JP3204352B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used for an IC having a large number of minute leads protruding laterally, and more particularly, to a fine contact pin required for high density and high mounting of the IC. It can respond to pitching.

[0002]

2. Description of the Related Art There is a conventional IC socket described in, for example, Japanese Patent Application Laid-Open No. Hei 5-144529. This I
For the C socket, the mounting base that supports the IC element is pushed down, and the lead terminals separated from the contact pins are brought into contact with the contact pins by the weight of the IC element, and after this contact, the mounting base is continuously pushed down to mount the IC element. From the IC, and in this floating state, the IC is
The side surface of the element body is regulated and lifted up to prevent displacement during pressure contact, and the lead terminal is pushed down while the mounting base is being pushed down to make contact with the contact pins under pressure. To prevent lead deformation.

[0003] Since the mounting table for the IC element and the pressure receiving portion to be pressed by the pressing means are formed into an integral structure while defining the contact pin positioning hole with the partition wall, the mounting table and the pressure receiving portion are temporarily provided. In this case, there is no problem such as an assembling error when the components are separate and a contact pin positioning accuracy based on the error, and there is an advantage in terms of manufacturing such as labor saving of the number of parts.

[0004] With the increase in the density and mounting of IC elements, there is also a demand for a fine pitch of contact pins in IC sockets. In this regard, in the conventional socket described above, the positioning holes are arranged in line along the outside of the mounting table, and the pressure receiving portion is formed outside the positioning holes to be pressed by the pressing means, thereby defining the positioning holes. The relative positions of the contact pins and the mounting table are secured by the partition walls. Therefore, the partition wall is required to have two functions, that is, a function of defining a positioning hole and a function of bridging a mounting table and a pressure receiving portion and acting as a beam that does not lose the load on the pressure receiving portion. Shaped cross-section,
As a result, the beam configuration hinders and there is a limit in promoting fine pitching.

In addition, since only the tip ends of the contact pins arranged in rows on the socket main body are positioned by the positioning holes on the mounting base, there is an error in assembling the mounting base with respect to the socket main body, and further, the mounting base is moved up and down. If the positional relationship between the contact pin mounting portion on the socket body side and the positioning hole on the mounting base is slightly displaced by the configuration that is enabled, there is a fear that the contact pin may be twisted due to the dislocation, Further, there is a problem that the torsion of the contact pin leads to poor contact with the lead terminal.

Further, since the width of the contact pin and the lead terminal is extremely small, the allowable range of the vertical positional relationship between the two is extremely narrow. If the allowable range is exceeded, the twist of the contact pin and the contact pin Poor contact with the lead terminals increases.

[0007]

A problem to be solved is a positioning hole defined by a partition wall bridging a mounting table and a pressure receiving portion for positioning and dividing a contact pin with respect to a lead terminal of an IC element. The problem is that it is not possible to cope with the fine pitch of contact pins. Positioning only the pin tip of the contact pin with the positioning hole allows for errors in mounting
The problem that the contact pin is twisted due to the positional relationship between the contact pin mounting portion and the positioning hole and the contact failure with the lead terminal occurs. Since the width of the contact pin and the lead terminal is extremely small, and the allowable range of the vertical positional relationship between the two is extremely narrow, the torsion of the contact pin and the poor contact between the contact pin and the lead terminal increase.
An object of the present invention is to provide an I-socket which solves these problems.

[0008]

In order to solve the above-mentioned problems, a socket body in which a number of contact pins for making an electrical connection with a lead terminal of an IC element are arranged and arranged,
A mounting portion on which the element can be mounted, and a pedestal that is mounted movably up and down via spring means and is urged upward, and a separator that guides and locates and divides the contact pin, and A separator frame portion which is integrally provided on the outer periphery of the mounting portion via a joint portion of a corner portion of the mounting portion, and a separator is separated from the mounting portion; And a pressing body having a pad which can be pressed toward the contact pin.

Further, in the present invention, the separator in the separator frame portion is formed so as to protrude in and out of the frame portion, and the highest portion of the spring portion of the contact pin is formed on the outer portion of the separator, and the contact pin is formed on the inner portion of the separator. The pin end portions extending from the spring portion and bypassing the lower side of the frame portion are respectively positioned and divided and guided.

In the present invention, the tip of the contact pin has an inner half guided by the separator, and an outer half protruding from the space between the separators to the pedestal side and capable of contacting the lead terminal. The outer half is slightly wider than the inner half.

In the present invention, when the spring portion of the contact pin and the tip of the pin are guided by the separator, the contact pin does not have to be provided with a groove for disposing the contact pin when the contact pin is aligned with the socket body. Also,
Even if a groove is provided, it can be extremely shallow, resin can be filled without problems during molding of the socket body, and the thin flat groove-shaped molding partition, which is the weakest in terms of structural strength of the mold, is kept to a very small height As a result, the durability against the molding pressure is remarkably improved, and stable molding and production of the socket body can be performed.

For positioning of the lead terminals of the IC element with respect to the contact pins, projecting inclined portions for positioning and guiding the lead terminals of the IC element are provided upright at the four corners of the separator frame, and each side of the IC element is positioned. The lead terminals at the ends may be directly guided and positioned. In this case, the separator frame portion performs the two functions of positioning the IC element and positioning and dividing the contact pins with respect to the lead terminals reliably and accurately. Thus, the contact position between the contact pin and the lead terminal can be properly specified and accurately contacted, and the contact pin and the lead terminal can be prevented from being twisted and the contact failure due to the twist can be eliminated.

Further, guide posts for positioning and guiding the lead terminals of the IC element are provided upright on the socket body so as to be interposed between the mounting portion and the corners of the separator frame. In this case, the guide terminals can guide and position the lead terminals of the IC element with respect to the contact pins, and appropriately guide and guide the vertical movement of the pedestal. it can.

Further, rising portions for positioning and guiding the IC element body may be provided on the four sides of the mounting portion so that the lead terminals of the IC element with respect to the contact pins can be positioned and guided. Also, a combination of the rising portion configuration and the protruding inclined portion configuration. A combination of a rising portion configuration and the guide post configuration. Combination of the projecting inclined portion configuration and the guide post configuration. There is a combination of a rising portion configuration, a protruding inclined portion configuration, and a guide post configuration.

[0015]

According to the present invention, there is provided a socket body in which a large number of contact pins for electrically connecting with the lead terminals of the IC element are arranged, and a mounting portion on which the IC element can be mounted. And a separator for guiding and positioning and dividing the contact pin, and integrally disposed on the outer periphery of the mounting portion via a joint at a corner of the mounting portion. hand,
A separator frame part where the separator is separated from the mounting part,
Since it is configured to have a holding body pivotally supported by the socket body and having a pad capable of pressing the lead terminal toward a contact pin, a mounting portion on which an IC element can be mounted and a joint portion at a corner portion are formed. Thus, the separator in the integral separator frame portion can be dedicated to a function of guiding and positioning and dividing the contact pins, and is useful in meeting the required fine pitch of the contact pins.

Since the mounting portion of the IC element and the separator frame are formed integrally through the joint at the corners of both, the mounting error and the same error when the mounting table and the separator frame are separate are assumed. There is no problem such as the positioning accuracy of the contact pins based on the above, and there is an advantage in terms of manufacturing such as labor saving of the number of parts.

The separator in the separator frame is formed so as to protrude in and out of the frame portion. The outermost portion of the separator extends the highest part of the spring portion of the contact pin from the spring portion of the contact pin to the lower portion of the frame portion. Since the pin tip extending around the side is positioned and divided and guided, respectively, both the pin tip of the contact and the spring part are always positioned and divided from the time when the contact pin and the lead terminal do not contact to the time when the contact comes into contact. The positioning relationship between the contact pin mounting part on the socket body side and the separator on the separator frame part side due to the mounting error of the cradle with respect to the socket body and the configuration that allows the cradle to move up and down. Even if there is some misalignment, this is corrected and the contact pin guiding ability is accurate and high. It can respond to the pitch of.

The pin tip of the contact pin has an inner half guided by the separator, and an outer half protruding from between the separators to the pedestal side and capable of contacting the lead terminal. Since it is slightly wider than the part, the allowable range of the vertical position relationship between the contact pin and the lead terminal can be widened, the twist of the contact pin and the occurrence of poor contact between the contact pin and the lead terminal can be suppressed, and the fine pitch The contact stability between the contact pin and the lead terminal having a very small width at a fine pitch can be improved.

[0019]

1 to 4 show a first embodiment of an IC socket according to the present invention, wherein a socket body 1 is made of an insulating material, and grooves are formed on four sides of a central flat rectangular projection 2. 3
Are provided in parallel with each other, and a hole 4 is formed at the bottom of each groove 3.
In each of the groove portions 3, a contact pin 9 is arranged in a fitting manner by inserting its terminal 10 into the hole portion 4.

In the protruding portion 2, mounting holes 5 each having a downwardly hooked locked portion 6 on the hole surface are opened substantially diagonally to the protruding portion 2, and the mounting holes 5 have springs. 32
The legs 16 of the cradle 14 are respectively inserted and attached so as to be able to move vertically. The holding body 26 is pivotally supported on one side edge of the socket body 1 by a pivot 33 so as to be openable and closable, and the cover 30 is pivotable by a cover 35 above the same side edge so as to be openable and closable.
It is pivoted at.

The contact pin 9 is a thin plate made of a desired conductive material. The contact pin 9 forms an upward hook-shaped engaging portion 10a on a terminal 10 which is vertically provided from the substrate portion 11, while the outer edge of the upper edge of the substrate portion 11 is formed. A spring portion 12 that rises from the inside and is folded back inward, and a pin tip portion 13 that extends horizontally inward from the tip of the spring portion 12 and then rises to the height of the highest portion 12a of the spring portion 12 is formed. The engaging part 10a is engaged with the surface of the hole part 4 and fixed so that the lower edge of the substrate part 11 is fitted in the groove part 3. Then, the pin tip portion 13 is positioned and divided by entering into a space between the separators 23 described after the separator frame portion 18.

The pedestal 14 is made of an insulating material, and has an upwardly hooked locking portion 21 at the lower end of the leg 16 on the lower surface of the mounting portion 15 having a flat rectangular shape. On 2,
Until the locking portion 21 is locked to the locked portion 6 of the mounting hole 5 and the upward movement is restricted, the mounting portion 21 is mounted movably downward against the spring 32 and upward by the pressure of the spring 32. Rising portions 20 are provided upright on four sides of the mounting portion 15 so that the side surface of the main body of the IC element 36 can be guided in the mounting portion 15 so as to be mounted at an appropriate position. Further, on the outer periphery of the mounting portion 15, a separator frame portion 18 formed in the same body via a joint portion 17 extending horizontally from the four corners of the mounting portion to the outside is provided.

The separator frame 18 has a rectangular frame shape and moves up and down integrally with the cradle 14. Projection-shaped inclined portions 24 are respectively provided on the upper surfaces of the four corners of the separator frame portion 18, and the lead terminals 37 outside the IC element 36 are guided by the inclined portions 24 to determine the mounting position in the mounting portion 15. It is formed as follows. A separator 23 is provided on each side 22 so as to protrude toward the inside, and each pin tip 13 is guided between the separators 23 to be divided and opposed directly below the lead terminal 37. Positioning. Further, on the upper surface of the side portion 22, a contact portion 25 is formed, which is in contact with a pad 28 described after the pressing body 26.

The holding member 26 is made of an insulating material, and has a shaft hole 27 of a shaft 33 formed in a vertically long and substantially elliptical cross section so that the holding member 26 can be vertically moved in parallel when pushed down by the cover 30. is there. On the lower surface of the presser body 26, the IC
Contact part between lead terminal 37 of element 36 and separator frame 18
A pad 28 corresponding to 25 is vertically provided, and in a state where the contact portion 25 is pressed by the pad 28 to push down the separator frame portion 18 and the mounting portion 15, the pad 28 contacts the lead terminal 37 and is pressed. The terminal 37 is formed so as to be able to come into contact with the pin tip 13 in a press-contact manner. Further, the presser body 26 is urged by a spring 34 to an open state.

The cover 30 is made of an insulating material, and has a pressing portion 31 suspended from the center of the lower surface thereof. The pressing body 26 can be vertically translated through the pressing portion 31.

Therefore, when the IC element 36 is mounted on the mounting portion 15 of the receiving stand 14, the IC element 36 is guided by the outer lead terminals 37 to the inclined portion 24, and each lead terminal 37 corresponds to each contact pin 9 respectively. It is mounted in the position where it does. And
When the presser 26 is closed through the cover 30, the pad 28 of the presser 26 pushes down the contact portion 25 of the separator frame 18, and the separator frame 18 and the cradle 14 descend. Accordingly, the lead terminal 37 is moved to the pin tip 13 by the weight of the IC element 36.
, And the IC element 36 rises from the mounting portion 15. In this floating state, that is, each contact pin 9 is placed at a position corresponding to each lead terminal 37 with a separator.
In the state where it is positioned and divided and guided at 23, the pad
By pressing the lead terminal 37 against the contact pin 9 by the pressing force of 28, electrical connection can be made. (FIG. 4)

Thus, the contact pins 9 guide the separator 23 separated from the mounting portion 15 of the integral separator frame 18 via the mounting portion 15 on which the IC element 36 can be mounted and the joint portion 17 at the corner. Therefore, it can be used exclusively for the function of positioning and dividing, and there is utility that can cope with the required fine pitch of the contact pins 9.

At the four corners of the separator frame 18, projecting inclined portions 24 for positioning and guiding the lead terminals 37 of the IC element 36 are erected, and the lead terminals outside each side of the IC element 36 are provided.
Because this IC is positioned by directly guiding 37
The positioning of the contact 36 and the positioning and division of the contact pin 9 with respect to the lead terminal 37 by the separator 23 can be reliably and accurately performed by the separator frame portion 18, and the contact position between the contact pin 9 and the lead terminal 37. Can be properly identified and contacted accurately,
No twist occurs in the contact pin 9 and the lead terminal 37,
Contact failure due to the twist can be eliminated.

FIGS. 5 to 7 show a second embodiment of the IC socket of the present invention. Since the configuration is basically the same as that of the first embodiment of the base, a common configuration is used. The description will be omitted, and different configurations will be described.

The separator frame 18 has the separator 23
The upper portion 12a of the spring portion 12 of the contact pin 9 is formed by the outer portion 23b of the separator 23 with the inner portion 23a of the separator 23.
The pin tip portions 13 extending from the spring portions 12 of the contact pins 9 so as to bypass the lower side of the side portions 22 are respectively positioned and divided and guided.

As a result, the same effects as those of the first embodiment can be obtained, and further, the tip of the contact pin 9 can be provided.
13 and the spring part 12 are connected to the contact pin 9 and the lead terminal 37.
Can be always positioned and divided and guided from the time of non-contact to the time of contact, so that there is an error in assembling the receiving base 14 with respect to the socket main body 1 and the socket main body 1 due to the configuration in which the receiving base 14 can be moved up and down. Even if there is a slight deviation in the positional relationship between the contact pin mounting portion and the separator 23 on the separator frame portion 18 side, this is corrected and the guiding ability of the contact pin 9 is accurate and high. Can handle pitching.

FIGS. 8 to 11 show a third embodiment of the IC socket according to the present invention. Since the configuration is basically the same as that of the second embodiment, a common configuration is used. The description will be omitted, and different configurations will be described.

The pin tip 13 of the contact pin 9 has an inner half 13b guided by an inner portion 23a of the separator 23,
The lead terminal 37 protrudes from the inner portion 23a to the pedestal 14 side.
The width of the outer half 13a is approximately twice as large as the width of the inner half 13b.

A guide groove 19 is provided in the lower half of the separator frame 18 inside the protruding inclined portion 24 so as to penetrate in the vertical direction, and the guide groove 19 is provided upright on the socket body 1. Guide posts 7 are inserted respectively, and the same mounting portion 15 and separator frame 18 are guided along the four corners along the guide posts 7 so as to move up and down in a state where the movement in the horizontal direction is restricted. It is. Further, the guide post 7 has an inclined surface 8 formed on the upper surface in the same plane as the inclined portion 24, and the lower end of the inclined portion 8 is formed so as to coincide with the lower end of the inclined portion 24 in the lateral direction. The lead terminals 37 on the outside of each side of the IC element 36 are directly guided by the portion 24 and the slope portion 8 so as to be positioned with respect to the contact pins 9.

As a result, the same effects as those of the second embodiment can be obtained.
Inner half 13b guided by the inner part 23a of the
An outer half 13a protruding from the space 23a toward the receiving base 14 and capable of contacting the lead terminal 37 is formed, and the width of the outer half 13a is formed to be about twice as large as the width of the inner half 13b. As a result, the allowable range of the vertical positional relationship between the contact pin 9 and the lead terminal 37 can be widened, and the occurrence of twisting of the contact pin 9 and poor contact between the contact pin 9 and the lead terminal 37 can be suppressed. Pitch contact pin 9
And the contact stability with the lead terminal 37, which is extremely narrow at a fine pitch, can be improved.

In addition, the guide post 7 erected on the socket body 1 allows the mounting portion 15 and the separator frame portion 18 of the same body to be mounted.
Are guided up and down so that they can be moved up and down with no movement in the horizontal direction.
Of the lead terminal 37 and the contact pins 9 can be accurately adjusted. In addition, since the slope 8 having the same plane as the slope 24 is formed on the upper surface of the guide post 7 and the lower end of the slope 8 is formed so as to coincide with the lower end of the slope 24 in the horizontal direction, the same plane is formed. The lead terminals 37 on the outside of each side of the IC element 36 are directly guided by the inclined portion 24 and the inclined surface portion 8 so as to be positioned with respect to the contact pins 9.

[0037]

【The invention's effect】

A. According to claim 1, a socket body in which a large number of contact pins for making electrical connection with a lead terminal of an IC element are arranged and arranged, and a mounting portion on which the IC element can be mounted, and which can be moved up and down via spring means. It is provided with a pedestal mounted and urged upward, and a separator for guiding and positioning and dividing the contact pin, and is integrally disposed on the outer periphery of the mounting portion via a joint at a corner of the mounting portion. A separator frame portion in which the separator is separated from the mounting portion, and a holding body pivotally supported by the socket body and having a pad capable of pressing the lead terminal toward the contact pin. Therefore, the separator in the integral separator frame portion is positioned and divided by guiding the contact pins through the joint portion between the mounting portion and the corner portion where the IC element can be mounted. That can be dedicated to one of the work, there is a utility that can cope with a fine pitch of the contact pins is desired.

B. According to the above paragraph, since the mounting portion of the IC element and the separator frame portion are formed integrally through the joint portion of both corners, an assembling error and the same error when the mounting table and the separator frame portion are separate bodies are provided. This eliminates the problem of contact pin positioning accuracy and the like, and is advantageous in terms of manufacturing such as labor saving of the number of parts.

C. According to claim 2, the separator in the separator frame is formed to protrude in and out of the frame portion, and the highest portion of the spring portion of the contact pin is formed on the outer portion of the separator, and the highest portion of the spring portion of the contact pin is formed on the inner portion of the separator. Since the pin tips extending around the lower side of the frame are positioned and guided separately, both the pin tips of the contacts and the springs are always positioned from the time when the contact pin and the lead terminal are not in contact to the time when they contact. The position between the contact pin mounting part on the socket body side and the separator on the separator frame part due to the assembly error of the cradle with respect to the socket body and the structure that allows the cradle to move up and down. Even if there is some deviation in the relationship, this is corrected and the contact pin guiding ability is accurate and high. It can respond to a fine pitch.

D. According to the third aspect, the pin tip of the contact pin has an inner half guided by the separator, and an outer half protruding from between the separators to the pedestal side and capable of contacting the lead terminal. Because it is slightly wider than the inner half, the allowable range of the vertical position relationship between the contact pin and the lead terminal can be expanded, the twist of the contact pin, and the occurrence of poor contact between the contact pin and the lead terminal can be suppressed. It is possible to improve the contact stability between a contact pin having a fine pitch and a lead terminal having a very small width at the fine pitch.

[Brief description of the drawings]

FIG. 1 is a plan view partially illustrating a first embodiment of an IC socket according to the present invention;

FIG. 2 is a vertical sectional view taken along the line AA of FIG.

FIG. 3 is a partially enlarged perspective view.

FIG. 4 is a longitudinal sectional view of a closed state in which a lead terminal and a pin tip are brought into contact with a pressing body.

FIG. 5 is a partially cutaway plan view illustrating a second embodiment of the IC socket of the present invention.

FIG. 6 is a vertical sectional view taken along line BB of FIG. 5;

FIG. 7 is a partially enlarged perspective view.

FIG. 8 is a partially enlarged plan view illustrating a third embodiment of the IC socket of the present invention.

FIG. 9 is a vertical sectional view taken along the line CC in FIG. 8;

FIG. 10 is a partially enlarged perspective view.

11 is a vertical sectional view taken along the line DD in FIG. 10.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket main body 2 Socket main body raised part 3 Socket main body groove 4 Groove hole 5 Socket main body mounting hole 6 Mounting hole locked part 7 Socket main body guide post 8 Guide post slope 9 Contact pin 10 Contact Pin terminals 11 Contact pin substrate 12 Contact pin springs 13 Contact pin pin tips 10a Terminal engagement 12a Highest part of spring 13a Outer part of pin tip 13b Inner part of pin tip 14 Receiver Stand 15 Rest part of pedestal 16 Leg of pedestal 17 Joint part of pedestal 18 Separate frame part of pedestal 19 Guide groove part of pedestal 20 Standing part of pedestal part 21 Leg locking part 22 Separator frame part Side part 23 Separator in separator frame part 24 Projected inclined part in separator frame part 25 Contact part of separator frame part 23a Inside part of separator 23b Outside part of separator 26 Holding body 27 Shaft hole of presser body 28 Pad of presser body 29 Protrusion of presser body 30 Cover 31 Push section of cover 32,34 Spring 33,35 Axis 36 IC element 37 Lead terminal of IC element

────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Masaru Arai 755-1, Ogano, Ogano-machi, Chichibu-gun, Saitama Prefecture Chichibu Fujiuchi Co., Ltd. (72) Tomohiro Arai 755, Ogano, Ogano-machi, Chichibu-gun, Saitama 1 Co., Ltd. Chichibu Fujiuchi (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 33/76 H01L 23/32

Claims (3)

(57) [Claims] 1. A socket body in which a number of contact pins electrically connecting to lead terminals of an IC element are arranged, and a mounting portion on which the IC element can be mounted is provided, and can be moved up and down via spring means. It is provided with a pedestal mounted and urged upward, and a separator for guiding and positioning and dividing the contact pin, and is integrally disposed on the outer periphery of the mounting portion via a joint at a corner of the mounting portion. A separator frame part in which the separator is separated from the mounting part, and a pressing body pivotally supported by the socket body and having a pad capable of pressing the lead terminal toward the contact pin. IC socket. 2. The separator in the separator frame portion is formed so as to protrude in and out of the frame portion, and the outermost portion of the separator has the highest portion of the contact pin spring portion and the inner portion of the separator has the highest portion of the contact pin spring portion. 2. The IC socket according to claim 1, wherein the tip ends of the pins extending around the lower side of the frame are positioned and divided and guided. 3. A pin tip of the contact pin has an inner half guided by the separator, and an outer half protruding from between the separators to the pedestal side and capable of contacting the lead terminal.
3. The IC according to claim 1, wherein the outer half is slightly wider than the inner half.
socket.