JP3204351B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket used for an IC having a large number of micro leads laterally protruding, and more particularly, to a contact pin and a lead terminal which can be surely contacted at an appropriate position. In addition to preventing the occurrence of torsion and poor contact, both the tip of the pin and the spring can be always positioned and divided so as to be able to cope with the fine pitch of the contact pins.

[0002]

2. Description of the Related Art A conventional IC socket is disclosed, for example, in Japanese Utility Model Laid-Open No. 4-115789. This I
The C socket includes a socket body in which a number of contact pins for making electrical connection with the lead terminals of the IC element are arranged and aligned, a stage on which the IC element can be mounted, and a projection for operating engagement. An intermediate plate mounted to be vertically movable and resiliently pressed upward, an inclined portion for guiding a lead terminal of the IC element, and a pedestal for positioning the IC element. A floating plate for restricting movement, and a cover having a projection pivotally supported by the socket main body and capable of engaging with the projection of the pad and the intermediate plate, and by closing the cover, the projection of the cover is By pressing the protrusion of the intermediate plate, the intermediate plate moves down to regulate the side surface of the contact pin, and The IC element mounted on the stage brought correctly positioned on the base, in which are configured to be made an electrical connection between the lead terminal and the contact pins in pressing force of the cover pad.

[0003] Just by mounting the IC element, the IC element can be lowered along the inclined portion and the straight portion as the guide wall and positioned at the correct position of the pedestal.
Furthermore, even if the contact pin is extremely thin, the partition wall of the intermediate plate moves up and down along the deformation of the spring part to regulate both sides of the spring part, so that the contact pin is prevented from twisting and falling down. It has the effect that can be.

However, in this IC socket, the positioning of the IC elements is performed by a floating plate, and the positioning and division of the contact pins with respect to the lead terminals are performed by an intermediate plate.
The two functions of positioning the element and positioning and dividing the contact pin with respect to the lead terminal are separated into two parts, the floating plate and the intermediate plate. There is an inconvenience that the contact position between the contact pin and the lead terminal shifts due to the fitting allowance that is made to be vertically movable, and is not specified. The problem is that both the contact pin and the lead terminal are thin, so that even a slight displacement may cause the contact pin and the lead terminal to twist, and the torsion of the contact pin may cause contact with the lead terminal. There is a problem that leads to failure.

In addition, the positioning and division of the contact pins are performed by the partition walls of the intermediate plate. When the intermediate plate is not pushed down by the cover, only the lower part of the tip of the contact pin is guided. In the state where the plate is pushed down by the cover and the contact pin and the lead terminal are in contact, only the spring part of the contact pin is guided, and the pin tip is in a free state where neither positioning nor division is performed. Since the guide of the contact pin by the intermediate plate is limited to either the pin tip side or the spring part side in accordance with the vertical movement of the plate, always position and divide both the pin tip part and the spring part. Is not possible, and there is uncertainty in the contact pin guiding ability,
There was a problem that it was not possible to cope with the fine pitch of the contact pins.

[0006]

The problem to be solved is that the two functions of positioning the IC element and positioning and dividing the contact pin with respect to the lead terminal are divided into two parts, a floating plate and an intermediate plate. As a result, the contact position between the contact pin and the lead terminal is not specified because it is misaligned, the contact pin and the lead terminal are twisted and the contact is poor, and both the pin tip and the spring cannot be positioned and divided at all times. Another problem is that it is not possible to cope with the fine pitch of the contact pins.

[0007]

In order to solve the above-mentioned problems, a socket body in which a number of contact pins for making an electrical connection with a lead terminal of an IC element are arranged and arranged,
A receiving portion provided with a mounting portion on which the element can be mounted and a projection for actuating engagement, and which is mounted so as to be vertically movable via a spring means and urged upward, and for guiding a lead terminal of the IC element. A projection-like inclined portion provided at the four corners and a separator for guiding and positioning and dividing the contact pin are provided, and the socket is attached to the socket body via a spring means so as to be vertically movable and urged upward, A presser body having a separator frame provided on the outer periphery of the mounting portion, a pad pivotally supported by the socket body, and capable of pressing the lead terminal and a protrusion capable of contacting and pressing a projection of the receiving base. And characterized by the following.

Further, according to the present invention, the separator in the separator frame is formed so as to protrude in and out of the frame portion, and the outermost portion of the separator has the highest portion of the spring portion of the contact pin, and the inner portion of the separator has the highest portion of the contact pin. A pin tip portion extending from the spring portion and bypassing the lower side of the frame portion is positioned, divided and guided separately.

In the present invention, the pin tip of the contact pin may have the same plate thickness as that of the main body, but the inner half of the pin tip is guided by the separator, and the outer half is located between the separators. From the outside to the cradle side, and the outer half thereof may be formed thicker.
The contact stability between the contact pins having fine pitches and the lead terminals can be improved.

When the spring portion of the contact pin and the tip of the pin are guided by the separator, the contact pin does not need to be provided with a groove for disposing the contact pin when it is arranged in the socket body. In addition, even when the groove is provided, it may be extremely shallow, and the resin filling can be performed without any problem at the time of molding the socket body, and the thin plate-shaped groove forming partition, which is the weakest in terms of the structural strength of the molding die, has an extremely small height. And the durability against the molding pressure is dramatically improved, so that the socket body can be formed and manufactured stably.

[0011]

A socket body in which a large number of contact pins electrically connecting to lead terminals of an IC element are arranged and arranged, a mounting portion on which the IC element can be mounted, and a projection for operating engagement, and a spring means. A receiving table which is attached to be movable up and down and is urged upward, and guides positioning and division by guiding a projecting inclined portion and a contact pin provided at four corners for guiding lead terminals of an IC element. It is equipped with a separator, and is attached to the socket body via a spring means so as to be vertically movable and urged upward,
A separator frame provided on the outer periphery of the mounting portion, a pad pivotally supported by the socket body and capable of pressing the lead terminal, and a presser having a protrusion which can be pressed against the protrusion of the receiving base; Because it is composed of a body,
The two functions of positioning the C element and positioning and dividing the contact pin with respect to the lead terminal can be reliably and accurately performed by the separator frame, which is a component, and the contact position between the contact pin and the lead terminal is appropriately specified. The contact can be accurately made, and the contact pin and the lead terminal are not twisted, and the poor contact due to the twist can be eliminated.

The separator in the separator frame is formed so as to protrude in and out of the frame portion. The outermost portion of the separator extends the highest portion of the spring portion of the contact pin from the inner portion of the separator to the lower portion of the spring portion of the contact pin. Since the pin tip extending around the side is positioned and divided and guided, respectively, both the pin tip of the contact and the spring part are always positioned and divided from the time when the contact pin and the lead terminal do not contact to the time when the contact comes into contact. The contact pins can be accurately guided with high accuracy, and can cope with a fine pitch of the contact pins.

[0013]

1 to 5 show a first embodiment of an IC socket according to the present invention, wherein a socket body 1 is made of an insulating material, and a groove is formed on four sides of a central flat square raised portion 2. FIG. 3
Are provided in parallel with each other, and a hole 4 is formed at the bottom of each groove 3.
In each of the groove portions 3, a contact pin 9 is arranged in a fitting manner by inserting its terminal 10 into the hole portion 4.

On the protruding portion 2, there are provided a mounting hole 5 having a hooked locked portion 6 on the hole surface and a mounting hole 7 having a hooked locked portion 8 on the hole surface. Openings are formed on the inner and outer sides of the raised portion 2 substantially diagonally. The leg 16 of the cradle 14 is interposed in the inner mounting hole 5 with a spring 31 interposed therebetween, and the spring 32 is interposed in the outer mounting hole 7. Thus, the leg portions 21 of the separator frame 19 are inserted and attached so as to be vertically movable. The holding body 25 is pivotally supported on one side edge of the socket main body 1 by a shaft 34 so as to be openable and closable, and the cover 29 is rockable by the shaft 35 on the upper side of the side edge. It is pivoted.

The contact pin 9 is a thin plate made of a desired conductive material. The contact pin 9 forms an upward hook-shaped engaging portion 10a on a terminal 10 which is vertically provided from the substrate portion 11, while the outer edge of the upper edge of the substrate portion 11 is formed. A spring portion 12 that rises from the inside and is folded back inward, and a pin tip portion 13 that extends horizontally inward from the tip of the spring portion 12 and then rises to the height of the highest portion 12a of the spring portion 12 is formed. The engaging part 10a is engaged with the surface of the hole part 4 and fixed so that the lower edge of the substrate part 11 is fitted in the groove part 3. The pin tip 13 enters between the separators 22 described later after the separator frame 19.

The cradle 14 is made of an insulating material, and has an upwardly hooked locking portion 16a formed at the lower end of the leg 16 on the lower surface of the mounting portion 15 having a flat rectangular shape, and this locking portion 16a is attached. Until the upward movement is restricted by being locked to the locked portion 6 of the hole 5, the downward movement against the spring 31 and the upward movement by the spring 31 pressure are enabled.
Then, rising portions 15a are erected on the four sides of the mounting portion 15 so that the IC elements 36 are mounted on the mounting portion 15, and the four corners of the mounting portion 15 extend diagonally from the same corner. An arm 17 extending horizontally outward is formed, and an operation engaging projection 18 rising from each arm 17 is formed.

The separator frame 19 is made of an insulating material. An upward hook-shaped engaging portion 21a is formed at the lower end of the leg 21 on the lower surface of the rectangular frame 20 provided on the outer periphery of the mounting portion 15. The downward movement and the spring movement of the spring 32 are continued until the locking portion 21a is locked to the locked portion 8 of the mounting hole 7 and the upward movement is restricted.
Upward movement is possible by 32 pressures. A guide groove 23 is formed at each corner on the lower surface of the frame portion 20, and the arm portion 17 fits into the guide groove 23, and the operation engaging projections 18 are provided outside the four corners of the frame portion 20. In the state where is positioned, both the separator frame 19 and the cradle 14 can be independently moved up and down. Projection-shaped inclined portions 24 are respectively provided on the upper surfaces of the four corners of the frame portion 20 to guide the outside of the lead terminal 37 of the IC element 36 with the inclined portions 24 so that the mounting position in the mounting portion 15 can be determined. And a separator 22 on each side of the frame 20.
Are disposed in a protruding shape toward the inside, and the pin tip portions 13 are guided between the separators 22 to be divided and positioned so as to face directly below the lead terminals 37.

The holding body 25 is made of an insulating material, and has a shaft hole 26 of a shaft 34 formed in a vertically long and substantially elliptical cross section so as to be able to move vertically when it is pushed down by the cover 29. is there. On the lower surface of the presser body 25, the IC in the
Pad 27 corresponding to lead terminal 37 of element 36 and cradle 14
The projection 28 corresponding to the operation engagement projection 18 is vertically provided,
In a state where the projections 18 are pushed by the projections 28 and the cradle 14 is pushed down, the pads 27 are brought into contact with the lead terminals 37 and pressed to
37 is formed so as to be able to contact the pin tip 13. Further, the presser body 25 is urged by a spring 33 to an open state.

The cover 29 is made of an insulating material, and has a pressing portion 30 suspended from the center of the lower surface, through which the pressing body 25 can be vertically translated.

Accordingly, when the IC element 36 is mounted on the mounting portion 15 of the receiving base 14 and the pressing body 25 is closed through the cover 29, the projection 28 of the pressing body 25 presses the projection 18 of the receiving base 14. The cradle 14 is lowered, and the lead terminal 37 is guided by the inclined portion 24 of the separator frame 19 around the mounting portion 15 of the cradle 14,
In a state where the IC element 36 is positioned on the mounting portion 15 and the contact pins 9 are positioned and divided and guided by the separators 22 of the separator frame 19 at positions corresponding to the respective lead terminals 37 (FIG. 4). The electrical connection between the lead terminal 37 and the contact pin 9 can be made by the pressing force of the pad 27 of the pressing body 25 (FIG. 5).

As a result, the two functions of positioning the IC element 36 and positioning and dividing the contact pin 9 with respect to the lead terminal 37 can be performed reliably and accurately by the separator frame 19 which is a component. The contact position between the lead terminal 37 and the lead terminal 37 can be properly specified and accurately contacted, and the contact pin 9 and the lead terminal 37 are not twisted, and the contact failure due to the twist can be eliminated.

FIGS. 6A and 6B show a second embodiment of the IC socket of the present invention. Since the configuration is basically the same as that of the first embodiment of the stand, it is common. The description of the different configurations will be omitted, and different configurations will be described.

The separator frame 19 is provided with a guide groove in the frame portion 20.
23 is formed in the projecting inclined portion 24 on the upper surface of the four corners, and the arm 17 is loosely fitted in the guide groove 23 and the operation engaging projection 18 is located outside the four corners of the frame portion 20, Both the separator frame 19 and the cradle 14 are independently movable up and down.

This has the same effect as that of the first embodiment.

FIGS. 7A and 7B show a third embodiment of the IC socket of the present invention. Since the configuration is basically the same as that of the first embodiment, the IC socket is common. The description of the different configurations will be omitted, and different configurations will be described.

The separator frame 19 includes a separator 22 and a frame portion 20.
The outer portion 22b of the separator 22 forms the uppermost portion 12 of the spring portion 12 of the contact pin 9.
In the inner portion 22a of the separator 22, a pin tip portion 13 extending from the spring portion 12 of the contact pin 9 to bypass the lower side of the frame portion 20 is positioned and divided and guided.

The pin tip 13 has an outer half 13a projecting inward from between the separators 22 and is formed to be approximately twice as thick as the inner half 13b.

This has the same effect as that of the first embodiment, and furthermore, the tip of the contact pin 9
13 and the spring part 12 are connected to the contact pin 9 and the lead terminal 37.
Can be always positioned and guided separately from the time of non-contact to the time of contact, and the contact pins 9 can be accurately and highly guided, and can cope with the fine pitch of the contact pins 9. In addition, since the outer half 13a of the pin tip 13 is formed to be approximately twice as thick as the inner half 13b, the contact stability between the fine pitch contact pin and the lead terminal can be improved. it can.

Each of the above-described embodiments is merely an example of the present invention. For example, the leg 16 of the receiving portion 14 is omitted in the form of the first embodiment unless the gist of the present invention is changed. Arbitrary such as configuration.

[0030]

【The invention's effect】

A. According to claim 1, a socket body in which a large number of contact pins for making electrical connection with a lead terminal of an IC element are arranged and arranged, a mounting portion on which the IC element can be mounted, and a projection for operating engagement, and a spring means. A pedestal mounted movably up and down and urged upward through the IC;
A projection-like inclined portion provided at the four corners for guiding the lead terminals of the element and a separator for guiding and positioning and dividing the contact pin are provided, and are attached to the socket body via a spring means so as to be vertically movable. Urged upward together with the separator frame provided on the outer periphery of the mounting portion and the pad that is pivotally supported by the socket body and can press the lead terminal and the projection of the receiving stand. And a pressing body having a pressable projection, so that the two functions of positioning the IC element and positioning and dividing the contact pin with respect to the lead terminal are reliably and accurately performed by the separator frame which is one component. The contact position between the contact pin and the lead terminal can be properly specified and accurately contacted. Twisting the terminal does not occur, it can wipe out poor contact due to the twist.

B. According to claim 2, the separator in the separator frame is formed to protrude in and out of the frame portion, and the highest portion of the spring portion of the contact pin is formed on the outer portion of the separator, and the highest portion of the spring portion of the contact pin is formed on the inner portion of the separator. Since the pin tips extending around the lower side of the frame are positioned and guided separately, both the pin tips of the contacts and the springs are always positioned from the time when the contact pin and the lead terminal are not in contact to the time when they contact. In addition, the guide can be divided and guided, so that the contact pins can be accurately and highly guided, and can cope with a fine pitch of the contact pins.

[Brief description of the drawings]

FIG. 1 is a plan view partially illustrating a first embodiment of an IC socket according to the present invention;

FIG. 2 is a vertical sectional view taken along the line aa in FIG.

FIG. 3 is a partially enlarged perspective view.

FIG. 4 is a vertical cross-sectional view showing a state in which the lid is being pushed down by a pusher to close the lid.

FIG. 5 is a longitudinal sectional view of a closed state in which a lead terminal and a pin tip are brought into contact with a pressing body.

FIG. 6A is a partial plan view illustrating a second embodiment of the IC socket of the present invention. (B) is a bb vertical sectional view of (A).

FIG. 7A is a partial plan view illustrating a third embodiment of the IC socket of the present invention. (B) is a cc vertical sectional view of (A).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket main body 2 Socket main body raised part 3 Socket main body groove 4 Groove hole 5,7 Socket main body mounting hole 6,8 Locked part of mounting hole 9 Contact pin 10 Contact pin terminal 11 Contact pin board Part 12 Contact pin spring part 13 Contact pin pin tip part 10a Terminal engagement part 12a Highest part of spring part 13a Outer part of pin tip part 13b Inner part of pin tip part 14 Receiving stand 15 Receiving part of receiving stand 16 Cradle legs 17 Cradle arms 18 Cradle operating engagement projections 15a Rise of mounting portion 16a Leg locking portions 19 Separator frame 20 Separator frame frame 21 Separator frame legs 22 Separator Frame Separator 23 Separator Frame Guide Groove 24 Separator Frame Protrusion Slope 21a Leg Locking Section 22a Separator Inner Part 22b Separator Outer Part 25 Presser Body 26 Presser Body Shaft Hole 27 Presser Body Head 28 lead terminal of the push portions 31, 32 spring 34, 35 shaft 36 IC elements 37 IC elements of the projection 29 cover 30 cover the pressing member

────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Masaru Arai 755-1, Ogano, Ogano-machi, Chichibu-gun, Saitama Prefecture Chichibu Fujiuchi Co., Ltd. (72) Inventor Tomohiro Arai 755, Ogano, Ogano-machi, Chichibu-gun, Saitama 1 Chichibu Fujiuchi (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 33/76

Claims (2)

(57) [Claims] 1. A socket body in which a number of contact pins electrically connecting to lead terminals of an IC element are arranged and arranged, a mounting portion on which the IC element can be mounted, and a projection for operation engagement, and a spring means. A pedestal that is vertically movably mounted and urged upward, and a projection-like inclined portion that is provided at four corners for guiding a lead terminal of an IC element and a contact pin are positioned and guided. A separator frame provided on an outer periphery of the mounting portion, the separator frame being mounted on the socket body so as to be vertically movable via a spring means and being urged upward; An IC socket comprising: a pad capable of pressing the lead terminal; and a pressing body having a projection capable of pressing against the projection of the receiving table. 2. The separator of the separator frame is formed so as to protrude in and out of the frame portion. The outermost portion of the separator has the highest portion of the contact pin spring portion, and the inner portion of the separator has the highest portion of the contact pin spring portion. 2. The IC socket according to claim 1, wherein the pin tips extending around the lower side of the frame are positioned and divided and guided.