JPH0620309Y2 - LSI socket - Google Patents

LSI socket

Info

Publication number
JPH0620309Y2
JPH0620309Y2 JP1989056232U JP5623289U JPH0620309Y2 JP H0620309 Y2 JPH0620309 Y2 JP H0620309Y2 JP 1989056232 U JP1989056232 U JP 1989056232U JP 5623289 U JP5623289 U JP 5623289U JP H0620309 Y2 JPH0620309 Y2 JP H0620309Y2
Authority
JP
Japan
Prior art keywords
lsi
pin
contact piece
base housing
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989056232U
Other languages
Japanese (ja)
Other versions
JPH02146781U (en
Inventor
昌司 梅里
芳紀 水沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
NEC Corp
Original Assignee
Japan Aviation Electronics Industry Ltd
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd, NEC Corp filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP1989056232U priority Critical patent/JPH0620309Y2/en
Publication of JPH02146781U publication Critical patent/JPH02146781U/ja
Application granted granted Critical
Publication of JPH0620309Y2 publication Critical patent/JPH0620309Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案はLSIソケットに関し、特に電子機器及び電子
計算機を構成する電子回路用のプリント基板に実装され
るLSIソケットに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an LSI socket, and more particularly to an LSI socket mounted on a printed circuit board for an electronic circuit that constitutes an electronic device and a computer.

[従来の技術] 従来、この種のLSIソケットは、第3図及び第4図に
示すようになっていた。
[Prior Art] Conventionally, this type of LSI socket has been shown in FIGS. 3 and 4.

図中19はLSI、17はプリント基板、13はベース
ハウジング、18はカバーで、LSI19のピン20と
接触する接触片15がベースハウジング13のピン20
対応位置に形成した凹部13a内に設けられている。
In the figure, 19 is an LSI, 17 is a printed circuit board, 13 is a base housing, 18 is a cover, and the contact piece 15 that contacts the pin 20 of the LSI 19 is the pin 20 of the base housing 13.
It is provided in the recess 13a formed at the corresponding position.

接触片15は、上部が開放した略コ字状のもので、その
両端部に各々内側に突出して曲折するピン20との接触
点14が形成してあり、この接触点14間にピン20を
挿入するようになっている。また、凹部13aの下部に
は外側に突出するプリント基板17接続用の端子16が
取付けてあり、この端子16と接触片15が連結された
状態になっている。
The contact piece 15 has a substantially U-shape with an open upper part, and contact points 14 with the pins 20 projecting inward and bending are formed at both ends of the contact piece 15, and the pin 20 is interposed between the contact points 14. It is designed to be inserted. Further, a terminal 16 for connecting to the printed circuit board 17 protruding outward is attached to the lower portion of the recess 13a, and the terminal 16 and the contact piece 15 are connected to each other.

そして、カバー18にはLSI19のピン20を挿入す
る挿入孔21があり、LSI19が装着された時はピン
20に接触片15が押圧状態になるものであった。
The cover 18 has an insertion hole 21 into which the pin 20 of the LSI 19 is inserted, and the contact piece 15 is pressed against the pin 20 when the LSI 19 is mounted.

[考案が解決しようとする課題] 上述した従来のLSIソケットにあっては、LSI19
のピン20に接触力が直接加わる構造となっていたた
め、LSI19の挿抜時にLSI19のピン20に対し
て負荷が加わった。このような構造の場合、最近の高密
度化において、LSI19のピン20の径が細くなる傾
向があり、これをLSIソケットに挿抜した場合、細径
のピン20に負荷が加わり、ピン20を変形及び破損さ
せる恐れがあった。
[Problems to be Solved by the Invention] In the conventional LSI socket described above, the LSI 19
Since the contact force is directly applied to the pin 20 of the LSI 19, a load is applied to the pin 20 of the LSI 19 when the LSI 19 is inserted and removed. In the case of such a structure, the diameter of the pin 20 of the LSI 19 tends to become smaller due to the recent increase in density, and when this is inserted into and removed from the LSI socket, a load is applied to the pin 20 having a small diameter and the pin 20 is deformed. There was a risk of damage.

又、細径のピン20であるため、接触片15のばね変形
量が少なくなる方向にあり、ばね特性上余裕のない設計
になるという欠点があった。
Further, since the pin 20 has a small diameter, the spring deformation of the contact piece 15 tends to decrease, and there is a drawback that the spring characteristic has a marginless design.

[課題を解決するための手段] 本考案は、上記課題を解決するためになしたもので、そ
の解決手段として本考案は、プリント基板上に実装固定
されLSIの複数のピンを受け入れるLSIソケットに
おいて、ベースハウジングのLSIのピン対応位置に凹
部を設け、該凹部内にLSIのピンを収納する導電性の
筒状の接触片を設け、該接触片の上記ピン挿入側端部に
上記ピンが取付けられているLSI基板底面のパッドと
接触する接触面を設けると共に、上記凹部下部に外方へ
突出するプリント基板接続用の端子を設け、かつ該端子
と上記接触片との間に上記接触片をLSI側に付勢する
導電性のばねを設け、更にLSIを上記ばねの付勢力に
抗してベースハウジング側に押圧する押えカバーをベー
スハウジング上に設ける構成としている。
[Means for Solving the Problems] The present invention has been made to solve the above problems. As a means for solving the problems, the present invention provides an LSI socket mounted and fixed on a printed circuit board for receiving a plurality of pins of an LSI. , A recess is provided in the base housing at a position corresponding to the LSI pin, and a conductive tubular contact piece for accommodating the LSI pin is provided in the recess, and the pin is attached to the end of the contact piece on the pin insertion side. A contact surface for contacting a pad on the bottom surface of the LSI substrate is provided, a printed circuit board connecting terminal protruding outward is provided in the lower portion of the recess, and the contact piece is provided between the terminal and the contact piece. A conductive spring for urging the LSI is provided, and a pressing cover for pressing the LSI against the base housing side against the urging force of the spring is provided on the base housing.

[実施例] 次に本考案の実施例について図面を参照して説明する。[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.

第1図は本考案の一実施例に係るLSIソケットのLS
I装着前の状態を示す断面図、第2図はLSI5を装着
した断面図である。
FIG. 1 is an LS of an LSI socket according to an embodiment of the present invention.
I is a sectional view showing a state before mounting, and FIG. 2 is a sectional view in which the LSI 5 is mounted.

このLSIソケットは、プリント基板9上に実装固定さ
れてLSI5の複数のピン4を受け入れ接続するもの
で、ベースハウジング1のLSI5のピン4対応位置に
複数の凹部1aを設け、この凹部1a内にそれぞれLS
I5のピン4を収納する導電性の筒状の接触片12を設
けるようにしている。
This LSI socket is mounted and fixed on the printed circuit board 9 to receive and connect a plurality of pins 4 of the LSI 5, and a plurality of recesses 1a are provided in the base housing 1 at positions corresponding to the pins 4 of the LSI 5, and the recesses 1a are provided in the recesses 1a. LS respectively
A conductive tubular contact piece 12 for accommodating the pin 4 of I5 is provided.

この接触片12は、ピン4の挿入側端部に、ピン4が取
付けられているLSI5の基板底面のパッド3と接触す
る接触点2を設けるようにしている。
The contact piece 12 is provided with a contact point 2 at the insertion side end of the pin 4 for contacting the pad 3 on the bottom surface of the substrate of the LSI 5 to which the pin 4 is attached.

また、ベースハウジング1の凹部1a下部には各々下外
方向へ突出するプリント基板9への接続用の端子7が設
けてある。
Further, terminals 7 for connecting to a printed circuit board 9 protruding downward are provided at the bottoms of the recesses 1a of the base housing 1, respectively.

そして、端子7と接触片12との間に、接触片12をL
SI5側に付勢する導電性のばね8を設けるようにして
いる。
Then, the contact piece 12 is set to L between the terminal 7 and the contact piece 12.
A conductive spring 8 that biases the SI5 side is provided.

更に、ベースハウジング1上には、ばね8の付勢力に抗
して接触片12をベースハウジング1側に押圧する押え
カバー6を設けるようにしている。この押えカバー6の
側部には回転可能にロックレバー11が取付けてあり、
このロックレバー11の先端をベースハウジング1の側
面対応位置に設けた突起10に係合させることにより、
押圧状態で固定できるようになっている。
Further, a pressing cover 6 for pressing the contact piece 12 toward the base housing 1 side against the biasing force of the spring 8 is provided on the base housing 1. A lock lever 11 is rotatably attached to a side portion of the presser cover 6,
By engaging the tip of the lock lever 11 with the protrusion 10 provided at the position corresponding to the side surface of the base housing 1,
It can be fixed in the pressed state.

そして、LSI5をLSIソケットに装着した場合、L
SI5の各々ピン4がLSIソケットの接触片12に収
納され、さらにLSI5を装着する方向に力を加える
と、ばね8が収縮し、ある規定量押え込んだ状態でロッ
クレバー11の先端がベースハウジングの突起10に引
掛り、LSI5のパッド3とLSIソケットの接触片1
2の接触点2が規定接触力の押圧状態になる。
When the LSI 5 is attached to the LSI socket, L
Each pin 4 of the SI 5 is housed in the contact piece 12 of the LSI socket, and when a force is further applied in the mounting direction of the LSI 5, the spring 8 contracts, and the tip of the lock lever 11 is pressed down by a certain specified amount so that the tip of the lock lever 11 is in the base housing. Hooked on the protrusion 10 of the LSI, and the contact piece 1 of the pad 3 of the LSI 5 and the LSI socket
The contact point 2 of 2 is in the pressed state of the specified contact force.

LSI5をLSIソケットから離脱する時はロックレバ
ー11を内側に倒してロックレバー11の先端を突起1
0から外すことによりばね8によってLSI5が持ち上
げられ離脱状態になる。
When detaching the LSI 5 from the LSI socket, the lock lever 11 is tilted inward and the tip of the lock lever 11 is projected.
When removed from 0, the spring 8 lifts the LSI 5 and puts it in a detached state.

[考案の効果] 以上説明したように本考案のLSIソケットは、ベース
ハウジングのLSIのピン対応位置に凹部を設け、該凹
部内にLSIのピンを収納する導電性の筒状の接触片を
設け、該接触片の上記ピン挿入側端部に上記ピンが取付
けられているLSI基板底面のパッドと接触する接触面
を設けると共に、上記凹部下部に外方へ突出するプリン
ト基板接続用の端子を設け、かつ該端子と上記接触片と
の間に上記接触片をLSI側に付勢する導電性のばねを
設け、更にLSIを上記ばねの付勢力に抗してベースハ
ウジング側に押圧する押えカバーをベースハウジング上
に設けることとしたため、LSIのピンが取付けられて
いるパッドに接触片の接触面を接触させることによっ
て、LSIのピンに負荷が加わらず、細径のピンであっ
ても変形及び破損させる恐れがなくなるという効果があ
る。
[Advantages of the Invention] As described above, the LSI socket of the present invention is provided with a recess at a position corresponding to the LSI pin in the base housing, and a conductive cylindrical contact piece for accommodating the LSI pin is provided in the recess. A contact surface for contacting a pad on the bottom surface of the LSI substrate on which the pin is mounted is provided at an end portion of the contact piece on the pin insertion side, and a terminal for connecting a printed circuit board protruding outward is provided at a lower portion of the recess. Further, a conductive spring for urging the contact piece toward the LSI side is provided between the terminal and the contact piece, and a pressing cover for pressing the LSI against the base housing side against the urging force of the spring is provided. Since it is provided on the base housing, even if the pin of the LSI has a small diameter, the load is not applied to the pin of the LSI by bringing the contact surface of the contact piece into contact with the pad to which the pin of the LSI is attached. This has the effect of eliminating the risk of deformation and damage.

又、接触力を安定化するため、ばねの変位量は細径ピン
に関係なく得られるため設計に余裕がでるという効果が
ある。
Further, in order to stabilize the contact force, the displacement amount of the spring can be obtained regardless of the small diameter pin, so that there is an effect that there is a margin in the design.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の一実施例に係るLSIソケットのLS
I装着前の状態を示す断面図、第2図は本実施例のLS
IソケットにLSIを装着した断面図、第3図は従来の
LSIソケットのLSI装着前の断面図、第4図は従来
のLSIソケットにLSIを装着した断面図である。 1:ベースハウジング 2:接触点、3:パッド 4:ピン、5:LSI 6:押えカバー、7:端子 8:ばね、9:プリント基板 12:接触片
FIG. 1 is an LS of an LSI socket according to an embodiment of the present invention.
I is a sectional view showing a state before mounting, FIG. 2 is an LS of the present embodiment
FIG. 3 is a cross-sectional view of the I socket in which the LSI is mounted, FIG. 3 is a cross-sectional view of the conventional LSI socket before the LSI is mounted, and FIG. 4 is a cross-sectional view of the conventional LSI socket in which the LSI is mounted. 1: Base housing 2: Contact point, 3: Pad 4: Pin, 5: LSI 6: Presser cover, 7: Terminal 8: Spring, 9: Printed circuit board 12: Contact piece

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】プリント基板上に実装固定されLSIの複
数のピンを受け入れるLSIソケットにおいて、 ベースハウジングのLSIのピン対応位置に凹部を設
け、該凹部内にLSIのピンを収納する導電性の筒状の
接触片を設け、該接触片の上記ピン挿入側端部に上記ピ
ンが取付けられているLSI基板底面のパッドと接触す
る接触面を設けると共に、上記凹部下部に外方へ突出す
るプリント基板接続用の端子を設け、かつ該端子と上記
接触片との間に上記接触片をLSI側に付勢する導電性
のばねを設け、更にLSIを上記ばねの付勢力に抗して
ベースハウジング側に押圧する押えカバーをベースハウ
ジング上に設けることを特徴とするLSIソケット。
1. An LSI socket mounted and fixed on a printed circuit board for receiving a plurality of pins of an LSI, wherein a recess is provided in a base housing at a position corresponding to the pin of the LSI, and a conductive tube for housing the pins of the LSI in the recess. -Shaped contact piece is provided, and a contact surface that comes into contact with a pad on the bottom surface of the LSI substrate on which the pin is attached is provided at an end portion of the contact piece on the pin insertion side, and a printed circuit board projecting outward at the lower portion of the recess. A terminal for connection is provided, and a conductive spring for urging the contact piece toward the LSI is provided between the terminal and the contact piece, and the LSI is further resistant to the urging force of the spring to the base housing side. An LSI socket characterized in that a pressing cover for pressing against is provided on a base housing.
JP1989056232U 1989-05-16 1989-05-16 LSI socket Expired - Lifetime JPH0620309Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989056232U JPH0620309Y2 (en) 1989-05-16 1989-05-16 LSI socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989056232U JPH0620309Y2 (en) 1989-05-16 1989-05-16 LSI socket

Publications (2)

Publication Number Publication Date
JPH02146781U JPH02146781U (en) 1990-12-13
JPH0620309Y2 true JPH0620309Y2 (en) 1994-05-25

Family

ID=31579875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989056232U Expired - Lifetime JPH0620309Y2 (en) 1989-05-16 1989-05-16 LSI socket

Country Status (1)

Country Link
JP (1) JPH0620309Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677467B2 (en) * 1992-12-25 1994-09-28 山一電機株式会社 IC socket
CN106159587A (en) * 2016-08-30 2016-11-23 镇江安邦电子有限公司 A kind of shockproof socket connector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258778B2 (en) * 1981-08-24 1987-12-08 Soichi Yamamoto
JPS6325573A (en) * 1986-07-18 1988-02-03 Hitachi Ltd Test board for integrated circuit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258778U (en) * 1985-09-30 1987-04-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258778B2 (en) * 1981-08-24 1987-12-08 Soichi Yamamoto
JPS6325573A (en) * 1986-07-18 1988-02-03 Hitachi Ltd Test board for integrated circuit

Also Published As

Publication number Publication date
JPH02146781U (en) 1990-12-13

Similar Documents

Publication Publication Date Title
JPH0222509B2 (en)
US7503770B2 (en) Electrical connector
US7435104B2 (en) Socket assembly
US7654862B2 (en) IC package having improved structure
US9130321B2 (en) Electrical connector having contact for either BGA or LGA package
JPH0620309Y2 (en) LSI socket
US7775803B2 (en) Electrical connector having contact retention device
JP2003187932A (en) Electric socket
US6957965B2 (en) Electrical connector assembly with a transfer member
JPS5854472B2 (en) integrated circuit board connector
JPS6023913Y2 (en) connector
US6406318B1 (en) Socket with improved base
JP2593416Y2 (en) IC socket for chip substrate
JP2545016Y2 (en) IC socket
US6648655B1 (en) Land grid array socket with supporting members
JPH0716318Y2 (en) LSI socket
JPH0537437Y2 (en)
JPH0715113Y2 (en) LSI socket
JPH0348862Y2 (en)
JPS6333514Y2 (en)
JPS5827518Y2 (en) IDC connector
JPS6055089U (en) Chip carrier connector
JP2603084Y2 (en) connector
JP2982871B1 (en) IC socket
JPS6322619B2 (en)