JPH06291426A - Printed board assembly and electronic equipment having printed board assembly - Google Patents
Printed board assembly and electronic equipment having printed board assemblyInfo
- Publication number
- JPH06291426A JPH06291426A JP7382393A JP7382393A JPH06291426A JP H06291426 A JPH06291426 A JP H06291426A JP 7382393 A JP7382393 A JP 7382393A JP 7382393 A JP7382393 A JP 7382393A JP H06291426 A JPH06291426 A JP H06291426A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- surface side
- hole
- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ファクシミリ等の電
子機器に用いられているプリント基板アッセンブリ、特
にプリント基板アッセンブリの放熱板に関するものであ
り、プリント基板アッセンブリを備えた電子機器に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board assembly used in an electronic device such as a facsimile, and more particularly to a heat sink of the printed circuit board assembly, and more particularly to an electronic device provided with the printed circuit board assembly.
【０００２】[0002]
【従来の技術】従来から電子機器に用いられているプリ
ント基板は該プリント基板上に実装する電子部品の実装
密度を向上させると共に、プリント基板の小形化を図る
ために様々な実装方法が発明されている。2. Description of the Related Art Conventionally, printed circuit boards used in electronic equipment have been invented with various mounting methods in order to improve the mounting density of electronic parts mounted on the printed circuit boards and to miniaturize the printed circuit boards. ing.
【０００３】電子部品の実装方法には片面実装や両面実
装等があるが、ＬＥＤプリントヘッドに用いるプリント
基板のようにプリント基板の一面側にＬＥＤやドライバ
ＩＣ等の電子部品を実装する必要がある場合、表面側の
電子部品から複数突出した端子はプリント基板の表裏面
間に設けられたスルーホールを介して裏面側に導かれ、
裏面に形成されたパターン配線に接続される。つまり、
表面側にはパターン配線のための領域を必要とせず高密
度の電子部品実装を可能にしている。There are single-sided mounting and double-sided mounting methods for mounting electronic components, but it is necessary to mount electronic components such as LEDs and driver ICs on one surface side of a printed circuit board such as a printed circuit board used for an LED print head. In this case, a plurality of terminals protruding from the electronic components on the front surface side are guided to the rear surface side through through holes provided between the front and rear surfaces of the printed circuit board,
It is connected to the pattern wiring formed on the back surface. That is,
The surface side does not require an area for pattern wiring and enables high-density electronic component mounting.
【０００４】ここで、プリント基板上に実装された電子
部品の駆動によって発熱が起こる場合があり、その発熱
によって実装された電子部品の性能を著しく損なう場合
がある。特にＬＥＤプリントヘッドのように発熱量が多
い場合は、図７に示すように、プリント基板２０の裏面
全体に放熱板３０を設ける必要がある。Here, heat generation may occur due to the driving of the electronic components mounted on the printed circuit board, and the heat generation may significantly impair the performance of the electronic components mounted. Particularly when the amount of heat generated is large as in the LED print head, it is necessary to provide the heat dissipation plate 30 on the entire back surface of the printed circuit board 20, as shown in FIG. 7.
【０００５】また、放熱板３０を設けようとする場合、
放熱板３０はアルミなどの金属で形成されていることか
ら、プリント基板２０に設けられている配線パターンに
おける裏面側のパターン、特にスルーホール部２４と放
熱板３０とが短絡することを防止するために、プリント
基板２０と放熱板３０の間にゴム等の絶縁板１８が貼着
されている。When the heat sink 30 is to be provided,
Since the heat dissipation plate 30 is formed of a metal such as aluminum, it is possible to prevent the heat dissipation plate 30 from being short-circuited with the pattern on the back surface side of the wiring pattern provided on the printed circuit board 20, especially the through hole portion 24. An insulating plate 18 such as rubber is attached between the printed circuit board 20 and the heat dissipation plate 30.
【０００６】また、絶縁板１８の代りに、プリント基板
裏面側のソルダーレジストを配線パターンにおけるスル
ーホール部を覆うぐらいプリント基板の母材に塗布して
短絡を防止するものがある。Further, instead of the insulating plate 18, there is one in which a solder resist on the back surface side of the printed circuit board is applied to the base material of the printed circuit board so as to cover the through holes in the wiring pattern to prevent a short circuit.
【０００７】[0007]
【発明が解決しようとする課題】しかし、従来のプリン
ト基板アッセンブリは、ゴム等の絶縁板１８を必要とす
るため、プリント基板２０と放熱板３０との間に絶縁板
１８を挟み込む際、絶縁板１８がずれたり捩じれたりし
て組立性が悪いという問題点があり、また絶縁板１８を
挟み込む手間が煩雑であった。However, since the conventional printed circuit board assembly requires the insulating plate 18 made of rubber or the like, when the insulating plate 18 is sandwiched between the printed circuit board 20 and the heat radiating plate 30, the insulating plate 18 is sandwiched between them. There is a problem in that the assembling property is poor due to the displacement or twisting of the insulating plate 18, and the labor for sandwiching the insulating plate 18 is complicated.
【０００８】また、プリント基板の配線パターンにおけ
るスルーホール部が覆われるぐらいソルダーレジストを
塗布する場合には、ソルダーレジストを薄く塗った場
合、図５の左側に示すように、配線パターン２４の部分
で生じる気泡がはじけた際、配線パターンの一部２４１
が露出して短絡するおそれがあった。さらに、パターン
の一部が露出しないように、図６に示すようにソルダー
レジスト２２を厚く塗った場合には、スルーホール部２
４の部分でソルダーレジスト２２がはじけてクレータ状
の突起２２１ができ、放熱板との密着性が悪くなるとい
う問題があった。また、絶縁板に比べてソルダーレジス
トは、絶縁耐性が低いという問題点があった。When the solder resist is applied so as to cover the through holes in the wiring pattern of the printed circuit board, when the solder resist is applied thinly, as shown on the left side of FIG. Part of the wiring pattern 241 when the generated bubbles burst
Could be exposed and short-circuited. Further, when the solder resist 22 is thickly applied as shown in FIG. 6 so that a part of the pattern is not exposed, the through hole portion 2
There was a problem that the solder resist 22 popped off at the portion 4 to form a crater-shaped projection 221 and the adhesion to the heat sink deteriorated. Further, there is a problem that the solder resist has a lower insulation resistance than the insulating plate.
【０００９】そこで、本発明は、上記のような課題を解
消するためになされたものであって、絶縁板をプリント
基板と放熱板の間に設ける必要がなく、また、放熱板と
の密着性がよく、プリント基板のスルーホール部と放熱
板とが短絡することを防止し得る絶縁耐性の高いＬＥＤ
プリントヘッドを提供することを目的とする。Therefore, the present invention has been made to solve the above problems, and it is not necessary to provide an insulating plate between the printed circuit board and the heat dissipation plate, and the adhesion to the heat dissipation plate is good. LED having high insulation resistance capable of preventing short circuit between the through hole portion of the printed circuit board and the heat dissipation plate
It is intended to provide a printhead.
【００１０】[0010]
【課題を解決するための手段】本発明は、プリント基板
アッセンブリにおいて、電子部品を一面側に実装しかつ
他面側に設けられた配線パターンと一面側の配線パター
ンとを電気的に接続する所定位置に設けられたスルーホ
ール部を有するプリント基板と、前記プリント基板の電
子部品の実装されていない側に配置されかつプリント基
板のスルーホール部に臨む部分に凹部断面により形成さ
れた空間部を有する放熱板と、を備えることを特徴とす
るものであり、また、電子機器において、電子部品を一
面側に実装しかつ他面側に設けられた配線パターンと一
面側の配線パターンとを電気的に接続する所定位置に設
けられたスルーホール部を有するプリント基板と、前記
プリント基板の電子部品の実装されていない側に配置さ
れかつプリント基板のスルーホール部に臨む部分に凹部
断面により形成された空間部を有する放熱板と、を備え
るプリント基板アッセンブリを有することを特徴とする
ものである。SUMMARY OF THE INVENTION According to the present invention, in a printed circuit board assembly, an electronic component is mounted on one surface side, and a wiring pattern provided on the other surface side and a wiring pattern on the one surface side are electrically connected. A printed circuit board having a through hole portion provided at a position, and a space portion which is arranged on the side of the printed circuit board where the electronic component is not mounted and which faces the through hole portion of the printed circuit board and which is formed by a concave section. A heat sink is provided, and in an electronic device, an electronic component is mounted on one surface side and a wiring pattern provided on the other surface side and a wiring pattern on the one surface side are electrically connected to each other. A printed circuit board having a through hole provided at a predetermined position for connection, and a printed circuit board arranged on the side of the printed circuit board on which no electronic component is mounted. It is characterized in that it has a heat radiating plate having a space formed by the recess section in a portion facing the through-hole, the printed circuit board assembly comprising a.
【００１１】[0011]
【作用】本発明におけるプリント基板アッセンブリ及び
プリント基板アッセンブリを含む電子機器では、プリン
ト基板の電子部品が実装されていない側に放熱板が設け
られているが、該放熱板には、プリント基板のスルーホ
ール部に臨む部分に凹部断面により形成された空間部を
有するので、スルーホール部が放熱板に接触せず、スル
ーホール部と放熱板との短絡を防止するとともに、絶縁
耐性を高くすることができる。In the printed circuit board assembly and the electronic device including the printed circuit board assembly according to the present invention, the heat dissipation plate is provided on the side of the printed circuit board on which the electronic parts are not mounted. Since there is a space formed by the concave section in the portion facing the hole, the through hole does not come into contact with the heat sink, so that a short circuit between the through hole and the heat sink can be prevented and insulation resistance can be increased. it can.
【００１２】[0012]
【実施例】以下、この発明の一実施例を図を用いて説明
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１３】図１は、本発明に係るプリント基板アッセ
ンブリとしてのＬＥＤプリントヘッドを示す断面図であ
る。ＬＥＤプリントヘッド１０は、図１に示すように、
ＬＥＤチップ３２、ドライバーＩＣチップ３４等を上面
側に実装したプリント基板２０を有しており、プリント
基板２０の上には、カバー１２が配置され、該カバー１
２には、レンズ１５が設けられている。そして、プリン
ト基板２０には、配線パターンにおけるスルーホール部
２４が配設されており、該スルーホール部２４は、ドラ
イバーＩＣチップ３４等とワイヤボンディング接続され
ている。プリント基板２０に配設されたスルーホール部
２４を含む複数のスルーホール部は図面において紙面垂
直方向に縦状に配設されている。FIG. 1 is a sectional view showing an LED print head as a printed circuit board assembly according to the present invention. The LED print head 10, as shown in FIG.
It has a printed circuit board 20 on which an LED chip 32, a driver IC chip 34, etc. are mounted on the upper surface side, and a cover 12 is arranged on the printed circuit board 20.
A lens 15 is provided at 2. The printed board 20 is provided with a through hole portion 24 in the wiring pattern, and the through hole portion 24 is wire-bonded to the driver IC chip 34 and the like. A plurality of through-hole parts including the through-hole part 24 arranged on the printed circuit board 20 are arranged vertically in the direction perpendicular to the paper surface of the drawing.
【００１４】プリント基板２０の下方には、放熱板３０
が設けられており、該放熱板３０の上部のスルーホール
部２４が臨む部分には凹状の断面を有する溝部３３が設
けられている。この溝部３３は縦状に配設された複数の
スルーホール部に合わせて図面において紙面垂直方向に
溝状に形成されており、放熱板３０を押出し成形する際
に一体に形成される。上記プリント基板２０と放熱板３
０は、固定部材１６によりカバー１２に押圧固定されて
いる。Below the printed circuit board 20, a heat sink 30 is provided.
Is provided, and a groove 33 having a concave cross section is provided at a portion of the upper portion of the heat dissipation plate 30 facing the through hole portion 24. The groove portion 33 is formed in a groove shape in the direction perpendicular to the paper surface of the drawing in accordance with the plurality of vertically arranged through-hole portions, and is integrally formed when the heat dissipation plate 30 is extruded. The printed circuit board 20 and the heat sink 3
0 is pressed and fixed to the cover 12 by the fixing member 16.
【００１５】ＬＥＤプリントヘッド１０を組み立てる場
合、プリント基板２０上に配線パターン及び配線パター
ンにおけるスルーホール２４を形成し、ＬＥＤチップ３
２、ドライバーＩＣチップ３４を搭載する。そして、プ
リント基板のスルーホール部２４に放熱板３０の溝部３
３を合わせて、放熱板３０とプリント基板２０とを貼着
等により固定する。それから、プリント基板２０上にレ
ンズ１４を設けたカバー１２を固定部材１６により固定
する。When assembling the LED print head 10, the wiring pattern and the through holes 24 in the wiring pattern are formed on the printed circuit board 20, and the LED chip 3 is formed.
2. Mount the driver IC chip 34. Then, the groove 3 of the heat sink 30 is formed in the through hole 24 of the printed circuit board.
3, the heat sink 30 and the printed circuit board 20 are fixed to each other by pasting or the like. Then, the cover 12 provided with the lens 14 on the printed circuit board 20 is fixed by the fixing member 16.
【００１６】上記構成のＬＥＤプリントヘッド１０にお
いては、プリント基板２０上に配されたＬＥＤチップ３
２からの光がレンズ１４を介して照射されて印字が行わ
れ、このＬＥＤチップ３２はドライバーＩＣチップ３４
により駆動される。上記のようなチップ等の駆動によ
り、プリント基板全体が熱を帯びることがあり、放熱板
３０によりその熱が放熱される。本実施例においては、
放熱板３０スルーホール部２４下方部分に凹状の断面を
有する溝部３３が設けられているので、スルーホール部
２４が放熱板３０に接触せず、スルーホール部２４と放
熱板３０との短絡を防止するとともに、絶縁耐性を高く
することができる。In the LED print head 10 having the above structure, the LED chip 3 arranged on the printed circuit board 20.
The light from 2 is emitted through the lens 14 for printing, and the LED chip 32 is driven by the driver IC chip 34.
Driven by. When the chip or the like is driven as described above, the entire printed circuit board may be heated, and the heat is dissipated by the heat dissipation plate 30. In this embodiment,
Since the groove portion 33 having a concave cross section is provided in the lower portion of the heat dissipation plate 30 through hole portion 24, the through hole portion 24 does not contact the heat dissipation plate 30 and a short circuit between the through hole portion 24 and the heat dissipation plate 30 is prevented. In addition, the insulation resistance can be increased.
【００１７】また、上記実施例においては、放熱板３０
に凹状の溝部３３が設けられた場合について説明した
が、図２に示すように、プリント基板２０に２つのスル
ーホール群がある場合、すなわち、スルーホール部が縦
に２列に配されている場合には、２つの溝部３３、３４
が設けられる。Further, in the above embodiment, the heat dissipation plate 30
Although the case where the concave groove portion 33 is provided in the above is described, as shown in FIG. 2, when the printed circuit board 20 has two through hole groups, that is, the through hole portions are vertically arranged in two rows. In some cases, the two grooves 33, 34
Is provided.
【００１８】また、スルーホール２４の部分について詳
述すると、図３に詳示するように、２０〜２５μｍの銅
メッキ部分２４ａと、約５μｍのニッケルメッキ部２４
ｂと、約０．３μｍの金メッキ部２４ｃとからなってお
り、配線パターンと裏面配線パターンとを導通してい
る。The through hole 24 will be described in detail. As shown in FIG. 3, the copper plated portion 24a having a thickness of 20 to 25 μm and the nickel plated portion 24 having a thickness of about 5 μm are provided.
b and a gold-plated portion 24c of about 0.3 μm, which electrically connects the wiring pattern and the backside wiring pattern.
【００１９】上述のＬＥＤプリントヘッドを使用した電
子機器としてのＬＥＤプリンタは、図４のように構成さ
れ、筐体５１内に画像形成部５２とヘッド制御部５３と
を備えている。An LED printer as an electronic device using the above-mentioned LED print head is constructed as shown in FIG. 4, and has an image forming section 52 and a head control section 53 in a housing 51.
【００２０】パソコン６５より出力された情報は、筐体
５１内におけるヘッド制御部５３に送られ、ここから、
ＬＥＤプリントヘッド５４に印字情報として送られる。The information output from the personal computer 65 is sent to the head controller 53 in the housing 51, and from there,
The print information is sent to the LED print head 54.
【００２１】次に、ＬＥＤプリンタの動作について説明
する。まず、帯電器５５により感光ドラム５６を数百ボ
ルトに帯電させ、感光ドラム５６表面に均一な電荷を与
える。次に、パソコン６５より送られてきた印字情報に
基づいてＬＥＤプリントヘッド５４を発光させ、光が照
射された箇所の電荷を消失させ、静電潜像を形成させ
る。そして、現像器５７を用いて極性を持ったトナーを
感光ドラム５６に付着させ、静電潜像を顕像化させる。
ここで、記録用紙５８は筐体５１上部より搬送ローラ５
９により搬送され、次の転写部６０によりドラム上のト
ナー像を電界の力で記録用紙５８に転写させる。Next, the operation of the LED printer will be described. First, the charging device 55 charges the photosensitive drum 56 to several hundreds of volts to give a uniform charge to the surface of the photosensitive drum 56. Next, based on the print information sent from the personal computer 65, the LED print head 54 is caused to emit light, the electric charge at the location where the light is irradiated disappears, and an electrostatic latent image is formed. Then, toner having a polarity is attached to the photosensitive drum 56 by using the developing device 57 to visualize the electrostatic latent image.
Here, the recording paper 58 is transferred from the upper part of the housing 51 to the transport roller 5
Then, the toner image on the drum is transferred onto the recording paper 58 by the force of the electric field.
【００２２】転写されたトナー像は定着部６１で圧力や
熱を加えられ記録用紙５８に定着し、永久像となり、搬
送ローラ６２により筐体５１外へ搬送され、原稿として
得られる。一方、筐体５１内部では感光ドラム表面に付
着している残留トナー及び残留電荷をそれぞれ清掃部６
３、除電部６４で取り除き、次の印刷に備える。The transferred toner image is fixed on the recording paper 58 by applying pressure or heat in the fixing section 61, becomes a permanent image, and is conveyed to the outside of the housing 51 by the conveyance rollers 62 to be obtained as a document. On the other hand, inside the casing 51, the cleaning unit 6 removes the residual toner and the residual electric charge adhering to the surface of the photosensitive drum, respectively.
3, removed by the static eliminator 64 to prepare for the next printing.
【００２３】なお、上述実施例においては、プリント基
板２０のスルーホール２４部に臨む部分に形成された放
熱板３０の溝部３３、３４を放熱板３０の押出し成形時
に一体に形成したが、これに限らず放熱板の形成後に刻
設してもよく、また、上述の説明では、放熱板３０に溝
部を設ける場合について説明したが、放熱板３０のスル
ーホール部２４に臨む部分のみに窪みまたは穴を設ける
ようにしてもよい。In the above embodiment, the groove portions 33 and 34 of the heat dissipation plate 30 formed in the portion facing the through hole 24 of the printed circuit board 20 are integrally formed when the heat dissipation plate 30 is extruded. The present invention is not limited to this, and the heat sink may be engraved after the heat sink is formed. Further, in the above description, the case where the groove portion is provided in the heat sink 30 has been described, but a recess or a hole is formed only in the portion of the heat sink 30 facing the through hole portion 24. May be provided.
【００２４】更に、上述実施例においては、電子機器と
してＬＥＤプリンタを例に取り説明したが、これに限ら
ず、他の画像形成装置でもよい。Further, in the above-described embodiment, the LED printer has been described as an example of the electronic apparatus, but the invention is not limited to this, and another image forming apparatus may be used.
【００２５】また、上述実施例においては、プリントヘ
ッドとしてＬＥＤプリントヘッドを例に取り説明した
が、これに限らず、サーマルプリントヘッドでもよい。Further, in the above-mentioned embodiment, the LED print head has been described as an example of the print head, but the print head is not limited to this and may be a thermal print head.
【００２６】なお、プリント基板と放熱板との対抗する
位置に予め基準穴を穿設しておき、これらの基準穴に位
置決めピンが嵌入するようにして、放熱板に対するプリ
ント基板の位置を位置決めするように構成すると、放熱
板に対するプリント基板の位置決めを容易に行うことが
可能である。It is to be noted that reference holes are preliminarily formed at positions where the printed circuit board and the heat sink are opposed to each other, and positioning pins are fitted into these reference holes to position the printed circuit board with respect to the heat sink. With this configuration, it is possible to easily position the printed circuit board with respect to the heat dissipation plate.
【００２７】[0027]
【発明の効果】以上説明したように、本発明によれば、
絶縁板をプリント基板と放熱板の間に設ける必要がな
く、放熱板との密着性がよいため、組立性を向上すると
共に、プリント基板のスルーホール部が放熱板により短
絡することを防止し得る絶縁耐性の高いＬＥＤプリント
ヘッドを提供することができる。As described above, according to the present invention,
Since there is no need to provide an insulating plate between the printed circuit board and the heat sink, and the adhesion to the heat sink is good, assembly is improved and insulation resistance that can prevent the through holes of the printed circuit board from being short-circuited by the heat sink It is possible to provide a high LED print head.
【図１】本発明に係るＬＥＤプリントヘッドを示す断面
図である。FIG. 1 is a sectional view showing an LED print head according to the present invention.
【図２】本発明に係るＬＥＤプリントヘッドの他の実施
例を示す断面図である。FIG. 2 is a sectional view showing another embodiment of the LED print head according to the present invention.
【図３】本発明に係るＬＥＤプリントヘッドのスルーホ
ール部の部分を拡大して示す断面図である。FIG. 3 is an enlarged cross-sectional view showing a through hole portion of the LED print head according to the present invention.
【図４】本実施例に係るＬＥＤプリンタを示す説明図で
ある。FIG. 4 is an explanatory diagram showing an LED printer according to the present embodiment.
【図５】従来のＬＥＤプリントヘッドのスルーホール部
を示す断面図である。FIG. 5 is a cross-sectional view showing a through hole portion of a conventional LED print head.
【図６】従来のＬＥＤプリントヘッドのスルーホール部
を示す断面図である。FIG. 6 is a cross-sectional view showing a through hole portion of a conventional LED print head.
【図７】従来のＬＥＤプリントヘッドを示す断面図であ
る。FIG. 7 is a sectional view showing a conventional LED print head.
１０ ＬＥＤプリントヘッド １２ カバー １４ レンズ １６ 固定部材 ２０ プリント基板 ３０ 放熱板 ３３ 溝部 10 LED print head 12 Cover 14 Lens 16 Fixing member 20 Printed circuit board 30 Heat sink 33 Groove
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 7/20 Ｂ 8727−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 7/20 B 8727-4E
Claims (2)
設けられた配線パターンと一面側の配線パターンとを電
気的に接続する所定位置に設けられたスルーホール部を
有するプリント基板と、 前記プリント基板の電子部品の実装されていない側に配
置されかつプリント基板のスルーホール部に臨む部分に
凹部断面により形成された空間部を有する放熱板と、 を備えることを特徴とするプリント基板アッセンブリ。1. A printed circuit board having a through-hole portion provided at a predetermined position for mounting an electronic component on one surface side and electrically connecting the wiring pattern provided on the other surface side and the wiring pattern on the one surface side. A heat sink disposed on a side of the printed circuit board on which no electronic component is mounted and having a space formed by a recess cross section in a portion facing the through hole of the printed circuit board; Assembly.
設けられた配線パターンと一面側の配線パターンとを電
気的に接続する所定位置に設けられたスルーホール部を
有するプリント基板と、 前記プリント基板の電子部品の実装されていない側に配
置されかつプリント基板のスルーホール部に臨む部分に
凹部断面により形成された空間部を有する放熱板と、 を備えるプリント基板アッセンブリを有することを特徴
とする電子機器。2. A printed circuit board having an electronic component mounted on one surface side and having a through hole portion provided at a predetermined position for electrically connecting the wiring pattern provided on the other surface side and the wiring pattern on the other surface side. A heat sink disposed on the side of the printed circuit board on which no electronic component is mounted and having a space formed by a concave cross section in a portion facing the through hole of the printed circuit board; and a printed circuit board assembly comprising: Characteristic electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7382393A JP2731690B2 (en) | 1993-03-31 | 1993-03-31 | Printed circuit board assembly and electronic device having the printed circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7382393A JP2731690B2 (en) | 1993-03-31 | 1993-03-31 | Printed circuit board assembly and electronic device having the printed circuit board assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06291426A true JPH06291426A (en) | 1994-10-18 |
| JP2731690B2 JP2731690B2 (en) | 1998-03-25 |
Family
ID=13529265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7382393A Expired - Lifetime JP2731690B2 (en) | 1993-03-31 | 1993-03-31 | Printed circuit board assembly and electronic device having the printed circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2731690B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001113744A (en) * | 1999-10-15 | 2001-04-24 | Fujitsu Ltd | Aligner and iamge forming apparatus |
| JP2007311398A (en) * | 2006-05-16 | 2007-11-29 | Fujikura Ltd | Light emitting device |
| JP2010201723A (en) * | 2009-03-02 | 2010-09-16 | Fuji Xerox Manufacturing Co Ltd | Print head and image forming device |
| JP2010208125A (en) * | 2009-03-10 | 2010-09-24 | Fuji Xerox Manufacturing Co Ltd | Print head and image forming apparatus |
| JP2019077132A (en) * | 2017-10-26 | 2019-05-23 | 株式会社沖データ | Exposure device and image formation device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106857U (en) * | 1989-02-10 | 1990-08-24 | ||
| JPH04206675A (en) * | 1990-11-30 | 1992-07-28 | Nippon Avionics Co Ltd | Printed circuit board with heat sink |
-
1993
- 1993-03-31 JP JP7382393A patent/JP2731690B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106857U (en) * | 1989-02-10 | 1990-08-24 | ||
| JPH04206675A (en) * | 1990-11-30 | 1992-07-28 | Nippon Avionics Co Ltd | Printed circuit board with heat sink |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001113744A (en) * | 1999-10-15 | 2001-04-24 | Fujitsu Ltd | Aligner and iamge forming apparatus |
| JP2007311398A (en) * | 2006-05-16 | 2007-11-29 | Fujikura Ltd | Light emitting device |
| JP2010201723A (en) * | 2009-03-02 | 2010-09-16 | Fuji Xerox Manufacturing Co Ltd | Print head and image forming device |
| JP2010208125A (en) * | 2009-03-10 | 2010-09-24 | Fuji Xerox Manufacturing Co Ltd | Print head and image forming apparatus |
| JP2019077132A (en) * | 2017-10-26 | 2019-05-23 | 株式会社沖データ | Exposure device and image formation device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2731690B2 (en) | 1998-03-25 |
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