JPH06302707A - Method and apparatus for installing cap with dowel - Google Patents

Abstract

PURPOSE:To reduce a bending stress at the time of putting on a cap with a dowel. CONSTITUTION:Dowel holes 8 and 10 are formed on cap mounting pieces 5 and 6 of a hybrid IC product body 1, and dowels 7 and 9 are formed protruding inside both sides of a cap 2 to be put on the product body 1. A cap guide 21 provided on the cap fitting position of the first process has a suction head 24 which sucks and holds the top of the cap 2 and, further, has a pusher 23 which can press hold the upper edge of one side of the cap on the dowel 7 side. At the cap fitting position of the second process, a pusher 25 which can press hold the upper edge of the other side of the cap on the dowel 9 side is provided. Consequently, by putting the cap on for each dowel on one side and for each dowel hole of the product body, one by one, a bending stress working on the product body at the time of fitting the cap can be reduced, thus preventing cracks from occurring on the product body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for mounting a cap with a dowel in a product having a fitting structure with a dowel and a dowel engaging portion. For example, it is used for mounting the cap with a dowel on a main body in a hybrid IC. And about effective technology.

[0002]

2. Description of the Related Art As a conventional hybrid IC, there is one in which a package is constructed by mounting a cap on a main body on which an IC chip or the like is mounted. In this hybrid IC, the main body and the cap are fixed by inserting the dowels formed on the inner side surfaces of both side walls of the cap into the dowel holes as the dowel engaging portions formed on the side wall on the main body side. Is done by.

As a conventional method of mounting the cap, the upper surface of the cap is sucked and held by a cap guide, the cap guide is vertically lowered, the cap is put on the main body, and the dowel is fitted in the dowel hole. Then, the method in which the suction of the cap of the cap guide is released and only the cap guide is raised is adopted.

An example of a hybrid IC with a cap is "IC" issued by the Industrial Research Institute Co., Ltd.
Packaging Technology ", published April 15, 1982, P249-2
There is 51.

[0005]

However, in the above-described conventional method of mounting the cap with dowel, when the cap is put on the main body and the dowel is fitted into the dowel hole, it is formed on both side walls of the cap. Since the dowels on both sides of the main body push the inner walls of the main body inward, bending stress is applied inward in the radial direction to the ceramic substrate of the main body, so that cracks occur in the ceramic substrate on which the IC chip of the main body is mounted. It was likely to occur.

An object of the present invention is to provide a mounting technique for a cap with dowel which can reduce bending stress when the cap with dowel is mounted.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, the caps with dowels to be mounted by fitting the caps having the dowels formed on the inner surfaces of the opposite side surface parts into the main body having the dowel engaging parts, respectively. In the mounting method described above, the dowel on one side surface of the cap is fitted into the dowel engaging recess formed on the main body, and then the dowel on the other side surface of the cap is attached to another dowel formed on the main body. It is characterized in that it is fitted into the engaging recess.

[0010]

According to the above-described means, first, the dowel on one side surface of the cap is fitted into the dowel engaging portion of the main body, so that bending stress due to the dowel does not act on the main body. At this time, the cap is slanted over the main body.

Next, fitting of the dowel on the other side surface of the cap to the dowel engaging portion is performed. At this time, since the fitting between the dowel and the tab engaging portion on the other side has been completed,
The bending stress generated in the main body due to the fitting of the other dowel of the cap and the dowel engaging portion is reduced as compared with the conventional case where both dowels are inserted at the same time. Therefore, the cap insertion pressure can also be reduced. As a result, it is possible to prevent damage to the components housed in the main body.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a method of mounting a cap with dowel which is an embodiment of the present invention. FIG. 1 (a) is a vertical sectional view showing a state in which the cap is placed on the product body in the first step. , (B) is a longitudinal sectional view showing a state in which the cap is pressed by the pusher from the state of (a) and the dowel on one side is inserted into the dowel hole on one side of the product body in the first step,
(C) is a longitudinal sectional view showing a state in which the cap is pressed by the pusher and the other dowel of the cap is inserted into the other dowel hole of the product body in the second step. 2A is a perspective view showing a cap guide, FIG. 2B is a cap, and FIG.

In this embodiment, the method for mounting the cap with dowel according to the present invention is used for assembling the hybrid IC package.

That is, the hybrid IC as a work in the present embodiment is configured by mounting the cap 2 on the product body 1 to form a package. The product body 1 has a header 3 made of a metal plate such as copper. The header 3 has a rectangular plate portion on which the ceramic substrate 4 is arranged and fixed, and the first cap attachment piece 5 and the second cap attachment piece 6 are formed so as to stand vertically on both sides of the long side thereof. There is.

The first cap attachment piece 5 is formed over the entire length of the long side of the rectangular plate portion, and has a first dowel hole 8 as an engaging recess into which the first dowel 7 of the cap 2 is inserted.
The individual pieces are formed at intervals in the longitudinal direction. A pair of second cap attachment pieces 6 are formed at intervals along the long side of the rectangular plate portion, and each has a second dowel hole 10 as an engaging recess into which the second dowel 9 of the cap 2 is inserted. Each one is formed.

The first and second mounting pieces 11 and 12 of the hybrid IC are respectively formed on both sides of the short side of the rectangular plate portion so as to horizontally project outward, and the pair of long sides are formed. A third mounting piece 13 of the hybrid IC is also formed between the second cap mounting pieces 6 and 6 so as to horizontally project outward. Mounting holes 14, 15, and 16 are formed in the mounting pieces 11, 12, and 13, respectively.

On the rectangular plate portion of the header 3, a ceramic substrate 4 having substantially the same shape and size as the rectangular plate portion is arranged and fixed. On this ceramic substrate 4, an IC chip 17 is mounted in a recess 4a formed on the upper surface, and an electric component 18 such as a capacitor is mounted on the upper surface. In addition,
The IC chip 17 and the electric part 18 mounted on the ceramic substrate 4 are electrically connected by the wiring formed on the ceramic substrate 4, but the wiring is not shown.

A plurality of outer leads 19 for extracting an electric signal from the IC chip 17 and the like to the outside are drawn out from the upper end portion of the ceramic substrate 4 to the outside. These outer leads 19 are formed by using a conductive metal material such as copper, and one end of the outer leads 19 is arranged at the end of the upper surface of the ceramic substrate 4 on which the pair of second cap attachment pieces 6, 6 are arranged. It is fixed. Each outer lead 19 has an end fixed to the upper surface of the ceramic substrate 4 extended along the end faces of the ceramic substrate 4 and the header 3, and further horizontally extends outward.

The cap 2 is formed as a flat rectangular parallelepiped box having a size that fits into the product body 1, and has a lower surface, which is one main surface, open. The cap 2 is formed in a rectangular shape in a plan view, and a first side surface, which is one side surface on the long side, is formed in a substantially rectangular shape as the first cap attachment piece 5 of the main body 1. A pair of first dowels 7 fitted into the first dowel holes 8 formed in the cap attachment piece 5 of the product body 1 are formed on the inner surface of the side surface on the long side side so as to respectively project inward.

The other side surface on the long side of the cap 2 is formed with a pair of mounting pieces 20 projecting downward and a part of which is cut out at a position aligned with the second cap mounting pieces 6, 6 of the product body 1. Has been done. On the inner surface of the pair of mounting pieces 20, 20, the second is formed on the cap mounting piece 6 of the product body 1.
The second dowels 9 inserted into the dowel holes 10 are formed so as to project inward.

Hybrid IC constructed as described above
The method for mounting the cap with the dowel with the hybrid IC, which is an embodiment of the present invention, used when assembling the package, is carried out by the cap mounting device with the cap for the hybrid IC, which is an embodiment of the present invention.

That is, this dowel cap mounting device is provided with a cap guide 21. The cap guide 21 is formed into a flat rectangular parallelepiped box having a size that fits into the cap 2, and the lower surface, which is one main surface, is open. A pusher hole 22 is formed so as to penetrate in the vertical direction at a central position of an end portion of the upper surface of the cap 2 that is closer to one long side. A pusher 23 formed of a rod is inserted through the pusher hole 22 so as to be vertically movable. This pusher 23 has hydraulic pressure, pneumatic pressure,
Alternatively, the cap 2 is configured to be pressed downward by a driving means (not shown) such as a cam so as to press the upper end portion of the cap 2 near one long side.

A pair of suction heads 24 are fixedly mounted on the upper wall of the cap guide 21. The suction heads 24 are vertically inserted through the long sides at substantially the center of the short sides and are spaced from each other. . The lower suction surfaces of the suction heads 24, 24 are arranged at substantially the same height as the lower end surface of the cap guide 21. The suction head 24 is connected to a vacuum source (not shown), and the suction surface is configured to suction-hold the upper surface of the cap 2.

In the present embodiment, the method of mounting the cap with dowel comprises the first step and the second step, so that the cap guide 21 is installed at the cap mounting position in the first step. Then, in the cap mounting position in the second step, the product body 1 in the first step
A second pusher 25 capable of pressing the upper end portion on the other end side of the cap 2 having one side fitted therein is provided. Second
The pusher 25 is configured to be pressed downward by a driving means such as hydraulic pressure, pneumatic pressure, or a cam so that the upper surface of the cap 2 can be pressed.

Next, a method for mounting a cap with a dowel on a hybrid IC according to an embodiment of the present invention will be described when a device for mounting a cap with a dowel on the hybrid IC according to the above configuration is used.

First, in the first step, the product body 1 is conveyed to the cap mounting position and stopped there. A cap guide 21 is provided at the cap mounting position so as to be movable in the vertical direction. The upper surface of the cap 2 is sucked and held by the suction surface of the suction head 24 of the cap guide 21 and is lowered, and as shown in FIG. 1A, it is put on the product main body 1 and stopped.

Next, as shown in FIG. 1 (b),
The pusher 23 is lowered and presses the upper end portion of the cap 2, so that the first dowel 7 on one side of the cap 2 is inserted into the second dowel hole 8 on one side of the product body 1. In the resulting state, the cap 2 is fitted into the product body 1 in an oblique posture.

When the cap 2 is inserted on one side, the first dowel 7 is inserted into the first dowel hole 8 without pressing the first cap attachment piece 5 of the product body 1, so that the first dowel of the product body 1 is inserted. It is avoided that the cap attachment piece 5 is pushed inward when the first dowel 7 is inserted into the first dowel hole 8. Therefore, it is possible to prevent cracks from being generated in the ceramic substrate 4.

Subsequently, the cap guide 21 is raised and separated from the cap 2 obliquely covered by the main body 21.

Next, the assembly in which one side of the cap 2 is fitted into the product body 1 in the first step is conveyed to the next second step and stopped at the cap mounting position. In this state, the second pusher 25 is lowered, and the upper end portion on the side where the cap 2 is not fitted is pressed. By the pressing by the second pusher 25, the other second dowel 9 of the cap 2 becomes the other second dowel hole 1 of the product body 1.
Inserted at 0.

At this time, since the fitting of the first dowel 7 on one side has been completed, the bending stress generated on the second cap mounting piece 6 of the product body 1 by the second dowel 9 on the other side of the cap 2 is the same as the conventional one. As compared with the case where the first dowels 7 and the second dowels 9 on both sides are simultaneously inserted as described above,
The insertion pressure of the cap 2 can also be reduced. That is, the second cap attachment piece 6 is the second dowel hole 1 of the second dowel 9.
The amount pushed down inward by fitting to 0 is reduced. Therefore, it is possible to prevent cracks from being generated in the ceramic substrate 4.

According to the above-mentioned embodiment, the following effects can be obtained. The cap 2 having the dowels 7 and 9 formed on both side surfaces is fitted to the product body 1 so that the cap 2 is fitted to the product body 1 when the dowel is inserted.
Since it is possible to reduce the bending stress that occurs, it is possible to prevent cracks from occurring in the ceramic substrate 4 arranged and fixed on the upper surface of the header 3 of the product body 1.

The cap 2 having the dowels 7 and 9 formed on both sides is fitted to the product body 1 with the cap 2 addressed to one side, whereby bending of the cap attachment pieces 5 and 6 in the product body 1 is reduced when the dowel is inserted. Therefore, the cap 2 and the cap mounting pieces 5 and 6 of the product body 1 are fitted to each other with certainty.

FIG. 3 is a perspective view showing a cap guide in a dowel cap mounting apparatus according to a second embodiment of the present invention.

In the first embodiment, the cap mounting method has the first step and the second step carried out at different positions. However, in the second embodiment, the cap mounting method is structured so that it can be carried out at the same position. There is.

That is, in the first embodiment, only one first pusher 23 that presses one end of the upper surface of the cap 2 is inserted into the cap guide 21, but in the second embodiment, the cap is inserted. The first pusher 23 and the second pusher 25A are inserted through the guide 21A. That is, on the upper wall of the cap guide 21A,
Similar to the first embodiment, one first pusher 23 capable of pressing the upper surface end portion of one side of the cap 2 on the side of the first dowel 7 is inserted, and the other side of the second dowel 9 of the cap 2 is attached. This means that another second pusher 25A that can press the upper end portion is inserted.

Therefore, in the second embodiment, as in the first embodiment, one side of the cap 2 is fitted into the product body 1 by the first pusher 23 on one side, and then the second one on the other side. The pusher 25A is lowered and the cap 2
The cap 2 is attached to the product main body 1 by pressing the upper end portion of the non-fitted side.

According to the second embodiment, since the mounting of the cap 2 is completed at the same place, the productivity becomes better than that of the first embodiment.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the cap guide may be omitted in some cases.

The dowel engaging portion is not limited to the dowel hole, but may be a dowel hole or a dowel recess.

In the above description, the case where the invention made by the present inventor is mainly applied to the assembly work of the package of the hybrid IC which is the background field of application has been described, but the present invention is not limited to this. The present invention can be applied to general mounting technology of a cap and a main body having a fitting structure of a dowel and a dowel engaging portion, such as a semiconductor device, an electronic component, and a package in an electronic device.

[0043]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

A method of mounting a cap with dowels, in which caps having dowels formed on the inner surfaces of opposing side surfaces are mounted by inserting the dowels into the body having dowel engaging portions. In, the dowel on one side surface of the cap is fitted into the dowel engaging recess formed on the main body, and then the dowel on the other side surface of the cap is inserted into another dowel engaging recess formed on the main body. By inserting it into the inside, it is possible to reduce the bending stress generated in the main body due to the dowel when the cap is inserted,
It is possible to prevent the main body from cracking.

[Brief description of drawings]

FIG. 1 shows a method of mounting a cap with dowel, which is an embodiment of the present invention, in which (a) is a vertical cross-sectional view showing a state in which the cap is arranged on the product body in the first step,
(B) is a longitudinal cross-sectional view showing a state in which the cap is pressed by the pusher from the state of (a) and the dowel on one side is inserted into the dowel hole on the one side of the product body in the first step, (b).
FIG. 7B is a vertical cross-sectional view showing a state in which the cap is pressed by the pusher and the other dowel of the cap is inserted into the other dowel hole of the product body in the second step.

2A is a cap guide, FIG. 2B is a cap,
(C) is each perspective view showing a product main body, respectively.

FIG. 3 is a perspective view showing a cap guide according to another embodiment 2 of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Product main body, 2 ... Cap, 3 ... Header, 4 ... Ceramic substrate, 4a ... Recess, 5,6 ... Cap mounting piece, 7,
9 ... Dowel, 8, 10 ... Dowel hole (dowel engaging portion), 11, 1
2, 13 ... IC mounting piece, 14, 15, 16 ... Mounting hole, 1
Reference numeral 7 ... IC chip, 18 ... Components such as capacitor, 19 ... Outer lead, 20 ... Mounting piece, 21, 21A ... Cap guide, 22 ... Pusher hole, 23, 25, 25A ... Pusher, 24 ... Suction head.

Claims (3)

[Claims] 1. A dowel engaging portion is fitted into a main body having a dowel engaging portion with caps each having a dowel formed on an inner surface of an opposing side surface portion.
In the method of mounting the cap with dowel, the dowel on one side surface of the cap is fitted into the dowel engaging recess formed on the main body, and then the dowel on the other side surface of the cap is formed on the main body. The method of mounting a cap with dowel, characterized in that the cap is fitted in another dowel engaging recess. 2. A dowel engaging portion is fitted into a main body having a dowel engaging portion with caps having dowels formed on the inner surfaces of opposite side surface portions, respectively.
In a mounting device for a cap with dowels to be mounted, a suction head for sucking and holding an upper surface of the cap, each of which has a dowel formed on an inner surface of a side surface facing each other, and an upper end portion of one side of the cap on the dowel side is the main body. A mounting device for a cap with dowel, comprising a pusher capable of pressing in a direction and a pusher capable of pressing the other upper end of the cap on the dowel side in the direction of the main body. 3. The dowel cap mounting device according to claim 2, further comprising a cap guide provided with the suction head and one pusher.