JPH06314583A - Socket for ic package - Google Patents

Abstract

PURPOSE:To provide a socket by which an IC package can be installed and removed under no load and which is excellent in the pressure of contact between a contact and its contact portion, the load of an operation for pushing down a cover, its operational life, and the ability to hold the IC package, etc. CONSTITUTION:A spring portion, which provides the pressure of contact with a package contact P2 by pressing the contact portion 2a of a contact 2 inwards, is formed by a first curved spring portion 2d which is extended upwardly inwards from the inner edge of a flat plate portion 2b and folded back outwards and a second spring portion 2e which is folded back inwards from the end of the first spring portion 2d and joined to the contact portion 2a. A connecting shaft 3 disposed along a line of contacts is provided with a recessed portion 3a for engagement with the protrusion 2g of the second spring portion 2e and a surface portion 3b for engagement with a projecting rear portion 2h. A cover 4 mounted on a base member 1 is provided with an inclined face 4d which makes sliding contact with a support shaft portion 3d at each end of the connecting shaft 3 to turn the connecting shaft 3 outwards. When the cover 4 is pushed down the connecting shaft 3 is turned outwards and displaces the contact portion 2a of the contact 2 outwards against the resilient force of the spring portion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used for testing whether a manufactured IC package is good or bad,
More specifically, along a side of the accommodation space provided in the base member, a contact portion with a contact of the IC package accommodated in the accommodation space and a contact pressure with the contact by urging the contact portion inward. A large number of contacts each having a spring portion are arranged in parallel, and the contact portion is diverted to the outer side against the elasticity of the spring portion by pushing down the cover mounted on the base member to separate from the IC package contact. The present invention relates to an IC package socket.

[0002]

2. Description of the Related Art Conventionally, as this type of IC package socket, a socket having a lever typified by JP-A-4-154065 or a direct-press type socket represented by JP-A-63-307678 is known. Has been.

As shown in FIG. 7, the lever type has a lever 10 arranged along a row of a large number of contacts 100 arranged in parallel.
The lever 101 is rotatably supported, and the operating portion 102 is formed on one end side (outer side) of the lever 101, and the engaging portion 103 with the contact 100 is formed on the other end side (inner side) of the lever 101 to push down the cover 104. Hold down the operation part 102 with the lever 10
1 is rotated downward so that the contact portion 105 is displaced outward against the elasticity of the spring portion 106.

Further, as shown in FIG. 8, the direct push type is as follows.
The operating part 20 is placed on the outside of the contacts 200 arranged in parallel.
1 is integrally formed, and by pushing down the cover 202, the operating portion 201 is displaced outward, and the contact portion 203 is displaced outward against the elasticity of the spring portion 204.

[0005]

According to the structure as described above, the contact portions of the multiple contacts 100, 200 are respectively formed.
Although the IC packages P can be attached / detached with no load by pushing down the covers 104,202 at the same time by pushing down the covers 104,202, the contact pressure of the contact portions 105,203 with respect to the contact P2 is
When the technical contents were examined in more detail with respect to the operating load and the operating life when the covers 104 and 202 were pushed down, and the reliable holding ability of the IC package P, it could be said that there were the following problems. .

That is, in the socket shown in FIG. 7, the spring portion 106 of the contact 100 has a shape as shown, and the fulcrum 107 of the lever 101 is a fixed point and the contact portion 10 has a fixed point.
Due to the short distance to 5 and the like, the mutant form of the contact part 105 moves almost linearly upward and outward as indicated by arrow Y1 in FIG. The force for pinching the IC package P is in the direction indicated by the arrow Y2 in FIG. 6C, and there is some concern about the reliable pinching of the IC package P.

Further, in the socket shown in FIG. 8, since the contact portion 203 has a form which is displaced in the horizontal direction, the force for holding the IC package P is in the direction indicated by arrow Z in the figure. However, there is a defect that deformation of the contact P2 of the IC package occurs.

The present invention has been made in view of such conventional circumstances, and an object thereof is to simultaneously mutate respective contact portions of a large number of contacts to the outside by pushing down the cover, and It can be attached and detached without load, the contact pressure of the contact part with respect to the contact, the operating load when pushing down the cover and its operating life,
An IC that excels in all of the reliable clamping ability of the IC package
To provide a package socket.

[0009]

In order to achieve the above-mentioned object, an IC package socket according to the present invention is an IC package which can be accommodated in the accommodating space along a side of the accommodating space provided in the base member. A plurality of contacts each having a contact portion with the contact point and a spring portion for biasing the contact portion inward to obtain a contact pressure with the contact point are arranged in parallel and arranged along the row of the contact points. The connecting shaft is linked to each contact, and the connecting shaft is rotated by pushing down the cover mounted on the base member to mutate the contact portion of the contact to the outside against the elasticity of the spring portion. The contacts are separated from each other, and the contact extends from the inner edge of the flat plate portion that is placed on the base member to the upper inside, and is bent back to the outside.
The second spring part includes a second spring part that is folded back inward from the tip of the first spring part and continues to the contact part, and a protrusion that protrudes on the upper surface of the second spring part, while the connecting shaft is a recessed part that engages with the protrusion. An engaging surface portion for engaging with a rear portion of the protrusion, and a support shaft portion protruding at both left and right ends, and further, the cover is provided with an inclined surface for slidingly contacting the support shaft portion to rotate the connecting shaft to the outside. Characterize.

[0010]

According to the above-mentioned contact shape, the elastic forces of the first spring portion and the second spring portion act in the direction of pressing the contact portion downward, so that the contact pressure of the contact portion against the contact and the operation of pushing down the cover are performed. It is possible to obtain a more reliable sandwiching capability of the IC package while maintaining the operation load and the operation life thereof, etc. at predetermined values (see FIGS. 1 and 3).

When attaching or detaching the IC package, the inclined surface pushes the support shaft portion inward by pushing down the cover and the connecting shaft rotates outward, whereby the engaging surface portion pushes the rear portion of the protrusion downward. Then, at the same time as the first spring portion is contracted and deformed, the engaging concave portion presses the projection downwardly and outwardly to rotate the second spring portion upwardly and outwardly so that the contact portion of the contact resists the elastic force of the spring portion to the outside. Mutate to. At that time, in the initial stage of the mutation, the contact portion rises in a substantially vertical direction, and thereafter, the contact portion is displaced obliquely outward and separated from the IC package contact, so that the above clamping ability can be obtained without causing a deformation defect of the IC package contact. (See FIGS. 2 and 4).

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC package socket according to the present invention will be described below with reference to FIGS. FIG. 6 is a perspective external view of the socket of this embodiment, and FIG. 5 is an external view of the same with the cover removed. In the drawing, 1 is a base member, 2 is a contact, 3 is a connecting shaft, and 4 is a cover.

The base member 1 is formed of an insulating material, and a flat rectangular ridge is provided in the center thereof, and a recess is formed in the center of the ridge to form the recess 1a in which the IC package P is accommodated. And A large number of contacts 2 are arranged in parallel along two opposing sides of the accommodation space 1a.

The contact 2 is made of a desired conductive material and has the shape shown in FIG.
A bottom end integrally formed with a contact portion 2a for contacting the contact (lead) P2 of the C package P, and a spring portion described later for urging the contact portion 2a inward to obtain contact pressure with the contact P2. The flat plate portion 2b is placed on the upper surface of the base member 1 and the flat plate portion 2b
The terminal 2c hanging from the base member 1 is fitted into the through hole 1b of the base member 1 and fixed in a state of standing vertically on the base member 1.

The tip of the contact 2 has a substantially C shape as shown in the drawing, and the upper end side thereof serves as the contact portion 2a, and the lower end side 2c functions as a positioning stopper which is slidably contacted with the side wall of the base member 1. The terminal 2c at the lower end of the contact 2 is inserted into a terminal insertion hole of a test circuit (not shown) and fixed by soldering or the like.

The spring portion is a curved first spring portion which extends upward from the inner edge of the flat plate portion 2b to the inner side and is folded back to the outer side.
2d and a second spring portion 2e which is folded back inward from the tip of the first spring portion 2d and is continuous with the contact portion 2a.
The contact part 2a is urged downward by the elasticity of 2d and 2e, and the contact P2
While maintaining the contact pressure of the contact portion 2a against, the operation load when pressing down the cover 4 and its operation life, etc.
A more reliable holding ability of the IC package P can be obtained. A protrusion 2g is formed on the upper surface of the second spring portion 2e near the connecting portion 2f with the first spring portion 2d.

A connecting shaft 3 is arranged along the row of the large number of contacts 2. The connecting shaft 3 has the above-mentioned protrusion 2g
Is provided with an engaging concave portion 3a for engaging with the engaging concave portion 3a, and an engaging surface portion 3b for engaging the projection rear portion 2h is provided in a middle portion of the lower surface continuous with the engaging concave portion 3a, and both left and right end portions 3c are extended downward and supported at the lower end portion thereof. The shaft portions 3d are provided so as to project, and the support shaft portions 3d are slidably contacted with an inclined surface 4c described later and supported so as to be vertically rotatable.

The support shaft portion 3d, that is, the rotation support point of the connecting shaft 3 is the first spring portion 2d and the second spring portion 2e of the contact 2.
It is provided so as to be separated from the connecting portion 2f for connecting the and a predetermined length.

The cover 4 has a central opening 4a communicating with the accommodating space 1a, and a mounted portion 4b for covering the row of the large number of contacts 2 is provided at a portion of the opening 4a along two opposing sides. Further, both left and right side surfaces of the mounted portion 4b are extended downward to form a hakama portion 4c, and an inclined surface 4d inclined outward is provided on the inner surface of the hakama portion 4c.
Has a sliding contact with the outer periphery of the support shaft portion 3d, and the base member 1
It is supported so that it can be raised and lowered while being covered from above. The connecting shaft 3 and the cover 4 are integrally formed of an insulating material.

The IC package P has a well-known structure,
A large number of contact points (leads) P2 bent in a substantially Z shape are provided in parallel at the side edge of the main body P1 that is placed in a storage state in the storage space 1a described above.

Thus, according to the socket of this embodiment having the above-described structure, the elastic force of the first spring portion 2d and the second spring portion 2e of the contact 2 acts in the direction of pressing the contact portion 2a downward. , Contact pressure of contact part 2a against contact P2, cover 4
A more reliable holding capability of the IC package P can be obtained while maintaining the operating load and the operating life during the pushing down operation of the IC package (see FIG. 3).

When the IC package P is attached or detached, as shown in FIG. 2, the inclined surface 4d pushes the support shaft portion 3d downward and inward by pushing down the cover 4, whereby the connecting shaft 3 rotates outward. The engaging surface portion 3b pushes the rear portion 2h of the protrusion downwardly and inwardly to deform the first spring portion 2d, and at the same time,
The engaging recessed portion 3a pushes the protrusion 2g downwardly and outwardly, and the second spring portion 2e
Is rotated upward and outward, and the contact portion 2a of the contact 2 is displaced outward against the elasticity of the spring portion, so that the IC package P can be attached and detached without load (see FIG. 2).

At that time, in addition to the spring portion having the above-mentioned shape, the rotation fulcrum of the connecting shaft 3 (that is, the fulcrum shaft portion 3d) is a free point, so that it is indicated by an arrow X1 in FIG. As described above, in the initial stage of mutation, the contact portion 2a rises in a substantially vertical direction, and thereafter, as shown by an arrow X2 in the figure, the contact portion 2a is obliquely outwardly diverged and separated from the IC package P contact P2. In addition, the distances W1 and W2 are longer and higher than when the rotation fulcrum is a fixed point (W '), so that the clamping ability can be obtained without fear of causing defective deformation of the IC package contact P2.

Further, since each contact 2 is linked to the connecting shaft 3 by the engagement of the projection 2g and the engagement recess 3a and the engagement of the projection rear portion 2h and the engagement surface portion 3b, for example, the contacts 2
Even if the spring characteristic of any one of the rows is reduced, the spring characteristic of the entire two rows of contacts can assist the reduction and prevent the contact failure with the contact P2.

[0025]

Since the IC package socket according to the present invention is constructed as described above, the contact contact portion is biased inward and downward to obtain a more reliable holding ability of the IC package. At the same time, when the IC package is attached or detached, the contact portion rises in a substantially vertical direction and then diverges obliquely outward and separates from the IC package contact, so that the sandwiching ability can be obtained without causing a deformation defect of the IC package contact. To be

Therefore, the contact portions of a large number of contacts can be simultaneously outwardly changed by pushing down the cover to attach / detach the IC package without load, and the contact pressure of the contact portion with respect to the contact and the pushing operation of the cover can be suppressed. It has been possible to provide a socket for an IC package, which has excellent effects in all respects, such as the operating load at that time, the operating life thereof, and the reliable gripping ability of the IC package.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view of a main part of an embodiment of an IC package socket of the present invention.

FIG. 2 is an enlarged sectional view of an essential part showing a standby state of the socket shown in FIG.

3 is an enlarged cross-sectional view of a main part showing an IC package set state of the socket shown in FIG.

FIG. 4 is an enlarged view of a main part of FIG.

5 is an external perspective view showing the socket shown in FIG. 1 with a cover removed.

6 is an external perspective view of the socket shown in FIG.

FIG. 7 is an enlarged cross-sectional view of a main part of a conventional socket having a lever.

FIG. 8 is an enlarged cross-sectional view of a main part of a direct-pressing type conventional socket.

[Explanation of symbols]

1: Base member 1a: Storage space 2: Contact 2a: Contact part 2b: Flat plate part 2d: First spring part 2e: Second spring part 2g: Projection 2h: Projection rear part 3: Connection shaft 3a: Engagement recess 3b: Engagement Mating part 3d: Spindle part 4: Cover 4d: Sloping surface

Claims (1)

[Claims] 1. A contact portion with a contact of an IC package accommodated in the accommodating space along a side of the accommodating space provided in the base member, and a contact with the contact by urging the contact portion inward. A large number of contacts each having a spring portion capable of exerting pressure are arranged in parallel, and a connecting shaft arranged along the row of the contacts is linked to each contact, and the connection is performed by pushing down a cover mounted on the base member. An IC package socket in which a shaft is rotated to diverge a contact portion of a contact to an outer side against an elastic force of the spring portion so as to be separated from an IC package contact, the contact being placed on a base member. A curved first spring portion that extends upward from the inner edge of the flat plate portion and folds back outward, and a second spring portion that folds inward from the tip of the first spring portion and continues to the contact portion. A projection protruding on the upper surface of the second spring portion, and the other connecting shaft includes an engaging concave portion with the projection, an engaging surface portion with a rear portion of the projection, and a support shaft portion protruding at both left and right ends, An IC package socket, wherein the cover is provided with an inclined surface that is in sliding contact with the support shaft portion to rotate the connecting shaft outward.