JPH06291166A - Film carrier and inner lead bonding equipment - Google Patents

Abstract

PURPOSE:To provide a film carrier and an inner lead bonding equipment capable of performing better and high-accuracy inner lead bonding. CONSTITUTION:This equipment comprises a lower die 10 and an upper die 11 for press-forming the tip portions of a plurality of inner lead 2,... projected to the inside of a device hall 1b of a film carrier, a bonding stage 4 for holding a semiconductor element 3 and bonding stage 4 for bringing an electrode 3a of the semiconductor 3 into contact with a tip portion formed to a gull wing of an inner lead 2' and a bonding tool 5 for bonding the tip of the inner lead 2' to the electrode 3a of the semiconductor element 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier and an inner reel provided on the film carrier.
The present invention relates to a bonding device for bonding a pad and a semiconductor element electrode pad by heating and pressing.

[0002]

2. Description of the Related Art In the process of manufacturing a semiconductor device using the TAB (Tape Automated Bonding) technique, there is a process of inner-lead bonding a semiconductor element to a flexible film carrier.

An apparatus for performing this inner lead bonding (inner lead bonding apparatus) is shown in FIG.
It has a configuration as shown in.

In the figure, reference numeral 1 is a film carrier. The film carrier 1 includes a carrier film 1a in the form of a flexible cine film, device holes 1b formed at predetermined intervals in the longitudinal direction of the carrier tape 1a, and the above carrier tape. A plurality of inner members formed on the surface and extended into the opening of the device hole 1b.
It consists of Lead 2 ...

In this apparatus, the film carrier 1 is stretched substantially horizontally and is intermittently fed and driven in a direction indicated by an arrow (a) in the figure. Then, the device holes 1b of the film carrier 1 are sequentially stopped at the bonding positions shown by A in the figure.

At the bonding position A, a bonding stage 4 for holding the semiconductor element 3 is sandwiched between the film carrier 1 and an inner lead 2 of the film carrier 1 is mounted on the upper side of the semiconductor carrier. Electrode 3a of element 3
There are provided bonding tools 5 for joining to each.

The bonding stage 4 holds the semiconductor element 3 on its upper surface and separates the electrodes 3a formed on the semiconductor element 3 from the lower surface of the inner lead 2 by a predetermined distance. Face each other.

The bonding tool 5 has all the inner leads 2 ... Extended in one device hole 1b of the film carrier 1 and the semiconductor element 3
Each electrode 3a has a pressing surface of a size capable of being collectively pressed.

In addition, in the bonding tool 5,
A heater 6 is embedded and the bonding tool 5 is heated to a predetermined temperature and kept warm.

This apparatus drives the bonding tool 5 downward when the device hole 1b and the inner lead 2 are stopped at the bonding position A.
This bonding tool 5 descends while deforming the inner lead 2 downward, as shown in FIG. 2B, and finally, as shown in FIG. In a state in which the inner lead 2 is deformed downward, the inner lead 2 and the electrode 3a are pressed and heated to be bonded (inner lead bonding) to each other.

At this time, the film carrier 1
The lower surface of is supported by a support plate shown in FIG. With this support plate 7, the inner lead 2 is
The inner lead 2 is adapted to be deformed downward with the base end portion as a fulcrum.

[0012]

By the way, in the conventional device, as described above, the electrode 3a of the semiconductor element 3 and the inner lead 2 of the film carrier 1 are held with a predetermined distance therebetween. Then, the inner lead 2 is deformed and joined to the electrode 3a.

This is because when the inner lead 2 and the electrode 3a are brought into contact with each other in advance, the base end portion of the inner lead 2 and the semiconductor element 3 come close to each other.
This is because, as shown in FIG. 3, the middle portion in the lengthwise direction of the inner lead 2 may come into contact with the edge (b) of the semiconductor element 3.

However, when the inner lead 3 is deformed by using the bonding tool 5, there are problems to be solved as described below.

First, the lower surface of the base end portion of the inner lead 2 is supported by the support plate 7, but means for restricting the lower surface of the tip end portion of the inner lead 2 is used. Absent.

Therefore, the amount of deformation of the tip portion of the inner lead 2 may vary, or the tip portion of the inner lead 2 may be deformed laterally as shown in FIG. Such a phenomenon occurs as the width of the inner leads 2 becomes narrower and the strength thereof becomes weaker. Further, when the inner leads 2 are provided at a narrow pitch, the inner leads 2 are adjacent to each other. Lead 2 ... causes a problem that they come into contact with each other and short.

Secondly, the bonding tool 5 first comes into contact with the inner lead 2 and then the inner lead 2 is brought into contact with the inner lead 2.
Is pressed downward and then the inner lead 2 is bonded to the electrode 3a of the semiconductor element 3.

Therefore, the film carrier 1 is heated through the inner lead 2 until the inner lead 2 is brought into contact with the electrode 3a, and the film carrier 1 is thermally expanded. Lateral and longitudinal stretching may occur.

In such a case, as described above, there is no means for restricting the tip portion of the inner lead, which causes defective molding, and the inner lead 2 is displaced in the width direction. In some cases, the inner lead 2 may slacken, and the middle portion in the lengthwise direction may contact the edge of the semiconductor element 3.

This phenomenon also occurs in the inner lead 2 described above.
There is a case where the accuracy of the inner lead bonding is greatly affected as the pitch of No. 1 becomes narrower.

In addition, in recent years, there is a possibility that the semiconductor elements 3 having a large number of terminals and a narrow pitch may be greatly hindered from being favorably subjected to inner lead bonding.

The present invention has been made in view of such circumstances, and provides a film carrier and an inner lead bonding apparatus capable of performing better and more accurate inner lead bonding. That is the purpose.

[0023]

The first means of the present invention is to provide a flexible carrier tape, a device hole formed on the carrier tape, and a surface of the carrier tape. And a plurality of inner leads that are formed and extend into the opening of the device hole and have a bent front end.

The second means is formed on the upper surface of the carrier tape and is a device hopper provided on the carrier tape.
In an inner lead bonding apparatus for connecting the tips of a plurality of inner leads extending to the opening of the inner hole to the electrodes of the semiconductor element, a press die is used to form the inner lead. The present invention is characterized by comprising press bending means for bending the tip portion and joining means for connecting the tip portion of the inner lead and the electrode of the semiconductor element.

[0025]

With this structure, the tip of the inner lead provided on the film carrier is bent in advance, and the bent tip of the inner lead is used as the electrode of the semiconductor element. By joining, the semiconductor element can be inner-lead bonded to the film carrier.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. The same components as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.

In this apparatus, the film carrier 1 is stretched substantially horizontally as shown in the figure. Then, the film carrier 1 is intermittently fed and driven in the direction shown by the arrow (c) by a feed driving means (not shown), and each device hole 1b (inner lead 2 ...) Is shown in FIG. The position shown in (d) is sequentially stopped from the position shown.

In the feed path of the film carrier 1, the inner lead molding position shown in FIG.
The bonding position shown in (d) is provided.

At the inner lead molding position (b),
A lower die 10 and an upper die 11 (press dies) which are provided with the film carrier 1 sandwiched therebetween and are driven in a direction in which the film carrier 1 is moved toward and away from each other by a driving means (not shown) are provided (press bending means).

The lower die 10 is provided at the outer peripheral edge of the upper end surface and is provided with a holding portion 10a for holding the lower surface of the base end portion of the inner lead 2 and a recessed portion at the center of the upper end surface. And a recess 10b for holding the lower surface of the tip of the inner lead 2 extended to the opening of the rule 1b.

The upper mold 11 is formed by sandwiching the tip of the inner lead 2 located in the concave portion 10b of the lower mold 10 between the upper mold 11 and the concave portion 10b to form a gull wing. The unit 11a is provided.

Further, although not shown, this apparatus is provided with a holder for projecting from the upper mold 11 and the lower mold 10 to sandwich the inner lead 2 from above and below before the press molding. .

If the substantially horizontal inner leads 2 ... Shown at the position (a) are stopped between the upper die 11 and the lower die 10 at the inner lead forming position (b). First,
The inner lead 2 is clamped by this holder,
It is fixed so that it cannot move in the width direction.

Next, when the lower die 10 is raised and the lower surface of the base end portion of the inner lead 2 is held by the holding portion 10a, the upper die 11 is driven downward, and the inner lead is driven. The tip of 2 ... is bent into a gull wing shape by press molding. (Hereinafter, the inner lead 2 after being bent in a gull wing shape is shown by reference numeral 2 '.) When this press molding is completed, the upper mold 11 and the lower mold 10 are separated from the film carrier 1. The inner lead 2'which is driven in the direction, is bent by one pitch and is moved to the position (c).

Next, the inner lead 2'is further fed one pitch from the position (c) and stopped at the bonding position (d). The bonding tool 5 and the bonding stage 4 are provided at the bonding position (d) (bonding means).

The semiconductor element 3 is supplied onto the bonding stage 4 by transfer means (not shown).
The bonding stage 4 positions each electrode 3a of the semiconductor element 3 so as to face the tip of the inner lead 2'formed in the gull wing shape, and then drives the semiconductor element 3 upward. As a result, the electrode 3a of the semiconductor element 3 is brought into contact with the lower surface of the tip of the inner lead 2 '.

Then, the bonding tool 5 is driven downward, and the tip of the inner lead 2'is heated and pressed against the electrode 3a of the semiconductor element 3 to bond them by thermocompression bonding. (Inner lead bonding).

When the inner lead bonding is completed in this way, the bonding tool 5 and the bonding stage 4 are separated from the film carrier 1. Then, the film carrier is driven by one pitch to move the semiconductor element 3 and the inner lead 2'to the position (e).

With this, the entire bonding process is completed, and the film carrier 1 to which the semiconductor element 3 is inner-read bonded is sent to a potting process (resin sealing process) not shown.

According to this structure, the following effects can be obtained.

First, the inner lead 2 is not deformed by the bonding tool 5, but the lower die 10 and the upper die 10 provided at the inner lead molding position (b) in advance. The mold 11 was press-molded into a gull wing shape 2 '.

That is, since the tip portion of the inner lead 2 is bent by using a dedicated press die, this bending can be performed well, and the inner lead 2 is laterally bent. Defects such as bending are less likely to occur.

Further, the above-mentioned bonding tool is used as an inner member.
Unlike the conventional example in which the inner lead 2 is deformed, the inner lead 2 is not heated when the inner lead 2 is bent. Therefore, at the time of bending, the film carrier 1
The inner lead 2 is not displaced due to the thermal expansion of the.

As a result, there is an effect that the inner lead 2 can be favorably bent.

Secondly, since the inner lead 2 is surely press-molded into the gull wing shape 2 ', it is possible to stably control the molding amount of the inner lead 2. Therefore, it is possible to effectively prevent looseness from occurring in the middle portion of the inner lead 2 in the length direction during joining. As a result,
It is possible to effectively prevent the short circuit of the inner lead 2 from coming into contact with the edge of the semiconductor element 3 and causing a short defect.

Third, since the tip of the inner lead 2'and the electrode 3a of the semiconductor element 3 can be brought into contact with each other in advance, the inner layer 2'can be bonded at the time of bonding.
At the same time as heating the lead 2, the inner lead 2 can be pressed against the electrode 3a.

As a result, the inner lead 2'may be displaced due to the thermal expansion of the film carrier 1 before the inner lead 2'is brought into contact with the electrode 3a. Disappear. Therefore, there is an effect that more accurate inner lead bonding can be performed.

From the above, according to the present invention, better and more accurate inner lead bonding can be performed as compared with the conventional inner lead bonding apparatus, so that the number of semiconductor elements 3 is large. Even if the pitch of the terminals is narrowed, there is an effect that it can be sufficiently dealt with.

The present invention is not limited to the above-described embodiment, but can be variously modified without departing from the gist of the invention.

For example, in the above-described embodiment, the gang bonding method in which the inner leads 2 '... Of the film carrier 1 are collectively joined to the electrodes 3a of the semiconductor element 3 is used. Single-point inner lead bonding (single-point bonding) may be used in which the two leads 2'are joined one by one.

In this single point bonding,
Conventionally, since the tip end of the linear inner lead 2 is brought into contact with the upper surface of the electrode 3a of the semiconductor element 3 for bonding, the inner lead by the bonding tool as described above is used. The push-bending forming (bending) of the dream 2 could not be performed.

Therefore, the distance between the film carrier 1 and the semiconductor element 3 is reduced, and the inner lead 2 is
The middle part of the semiconductor element 3 contacts the edge of the semiconductor element 3 and
There is a greater possibility that a defective soldering may occur than in the case of the gang bonding method.

However, according to the present invention, the above inner
Even when the tip portion of the lead 2'and the electrode 3a of the semiconductor element 3 are in contact with each other, the distance between the film carrier 1 and the semiconductor element 3 can be separated by a predetermined dimension, so that the distance between the film carrier 1 and the semiconductor element 3 can be increased. There is an effect that it is possible to effectively prevent the occurrence of defective printing.

Further, in the above-mentioned embodiment, the inner lead bonding is performed by tensioning the long film carrier 1 and intermittently feeding and driving the film carrier 1. However, the present invention is not limited to this. Not something.

That is, the film carrier 1 is cut into strips for each device hole 1b, and the strips are stored in the slide carrier. Then, the inner carrier 2 may be molded and the inner lead bonding may be performed by feeding and driving the slide carrier.

In this way, since the film carrier 1 is not wound up, the deformation of the inner lead 2 and the inner lead 2 which are caused by the winding up.
With this, it is possible to effectively reduce defects such as disconnection between the semiconductor element 3 and the semiconductor element 3. Furthermore, although the inner lead 2 is bent in a gull wing shape in the above-described embodiment, the present invention is not limited to this. Other shapes may be used as long as the tip of the inner lead 2 is bent in the direction away from the film carrier 1.

[0057]

As described above, the first structure of the present invention comprises a flexible carrier tape, a device hole formed on the carrier tape, and the above-mentioned carrier tape. It is characterized by comprising a plurality of inner leads which are formed on the surface and are extended to the opening of the device hole and whose tip is bent.

The second structure is formed on the upper surface of the carrier tape and is a device hop provided on the carrier tape.
In an inner lead bonding apparatus for connecting the tips of a plurality of inner leads extending to the opening of the inner hole to the electrodes of the semiconductor element, a press die is used to form the inner lead. The present invention is characterized by comprising press bending means for bending the tip portion and joining means for connecting the tip portion of the inner lead and the electrode of the semiconductor element.

According to the first and second configurations as described above, there is an effect that better and highly accurate inner lead bonding can be performed.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.

2A to 2C are process diagrams showing an inner lead bonding process of a conventional example.

FIG. 3 is a vertical cross-sectional view similarly showing an enlarged state of defective inner lead bonding.

FIG. 4 is an enlarged plan view showing a defective state of inner lead bonding.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Film carrier, 1b ... Device hole, 2 ... Inner lead, 3 ... Semiconductor element, 3a ... Electrode, 5 ... Bonding tool (joining means), 10 ... Lower die (press die), 11 ... Upper mold (press mold), 2 '... Inner lead bent in a gull wing shape.

Claims (2)

[Claims] 1. A flexible carrier tape, a device hole formed on the carrier tape, a surface formed on the carrier tape, and extended to an opening of the device hole. And a plurality of inner leads each having a bent front end portion. 2. A tip of a plurality of inner leads formed on the upper surface of a carrier tape and extended to an opening of a device hole provided on the carrier tape, and an electrode of a semiconductor element. In an inner lead bonding apparatus for connecting with the above, a press bending means for bending the tip of the inner lead using a press die, and a tip of the inner lead and the semiconductor element An inner lead bonding apparatus, which is provided with a joining means for connecting the electrodes of the above.