit board. 2 ... Electronic parts, 3 ... Conductor, 4 ... Resistor, 5, 7 ...
... through hole, 6 ... thick film glass, resin overcoat, 8 ... solder, 9 ... high dielectric constant ceramic substrate, 10 ... low dielectric constant ceramic substrate, 11 ... through hole 5 surface conductor , 12 ... Thick film glass or resin for adhering the high-dielectric-constant ceramic substrate 9 and the low-dielectric-constant ceramic substrate 10, C10, C11 ... Multilayer capacitor formed inside the low-dielectric-constant ceramic substrate 10, C12,
C13 ... A multilayer capacitor formed inside the high dielectric constant ceramic substrate 9.
Claims (2)
数の積層コンデンサをスルーホールによって表面に引き
出すとともに表面に厚膜回路を構成して成る第１の複合
部品と、低誘電率セラミック基板の内部に設けた複数の
積層コンデンサをスルーホールによって表面に引き出す
とともに表面に厚膜回路を構成して成る第２の複合部品
とを樹脂あるいは厚膜ガラス等によって接着すると同時
に対向する導体を接続し、さらに第１あるいは第２の複
合部品の表面に他の電子部品を装着して成ることを特徴
とする回路基板。1. A first composite component comprising a plurality of multilayer capacitors provided inside a high dielectric constant ceramic substrate and having a thick film circuit formed on the surface through a through hole, and a low dielectric constant ceramic substrate. A plurality of multilayer capacitors provided inside are pulled out to the surface by through holes, and a second composite component formed by forming a thick film circuit on the surface is bonded with resin or thick film glass, and at the same time, opposing conductors are connected, A circuit board characterized in that another electronic component is mounted on the surface of the first or second composite component.
少なくとも一つ以上が複合部品の表裏面を結線するため
にのみに構成されたことを特徴とする特許請求の範囲第
１項記載の回路基板。2. At least one of the through holes of the first and second composite parts is configured only to connect the front and back surfaces of the composite part. The described circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60010143A JPH0632382B2 (en) | 1985-01-22 | 1985-01-22 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60010143A JPH0632382B2 (en) | 1985-01-22 | 1985-01-22 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61168992A JPS61168992A (en) | 1986-07-30 |
| JPH0632382B2 true JPH0632382B2 (en) | 1994-04-27 |
Family
ID=11742059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60010143A Expired - Lifetime JPH0632382B2 (en) | 1985-01-22 | 1985-01-22 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632382B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258478A (en) * | 2006-03-23 | 2007-10-04 | Rohm Co Ltd | Composite circuit component and semiconductor device comprising the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6480096A (en) * | 1987-09-19 | 1989-03-24 | Nippon Cmk Kk | Formation of condenser or like on printed wiring board |
| JPH02249294A (en) * | 1989-03-23 | 1990-10-05 | Mitsubishi Mining & Cement Co Ltd | Lc-including ceramics substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59111394A (en) * | 1982-12-16 | 1984-06-27 | 松下電器産業株式会社 | Condenser-contained ceramic multilayer board |
| JPS59136962A (en) * | 1983-01-27 | 1984-08-06 | Matsushita Electric Ind Co Ltd | Component parts for electronic circuit |
| JPS59136961A (en) * | 1983-01-27 | 1984-08-06 | Matsushita Electric Ind Co Ltd | Component parts for electronic circuit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166068U (en) * | 1982-04-30 | 1983-11-05 | 富士通株式会社 | multilayer printed wiring board |
-
1985
- 1985-01-22 JP JP60010143A patent/JPH0632382B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59111394A (en) * | 1982-12-16 | 1984-06-27 | 松下電器産業株式会社 | Condenser-contained ceramic multilayer board |
| JPS59136962A (en) * | 1983-01-27 | 1984-08-06 | Matsushita Electric Ind Co Ltd | Component parts for electronic circuit |
| JPS59136961A (en) * | 1983-01-27 | 1984-08-06 | Matsushita Electric Ind Co Ltd | Component parts for electronic circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258478A (en) * | 2006-03-23 | 2007-10-04 | Rohm Co Ltd | Composite circuit component and semiconductor device comprising the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61168992A (en) | 1986-07-30 |
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