JPH0629395A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce a chip size, by providing an additional power connecting wiring as well as a power connecting wiring between first and second power wirings. CONSTITUTION:First power wirings 1 and 2 are provided around an inner circuit block 9 in a semiconductor chip. On the other hand, second power wirings 3 and 4 are provided on an outer circuit block 10 formed at a peripheral part of the first power wirings 1 and 2 so that the second power wirings 3 and 4 are formed around the first power wirings 1 and 2. Power connecting wirings 5 and 6 for supplying power to the first and second power wirings (1, 2) and (3, 4) is connected to a power-supply pad 11 formed at a peripheral part of the outer circuit block 10. Moreover, additional power connecting wirings 7 and 8 in a region other than the power connecting wirings 5 and 6 are provided to connect the first power wirings (1, 2) with the second power wirings (3, 4). Consequently, the wiring width of the first power wirings 1 and 2 for supplying power to the inner circuit block 9 with high power consumption can be reduced, and the chip size can be made small.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to power supply wiring on a semiconductor chip.

[0002]

2. Description of the Related Art A conventional semiconductor integrated circuit device, as shown in FIG. 2, has an internal circuit block 9 provided on a semiconductor chip.
The first power supply wirings 1 and 2 provided around the
Is for V _DD , the power supply wiring 2 is for GND), the external circuit block 10 is provided on the outer periphery of the first power supply wirings 1, 2, and the first power supply wirings 1, 2 provided on the external circuit block 10. The second power supply wirings 3 and 4 provided on the outer periphery of the
ND, power supply wiring 4 is for V _DD ) and external circuit block 1
The power supply pad 11 for V _DD and the power supply pad 12 for GND provided on the outer periphery of 0 are connected to the first power supply wirings 1 and 2 and the second power supply wirings 3 and 4 for V _DD and GND, respectively. Power supply connection wirings 5 and 6 for connection are provided. Here, the power supply connection wirings 5, 6 are connected to the first and second power supply wirings 1, 2, 3, 4 through the contact holes 14,
A power supply pad 11, 1 is provided on the outer periphery of the external circuit block 10.
In addition to 2, pad 15 for signals and empty pad 16 connected to external circuit block 10 are arranged.

By electrically separating the first power supply wirings 1 and 2 from the second power supply wirings 3 and 4, the internal circuit block 9 and the external circuit block 10 are driven by different power supplies. You can also

[0004]

In this conventional semiconductor integrated circuit device, the first power source wiring and the second power source wiring are connected by the power source connecting wiring to drive the internal circuit block and the external circuit block at a common potential. Therefore, it is necessary to widen the wiring width in order to increase the current capacity of the first power supply wiring that supplies power to the internal block that consumes a large amount of power, and there is a problem that the chip size becomes large.

[0005]

A semiconductor integrated circuit device according to the present invention comprises an internal circuit block provided on a semiconductor chip,
A first power supply wiring provided around the internal circuit block, an external circuit block arranged on the outer periphery of the first power supply wiring, and a first power supply wiring provided on the external circuit block. For supplying power to the first and second power supply wirings by connecting to a second power supply wiring provided around the outer circumference of the power supply wiring and a power supply pad provided on the outer circumference of the external circuit block. Power supply connection wirings and additional power supply connection wirings that are provided in regions other than the power supply connection wirings and connect the first and second power supply wirings are provided.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a layout diagram showing an embodiment of the present invention.

As shown in FIG. 1, the internal circuit block 9 provided on the semiconductor chip and the first power supply wirings 1 and 2 provided around the internal circuit block 9 (however, the power supply wiring 1
Is for V _DD , the power supply wiring 2 is for GND), the external circuit block 10 is provided on the outer periphery of the first power supply wirings 1 and 2, and the first power supply wiring 1 is provided on the external circuit block 10. Two
The second power supply wirings 3 and 4 provided on the outer periphery of the
Is for GND, the power supply wiring 4 is for V _DD ), and the V _DD electrode pad 11 and GND provided on the outer periphery of the external circuit block 10.
For connecting the power supply pad 12 for power supply and the power supply pad 11 for V _DD to the first and second power supply wirings 1 and 4
A power supply connection wiring 5 and a power supply connection wire 12 for GND, which are connected via the contact hole 14 to the first and second power supply wirings 2 and 3;
The signal pad 15 provided on the outer periphery of the external circuit block 10 and connected to the external circuit block 10, the empty pad 16 not electrically connected to anywhere, and the empty pad 16 between the first and second power supply wirings Additional power supply connection wirings 17 and 18 connected through the contact holes 14 are provided.

By increasing the number of the additional power supply connection wires 7 and 8, the current capacity of the first power supply wire, that is, the wiring width can be further reduced, and the line width of the additional power supply connection wiring can be reduced. There are advantages.

[0010]

As described above, according to the present invention, an additional power supply connection wiring is provided in addition to the power supply connection wiring for connecting the first power supply wiring and the second power supply wiring to the internal circuit block consuming large power. The width of the first power supply line for supplying electric power can be reduced, and the chip size can be reduced.

[Brief description of drawings]

FIG. 1 is a layout diagram showing an embodiment of the present invention.

FIG. 2 is a layout diagram showing an example of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

1, 2 First power supply wiring 3, 4 Second power supply wiring 5, 6 Power supply connection wiring 7, 8 Additional power supply connection wiring 9 Internal circuit block 10 External circuit block 11 V _DD power supply pad 12 GND power supply pad 14 Contacts Hall 15 Signal pad 16 Empty pad

Claims (2)

[Claims] 1. An internal circuit block provided on a semiconductor chip, a first power supply wiring provided around the internal circuit block, and an external device arranged on the outer periphery of the first power supply wiring. A circuit block, a second power supply wiring provided on the external circuit block and surrounding the outer periphery of the first power supply wiring, and a power supply pad provided on the outer periphery of the external circuit block. A power supply connection wiring for supplying electric power to the first and second power supply wirings, and an additional power supply connection wiring provided in a region other than the power supply connection wiring and connecting the first and second power supply wirings. A semiconductor integrated circuit device characterized by comprising. 2. The semiconductor integrated circuit device according to claim 1, wherein the additional power supply connection wiring is arranged at a position of an empty pad provided on the outer periphery of the external circuit block.