JPH06299391A - Resin product subjected to partial plating - Google Patents

Abstract

PURPOSE:To prevent 'blossoming' in the corner parts of boundary parts between the parts on the surface of a base material where plating is required and the parts where plating is not required by forming these boundary parts to an arc shape having a specific radius of curvature at the time of forming line grooves having an approximately V shape in section in the boundary parts. CONSTITUTION:The line grooves 5 having the approximately V shape in section are formed to a T shape in the boundary line parts between the parts of an approximately disk-shaped mark plate body 3 made of a resin where the plating is applied and the parts where the plating is not applied. Electroless plating layers 6 are formed exclusive of the bottoms 5a of the line grooves 5 when this mark plate body 3 is subjected to electroless plating. The electroless plating layers 6 of the parts where the plating is not required dissolve and the plating layers 4 consisting of the electroless plating layers 6 and electroplating layers 6 are formed only in the parts where the plating is required when only the parts where the plating is required is subjected to electroplating. The sectional shape of the boundary parts of the line grooves 5 and the surface of the mark plate body 3 are formed to the arc shape of >=0.2mm radius of curvature at this time. As a result, the generation of the 'blossoming' in the electroplating layers 7 is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin product in which a portion of the surface of a resin base material that requires plating is partially plated.

[0002]

2. Description of the Related Art Conventionally, as this type of technique, for example, Japanese Patent Laid-Open Nos. 55-152195 and 52-5093.
The one proposed in Japanese Patent Publication No. 7 is known. In these techniques, as shown in FIG.
Part of the surface that requires plating (left side of the figure)
And a groove 22 having a substantially V-shaped cross section is formed at a boundary line between the groove and a portion not requiring plating (right side in the drawing). Then, the base material 21 is first subjected to electroless plating.
At this time, the plating solution does not reach the bottom portion 22a of the groove 22 because the gap is narrow. Therefore, the bottom 22a is not plated. In other words, the electroless plating layer 23 is formed on all parts except the bottom part 22a.

Next, as shown in FIG. 12, the base material 21 on which the electroless plating layer 23 is formed is subjected to electroplating. That is, the base material 21 is immersed in a predetermined electroplating solution,
The portion requiring plating is electrically connected. Then, the electroless plating layer 23 formed in the portion that does not require plating is dissolved by the electroplating solution. Also,
The electroless plating layer 2 is used in the portion requiring plating.
An electroplating layer 24 is formed on the surface of No. 3. In this way, the electroless plating layer 23 and the electroplating layer 24 are formed on the base material 21 only in the portions that require plating. In other words, the so-called partially plated resin product 25 is obtained through the above steps.

[0004]

However, in the above-mentioned prior art, only the groove 22 having a substantially V-shaped cross section is formed on the surface of the base material 21. For this reason, the boundary portion between the groove 22 and the portion of the base material 21 that requires plating has a sharp corner 26 at the tip. Therefore, when electroless plating and electroplating were actually performed, as shown in FIG. 13, the electroplating layer 24 was particularly likely to be deposited on the corner portion 26. As a result, there is a possibility that a so-called “flower bloom phenomenon” may occur in which the electroplating layer 24 is diffused and formed in the corner portion 26. In this case, the parting line of the plated portion becomes unclear, and the appearance quality may be deteriorated. Further, when the electroplating layer 24 reaches a portion that does not require plating in a bridging manner, the electroplating layer 24 may be formed even in that portion.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to coat unnecessary portions and to improve the appearance quality. To provide plated resin products.

[0006]

In order to achieve the above object, in the present invention, in the surface of a resin base material, a boundary line between a portion requiring plating and a portion not requiring plating is provided. A groove having a V-shaped cross section is formed in an annular shape, electroless plating is performed on the base material, and then electroplating is performed on a portion requiring plating, and plating is required on the surface of the base material. A resin product in which only the portion to be subjected to partial plating is applied, and the cross-sectional shape of the boundary portion between the groove and the portion of the surface of the base material requiring plating has a curvature radius of 0.2 mm.
The gist of the above is to form the arc shape.

If the radius of curvature is less than 0.2 mm, the object of the present invention may not be achieved.

[0008]

According to the above structure, a groove having a substantially V-shaped cross section is formed in the boundary line between the portion requiring plating and the portion not requiring plating on the surface of the resin base material. To be done. Then, electroless plating is performed on the base material. At this time, since the plating solution does not reach the bottom of the groove, electroless plating is performed on the portion other than the bottom. After that, electroplating is applied to a portion requiring plating.
At this time, the electroless plating in the portion which does not require plating is dissolved by the plating solution. Then, the electroless plating is applied only to the portion requiring the plating, and then the electroplating is applied.

At this time, the cross-sectional shape of the boundary portion between the groove and the portion of the surface of the base material which requires plating is formed in an arc shape having a radius of curvature of 0.2 mm or more. Therefore, the electroplating is not concentrated and deposited on this boundary portion, and the plating layer is not diffused and formed in this portion. Therefore, the partial plating is performed only on the portion that definitely needs the plating. In addition, the parting portion of the plating layer is clearly formed in appearance.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment embodying the present invention will now be described with reference to FIGS.
It will be described based on 5. As shown in FIGS. 2 and 3, a mark plate 2 as a resin product is attached to a predetermined portion of an automobile. On the surface of the mark plate 2, a mark 1 in the shape of the letter "T" is formed. The mark plate 2 has a substantially disc shape,
A mark plate body 3 as a base material made of ABS resin,
It is composed of a partially formed plating layer 4 (a portion other than the mesh pattern in FIG. 2). That is, as shown in FIGS. 1 to 3, on the surface of the mark 1, three annular grooves 5 having a substantially V-shaped cross section are formed in order to form a letter “T”. . The part surrounded by these groove 5 (Fig. 2
The plating layer 4 is formed in a portion other than the (mesh pattern portion).

The plating layer 4 comprises an electroless plating layer 6 and an electroplating layer 7. In the present embodiment, the electroless plating layer 6 is made of nickel and has a thickness of "0.3-0.
The thickness is about 4 μm ”. Also, the electroplating layer 7
Is formed of three kinds of metals such as copper, nickel and chromium to a thickness of about 20 to 50 μm, and has a multilayer structure.

The width W of the groove 5 is "0.5 m".
m ”and the depth D are formed to be“ 0.5 mm ”. However, the width W is not particularly limited, but is preferably "0.2 mm" or more due to processing restrictions, and is preferably "1.0 mm" or less in order to improve the designability. The depth D is also not particularly limited, but is preferably "0.2 mm" or more due to the processing limitation, and "0.6 mm" due to the strength limitation of the mark plate body 3.
The following are preferred. Further, the ratio of the depth D to the width W (D /
W) is preferably "1.0" or more.

Further, in this embodiment, the cross-sectional shape of the boundary portion between the groove 5 and the surface of the mark plate body 3 is formed in a curved shape. More specifically, the cross-sectional shape of the boundary portion is formed in an arc shape having a curvature radius of “0.2 mm or more” (“0.3 mm” in this embodiment). The groove 5 is formed at the same time when the mark plate body 3 is molded by a mold.

Next, the operation and effect of manufacturing the mark plate 2 described above, that is, when performing partial plating will be described. First, as shown in FIG. 4, the mark plate body 3 having the groove 5 as described above is formed by a known mold forming method. Then, as shown in FIG. 5, the mark plate body 3 is immersed in an electroless plating solution to perform electroless plating. At this time, the plating solution does not reach the bottom 5a of the groove 5 because the gap is narrow. Therefore, the bottom portion 5a is not plated. In other words, the bottom portion 5 of the surface of the mark plate body 3
The electroless plating layer 6 is formed on all parts except a.

Next, as shown in FIG. 1, the mark plate body 3 having the electroless plating layer 6 formed thereon is subjected to electroplating. That is, the main body 3 is dipped in a predetermined electroplating solution a plurality of times, and a portion requiring plating (a tip side portion of the mark 1) is electrically connected. Then,
The electroless plating layer 6 formed in the portion that does not require plating is dissolved by the electroplating solution. Further, the electroplating layer 7 having the above-described multilayer structure is formed on the surface of the electroless plating layer 6 in the portion requiring plating (on the left side of the figure). In this way, the mark plate 2 on which the electroless plating layer 6 and the electroplating layer 7 are formed is formed only on the tip side portion of the mark 1.

At this time, the cross-sectional shape of the boundary between the groove 5 and the mark plate body 3 has a radius of curvature of 0.2 m.
It is formed in an arc shape of "m or more". Therefore, the electroplating layer 7 is not concentrated and deposited on this boundary portion, and the electroplating layer 7 is not diffused and formed in this portion. As a result, the partial plating can be surely performed only in the necessary place.

Further, the "flowering phenomenon" as in the prior art does not occur, and the parting portion of the plating layer 4 is clearly formed in appearance. As a result, the parting line of the plating layer 4 can be made clear and clear, and the appearance quality can be remarkably improved.

The present invention is not limited to the above-described embodiments, but may be implemented as follows with a part of the configuration appropriately changed without departing from the spirit of the invention. (1) In the above-described embodiment, the boundary shape between the groove 5 and the mark plate body 3 has a curved cross-sectional shape at both the left and right boundary portions in FIG. 1, but as shown in FIG. The cross-sectional shape of only the boundary portion (left side portion) between the groove 8 in the portion requiring partial plating and the mark plate body 9 may be curved.

Further, as shown in FIG. 7, it is also possible to use a mark plate main body 11 having a shape in which all the cross-sectional shapes of the groove 10 are arcuate and having no linear portion. Further, as shown in FIG. 8, a mark plate body 13 having a step between the portion where the plating layer 4 is formed and the portion where the plating layer 4 is not formed may be used with the groove 12 as a boundary.

In addition, as shown in FIG. 9, a mark plate body 15 having a groove 14 at the midpoint of the slope may be used. In addition, as shown in FIG.
You may use the mark plate main body 17 which has in the corner part of 8.

(2) In the above embodiment, the present invention is embodied in the disc-shaped mark plate 2, but the mark plate 2
Does not have to be disk-shaped. Further, although the present invention has been embodied in the above embodiment in which the surface of the mark 1 is shaped like a letter "T", the shape of the portion to be plated is not particularly limited. In other words, the plated portion may have any shape as long as the groove 5 is formed in an annular shape.

(3) In the above embodiment, the mark plate 2 is embodied as a resin product. However, in addition to the mark plate 2, various resins such as a front grill, an outer panel for a door mirror bracket, a back panel, a louver, a pillar garnish, a quarter vent, etc. It can also be embodied in a product. Further, the resin material constituting these base materials is not limited to ABS, and polypropylene, polyphenine oxide,
Various resin materials such as polyamide, polysulfone, and polyester may be used.

(4) In the above embodiment, the electroless plating layer 6
Although it is formed of nickel, it may be formed of copper or the like. Further, in the above embodiment, the electroplating layer 7
Was formed of three kinds of metals such as copper, nickel and chromium so as to form a multi-layer structure. However, a metal other than these may be used, or may be embodied when the multi-layer structure is not formed.

[0024]

As described above in detail, according to the partially plated resin product of the present invention, it is possible to surely perform the partial plating only on a necessary portion, and to improve the appearance quality. It has an excellent effect that it can be done.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a partially plated mark plate according to an embodiment of the present invention.

FIG. 2 is a plan view schematically showing a mark plate in one embodiment.

FIG. 3 is a sectional view taken along line AA of FIG. 2 in one embodiment.

FIG. 4 is a cross-sectional view of essential parts showing a mark plate body in one embodiment.

FIG. 5 is a cross-sectional view of essential parts showing a state in which electroless plating is applied to the mark plate body in one embodiment.

FIG. 6 is a cross-sectional view showing the main parts of a partially plated mark plate according to another embodiment.

FIG. 7 is a cross-sectional view showing a main part of a partially plated mark plate according to another embodiment.

FIG. 8 is a cross-sectional view showing a main part of a partially plated mark plate according to another embodiment.

FIG. 9 is a cross-sectional view showing the main parts of a partially plated mark plate according to another embodiment.

FIG. 10 is a cross-sectional view showing the main parts of a partially plated mark plate according to another embodiment.

FIG. 11 is a cross-sectional view showing a main part of a resin product that is partially plated according to a conventional technique.

FIG. 12 is a partial cross-sectional view showing a state in which electroless plating is applied on a base material in the conventional technique.

FIG. 13 is a partial cross-sectional view showing the occurrence of a problem in the conventional technique.

[Explanation of symbols]

3, 9, 11, 13, 15, 17 ... Mark plate body as a base material, 5, 8, 10, 12, 14, 16 ... Strip grooves.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naruyuki Takahashi No. 1 Nagahata, Ochiai, Kasuga-cho, Nishikasugai-gun, Aichi Toyoda Gosei Co., Ltd. Address: Toyoda Gosei Co., Ltd.

Claims (1)

[Claims] 1. A resin base material (3, 9, 11, 13, 1)
5, 17), a groove having a substantially V-shaped cross section (5, 8, 10, 12, 14, 16) at the boundary between the portion requiring plating and the portion not requiring plating. To form a ring, and the base material (3, 9, 11, 13, 15, 17)
After electroless plating on the base material, electroplating is performed on a portion requiring plating, and the base material (3, 9, 11, 13,
15 and 17) is a resin product in which the plating is performed only on a portion requiring plating, and the groove (5, 8, 10, 12, 14, 16) and the base material ( 3,9,11,13,15,17) of the partial plating characterized in that the cross-sectional shape of the boundary portion with the portion requiring plating of the surface is formed in an arc shape with a radius of curvature of 0.2 mm or more. The applied resin product.