JPH06291027A - Supplying device for treatment liquid of rotary substrate treatment apparatus - Google Patents

Supplying device for treatment liquid of rotary substrate treatment apparatus

Info

Publication number
JPH06291027A
JPH06291027A JP5096697A JP9669793A JPH06291027A JP H06291027 A JPH06291027 A JP H06291027A JP 5096697 A JP5096697 A JP 5096697A JP 9669793 A JP9669793 A JP 9669793A JP H06291027 A JPH06291027 A JP H06291027A
Authority
JP
Japan
Prior art keywords
nozzle
substrate
arm
support arm
nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5096697A
Other languages
Japanese (ja)
Other versions
JP2907676B2 (en
Inventor
Kazuhisa Takamatsu
和久 高松
Akihiro Hisai
章博 久井
Hiroshi Kato
洋 加藤
Masami Otani
正美 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP5096697A priority Critical patent/JP2907676B2/en
Priority to KR1019940005751A priority patent/KR0142807B1/en
Priority to US08/220,915 priority patent/US5514215A/en
Publication of JPH06291027A publication Critical patent/JPH06291027A/en
Application granted granted Critical
Publication of JP2907676B2 publication Critical patent/JP2907676B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/70Arrangements for moving spray heads automatically to or from the working position
    • B05B15/72Arrangements for moving spray heads automatically to or from the working position using hydraulic or pneumatic means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08Spreading liquid or other fluent material by manipulating the work, e.g. tilting

Abstract

PURPOSE:To obtain a supply device wherein, while a temperature can be regulated sufficiently by a temperature-regulating pipe, the unexpected drop of a treatment liquid due to the deformation of a treatment liquid supply tube is not caused and a nozzle which has been selected from a plurality of nozzles is moved surely to a prescribed position in a prescribed attitude. CONSTITUTION:A plurality of nozzles 1 and treatment liquid supply tubes are supported by a rigid arm 4 which is used partly as, and constituted of, temperature regulating pipes 3 which come into contact with the tubes and which make the temperature of treatment liquids at their inside defnite. The support arm 4 is supported so as to be rotatable around the rotation center prescribed in a prescribed part at the side of a substrate W in such a way that the nozzles 1 are displaced to their discharge positions and their standby positions away from the upper part of the wafer W. The support arm 4 is engaged and held alternatively by a driving arm 21, and it is turned in such a way that the nozzles 1 are displaced to their discharge positions and their standby positions.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体ウエハ、フォト
マスク用のガラス基板、液晶表示装置用のガラス基板、
光ディスク用の基板等の基板に、フォトレジスト液など
の表面処理液を供給して表面処理を行うために、回転可
能に支持された基板に処理液を供給する複数のノズル
と、ノズルと処理液貯留部とを接続する複数のチューブ
と、チューブに接触してその内部の処理液の温度を一定
化する温調配管と、ノズルのうち、所望のノズルを択一
的に取り出して基板の上方の吐出位置に移動するノズル
移動手段とを備えた回転式基板処理装置の処理液供給装
置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device,
A plurality of nozzles for supplying a treatment liquid to a rotatably supported substrate for supplying a surface treatment liquid such as a photoresist liquid to a substrate such as an optical disc substrate for performing the surface treatment, and a nozzle and the treatment liquid. A plurality of tubes that connect to the storage part, temperature control pipes that contact the tubes to keep the temperature of the processing liquid in the tubes constant, and of the nozzles, selectively take out the desired nozzle and place it above the substrate. The present invention relates to a processing liquid supply apparatus for a rotary substrate processing apparatus including a nozzle moving unit that moves to a discharge position.

【0002】[0002]

【従来の技術】上述のような回転式基板処理装置におい
ては、同一装置内であっても、成分や粘度が異なる複数
種の処理液を選択して供給するために、複数の処理液供
給系を設けることが望まれている。このため、従来、例
えば、実公平4−52990号公報に開示されているよ
うに、待機位置に設けられた複数のノズルのうち、所望
のノズルを移送アームで択一的に把持して基板の上方の
吐出位置に移動するように構成したものが知られてい
る。
2. Description of the Related Art In a rotary substrate processing apparatus as described above, a plurality of processing liquid supply systems are provided for selecting and supplying a plurality of types of processing liquids having different components and viscosities even in the same apparatus. Is desired to be provided. Therefore, conventionally, for example, as disclosed in Japanese Utility Model Publication No. 4-52990, a desired nozzle among a plurality of nozzles provided at a standby position is selectively gripped by a transfer arm, and a desired substrate is ejected. There is known one configured to move to an upper discharge position.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記従
来例では次のような欠点があった。 ノズルを移送アームで把持して移動させる際、ノズ
ルに接続したチューブの硬さが抵抗となってノズル姿勢
が変化し、基板上の吐出位置に移動させた際に、例え
ば、ノズルが所望の吐出位置からずれたり、真下を向か
ずに傾いたりするなど、その吐出姿勢が不安定になり、
ノズルからの処理液の基板上の滴下位置にズレが生じて
しまう。一般に、このような処理液の滴下位置は、処理
を均一に行うなどのために、 0.1mm単位の精度が要求さ
れるが、このように滴下位置にズレが生じると、処理品
質が低下する欠点があった。 ノズルを待機位置と吐出位置との間で移動させる際
に、処理液供給源とノズルとを接続するチューブが大き
く変位するので、処理液の温度を一定化するために処理
液供給用のチューブを温調配管に挿通した多重配管にし
た場合、この多重配管の剛性が大きいものとなるため
に、配管の取り廻しが困難になる。逆に、配管の取り廻
しを優先するために温調配管を細く柔軟な材質のものに
すると、温調配管内の温調用液体量が不十分となって処
理液供給用のチューブを周囲から均一に温調できなくな
り、温調精度が低下する欠点があった。 チューブが大きく移動する際にチューブに大きな曲
げ変形やねじり変形が生じ、この変形に起因して配管内
の体積変動が発生し、これに伴ってチューブ内の処理液
がノズルから基板上に滴下してしまう現象、いわゆるボ
タ落ち現象が発生しやすい欠点があった。
However, the above-mentioned conventional example has the following drawbacks. When gripping and moving the nozzle with the transfer arm, the hardness of the tube connected to the nozzle acts as a resistance and the nozzle posture changes, and when the nozzle is moved to the discharge position on the substrate, for example, the nozzle discharges the desired discharge. The ejection posture becomes unstable, such as shifting from the position or tilting without going directly below,
The position where the processing liquid is dropped from the nozzle is displaced on the substrate. Generally, such a treatment liquid dropping position is required to have an accuracy of 0.1 mm unit in order to perform the treatment uniformly.However, if such a dropping position occurs, the treatment quality will deteriorate. was there. When the nozzle is moved between the standby position and the discharge position, the tube connecting the processing liquid supply source and the nozzle is largely displaced, so that the processing liquid supply tube is used to keep the temperature of the processing liquid constant. When a multiple pipe is inserted through the temperature control pipe, the rigidity of the multiple pipe becomes large, which makes it difficult to handle the pipe. Conversely, if the temperature control pipe is made of a thin and flexible material in order to prioritize the handling of the pipe, the amount of the temperature control liquid in the temperature control pipe will be insufficient and the tube for supplying the processing liquid will be evenly distributed from the surroundings. There was a drawback that the temperature control became impossible and the temperature control accuracy decreased. When the tube moves a lot, the tube undergoes large bending deformation and torsional deformation, and this deformation causes a volume change in the pipe, which causes the treatment liquid in the tube to drip from the nozzle onto the substrate. There was a drawback that the phenomenon of falling off, so-called fluffing phenomenon, was likely to occur.

【0004】本発明は、このような事情に鑑みてなされ
たものであって、請求項1に係る発明の回転式基板処理
装置の処理液供給装置は、温調配管により処理液を充分
に温調でき、かつ、処理液供給用のチューブの変形に起
因する処理液の不測の滴下を生じることなく、複数個の
ノズルのうちから選択したノズルを所定の姿勢で確実に
所定の位置に移動できるようにすることを目的とし、請
求項2および請求項3に係る発明の回転式基板処理装置
の処理液供給装置は、更に、選択したノズルの移動を、
基板上に塵埃を持ち込むことなく行うことができるよう
にすることを目的とする。
The present invention has been made in view of the above circumstances, and the processing liquid supply apparatus of the rotary substrate processing apparatus according to the first aspect of the present invention sufficiently heats the processing liquid by the temperature control pipe. In addition, the nozzle selected from the plurality of nozzles can be reliably moved to a predetermined position in a predetermined posture without causing unexpected drops of the processing liquid due to deformation of the processing liquid supply tube. In order to achieve the above, the processing liquid supply apparatus of the rotary substrate processing apparatus according to the second and third aspects of the present invention further includes the movement of the selected nozzle,
It is an object of the present invention to make it possible to carry out without bringing dust on the substrate.

【0005】[0005]

【課題を解決するための手段】請求項1に係る発明の回
転式基板処理装置の処理液供給装置は、上述のような目
的を達成するために、回転可能に支持された基板に処理
液を供給する複数のノズルと、そのノズルと処理液貯留
部とを接続する複数のチューブと、そのチューブに接触
してその内部の処理液の温度を一定化する温調配管と、
ノズルのうち、所望のノズルを択一的に取り出して前記
基板の上方の吐出位置に移動するノズル移動手段とを備
えた回転式基板処理装置の処理液供給装置において、ノ
ズルとチューブとの組の各々を剛性の支持アームを介し
て支持し、前記ノズル移動手段を、ノズルが吐出位置と
基板の上方から外れた待機位置とに変位するように支持
アームそれぞれをノズルの上方から外れた位置でかつ所
定の位置に規定された回転中心周りで回転可能に支持す
るアーム支持手段と、支持アームと択一的に係合してノ
ズルが吐出位置と待機位置とに変位するように回転させ
るアーム回転手段とから構成する。
According to a first aspect of the present invention, there is provided a processing liquid supply apparatus for a rotary substrate processing apparatus, wherein the processing liquid is supplied to a rotatably supported substrate in order to achieve the above object. A plurality of nozzles to be supplied, a plurality of tubes that connect the nozzles to the processing liquid storage unit, and a temperature control pipe that contacts the tubes to keep the temperature of the processing liquid inside the tubes constant,
In a processing liquid supply device of a rotary substrate processing apparatus, which comprises a nozzle moving means for selectively taking out a desired nozzle among the nozzles and moving it to a discharge position above the substrate, Each of them is supported via a rigid support arm, and each of the support arms is located at a position off the nozzle so that the nozzle moving means is displaced to a discharge position and a standby position off the substrate. Arm support means for rotatably supporting a rotation center defined at a predetermined position, and arm rotation means for selectively engaging the support arm and rotating the nozzle so as to displace the nozzle between the discharge position and the standby position. It consists of and.

【0006】また、請求項2に係る発明の回転式基板処
理装置の処理液供給装置は、上述のような目的を達成す
るために、回転可能に支持された基板に処理液を供給す
る複数のノズルと、そのノズルと処理液貯留部とを接続
する複数のチューブと、そのチューブに接触してその内
部の処理液の温度を一定化する温調配管と、ノズルのう
ち、所望のノズルを択一的に取り出して前記基板の上方
の吐出位置に移動するノズル移動手段とを備えた回転式
基板処理装置の処理液供給装置において、ノズルと前記
チューブとの組の各々を剛性の支持アームを介して支持
し、前記ノズル移動手段を、支持アームそれぞれを個別
に回転自在に支持するアーム回転支持体と、そのアーム
回転支持体のうちの所望のものを基板の側方で所定位置
へ移動させるアーム選択移動手段と、そのアーム選択移
動手段により所定位置へ移動させられた支持アームと基
板の側方で係合することにより、その支持アームを、ノ
ズルの上方から外れた位置でかつ所定の位置に規定され
た回転中心周りで回転するように回転中心位置を規定す
る芯出し係合機構と、その芯出し係合機構によって芯出
しされた支持アームに基板の側方で係合して回転するこ
とで、当該支持アームが支持するノズルを、吐出位置と
基板の上方から外れた待機位置とに移動させるアーム回
転手段とから構成する。
Further, in order to achieve the above-mentioned object, the processing liquid supply apparatus for the rotary substrate processing apparatus according to the second aspect of the present invention supplies a plurality of processing liquids to the rotatably supported substrates. A nozzle, a plurality of tubes that connect the nozzle to the processing liquid storage unit, a temperature control pipe that contacts the tubes to keep the temperature of the processing liquid inside the nozzle constant, and a desired nozzle is selected from the nozzles. In a processing liquid supply apparatus of a rotary substrate processing apparatus, which is provided with a nozzle moving means that is taken out once and moved to a discharge position above the substrate, each set of a nozzle and the tube is connected via a rigid support arm. And the nozzle moving means for individually supporting the respective supporting arms so as to be rotatable, and an arm for moving a desired one of the arm rotating supports to a predetermined position laterally of the substrate. By engaging the selective moving means and the support arm moved to the predetermined position by the arm selective moving means at the side of the substrate, the support arm is moved to a predetermined position apart from above the nozzle. A centering engagement mechanism that regulates a rotation center position so as to rotate around a defined rotation center, and a support arm that is centered by the centering engagement mechanism engages with the side of the substrate to rotate. Then, the nozzle supported by the support arm is composed of arm rotating means for moving the nozzle to a discharge position and a standby position deviated from above the substrate.

【0007】また、請求項3に係る発明の回転式基板処
理装置の処理液供給装置は、上述のような目的を達成す
るために、回転可能に支持された基板に処理液を供給す
る複数のノズルと、そのノズルと処理液貯留部とを接続
する複数のチューブと、そのチューブに接触してその内
部の処理液の温度を一定化する温調配管と、ノズルのう
ち、所望のノズルを択一的に取り出して前記基板の上方
の吐出位置に移動するノズル移動手段とを備えた回転式
基板処理装置の処理液供給装置において、ノズルとチュ
ーブとの組の各々を剛性の支持アームを介して支持し、
前記ノズル移動手段を、支持アームそれぞれを基板の側
方の個別の所定位置を中心に回転自在に支持するアーム
回転支持体と、支持アーム間を移動して、所望の支持ア
ームに基板の側方で択一的に係合するアーム選択機構
と、そのアーム選択機構により基板の側方で係合した支
持アームを回転させて、当該支持アームが支持するノズ
ルを、吐出位置と基板の上方から外れた待機位置とに移
動させるアーム回転手段とから構成する。
Further, in order to achieve the above-mentioned object, the processing liquid supply apparatus for the rotary substrate processing apparatus according to the third aspect of the present invention supplies a plurality of processing liquids to the rotatably supported substrates. A nozzle, a plurality of tubes that connect the nozzle to the processing liquid storage unit, a temperature control pipe that contacts the tubes to keep the temperature of the processing liquid inside the nozzle constant, and a desired nozzle is selected from the nozzles. In a processing liquid supply apparatus of a rotary substrate processing apparatus, which is provided with a nozzle moving means that is taken out once and moved to a discharge position above the substrate, each set of a nozzle and a tube is passed through a rigid support arm. Support,
The nozzle moving means is moved between an arm rotation supporting member that rotatably supports each of the supporting arms around an individual predetermined position on the side of the substrate and the supporting arms so that the nozzle moving means moves to a desired supporting arm laterally of the substrate. The arm selection mechanism that engages selectively with and the support arm that is engaged on the side of the substrate by the arm selection mechanism are rotated to disengage the nozzle supported by the support arm from the ejection position and above the substrate. Arm rotation means for moving the arm to the standby position.

【0008】[0008]

【作用】請求項1に係る発明の回転式基板処理装置の処
理液供給装置の構成によれば、複数のノズルとチューブ
の組ごとに支持アームに支持させ、それら複数の支持ア
ームのうち、所望のノズルとチューブを支持する支持ア
ームに対して、アーム回転手段を択一的に係合させ、ア
ーム回転手段により、アーム支持手段が規定する回転中
心周りで回転すると、前記支持アームが支持している前
記所望ノズルは所定位置へ移動する。
According to the structure of the processing liquid supply apparatus for the rotary substrate processing apparatus of the first aspect of the present invention, a set of a plurality of nozzles and tubes is made to be supported by a support arm, and a desired one of the plurality of support arms is supported. When the arm rotating means is selectively engaged with the supporting arm supporting the nozzle and the tube, and the arm rotating means rotates about the rotation center defined by the arm supporting means, the supporting arm supports the supporting arm. The desired nozzle is moved to a predetermined position.

【0009】このように前記ノズルの移動は、アーム支
持手段によって所定位置に回転中心が規定され、支持ア
ームによってノズルの前記回転中心からの距離が規定さ
れた状態での回転移動となるように動きが規制される。
したがって、所望のノズルを、中心と半径が規定された
回転運動にて正確に所定位置へ移動させることができ
る。
As described above, the movement of the nozzle moves so that the rotation center is defined at a predetermined position by the arm support means and the distance from the rotation center of the nozzle is defined by the support arm. Is regulated.
Therefore, the desired nozzle can be accurately moved to the predetermined position by the rotational movement whose center and radius are defined.

【0010】また、前記移動の際、ノズルとともにチュ
ーブも支持アームに支持されているので、移動時にチュ
ーブが変形させられることで生じる力は支持アームが受
けとめ、ノズルに力を与えないので、ノズルの姿勢が不
安定になったり、処理液の滴下位置がずれることがな
い。
Further, during the movement, since the tube is also supported by the support arm together with the nozzle, the support arm receives the force generated by the deformation of the tube during the movement and does not give the force to the nozzle. The posture does not become unstable, and the treatment liquid dropping position does not shift.

【0011】請求項2に係る発明の回転式基板処理装置
の処理液供給装置の構成によれば、複数のノズルとチュ
ーブの組ごとに支持アームに支持させ、それら複数の支
持アームのうち、所望のノズルとチューブを支持する支
持アームを選択手段により基板側方の所定位置へ移動さ
せ、ここで芯出し係合機構により回転中心を規定したの
ち、基板側方位置にてアーム回転手段を択一的に係合さ
せ、アーム回転手段により、前記支持アームは、芯出し
係合機構が規定する回転中心周りで回転し、前記支持ア
ームに支持されている前記所望ノズルは所定位置へ移動
する。
According to the structure of the processing liquid supply apparatus of the rotary substrate processing apparatus of the second aspect of the present invention, a set of a plurality of nozzles and tubes is supported by a support arm, and a desired one of the plurality of support arms is supported. The support arm for supporting the nozzle and the tube is moved to a predetermined position on the side of the substrate by the selecting means, and the center of rotation is defined by the centering and engaging mechanism, and then the arm rotating means is selected at the side of the substrate. And the support arm is rotated about the center of rotation defined by the centering engagement mechanism by the arm rotating means, and the desired nozzle supported by the support arm is moved to a predetermined position.

【0012】このように前記ノズルの移動は、芯出し係
合機構によって基板側方の所定位置に回転中心が規定さ
れ、支持アームによってノズルの前記回転中心からの距
離が規定された状態での回転移動となるように動きが規
制される。したがって、所望のノズルを、中心と半径が
規定された回転運動にて正確に所定位置へ移動させるこ
とができる。
As described above, the nozzle is moved in such a manner that the center of rotation defines the center of rotation at a predetermined position on the side of the substrate by the centering engagement mechanism, and the distance from the center of rotation of the nozzle is defined by the support arm. Movement is regulated so that it can be moved. Therefore, the desired nozzle can be accurately moved to the predetermined position by the rotational movement whose center and radius are defined.

【0013】また、前記移動の際、ノズルとともにチュ
ーブも支持アームに支持されているので、移動時にチュ
ーブが変形させられることで生じる力は支持アームが受
けとめ、ノズルに力を与えないので、ノズルの姿勢が不
安定になったり、処理液の滴下位置がずれることがな
い。
Further, during the movement, since the tube is also supported by the support arm together with the nozzle, the support arm receives the force generated by the deformation of the tube during the movement, and does not give the force to the nozzle. The posture does not become unstable, and the treatment liquid dropping position does not shift.

【0014】請求項3に係る発明の回転式基板処理装置
の処理液供給装置の構成によれば、複数のノズルとチュ
ーブの組ごとに支持アームに支持させ、これら各支持ア
ームは、各々アーム回転支持体で基板側方の各所定位置
を回転中心として回転自在に支持されているので、それ
ら複数の支持アームのうち、所望のノズルとチューブを
支持する支持アームに対して、基板側方の位置でアーム
選択機構が択一的に係合させ、アーム選択機構により、
アーム回転支持体が規定する回転中心周りで回転し、こ
の支持アームが支持している前記所望ノズルは所定位置
へ移動する。
According to the structure of the processing liquid supply device of the rotary substrate processing apparatus of the third aspect of the present invention, each set of a plurality of nozzles and tubes is supported by the support arm, and each of the support arms rotates the arm. Since the support body is rotatably supported around each predetermined position on the side of the substrate as a rotation center, the position on the side of the substrate with respect to the support arm supporting the desired nozzle and tube among the plurality of support arms. The arm selection mechanism engages with the
The arm rotation support rotates about a rotation center defined by the arm rotation support, and the desired nozzle supported by the support arm moves to a predetermined position.

【0015】このように前記ノズルの移動は、アーム回
転支持体によって基板側方の所定位置に回転中心が規定
され、支持アームによってノズルの前記回転中心からの
距離が規定された状態での回転移動となるように動きが
規制される。したがって、所望のノズルを、中心と半径
が規定された回転運動にて正確に所定位置へ移動させる
ことができる。
As described above, the movement of the nozzle is such that the rotation center is defined by the arm rotation support at a predetermined position on the side of the substrate, and the distance from the rotation center of the nozzle is defined by the support arm. The movement is regulated so that Therefore, the desired nozzle can be accurately moved to the predetermined position by the rotational movement whose center and radius are defined.

【0016】また、前記移動の際、ノズルとともにチュ
ーブも支持アームに支持されているので、移動時にチュ
ーブが変形させられることで生じる力は支持アームが受
けとめ、ノズルに力を与えないので、ノズルの姿勢が不
安定になったり、処理液の滴下位置がずれることがな
い。
Further, during the movement, since the tube is also supported by the support arm together with the nozzle, the force generated by the deformation of the tube during the movement is received by the support arm and does not give a force to the nozzle. The posture does not become unstable, and the treatment liquid dropping position does not shift.

【0017】[0017]

【実施例】図1は、本発明に係る回転式基板処理装置の
処理液供給装置の第1実施例を示す一部切欠側面図、図
2は平面図、および、図3は、要部の一部切欠側面図で
あり、回転可能に支持された半導体基板Wに処理液の一
例であるフォトレジスト液を供給する複数のノズル1…
それぞれと処理液貯留部Tとがチューブ2を介して接続
されるとともに、チューブ2…それぞれが、その内部の
処理液の温度を一定化する恒温水を流通させる温調配管
3で覆われ、そして、ノズル1…のうち、所望のノズル
1を択一的に取り出して基板Wの回転中心近くの上方に
設定した吐出位置と、基板Wの上方から外れた待機位置
とにわたって移動するノズル移動手段が備えられ、処理
液供給装置が構成されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partially cutaway side view showing a first embodiment of a processing liquid supply apparatus for a rotary substrate processing apparatus according to the present invention, FIG. 2 is a plan view, and FIG. FIG. 3 is a partially cutaway side view showing a plurality of nozzles 1 for supplying a photoresist liquid, which is an example of a processing liquid, to a semiconductor substrate W rotatably supported.
Each of them and the treatment liquid storage portion T are connected via a tube 2, and each of the tubes 2 ... Is covered with a temperature control pipe 3 for circulating constant temperature water that keeps the temperature of the treatment liquid therein, and Of the nozzles 1, ..., a desired nozzle 1 is selectively taken out and a nozzle moving means that moves between a discharge position set above the vicinity of the rotation center of the substrate W and a standby position deviated from above the substrate W is provided. The processing liquid supply device is provided.

【0018】前記ノズル1…それぞれは、温調配管3の
一部に兼用構成される剛性の高い金属パイプ3aの先端
に設けられ、チューブ2の先端側が金属パイプ3aの内
部に挿通支持されている。また、金属パイプ3aの内部
には戻りチューブ5が挿通されており、金属パイプ3a
内に供給された恒温水がチューブ2内の処理液を一定温
度に保温した後、戻りチューブ5を介して回収されるよ
うになっている。なお、恒温水は前記とは逆向きの流れ
に、すなわち、前記戻りチューブ5を通して温調配管内
に供給するようにしてもよい。
Each of the nozzles 1 ... Is provided at the tip of a highly rigid metal pipe 3a which is also used as a part of the temperature control pipe 3, and the tip side of the tube 2 is inserted and supported inside the metal pipe 3a. . Further, the return tube 5 is inserted through the inside of the metal pipe 3a.
The constant temperature water supplied inside keeps the treatment liquid in the tube 2 at a constant temperature, and then is recovered via the return tube 5. The constant temperature water may be supplied in the opposite direction to the above, that is, may be supplied into the temperature control pipe through the return tube 5.

【0019】前記金属パイプ3aの基部には支持ブロッ
ク6が一体的に取り付けられるとともに、この支持ブロ
ック6の一端側に、金属製の筒軸7が一体的に連接さ
れ、これら金属パイプ3a、支持ブロック6、筒軸7に
より、ノズル1とチューブ2を支持する剛性の支持アー
ム4が構成される。また、温調配管3は、金属パイプ3
a、支持ブロック6、筒軸7、戻りチューブ5により構
成される。筒軸7の下端には、温調配管3を構成する恒
温水供給用チューブ8が接続され、この恒温水供給用チ
ューブ8内に処理液供給用チューブ2および戻りチュー
ブ5が挿通されている。恒温水供給用チューブ8は、図
示しない恒温水供給源に接続されている。
A support block 6 is integrally attached to the base of the metal pipe 3a, and a metal cylinder shaft 7 is integrally connected to one end of the support block 6 to support the metal pipe 3a and the support. The block 6 and the cylinder shaft 7 constitute a rigid support arm 4 that supports the nozzle 1 and the tube 2. The temperature control pipe 3 is a metal pipe 3
a, a support block 6, a cylinder shaft 7, and a return tube 5. At the lower end of the cylindrical shaft 7, a constant temperature water supply tube 8 that constitutes the temperature control pipe 3 is connected, and the processing liquid supply tube 2 and the return tube 5 are inserted into the constant temperature water supply tube 8. The constant temperature water supply tube 8 is connected to a constant temperature water supply source (not shown).

【0020】そして、各支持アーム4…の筒軸7は、そ
れぞれ、アーム支持手段を構成するアーム回転支持体9
に筒軸7の軸芯を中心として回転可能に支持される。ま
た、各アーム回転支持体9…は共通の可動フレーム10
にそれぞれのガイドレール11を介してそれぞれ垂直方
向に昇降可能に一直線状に並列支持されている。
The cylinder shafts 7 of the support arms 4 ... Respectively support the arm rotation support 9 which constitutes arm support means.
Is rotatably supported around the axis of the cylindrical shaft 7. Further, each arm rotation support 9 ... Is a common movable frame 10
Further, they are supported in parallel in a straight line so as to be vertically movable via the respective guide rails 11.

【0021】可動フレーム10は、回転式基板処理装置
の装置フレーム12(不動)にガイドレール13を介し
て水平方向に移動可能に支持され、可動フレーム10に
設けたラック14は、正逆転可能な電動モータ15で駆
動されるピニオン16と咬合されており、電動モータ1
5の正逆駆動によってアーム回転支持体9をその並列方
向に移動するようにアーム選択移動手段が構成されてい
る。
The movable frame 10 is supported by the apparatus frame 12 (immovable) of the rotary substrate processing apparatus so as to be horizontally movable via the guide rails 13, and the rack 14 provided on the movable frame 10 can be rotated forward and backward. It is engaged with the pinion 16 driven by the electric motor 15,
The arm selection moving means is configured to move the arm rotation support 9 in the parallel direction by the forward and reverse drive of 5.

【0022】アーム回転支持体9の側部には、直列に連
結した一対のエアシリンダ17a,17bによって垂直
方向に移動される昇降枠18が設けられるとともに、こ
の昇降枠18に、エアシリンダ19によって垂直方向に
移動される可動ブラケット20が設けられている。可動
ブラケット20の上部には、所定位置の回転中心P周り
で回転可能な支軸21aが設けられ、支軸21aの下部
には回転中心P周りで回転可能に駆動アーム21が設け
られている。
An elevating frame 18 which is vertically moved by a pair of air cylinders 17a and 17b connected in series is provided on a side portion of the arm rotation support 9, and the elevating frame 18 is connected to the elevating frame 18 by an air cylinder 19. A movable bracket 20 is provided which is movable in the vertical direction. A support shaft 21a that is rotatable around a rotation center P at a predetermined position is provided on the movable bracket 20, and a drive arm 21 is provided below the support shaft 21a so as to be rotatable around the rotation center P.

【0023】各支持アーム4…における支持ブロック6
の上面には、筒軸7の軸心上に位置して円錐状の係合凹
部22が形成されるとともに、それからノズル1側に離
れた位置に係合ピン23が突設されている。
A support block 6 in each support arm 4 ...
A conical engagement concave portion 22 is formed on the upper surface of the cylinder shaft 7 on the axial center of the cylinder shaft 7, and an engagement pin 23 is provided at a position away from the concavity concave portion 22 on the nozzle 1 side.

【0024】他方、駆動アーム21の下面には、回転中
心Pと同軸に位置して円錐状の係合突起24が突設され
るとともに、その回転中心Pから離れて係合ピン23に
対応する係合孔25が形成されている。そして、任意に
選択されたひとつの支持アーム4が、前記可動フレーム
10、電動モータ15等によりなるアーム選択移動手段
によって、支持アーム4の筒軸7の軸芯が駆動アーム2
1の回転中心Pの直下に位置する所定の位置へ移動させ
られたとき、その支持アーム4に対して駆動アーム21
を下降させることで、この支持アーム4の係合凹部22
と係合ピン23とに駆動アーム21の係合突起24と係
合孔25を夫々係合させて、駆動アーム21と支持アー
ム4とを一体に係合保持するとともに、支持アーム4の
筒軸7の軸芯が駆動アーム21の回転中心Pから水平方
向に位置ずれしないように位置決めする芯出し係合機構
が構成されている。
On the other hand, on the lower surface of the drive arm 21, a conical engagement projection 24 is provided coaxially with the center of rotation P so as to project from the center of rotation P and corresponds to the engagement pin 23. Engagement holes 25 are formed. Then, one arbitrarily selected support arm 4 is moved by the arm selecting and moving means including the movable frame 10 and the electric motor 15 so that the axis of the cylindrical shaft 7 of the support arm 4 is the drive arm 2.
When it is moved to a predetermined position located directly below the rotation center P of the drive arm 1, the drive arm 21 is moved with respect to the support arm 4.
By lowering the engaging recess 22 of the support arm 4.
The engaging projection 23 and the engaging hole 25 of the drive arm 21 are engaged with the engaging pin 23 to hold the drive arm 21 and the support arm 4 in one body, and the cylindrical axis of the support arm 4 is retained. A centering engagement mechanism that positions the shaft 7 of the drive arm 21 so as not to be displaced in the horizontal direction from the rotation center P of the drive arm 21 is configured.

【0025】また、駆動アーム21の支軸21aが可動
ブラケット20に設置した正逆転可能な電動モータ26
にタイミングベルト27を介して連動連結されており、
駆動アーム21を正逆転することにより、前述のように
係合保持した支持アーム4を所定位置に規定した回転中
心P周りに回転させ、当該支持アーム4のノズル1を基
板Wの側方に外れた待機位置と基板中心近くの吐出位置
とにわたって移動させるようにアーム回転手段が構成さ
れている。
The support shaft 21a of the drive arm 21 is mounted on the movable bracket 20 and is capable of rotating in the forward and reverse directions.
Are linked to each other via a timing belt 27,
By rotating the drive arm 21 forward and backward, the support arm 4 engaged and held as described above is rotated around the rotation center P defined at a predetermined position, and the nozzle 1 of the support arm 4 is dislocated to the side of the substrate W. The arm rotating means is configured to move over the standby position and the discharge position near the center of the substrate.

【0026】以上の構成による処理液供給のための動作
につき、次に説明する。 (1)初期状態では、図1および図2に実線で示すよう
に、すべてのノズル1は基板Wの側方に外れた待機位置
に後退しており、かつ、アーム回転支持体9も下降位置
に待機している。下降位置Lに待機している各支持アー
ム4は、支持ブロック6の下面に備えた位置決め突起2
8と可動フレーム10の上面に備えた位置決め凹部29
との係合により一定姿勢に位置決め保持されている。こ
の待機状態では、各ノズル1は固定位置に設けられた乾
燥防止用カップ30に上方より突入されて湿潤雰囲気中
に置かれる。 (2)処理液供給に際しては、先ず、所望するノズル1
の支持アーム4が回転中心P、すなわち、駆動アーム2
1の直下位置にくるように、電動モータ15により可動
フレーム10を駆動する。 (3)次に、図4の一部切欠側面図に示すように、エア
シリンダ19が伸長作動して可動ブラケット20を下降
し、これに伴う駆動アーム21の下降によって支持アー
ム4を駆動アーム21に係合する。これによって、使用
するノズル1が基板上の吐出位置に位置するよう支持ア
ーム4が回転させられる時の、回転中心となる筒軸7
が、駆動アーム21の回転中心Pと一致するように位置
決めされる。 (4)その後に、エアシリンダ17a,17bを共に伸
長作動して昇降枠18を上昇させる。その初期において
は、昇降枠18に設けた当接部31がアーム回転支持体
9の上端突起32に下方から当接し、これによって支持
アーム4は駆動アーム21と昇降枠18の当接部31と
で上下にクランプ固定される。このクランプ状態で更に
昇降枠18を上昇し、図5の一部切欠側面図に示すよう
に、支持アーム4をアーム回転支持体9と共に上限
(H)まで上昇させる。 (5)次に、電動モータ26を正転し、駆動アーム21
を図2における時計方向に所定角度だけ回転し、ノズル
1を基板W上方の所定の吐出位置まで回転移動させる。 (6)次に、エアシリンダ17a,17bの片方のみを
短縮作動して、ノズル1を基板W上方において所定の供
給高さ(F)にまで下降させ、この状態で回転前ないし
低速回転し始めた基板W上に所定量の処理液を滴下供給
し、均一に回転塗布させるように、ただちに基板を高速
回転させる。 (7)処理液供給が完了すると、短縮していた片方のエ
アシリンダを再び伸長して支持アーム4およびノズル1
を基板W上方の所定高さ(H)にまで上昇退避させ、そ
の後、電動モータ26を逆転して支持アーム4を待機位
置まで後退回転させ、支持アーム4が待機位置にある状
態で、エアシリンダ17a,17bを共に短縮作動させ
て昇降枠18を下限まで下降させるとともにエアシリン
ダ19を短縮作動させ、これにより可動ブラケット20
および駆動アーム21を上昇復帰させ、駆動アーム21
と支持アーム4との係合を解除する。その後、使用する
ノズル1を変更する場合には、可動フレーム10を適宜
駆動して駆動アーム21に連結する支持アーム4を選択
して上記作動を行う。
The operation for supplying the processing liquid with the above configuration will be described below. (1) In the initial state, as shown by the solid lines in FIGS. 1 and 2, all the nozzles 1 are retracted to the standby position which is laterally displaced from the substrate W, and the arm rotation support 9 is also in the lowered position. Waiting for Each support arm 4 standing by at the lowered position L has a positioning protrusion 2 provided on the lower surface of the support block 6.
8 and the positioning recess 29 provided on the upper surface of the movable frame 10.
It is positioned and held in a fixed posture by engagement with. In this standby state, each nozzle 1 is thrust into the drying prevention cup 30 provided at a fixed position from above and placed in a wet atmosphere. (2) When supplying the processing liquid, first, the desired nozzle 1
The support arm 4 is the center of rotation P, that is, the drive arm 2
The movable frame 10 is driven by the electric motor 15 so as to come to a position directly below 1. (3) Next, as shown in the partially cutaway side view of FIG. 4, the air cylinder 19 is extended and the movable bracket 20 is lowered, and the drive arm 21 is lowered accordingly. Engage with. As a result, when the support arm 4 is rotated so that the nozzle 1 to be used is located at the ejection position on the substrate, the cylindrical shaft 7 that serves as a rotation center.
Are positioned so as to coincide with the rotation center P of the drive arm 21. (4) After that, the air cylinders 17a and 17b are both extended to raise the elevating frame 18. In the initial stage, the abutment portion 31 provided on the elevating frame 18 abuts on the upper end protrusion 32 of the arm rotation support 9 from below, whereby the support arm 4 becomes the drive arm 21 and the abutting portion 31 of the elevating frame 18. It is clamped up and down with. In this clamped state, the elevating frame 18 is further raised to raise the support arm 4 together with the arm rotation support 9 to the upper limit (H) as shown in the partially cutaway side view of FIG. (5) Next, the electric motor 26 is normally rotated to drive the drive arm 21.
2 is rotated clockwise by a predetermined angle, and the nozzle 1 is rotationally moved to a predetermined ejection position above the substrate W. (6) Next, only one of the air cylinders 17a, 17b is shortened to lower the nozzle 1 to a predetermined supply height (F) above the substrate W, and in this state, start pre-rotation or low-speed rotation. A predetermined amount of the treatment liquid is dropped and supplied onto the substrate W, and the substrate is immediately rotated at a high speed so that the substrate is uniformly spin-coated. (7) When the supply of the processing liquid is completed, the shortened one air cylinder is extended again to support arm 4 and nozzle 1.
Is lifted and retracted to a predetermined height (H) above the substrate W, and then the electric motor 26 is reversely rotated to retract and rotate the support arm 4 to the standby position. With the support arm 4 in the standby position, the air cylinder 17a and 17b are both shortened to lower the elevating frame 18 to the lower limit and the air cylinder 19 is shortened, whereby the movable bracket 20 is moved.
And the drive arm 21 is returned to the ascending position, and the drive arm 21
And the support arm 4 are disengaged. After that, when the nozzle 1 to be used is changed, the movable frame 10 is appropriately driven to select the support arm 4 connected to the drive arm 21, and the above operation is performed.

【0027】図6は、本発明に係る回転式基板処理装置
の処理液供給装置の第2実施例を示す側面図であり、第
1実施例と異なるところは次の通りである。すなわち、
支持アーム4における筒軸7の下端に、駆動アーム21
に芯出し係合される連結アーム40が備えられるととも
に、駆動アーム21と共働で筒軸7をクランプする当接
部41が、昇降枠20に設けたエアシリンダ42によっ
て独立的に上下駆動されるように構成されている。他の
構成は第1実施例と同じであり、同じ図番を付すことに
より、その説明は省略する。
FIG. 6 is a side view showing a second embodiment of the processing liquid supply apparatus of the rotary substrate processing apparatus according to the present invention. The difference from the first embodiment is as follows. That is,
The drive arm 21 is attached to the lower end of the cylinder shaft 7 of the support arm 4.
Is provided with a connecting arm 40 that is centered and engaged with the drive arm 21, and an abutting portion 41 that cooperates with the drive arm 21 to clamp the cylinder shaft 7 is independently moved up and down by an air cylinder 42 provided in the elevating frame 20. Is configured to. The other structure is the same as that of the first embodiment, and the description thereof will be omitted by giving the same drawing numbers.

【0028】図7は、本発明に係る回転式基板処理装置
の処理液供給装置の第3実施例を示す側面図、図8は平
面図、図9は要部の断面図であり、第1実施例と異なる
ところは次の通りである。すなわち、ノズル1およびチ
ューブ2を支持した複数の支持アーム4がそれぞれ異な
った所定位置に規定された回転中心Q1 ,Q2 ,Q3 周
りに回転自在に並んで設けられるとともに、支持アーム
4の基部に連接した筒軸7を回転可能に支持したアーム
回転支持体9が、装置フレーム50にガイドレール51
を介して昇降可能に支持され、また、これら支持アーム
4群の側部には、使用するノズル1を選択する駆動アー
ム21が一定の中心R周りに回転可能に設けられてい
る。
FIG. 7 is a side view showing a third embodiment of the processing liquid supply apparatus for a rotary substrate processing apparatus according to the present invention, FIG. 8 is a plan view, and FIG. 9 is a sectional view of a main part. The difference from the embodiment is as follows. That is, a plurality of support arms 4 supporting the nozzle 1 and the tube 2 are rotatably provided side by side around rotation centers Q1, Q2, Q3 defined at different predetermined positions, and are connected to the base of the support arm 4. The arm rotation support 9 that rotatably supports the cylindrical shaft 7 is attached to the device frame 50 by the guide rail 51.
A drive arm 21 for selecting the nozzle 1 to be used is rotatably provided around a certain center R on the side of the support arm 4 group.

【0029】駆動アーム21の基部に備えられた支軸5
2が、直列に連結された一対のエアシリンダ17a,1
7bによって昇降される昇降枠18に前記中心R周りに
回転可能に支持されるとともに、この支軸52から延出
したアーム53と昇降枠18に設置した電動モータ26
とがリンク機構54を介して連動連結され、モータ26
の正逆転によって駆動アーム21が支持アーム4群の上
方を横断移動するように構成されている。
Support shaft 5 provided at the base of drive arm 21
2 is a pair of air cylinders 17a, 1 connected in series
An arm 53 extending from the support shaft 52 and an electric motor 26 installed on the elevating frame 18 are rotatably supported by the elevating frame 18 that is moved up and down by 7b.
Are linked together via a link mechanism 54, and the motor 26
The drive arm 21 is configured to traverse above the support arm 4 group by the forward and reverse rotations of.

【0030】各支持アーム4における基部近くの上部に
はV溝付きのローラ55が縦軸周りに回転自在に取り付
けられるとともに、駆動アーム21の下部にはエアシリ
ンダ56によってアーム長手方向に出退可能に左右一対
のガイドレール57が設けられ、前方へ進出移動された
ガイドレール57が前記ローラ55に係合するように構
成されている。他の構成は第1実施例と同じであり、同
じ図番を付すことによその説明は省略する。
A roller 55 with a V-groove is rotatably attached to the upper portion of each support arm 4 near the base portion so as to be rotatable about the vertical axis, and can be retracted in the longitudinal direction of the arm by an air cylinder 56 at the lower portion of the drive arm 21. A pair of left and right guide rails 57 are provided in the guide rail 57, and the guide rails 57 that are moved forward and are engaged with the rollers 55. The other structure is the same as that of the first embodiment, and the explanation is omitted by giving the same drawing numbers.

【0031】この第3実施例によれば次のように動作す
る。 (1)下降位置(L)で待機している支持アーム4群の
上で駆動アーム21が回転し、これにより使用するノズ
ル1の支持アーム4を選択し、ガイドレール57を進出
移動させて対象となる支持アーム4のローラ55を係合
支持する。 (2)両エアシリンダ17a,17bを共に伸長させて
昇降枠18を上昇させ、係合選択した支持アーム4を上
限(H)まで移動させる。 (3)次に、駆動アーム21を回転駆動して係合支持し
た支持アーム4のノズル1を基板W上方の吐出位置まで
移動させる。この場合、支持アーム4と駆動アーム21
との回転中心の差異がガイドレール57とローラ55と
の相対転動により吸収される。 (4)その後、一方のエアシリンダ17aを短縮作動さ
せることにより支持アーム4を所定量だけ下降させ、基
板Wに対して所定の供給高さ(F)にセットする。
According to the third embodiment, it operates as follows. (1) The drive arm 21 rotates on the group of support arms 4 standing by at the lowered position (L), whereby the support arm 4 of the nozzle 1 to be used is selected and the guide rail 57 is advanced to move the target. The roller 55 of the support arm 4 is engaged and supported. (2) Both air cylinders 17a and 17b are extended together to raise the elevating frame 18, and the support arm 4 selected for engagement is moved to the upper limit (H). (3) Next, the drive arm 21 is rotationally driven to move the nozzle 1 of the support arm 4 that is engaged and supported to the ejection position above the substrate W. In this case, the support arm 4 and the drive arm 21
The difference in the center of rotation between and is absorbed by the relative rolling of the guide rail 57 and the roller 55. (4) After that, one of the air cylinders 17a is shortened to lower the support arm 4 by a predetermined amount, and the substrate W is set to a predetermined supply height (F).

【0032】上記第1から第3の実施例では、ノズル1
およびチューブ2を支持する支持アーム4の一部である
金属パイプ3aで兼用し、チューブ2を金属パイプ3a
の内部すなわち支持アーム4の内部に納めた構造として
いるが、温調配管3とは別体の専用の支持アームを設け
て構成しても良い。
In the first to third embodiments, the nozzle 1
And the metal pipe 3a, which is a part of the support arm 4 that supports the tube 2, also serves as the metal pipe 3a.
However, the structure may be such that a dedicated support arm separate from the temperature control pipe 3 is provided.

【0033】[0033]

【発明の効果】請求項1に係る発明の回転式基板処理装
置の処理液供給装置によれば、複数のノズルとチューブ
の組ごとに支持アームに支持させ、それら複数の支持ア
ームのうち、所望のノズルとチューブを支持する支持ア
ームに対して、アーム回転手段を択一的に係合させ、ア
ーム支持手段が規定する回転中心周りで回転させて前記
所望ノズルが所定位置へ移動するようにしているので、
前記ノズルの移動は、中心と半径が規定された回転運動
となるように動きが規制された移動であるから、所望の
ノズルを正確に所定位置へ移動させることができる。ま
た、前記移動の際、ノズルとともにチューブも支持アー
ムに支持させているので、移動時にチューブが変形させ
られることで生じる力は支持アームが受けとめてノズル
に与えないことも相まって、ノズルを所定の姿勢で確実
に所定の吐出位置に移動でき、処理精度を向上できるよ
うになった。しかも、選択した支持アームを所定の回転
中心周りに回転させるから、配管の取り廻しに対する制
約が少なく、処理液供給用のチューブおよびこれに接触
する温調配管の太さや材質を任意に設定して良好な処理
液の温調を行うことができるようになった。更に、支持
アームの回転によってもたらされるチューブの変形は所
定の回転中心周りのねじり変形に限られるから、曲げ変
形とねじり変形とを受ける従来手段に比較してチューブ
内の容積変形が少なく、処理液供給用のチューブの変形
に起因する処理液の不測の滴下を回避できる。
According to the processing liquid supply apparatus of the rotary substrate processing apparatus of the first aspect of the present invention, a set of a plurality of nozzles and tubes is supported by a support arm, and a desired one of the plurality of support arms is supported. The arm rotation means is selectively engaged with the support arm supporting the nozzle and the tube of FIG. 1 and is rotated around the rotation center defined by the arm support means to move the desired nozzle to a predetermined position. Because
Since the movement of the nozzle is a movement whose movement is restricted so as to be a rotational movement having a center and a radius defined, a desired nozzle can be accurately moved to a predetermined position. In addition, since the tube is supported by the support arm together with the nozzle during the movement, the force generated by the deformation of the tube during the movement is received by the support arm and is not applied to the nozzle. With this, it is possible to reliably move to a predetermined ejection position and improve the processing accuracy. Moreover, since the selected support arm is rotated around a predetermined rotation center, there are few restrictions on the handling of the piping, and the thickness and material of the processing liquid supply tube and the temperature control piping that comes into contact with the processing liquid supply tube can be set arbitrarily. It has become possible to perform good temperature control of the processing liquid. Further, since the deformation of the tube caused by the rotation of the support arm is limited to the torsional deformation around the predetermined rotation center, the volumetric deformation in the tube is less than that in the conventional means that undergoes bending deformation and torsional deformation, and the treatment liquid It is possible to avoid accidental dropping of the processing liquid due to the deformation of the supply tube.

【0034】また、請求項2に係る発明の回転式基板処
理装置の処理液供給装置によれば、前述の請求項1に係
る発明の回転式基板処理装置の処理液供給装置と同様
に、ノズルを所定の姿勢で確実に所定の吐出位置に移動
でき、処理精度を向上できるとともに、良好な処理液の
温調を行うことができ、かつ、処理液供給用のチューブ
の変形に起因する処理液の不測の滴下を回避できる。そ
のうえ、アーム回転手段により、基板の側方、すなわ
ち、基板の上方から外れた位置で係合した状態で支持ア
ームを回転して吐出位置と待機位置とに変位するから、
ノズルの移動を、基板上にゴミを持ち込むことなく行う
ことができるようになり、一層処理品質を向上できるよ
うになった。
Further, according to the processing liquid supply apparatus of the rotary substrate processing apparatus of the invention of claim 2, the nozzle is the same as the processing liquid supply apparatus of the rotary substrate processing apparatus of the invention of claim 1 described above. Can be reliably moved to a predetermined discharge position in a predetermined posture, processing accuracy can be improved, good temperature control of the processing liquid can be performed, and the processing liquid caused by deformation of the processing liquid supply tube It is possible to avoid accidental dripping. Moreover, since the arm rotation means rotates the support arm laterally of the substrate, that is, in a state of engaging at a position disengaged from above the substrate, the support arm is displaced to the discharge position and the standby position,
The nozzle can be moved without bringing dust on the substrate, and the processing quality can be further improved.

【0035】また、請求項3に係る発明の回転式基板処
理装置の処理液供給装置によれば、前述の請求項1に係
る発明の回転式基板処理装置の処理液供給装置と同様
に、ノズルを所定の姿勢で確実に所定の吐出位置に移動
でき、処理精度を向上できるとともに、良好な処理液の
温調を行うことができ、かつ、処理液供給用のチューブ
の変形に起因する処理液の不測の滴下を回避できる。そ
のうえ、アーム選択機構により、基板の側方、すなわ
ち、基板の上方から外れた位置で係合した状態で支持ア
ームを回転して吐出位置と待機位置とに変位するから、
ノズルの移動を、基板上にゴミを持ち込むことなく行う
ことができるようになり、一層処理品質を向上できるよ
うになった。
Further, according to the processing liquid supply apparatus of the rotary substrate processing apparatus of the invention according to claim 3, the nozzle is the same as the processing liquid supply apparatus of the rotary substrate processing apparatus of the invention according to claim 1 described above. Can be reliably moved to a predetermined discharge position in a predetermined posture, processing accuracy can be improved, good temperature control of the processing liquid can be performed, and the processing liquid caused by deformation of the processing liquid supply tube It is possible to avoid accidental dripping. In addition, the arm selection mechanism causes the support arm to rotate and be displaced to the discharge position and the standby position while being engaged at the side of the substrate, that is, at the position disengaged from above the substrate.
The nozzle can be moved without bringing dust on the substrate, and the processing quality can be further improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】第1実施例の一部切欠側面図である。FIG. 1 is a partially cutaway side view of a first embodiment.

【図2】第1実施例の平面図である。FIG. 2 is a plan view of the first embodiment.

【図3】第1実施例の要部の一部切欠側面図である。FIG. 3 is a partially cutaway side view of a main part of the first embodiment.

【図4】支持アームが係合した状態の第1実施例の一部
切欠側面図である。
FIG. 4 is a partially cutaway side view of the first embodiment with a support arm engaged.

【図5】支持アームが上昇した状態の第1実施例の一部
切欠側面図である。
FIG. 5 is a partially cutaway side view of the first embodiment with the support arm raised.

【図6】第2実施例の一部切欠側面図である。FIG. 6 is a partially cutaway side view of the second embodiment.

【図7】第3実施例の一部切欠側面図である。FIG. 7 is a partially cutaway side view of the third embodiment.

【図8】第3実施例の平面図である。FIG. 8 is a plan view of the third embodiment.

【図9】第3実施例の要部の断面図である。FIG. 9 is a sectional view of an essential part of the third embodiment.

【符号の説明】[Explanation of symbols]

1…ノズル 2…チューブ 3…温調配管 4…支持アーム 9…アーム回転支持体 P…回転中心 W…基板 1 ... Nozzle 2 ... Tube 3 ... Temperature control pipe 4 ... Support arm 9 ... Arm rotation support P ... Rotation center W ... Substrate

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 G03F 7/30 502 7124−2H (72)発明者 加藤 洋 京都市伏見区羽束師古川町322番地 大日 本スクリーン製造株式会社洛西工場内 (72)発明者 大谷 正美 京都市伏見区羽束師古川町322番地 大日 本スクリーン製造株式会社洛西工場内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical indication location G03F 7/30 502 7124-2H (72) Inventor Hiroshi Kato 322 Hazushi Furukawacho, Fushimi-ku, Kyoto City Univ. Nihon Screen Manufacturing Co., Ltd.Rakusai Factory (72) Inventor Masami Otani 322 Hazushishi Furukawacho, Fushimi-ku, Kyoto Dainichi Screen Manufacturing Co., Ltd. Rakusai Factory

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 回転可能に支持された基板に処理液を供
給する複数のノズルと、 前記ノズルと処理液貯留部とを接続する複数のチューブ
と、 前記チューブに接触してその内部の処理液の温度を一定
化する温調配管と、 前記ノズルのうち、所望のノズルを択一的に取り出して
前記基板の上方の吐出位置に移動するノズル移動手段
と、 を備えた回転式基板処理装置の処理液供給装置におい
て、 前記ノズルと前記チューブとの組の各々を剛性の支持ア
ームを介して支持し、 前記ノズル移動手段を、 前記ノズルが吐出位置と前記基板の上方から外れた待機
位置とに変位するように、前記支持アームそれぞれを前
記ノズルの上方から外れた位置でかつ所定の位置に規定
された回転中心周りで回転可能に支持するアーム支持手
段と、 前記支持アームと択一的に係合して前記ノズルが吐出位
置と待機位置とに変位するように回転させるアーム回転
手段と、 から構成したことを特徴とする回転式基板処理装置の処
理液供給装置。
1. A plurality of nozzles for supplying a processing liquid to a rotatably supported substrate, a plurality of tubes connecting the nozzles and a processing liquid storage section, and a processing liquid inside the tubes in contact with the tubes. Of the rotary substrate processing apparatus including: a temperature control pipe for keeping the temperature of the substrate constant; and a nozzle moving unit that selectively takes out a desired nozzle from the nozzles and moves it to a discharge position above the substrate. In the processing liquid supply apparatus, each of the set of the nozzle and the tube is supported via a rigid support arm, and the nozzle moving means is provided at a discharge position where the nozzle is located and a standby position where the nozzle deviates from above the substrate. Arm supporting means for rotatably supporting each of the support arms rotatably around a rotation center defined at a position deviated from above the nozzle and the support arm; Process liquid supply apparatus of the rotary substrate processing apparatus, characterized in that the nozzle engages one coupled to each other is composed of an arm rotation means for rotating so as to be displaced in the standby position and the discharge position.
【請求項2】 回転可能に支持された基板に処理液を供
給する複数のノズルと、 前記ノズルと処理液貯留部とを接続する複数のチューブ
と、 前記チューブに接触してその内部の処理液の温度を一定
化する温調配管と、 前記ノズルのうち、所望のノズルを択一的に取り出して
前記基板の上方の吐出位置に移動するノズル移動手段
と、 を備えた回転式基板処理装置の処理液供給装置におい
て、 前記ノズルと前記チューブとの組の各々を剛性の支持ア
ームを介して支持し、 前記ノズル移動手段を、 前記支持アームそれぞれを個別に回転自在に支持するア
ーム回転支持体と、 前記アーム回転支持体のうちの所望のものを前記基板の
側方で所定位置へ移動させるアーム選択移動手段と、 そのアーム選択移動手段により所定位置へ移動させられ
た前記支持アームと前記基板の側方で係合することによ
り、その支持アームを、前記ノズルの上方から外れた位
置でかつ所定の位置に規定された回転中心周りで回転す
るように回転中心位置を規定する芯出し係合機構と、 前記芯出し係合機構によって芯出しされた前記支持アー
ムに前記基板の側方で係合して回転することで、当該支
持アームが支持するノズルを、吐出位置と前記基板の上
方から外れた待機位置とに移動させるアーム回転手段
と、 から構成したことを特徴とする回転式基板処理装置の処
理液供給装置。
2. A plurality of nozzles for supplying a treatment liquid to a rotatably supported substrate, a plurality of tubes connecting the nozzles and a treatment liquid storage section, and a treatment liquid inside the tubes in contact with the tubes. Of the rotary substrate processing apparatus including: a temperature control pipe for keeping the temperature of the substrate constant; and a nozzle moving unit that selectively takes out a desired nozzle from the nozzles and moves it to a discharge position above the substrate. In the treatment liquid supply apparatus, each of the set of the nozzle and the tube is supported via a rigid support arm, and the nozzle moving means is an arm rotation support member that individually rotatably supports each of the support arms. An arm selection moving means for moving a desired one of the arm rotation supports to a predetermined position laterally of the substrate, and the arm selection moving means moved to the predetermined position by the arm selection moving means. By engaging the support arm with the side of the substrate, the rotation center position is defined so as to rotate the support arm at a position deviated from above the nozzle and around a rotation center defined at a predetermined position. A centering engagement mechanism for rotating the nozzle supported by the support arm by engaging the support arm centered by the centering engagement mechanism and rotating the support arm laterally of the substrate. A processing liquid supply device for a rotary substrate processing apparatus, comprising: an arm rotating means for moving the substrate to a standby position which is separated from above the substrate.
【請求項3】 回転可能に支持された基板に処理液を供
給する複数のノズルと、 前記ノズルと処理液貯留部とを接続する複数のチューブ
と、 前記チューブに接触してその内部の処理液の温度を一定
化する温調配管と、 前記ノズルのうち、所望のノズルを択一的に取り出して
前記基板の上方の吐出位置に移動するノズル移動手段
と、 を備えた回転式基板処理装置の処理液供給装置におい
て、 前記ノズルと前記チューブとの組の各々を剛性の支持ア
ームを介して支持し、 前記ノズル移動手段を、 前記支持アームそれぞれを前記基板の側方の個別の所定
位置を中心に回転自在に支持するアーム回転支持体と、 前記支持アーム間を移動して、所望の支持アームに前記
基板の側方で択一的に係合するアーム選択機構と、 そのアーム選択機構により前記基板の側方で係合した支
持アームを回転させて、当該支持アームが支持するノズ
ルを、吐出位置と前記基板の上方から外れた待機位置と
に移動させるアーム回転手段と、 から構成したことを特徴とする回転式基板処理装置の処
理液供給装置。
3. A plurality of nozzles for supplying a treatment liquid to a rotatably supported substrate, a plurality of tubes connecting the nozzles and a treatment liquid storage section, and a treatment liquid inside the tubes in contact with the tubes. Of the rotary substrate processing apparatus including: a temperature control pipe for keeping the temperature of the substrate constant; and a nozzle moving unit that selectively takes out a desired nozzle from the nozzles and moves it to a discharge position above the substrate. In the processing liquid supply apparatus, each of the set of the nozzle and the tube is supported via a rigid support arm, and the nozzle moving means is arranged so that each of the support arms is centered on an individual predetermined position on a side of the substrate. An arm rotation support for rotatably supporting the arm, and an arm selection mechanism that moves between the support arms to selectively engage a desired support arm laterally of the substrate. And an arm rotating means for rotating the support arm engaged on the side of the substrate to move the nozzle supported by the support arm to a discharge position and a standby position deviated from above the substrate. A processing liquid supply device for a rotary substrate processing apparatus.
JP5096697A 1993-03-30 1993-03-30 Processing liquid supply device for rotary substrate processing equipment Expired - Fee Related JP2907676B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP5096697A JP2907676B2 (en) 1993-03-30 1993-03-30 Processing liquid supply device for rotary substrate processing equipment
KR1019940005751A KR0142807B1 (en) 1993-03-30 1994-03-22 Terating liquid supplying apparatus for a substrate spin treating apparatus
US08/220,915 US5514215A (en) 1993-03-30 1994-03-30 Treating liquid supplying apparatus for a substrate spin treating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5096697A JP2907676B2 (en) 1993-03-30 1993-03-30 Processing liquid supply device for rotary substrate processing equipment

Publications (2)

Publication Number Publication Date
JPH06291027A true JPH06291027A (en) 1994-10-18
JP2907676B2 JP2907676B2 (en) 1999-06-21

Family

ID=14171963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5096697A Expired - Fee Related JP2907676B2 (en) 1993-03-30 1993-03-30 Processing liquid supply device for rotary substrate processing equipment

Country Status (3)

Country Link
US (1) US5514215A (en)
JP (1) JP2907676B2 (en)
KR (1) KR0142807B1 (en)

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JP2000343016A (en) * 1999-04-06 2000-12-12 Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Gmbh Device for injecting plural media through plural nozzles for media
KR100436549B1 (en) * 2001-11-15 2004-06-16 한국디엔에스 주식회사 Spin coater apparatus
US7267723B2 (en) 2003-05-13 2007-09-11 Dainippon Screen Mfg. Co., Ltd. Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle
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US5514215A (en) 1996-05-07
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KR940022719A (en) 1994-10-21

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