JPH06310423A - Apparatus for cleaning end edge of board - Google Patents

Abstract

PURPOSE:To efficiency clean the whole periphery of the end edge of a rectangular board in a short time while making a simple cleaning configuration possible. CONSTITUTION:In an apparatus for cleaning the end edges of boards, a rectangular board 1 on whose surface a thin film is formed is held by a board holding means 2. A solvent discharging means 3 which dissolves the unwanted thin film while discharging a solvent to both the surface and rear surface of the end edge of the rectangular board 1 held by the means 2 is provided movably along each one of the four sides of the rectangular board 1 held by the means 2. Further, a wire 20 is so wound around the rectangular board 1 as to surround its periphery while extending via a driving pulley 18 and free pulleys 19..., and four solvent discharging means 3... are connected in a body movably with the wire 20 in its predetermined places, and moreover, a single motor 16 is linked with the driving pulley 18 in an interlocking way. Thereby, the four solvent discharging means 3... are moved in a body, and the whole periphery of the end edge of the rectangular board 1 is cleaned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the production of glass substrates for liquid crystals, glass substrates for photomasks, and thermal heads on the surface of which a thin film composed of a photoresist solution, a photosensitive polyimide resin, a dyeing agent for color filters, etc. is applied. Substrate for mounting and holding a rectangular substrate with a thin film formed on its surface in order to dissolve and remove unnecessary thin films adhering to the edges of the rectangular substrate after applying the thin film to a rectangular substrate such as a ceramic substrate The present invention relates to a substrate edge cleaning apparatus including a holding unit and a solvent discharge unit that discharges a solvent onto at least one of the front and back surfaces of the edge of a rectangular substrate held by the substrate holding unit to dissolve an unnecessary thin film. .

[0002]

2. Description of the Related Art As a substrate edge cleaning device as described above, there is one disclosed in Japanese Patent Publication No. 3-78777. According to this conventional example, the first tube and the second tube are provided so as to face the upper surface and the lower surface of the peripheral portion of the substrate having the thin film formed on the surface thereof, and between the first and second tubes. A third pipe is provided in the gap and on the extension of the substrate end, and the solvent is supplied from the first and second pipes to the upper and lower surfaces of the peripheral portion of the substrate, and the solvent and the solvent are removed. The unnecessary thin film can be sucked and discharged from the third tube.

Then, by sucking and discharging the unnecessary thin film from the third tube, the solvent is prevented from entering the center side of the substrate, and the first, second and third substrates are rotated at a low speed. By moving the tube in the direction away from the center of rotation of the substrate, even for substrates with an orientation flat or rectangular substrates such as glass substrates for liquid crystals,
It is constructed so that the unnecessary thin film on the edge can be dissolved and removed.

[0004]

However, the first, the second, and the third tubes are moved in the direction of moving away from the rotation center of the substrate so as to cope with the change in the distance from the rotation center due to the rotation of the rectangular substrate. In order to move to the edge of the rectangular substrate, it is necessary to control the substrate with extremely high precision, and since the substrate cannot be rotated at a high speed, the processing efficiency is significantly reduced. It is not practical to wash.

Therefore, a solvent discharge means for discharging a solvent to at least one of the front and back surfaces of the edge of the rectangular substrate to dissolve the unnecessary thin film is provided on one or two sides of the rectangular substrate,
It is proposed that the solvent discharge means is moved along the edge of the rectangular substrate in the state where the rotation is stopped, but if the solvent discharge means is provided for one side, , It must be rotated by 90 ° each time after cleaning one side, and if it is installed on two sides, it must be rotated by 180 ° after cleaning each side. There was still room for improvement in terms of efficiency.

The present invention has been made in view of the above circumstances, and the substrate edge cleaning apparatus according to the first aspect of the present invention is structurally simple in construction, and yet has the entire edge of the rectangular substrate. A substrate edge cleaning device of the invention according to claim 2 is intended to enable efficient cleaning of the circumference in a short time.
It is an object of the present invention to reduce the space of the drive system of the solvent ejecting means, and an object of the present invention is to provide a substrate edge cleaning device having a simple control structure.

[0007]

In order to achieve the above-mentioned object, a substrate edge cleaning apparatus according to a first aspect of the present invention mounts and holds a square substrate having a thin film formed on its surface. In a substrate edge cleaning device including a holding means and a solvent discharge means for discharging a solvent to at least one of both front and back surfaces of an edge of a rectangular substrate held by the substrate holding means to dissolve an unnecessary thin film The solvent discharge means is provided so as to be movable along each edge of each of the four sides of the rectangular substrate held by the substrate holding means, and the four solvent discharge means are integrally movable via a linkage mechanism. And the interlocking mechanism is provided with a single drive mechanism for integrally moving the four solvent discharging means.

Further, in order to achieve the above-mentioned object, the substrate edge cleaning device of the invention according to claim 2 has one linking mechanism in the substrate edge cleaning device of the invention according to claim 1 described above. A wire wound in a loop along the outer peripheral edge of the rectangular substrate held by the substrate holding means over the drive pulley and the idle pulley of
The drive mechanism is composed of a single electric motor capable of forward and reverse rotations, which is linked to a drive pulley.

Further, the substrate edge cleaning device of the invention according to claim 3 is the same as in claim 1 in order to achieve the above object.
Alternatively, the substrate edge cleaning apparatus according to the second aspect of the invention is provided with a moving position detecting unit that detects a moving position of one of the four solvent discharging units, and based on the detection result by the moving position detecting unit. It is configured by including control means for controlling the drive mechanism.

[0010]

According to the structure of the substrate edge cleaning apparatus of the first aspect of the present invention, the solvent discharging means provided corresponding to each of the four sides of the rectangular substrate is driven by the driving of the single driving mechanism. By moving integrally along the edge, the four sides of the rectangular substrate can be cleaned at once.

Further, according to the structure of the substrate edge cleaning device of the second aspect of the invention, one wire in which four solvent discharging means are interlockingly connected is reciprocally moved by the forward and reverse rotation of the drive pulley by the electric motor. Then, the solvent discharge means provided corresponding to each of the four sides of the rectangular substrate can be moved integrally along the edge of the rectangular substrate.

According to the structure of the substrate edge cleaning device of the third aspect of the present invention, the control is performed based on the moving position of one of the four solvent discharging means with respect to the solvent discharging means, so that it is integrated with it. It is also possible to control the movement of the other solvent discharging means that moves automatically.

[0013]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is an overall schematic side view of a substrate edge cleaning apparatus according to a first embodiment of the present invention, and FIG. 2 is an overall schematic plan view of a partly cutaway surface. A thin film is formed on the surface by spin coating. Solvent ejecting means 3 for ejecting a solvent on both front and back surfaces of the rectangular substrate 1 to dissolve an unnecessary thin film at each of four places around the substrate holding means 2 for mounting the rectangular substrate 1 and holding it by vacuum adsorption.
, And a suction member 4 for sucking the solvent and the dissolved unnecessary thin film, and the substrate edge cleaning device 5 is configured.

A spin coater 6 for applying a photoresist solution is provided on one side of the substrate edge cleaning device 5, and a drying oven 7 is provided on the other side thereof, and the spin coater 6 and the substrate edge cleaning device are provided. 5, an entrance side arm 8 for transferring the substrate is provided, and an exit side arm 9 for transferring the substrate is provided between the substrate edge cleaning device 5 and the oven 7 for drying.

As shown in the enlarged side view of the main part of FIG. 3 and the plan view of FIG. 4, each of the solvent discharge means 3 has a first upper side in the vertical direction with the suction port 4a of the suction member 4 interposed therebetween. The rinse liquid nozzle 10a and the first gas nozzle 11a are provided, while the second rinse liquid nozzle 10b and the second gas nozzle 11b are provided on the lower side.

The first and second rinse liquid nozzles 10
a, 10b and the first and second gas nozzles 11a, 11
b, and the suction member 4 is integrally attached to the nozzle block 12, and the support arm 13 to which the nozzle block 12 is attached is attached to the fixed frame 14 through a pair of upper and lower guides 15 and 15 to form a rectangular substrate. It is provided so as to be movable along the edge of 1.

A motor bracket 17 provided with an electric motor 16 as a drive mechanism capable of forward and reverse rotations at a position corresponding to one corner of the rectangular substrate 1 held by the substrate holding means 2.
Is erected, and a drive pulley 18 is interlocked with the drive shaft of the electric motor 16.

One idler pulley 19 is provided at a position corresponding to one corner of the rectangular substrate 1 held by the substrate holding means 2.
, And two idler pulleys 19 and 19 are provided at the positions corresponding to the other three corners, and a pair of wires 20 and 20 are provided across the drive pulley 18 and the idler pulley 19 ... Wound and that wire 2
A support arm 13 is connected to each of four predetermined positions of 0 and 20, and the four solvent discharge means 3, ..., Suction members 4, ... It is configured to be able to reciprocate and clean the edge of the rectangular substrate 1.

A nozzle block origin detection sensor 21 for detecting that one nozzle block 12 has moved to the origin position by contacting the support arm 13 is provided at a position corresponding to a predetermined side of the rectangular substrate 1, and A nozzle block dock sensor 22 is provided at a position close to the nozzle block origin detection sensor 21 to detect that the nozzle block 12 has reached a predetermined position immediately before reaching the origin when the nozzle block 12 moves to the origin position side. ing.

As shown in the block diagram of FIG. 5, the inlet side arm in detection sensor 23, the inlet side arm down detection sensor 24, the inlet side arm open detection sensor 25, the inlet side, which are attached to the inlet side arm 8, are provided. The arm up detection sensor 26, the entrance side arm out detection sensor 27, and the exit side arm in detection sensor 28, the exit side arm down detection sensor 29, the exit side arm close detection sensor 30, which are attached to the exit side arm 9. The exit side arm up detection sensor 31, the exit side arm out detection sensor 32, the nozzle block origin detection sensor 21, and the nozzle block dock sensor 22 are the CPU 33.
Further, a substrate suction confirmation sensor 34 for detecting that the substrate holding means 2 holds the rectangular substrate 1 by vacuum suction is connected to the CPU 33.

The entrance side arm in detection sensor 23 detects that the entrance side arm 8 holding the rectangular substrate 1 placed in the spin coater 6 has moved to a predetermined position in the substrate edge cleaning device 5. Has become.

The entrance side arm down detection sensor 24 is
It is detected that the entrance side arm 8 holding the rectangular substrate 1 is lowered to a position where the rectangular substrate 1 is placed on the substrate holding means 2 of the substrate edge cleaning device 5.

The entrance side arm open detection sensor 25 is
The claw of the entrance-side arm 8 lowered to the position where the rectangular substrate 1 is placed on the substrate holding means 2 is opened, and it is detected that the grasping of the rectangular substrate 1 is released.

The entrance-side arm up detection sensor 26 is adapted to detect that the entrance-side arm 8 which has released the grip of the rectangular substrate 1 has risen to a predetermined position with its claw open. Further, the entrance side arm out detection sensor 27 is adapted to detect that the entrance side arm 8 that has risen to a predetermined position has moved to the retracted position on the spin coater 6 side.

The outlet-side arm-in detection sensor 28 has an outlet-side arm 9 for gripping the rectangular substrate 1 for which the edge cleaning process has been completed and transferring it to the oven 7 up to a predetermined position in the substrate-edge cleaning device 5. It is designed to detect that you have moved.

The outlet side arm down detection sensor 29 is
It is possible to detect that the exit side arm 9 holding the rectangular substrate 1 has moved down to a lowered position where the rectangular substrate 1 placed on the substrate holding means 2 of the substrate edge cleaning device 5 can be held. There is.

Outlet arm close detection sensor 30
Detects that the square-shaped substrate 1 held on the substrate holding means 2 is closed and the claw of the exit side arm 9 is closed to grip the square-shaped substrate 1. .

The outlet-side arm up detection sensor 31 is adapted to detect that the outlet-side arm 9 holding the rectangular substrate 1 has risen to a predetermined position with its claw closed.
Further, the outlet-side arm out detection sensor 32 is configured to detect that the outlet-side arm 9 that has risen to a predetermined position has moved to a predetermined retracted position on the oven 7 side.

Further, the CPU 33 is connected with a scan number n setting means 35 so that the number of times the nozzle block 12 is reciprocated with respect to one rectangular substrate 1 is manually set (by a keyboard or the like) and set. Has become.

Further, the CPU 33 is connected with end points A and B setting means 36, and sets the moving distance of the nozzle block 12 according to the size of the rectangular substrate 1. When the rectangular substrate 1 is conveyed onto the substrate holding means 2 by the entrance side arm 8, the center of the long side of the rectangular substrate 1 is always the substrate holding means 2 regardless of the size of the rectangular substrate 1.
Is conveyed so as to be located at a predetermined position. With this in mind, the positions of the end points A and B in the movement of the nozzle block 12 are set and represented by the distance from the predetermined position. Then, the spin coater 6 measures the size of the rectangular substrate 1 and inputs the size data to the CPU 33. Based on the known origin position, the width of the nozzle block 12, and the size data, the end point A is obtained. The positions of B and B are automatically calculated and set and displayed. This display value can be changed manually for fine adjustment. The movement amount between the end points A and B and the movement amount from the origin to the end point A set by the end point A and B setting means 36 is based on the origin position detected by the nozzle block origin detection sensor 21 and is used as a reference. Then, the rotation amount of the electric motor 16 is detected, and this configuration is referred to as moving position detecting means.

Rectangular substrate 1 coated with photoresist solution
Inlet side arm control means 37 for controlling the operation of the inlet side arm 8 for transporting the substrate edge cleaning device 5 (rotation of the arm, lifting and lowering, opening and closing of the claw), and the rectangular substrate 1 for which the edge cleaning process is completed.
To the oven 7. The exit side arm control unit 38 for controlling the operation of the exit side arm 9 (rotation, raising and lowering, opening and closing of the claw) of the exit side arm 9 and the substrate holding unit 2 for sucking and holding the rectangular substrate 1 by vacuum suction. Substrate adsorption control means 3 for controlling the operation
9, the nozzle block drive means 40 for controlling the rotation direction and speed of the electric motor 16 to control the moving direction and speed of the nozzle block 12, and the discharge of the rinse liquid from the first and second rinse liquid nozzles 10a ... 10b. Rinse liquid nozzle control means 41 for performing stop and stop, and gas nozzle control means 42 for discharging and stopping the nitrogen gas from the first and second gas nozzles 11a ... 11b are connected to the CPU 33, respectively. The suction from the suction member 4 is always performed.

With the above configuration, loading and unloading of the rectangular substrate 1 into and from the substrate edge cleaning device 5 and edge cleaning are automatically performed. Next, referring to the time chart of FIG. Will be described with reference to the flowcharts of FIGS. 7 and 8.

First, after holding the square substrate 1 coated with the photoresist solution by the spin coater 7 on the inlet side arm 8, the inlet side arm 8 is rotated to clean the square substrate 1 at the substrate edge cleaning device 5. It is carried upward (S1), and the entrance side arm in detection sensor 23 detects whether it has been carried to a predetermined position (S2).

After the entrance side arm 8 is moved down to the predetermined position (S3), it is determined whether the entrance side arm 8 is lowered to the position where the rectangular substrate 1 is placed on the substrate holding means 2 or not. After the detection by the detection sensor 24 (S4), the substrate suction control means 39 starts the vacuum suction by the substrate holding means 2 (S5), and the claw of the inlet side arm 8 is opened (S6).

The opening of the claw of the entrance side arm 8 is detected by the entrance side arm open detection sensor 25 (S7).
Then, the inlet arm 8 is raised (S8). afterwards,
After the entrance-side arm up detection sensor 26 detects that the entrance-side arm 8 has risen to a predetermined position (S9), the substrate holding confirmation sensor 34 detects that the substrate holding means 2 holds the rectangular substrate 1 by vacuum suction. It is detected (S10).

After that, the nozzle block drive means 40 drives the electric motor 16 to move the nozzle block 12 from the origin position to the end point A (S11), and the gas nozzle control means 42 supplies nitrogen gas and controls the rinsing liquid nozzle. The discharge of the rinse liquid by the means 41 is started (S12, S13), and further, the inlet side arm 8 is rotated,
The nozzle block 12 is moved from the end point A to the end point B (S15) while the electric motor 16 is normally and reversely rotated at a predetermined timing while retracting from a position above the substrate edge cleaning device 5 to a retracted position (S14), and From end point B to end point A (S
16) and is reciprocated to perform cleaning processing on the entire circumference of the edge of the rectangular substrate 1.

When one scan of the nozzle block 12 is completed, the nozzle block 12 is counted (n = n-1) (S1).
From 7), it is determined whether or not the count value has reached the set number (S18), and if it has not reached the set number, the process returns to step S15, and the nozzle block 12 is reciprocated again to move the edge of the rectangular substrate 1. Wash the entire circumference. Here, the number of scan settings is set to two (see FIG. 6).

After the set number of scans is completed, the discharge of the rinse liquid by the rinse liquid nozzle control means 41 and the supply of the nitrogen gas by the gas nozzle control means 42 are stopped (S19, S20), and the nozzle block drive means 40 is also used. The electric motor 16 to drive the nozzle block 1
2 is moved from the end point A to the origin position (S21), and
The vacuum suction is released by the substrate suction control means 39 (S
22).

The nozzle block dock sensor 22
With detecting that the nozzle block 12 has moved to a predetermined dock position (S23), the rotation speed of the electric motor 16 is reduced (S24) to prevent overrun. Next, the nozzle block 12 is moved until the origin position is detected by the nozzle block origin detection sensor 21 (S25), and after the origin position is detected, the driving of the electric motor 16 is stopped and the movement of the nozzle block 12 is stopped ( S2
6).

After that, the entrance arm out detection sensor 2
7, it is confirmed that the inlet side arm 8 has moved to the retracted position (S27), and that the vacuum suction of the rectangular substrate 1 is released (S28), and then the outlet side arm 9 is rotated. , Is moved to a predetermined carry-out position on the substrate edge cleaning device 5 (S29). Here, the entrance side arm 8
Is to prevent the interference between the outlet side arm 9 and the inlet side arm 8, and the confirmation of the suction release is performed by the outlet side arm 9 acting on the rectangular substrate 1 in the sucked state. This is to prevent the substrate 1 from being damaged.

After that, whether or not the outlet side arm 9 has moved to a predetermined carry-out position on the substrate edge cleaning device 5 is detected by the outlet side arm-in detection sensor 28 (S30), and after being conveyed to the predetermined position. Lower the outlet arm 9 (S
31), the exit side arm down detection sensor 29 detects whether or not the rectangular substrate 1 held by the substrate holding means 2 has been lowered to a position where it can be held in a state where the vacuum suction is released (S32).

After descending to a predetermined position, the claws of the exit side arm 9 are closed to grip the square substrate 1 (S33), and the claws are closed to grip the square substrate 1 and the exit side arm c
After being detected by the lose detection sensor 30 (S34), the outlet side arm 9 is raised (S35).

After that, the exit side arm up detection sensor 31
After detecting that the outlet side arm 9 has risen to a predetermined position (S36), the outlet side arm 9 is rotated to move to a predetermined retracted position on the oven 7 side (S37).

The exit side arm out detection sensor 32 detects whether or not the exit side arm 9 has moved to a predetermined retreat position (S38), and after confirming the retreat, it is determined whether or not continuous processing is to be performed (S39). If it is a continuous process, the process returns to step S1 and the above process is repeated. On the other hand, if it is not a continuous process, the process ends.

By the above operation, the square substrate 1 is loaded into the substrate edge cleaning device 5 from the spin coater 6, the edge cleaning process is performed, and the rectangular substrate 1 is unloaded from the substrate edge cleaning device 5 into the oven 7. Can be done automatically.

The position of the nozzle block 12 detected by the moving position detecting means, that is, the solvent discharging means 3
The control unit is configured to control the operation of the nozzle block drive unit 40 based on the position of.

FIG. 9 is a schematic plan view of the second embodiment of the substrate edge cleaning device according to the present invention, in which the screw shafts are parallel to the respective sides of the rectangular substrate 1 placed on the substrate holding means 2. 43 is rotatably provided, and the support arms 13 are screwed to the respective screw shafts 43 ...

The electric motor 16a is interlocked with a predetermined one of the screw shafts 43 ...
Two screw shafts 43, 43 are interlockingly connected with each other via a bevel gear mechanism 44, and one screw shaft 43 among them is connected.
And the remaining one screw shaft 43 is different from the bevel gear mechanism 44.
The solvent discharge means 3 and the suction member 4 are integrally reciprocally moved by forward and reverse rotation of a single electric motor 16 to perform cleaning processing on the entire circumference of the edge of the rectangular substrate 1. It is configured so that it can be performed all at once.

In the first embodiment, the drive pulley 18, the idle pulley 19, ... And the wire 20 are used, and in the second embodiment, the screw shaft 43, and the bevel gear mechanism 44 are used. The four solvent discharging means 3 are collectively referred to as a linkage mechanism for moving integrally.

The present invention can also be applied to a substrate edge cleaning device which is provided with only the solvent discharging means 3 without having the suction member 4.

Further, in the above embodiment, the solvent is discharged onto both the front and back surfaces of the edge of the rectangular substrate, but for example, the solvent is supplied to the lower side of the rotatably held rectangular substrate 1. Then, while the back surface is being cleaned by the back surface cleaning type spin coating device configured to dissolve and remove the thin film formed around the back surface of the square substrate 1, the square substrate 1 on which the thin film is formed by spin coating is formed. On the other hand, the solvent may be discharged only to the front surface side of the edge of the rectangular substrate 1, or the solvent may be discharged only to the back surface side of the edge of the rectangular substrate 1 to cause the surface side by surface tension. The present invention may be configured so that the solvent is discharged to at least one of the front and back surfaces of the edge of the rectangular substrate 1, for example, by wrapping the solvent around.

[0053]

As is apparent from the above description, according to the substrate edge cleaning device of the first aspect of the invention, the single drive mechanism and the four solvent discharging means are interlocked via the linkage mechanism. By simply connecting, the drive mechanism is driven to clean the edges of the four sides of the rectangular substrate placed and held on the substrate holding means all at once. For example, the drive mechanism is interlockingly connected to each solvent ejecting means. Not only can the number of drive mechanisms be reduced compared to the case, but the installation space can also be made smaller, and for example, after cleaning one side, the square substrate is rotated 90 °,
Compared to the case of cleaning the next one side, it can be cleaned in less than 1/4 of the time, and it can be cleaned in less than 1/2 of the time of cleaning every two sides. While being able to do this, the entire circumference of the edge of the rectangular substrate can be efficiently cleaned in a short time.

According to the substrate edge cleaning device of the second aspect of the present invention, four solvent discharging means are provided on one wire wound around the drive pulley and the idle pulley which are rotated in the normal and reverse directions by the electric motor. Since the solvent discharging means provided in association with each of the four sides of the rectangular substrate are integrally moved along the edge of the rectangular substrate, a member having a width such as a belt is used. Compared with the case, the space of the drive system of the solvent discharge means can be made smaller, and the problem of dust generation can be suppressed as compared with the case where a felt belt is used.

Further, according to the substrate edge cleaning device of the third aspect of the present invention, the movement of all four solvent discharging means can be controlled only by controlling the movement position with respect to one solvent discharging means. , The control structure can be simplified.

[Brief description of drawings]

FIG. 1 is an overall schematic side view of a substrate edge cleaning device according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view of an entire partially cutout.

FIG. 3 is an enlarged side view of a main part.

FIG. 4 is an enlarged plan view of a main part.

FIG. 5 is a block diagram.

FIG. 6 is a time chart.

FIG. 7 is a flowchart.

FIG. 8 is a flowchart.

FIG. 9 is an overall schematic side view of a substrate edge cleaning device according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Rectangular substrate 2 ... Substrate holding means 3 ... Solvent discharge means 5 ... Substrate edge cleaning device 16 ... Electric motor as a drive mechanism 18 ... Drive pulley 19 ... Idling pulley 20 ... Wire 21 ... Nozzle block origin detection sensor

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location B08B 11/04 2119-3B G03F 1/08 X 7369-2H

Claims (3)

[Claims] 1. A substrate holding means for placing and holding a rectangular substrate having a thin film formed on its surface, and a solvent on at least one of both front and back surfaces of an edge of the rectangular substrate held by the substrate holding means. Is a substrate edge cleaning device provided with a solvent discharge means for discharging an unnecessary thin film, wherein the solvent discharge means has an edge for each of the four sides of the rectangular substrate held by the substrate holding means. The four solvent discharging means are provided so as to be movable along an edge, and the four solvent discharging means are integrally and movably interlocked with each other via a linkage mechanism, and the four solvent discharging means are integrated with the linkage mechanism. A substrate edge cleaning device, characterized in that a single drive mechanism for moving the substrate is provided. 2. The linkage mechanism according to claim 1, wherein the linkage mechanism is wound in a loop shape along the outer peripheral edge of the rectangular substrate held by the substrate holding means across one drive pulley and an idle pulley. Substrate edge cleaning device, which is a wire and the drive mechanism is a single electric motor capable of forward and reverse rotation, which is interlocked with the drive pulley. 3. A moving position detecting means for detecting a moving position of one of the four solvent discharging means according to claim 1 or 2, is provided, and based on a detection result by the moving position detecting means. A substrate edge cleaning device equipped with a control means for controlling a drive mechanism.