JPH06289625A - Developing device - Google Patents

Developing device

Info

Publication number
JPH06289625A
JPH06289625A JP7549193A JP7549193A JPH06289625A JP H06289625 A JPH06289625 A JP H06289625A JP 7549193 A JP7549193 A JP 7549193A JP 7549193 A JP7549193 A JP 7549193A JP H06289625 A JPH06289625 A JP H06289625A
Authority
JP
Japan
Prior art keywords
substrate
developer
spin chuck
washing
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7549193A
Other languages
Japanese (ja)
Other versions
JP3211468B2 (en
Inventor
Shinichi Shimakawa
伸一 島川
Toshiyuki Watanabe
利幸 渡辺
Kazuhisa Ogasawara
和久 小笠原
Masaki Suzuki
正樹 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7549193A priority Critical patent/JP3211468B2/en
Publication of JPH06289625A publication Critical patent/JPH06289625A/en
Application granted granted Critical
Publication of JP3211468B2 publication Critical patent/JP3211468B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)

Abstract

PURPOSE:To miniaturize the device and to enhance its productivity by providing the device with a planar member which spreads the developer of a substrate, a mechanism for vacuum-sucking the rear surface of the substrate and rotating the substrate, a lifting mechanism and a washing mechanism. CONSTITUTION:The planar member 5 longer than the width of the substrate 1 and shorter than the width of the part of the outside frame of a receiving tray 7 is moved onto the surface of the substrate 1 by using rollers. The planar member 5 is scanned forward and backward in a direction A, by which the developer on the substrate 1 is spread. The vacuum suction to the receiving tray 7 is stopped and a spin chuck 11 is risen by an air cylinder 14 for lifting the spin chuck by which the substrate 1 is lifted and washing is started. Washing water is first dropped from a substrate washing nozzle 3. Simultaneously, the spin chuck 11 rotates to wash the developer 2 while sucking the substrate 1 by vacuum. The developer 2 is washed by ejecting the washing water upward from a rear surface nozzle 10 of the substrate. Further, the substrate 1 is rotated while the substrate is held sucked by the spin chuck 11, by which the washing water is dried.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、液晶用ガラス基板等の
製造工程におけるフォトリソ工程に用いられる現像装置
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a developing device used in a photolithography process in the manufacturing process of glass substrates for liquid crystals.

【0002】[0002]

【従来の技術】以下に従来の現像装置について説明す
る。
2. Description of the Related Art A conventional developing device will be described below.

【0003】図5は従来の現像装置に示すものである。
図5において、31は基板で、32は真空源で基板31
を吸着する。33はノズルで、現像液34を供給する。
35は外枠である。36は受皿で基板31を収容する。
37は板状部材である。
FIG. 5 shows a conventional developing device.
In FIG. 5, 31 is a substrate and 32 is a vacuum source.
Adsorb. A nozzle 33 supplies the developing solution 34.
Reference numeral 35 is an outer frame. Reference numeral 36 is a saucer for accommodating the substrate 31.
37 is a plate-shaped member.

【0004】以上のように構成された現像装置について
以下その動作について説明する。まず、基板31の裏面
を真空源32にて真空吸着させ、基板を収容する。次に
現像方法であるが、まず外部のノズル33より現像液3
4を落下させる。現像液34は外枠35により基板31
は外枠35により基板31の表面、基板31と受皿36
とのすきま37及び受皿36の表面に貯槽される。基板
31は受皿36の真空吸着されている。次に板状部材3
7を用いて基板31の表面上に移動させて、基板表面よ
り0.2〜0.5mmのギャップGを形成した後、板上部
材37のなが手方向に対して走査往復させることによ
り、基板31上の現像液を押し広げる。必要時間経過
後、真空吸着を停止、大気に戻し、受皿36の下部の突
き上げピン41を突き上げて基板31を持ち上げ、搬送
アーム42にて基板を水洗工程へ搬送する。
The operation of the developing device configured as described above will be described below. First, the back surface of the substrate 31 is vacuum-sucked by the vacuum source 32 to accommodate the substrate. Next, regarding the developing method, first, the developing solution 3 is discharged from the external nozzle 33.
Drop 4 The developer 34 is transferred to the substrate 31 by the outer frame 35
The outer frame 35 covers the surface of the substrate 31, the substrate 31 and the saucer 36.
It is stored in the clearance 37 and the surface of the tray 36. The substrate 31 is vacuum-adsorbed on the tray 36. Next, the plate member 3
7 is used to move the surface of the substrate 31 to form a gap G of 0.2 to 0.5 mm from the substrate surface, and then the plate member 37 is reciprocally scanned in the hand direction, The developer on the substrate 31 is spread. After the required time has passed, the vacuum suction is stopped, the atmosphere is returned to the atmosphere, the push-up pins 41 at the bottom of the tray 36 are pushed up to lift the substrate 31, and the substrate is transported by the transport arm 42 to the washing step.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、このよ
うな従来の現像装置の構成では水洗・乾燥を同じ場所で
行えないので、装置構成が大型になり生産性も低い。ま
た、基板を真空吸着した祭に現像液が基板裏面の端面に
回り込んで残り、搬送アームを汚す。
However, with such a conventional developing device structure, washing and drying cannot be performed at the same place, so that the device structure becomes large and the productivity is low. Further, when the substrate is vacuum-adsorbed, the developing solution wraps around and remains on the end face of the back surface of the substrate, and the transfer arm is soiled.

【0006】そこで、本発明は現像装置の小型化を図
り、生産性が高い省液現象装置を提供する。
Therefore, the present invention aims at downsizing the developing device and provides a liquid-saving phenomenon device having high productivity.

【0007】[0007]

【課題を解決するための手段】この目的を達成するため
に、本発明の現像装置は、基板を収容する受皿部と基板
表面との微小間隔を維持したまま基板上を走査して基板
の現像液を押し広げる板状部材と、受皿部の中央に基板
の裏面を真空吸着して回転させる機構と、さらに回転機
構を昇降させる機構と基板の表裏面を洗浄させる機構で
構成したものである。
In order to achieve this object, a developing device of the present invention develops a substrate by scanning the substrate while maintaining a minute gap between a tray portion for accommodating the substrate and the surface of the substrate. It is composed of a plate-shaped member for spreading the liquid, a mechanism for vacuum-adsorbing and rotating the back surface of the substrate at the center of the tray, a mechanism for moving the rotating mechanism up and down, and a mechanism for cleaning the front and back surfaces of the substrate.

【0008】[0008]

【作用】この構成によって、板状部材の往復運動により
極小液量で現像を行うことができ、さらに同じ装置で水
洗、乾燥も行うことができる。
With this structure, the reciprocating motion of the plate-like member enables development with a very small amount of liquid, and further washing and drying with the same apparatus.

【0009】[0009]

【実施例】以下本発明の一実施例について、図1〜図4
を参照しながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.
Will be described with reference to.

【0010】図1は全体の構成図である。1は基板であ
る。2は現像液である。3は基板表面洗浄ノズルであ
る。4は板状部材洗浄ノズルであり、5は板状部材であ
る。6は基板1を乾燥するノズルである。7は基板1を
収容する受皿であり、8は現像液2が供給される現像液
供給部である。9は真空吸着ノズル、10は基板裏面洗
浄ノズル、11はスピンチャック、12はモータ、14
はスピンチャック昇降用エアシリンダ、16は現像液タ
ンクであり、定量ポンプ15によって現像液2を現像液
供給部8に供給する。
FIG. 1 is an overall configuration diagram. 1 is a substrate. 2 is a developing solution. Reference numeral 3 is a substrate surface cleaning nozzle. Reference numeral 4 is a plate-shaped member cleaning nozzle, and 5 is a plate-shaped member. Reference numeral 6 is a nozzle for drying the substrate 1. Reference numeral 7 is a tray for accommodating the substrate 1, and 8 is a developing solution supply section to which the developing solution 2 is supplied. 9 is a vacuum suction nozzle, 10 is a substrate back surface cleaning nozzle, 11 is a spin chuck, 12 is a motor, 14
Is an air cylinder for raising and lowering the spin chuck, and 16 is a developer tank, and the developer 2 is supplied to the developer supply unit 8 by a metering pump 15.

【0011】以上のように構成された現像装置につい
て、図1〜図4を用いて、その動作を説明する。まず、
基板1の裏面を真空源9にて真空吸着させ受皿7を収容
する。
The operation of the developing device configured as described above will be described with reference to FIGS. First,
The back surface of the substrate 1 is vacuum-sucked by the vacuum source 9 to accommodate the tray 7.

【0012】次に現像方法について説明する。定量ポン
プ15より、現像液タンク16から現像液供給部8に現
像液2が供給される。現像液2は受皿7により基板1の
表面上に貯槽される。そして基板1の中より長く、受皿
7の外枠の部分の中より短い板状部材5をローラー23
を使って基板1の表面上に移動させて、基板表面より
0.2〜0.5mmのギャップを形成した後、板上部材5
をA方向に走査往復させることにより、基板1上の現像
液2を押し広げる(図2参照)。
Next, the developing method will be described. The developer 2 is supplied from the developer tank 16 to the developer supply unit 8 by the metering pump 15. The developing solution 2 is stored on the surface of the substrate 1 by the pan 7. The plate-like member 5 which is longer than the inside of the substrate 1 and shorter than the inside of the outer frame portion of the tray 7 is attached to the roller 23.
After moving to the surface of the substrate 1 by using, to form a gap of 0.2 to 0.5 mm from the substrate surface, the plate member 5
Is reciprocated in the direction A to spread the developer 2 on the substrate 1 (see FIG. 2).

【0013】そして、必要時間経過後受皿7への真空吸
着を停止、図3のようにそしてスピンチャック11には
真空吸着したまま、スピンチャック11を上昇させて基
板1を持ち上げる。そして水洗を始める。まず基板洗浄
ノズル3から洗浄水を落下させる。それと同時にスピン
チャック11は基板1を真空吸着したまま、回転し現像
液2を洗浄する。また基板裏面ノズル10から上に向け
て洗浄水を噴出して基板1の裏面の端に回り込んだ現像
液2を洗浄する。
Then, after the required time has passed, the vacuum suction on the tray 7 is stopped, and the spin chuck 11 is lifted to lift the substrate 1 as shown in FIG. Then start washing with water. First, cleaning water is dropped from the substrate cleaning nozzle 3. At the same time, the spin chuck 11 rotates while the substrate 1 is vacuum-adsorbed to wash the developing solution 2. In addition, cleaning water is jetted upward from the substrate backside nozzle 10 to clean the developer 2 that has flown around the edge of the backside of the substrate 1.

【0014】洗浄終了後に乾燥工程にはいる。図4のよ
うに基板1をスピンチャック11で基板吸着させたま
ま、回転し、洗浄水を乾燥させる。さらに基板1の中心
部分へ基板乾燥ノズル6をD方向に移動させてN2ガス
を吹きかけて、基板1上の水滴を除去して乾燥させる。
After the cleaning is completed, the drying process is started. As shown in FIG. 4, the substrate 1 is rotated while the substrate is adsorbed by the spin chuck 11, and the cleaning water is dried. Further, the substrate drying nozzle 6 is moved in the direction D to the central portion of the substrate 1 to blow N 2 gas to remove water droplets on the substrate 1 and dry the substrate 1.

【0015】[0015]

【発明の効果】同一装置内で現像・水洗・乾燥が行え
る。よって装置が小型になりスペースもとらず、生産性
も高くなる。また基板の裏面に回り込んだ現像液も洗浄
するので、基板の汚染の伝播がない。
EFFECT OF THE INVENTION Development, washing with water and drying can be performed in the same apparatus. As a result, the device becomes smaller, takes up less space, and productivity is increased. In addition, since the developer that has flowed around the back surface of the substrate is also washed, the contamination of the substrate does not propagate.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の現像装置の全体の構成を示すための図FIG. 1 is a diagram showing an overall configuration of a developing device of the present invention.

【図2】実施例における現像工程の動作説明のための図FIG. 2 is a diagram for explaining an operation of a developing process in the embodiment.

【図3】実施例における洗浄工程の動作説明のための図FIG. 3 is a diagram for explaining an operation of a cleaning process in the example.

【図4】従来例における乾燥工程の動作説明のための図FIG. 4 is a diagram for explaining an operation of a drying process in a conventional example.

【図5】従来の現像装置の構成を示す図FIG. 5 is a diagram showing a configuration of a conventional developing device.

【符号の説明】[Explanation of symbols]

1 基板 2 現像液 5 板状部材 13 外枠 1 substrate 2 developing solution 5 plate-like member 13 outer frame

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 正樹 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masaki Suzuki 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基板の導体パターンが形成されない面を
支持して、前記基板を収納するとともに前記基板上の現
像液を貯槽する外枠を備えた受皿部と、前記基板表面と
微小間隔を維持したまま前記基板上を走査して前記の基
板上の現像液を流動させる板状部材と、前記受皿中央に
開口部を設け、開口部に昇降可能かつ前記基板を水平支
持した状態で回転させる回転台と、受皿中央の開口部に
下方より前記の基板の裏面に向けて洗浄液を供給する基
板裏面洗浄液供給手段と、受皿部の上方より前記基板の
表面に向けて洗浄液を供給する基板表面洗浄液供給手段
とを備えたことを特徴とする現像装置。
1. A saucer part having an outer frame for supporting the surface of the substrate on which the conductor pattern is not formed and accommodating the substrate and storing a developing solution on the substrate, and maintaining a minute gap from the surface of the substrate. A plate-like member that allows the developer to flow on the substrate while still scanning, and an opening provided in the center of the tray so that the opening can be raised and lowered and the substrate is rotated while being horizontally supported. A pedestal, a substrate backside cleaning liquid supply means for supplying a cleaning liquid from below to the opening in the center of the saucer, and a substrate surface cleaning liquid supply from above the saucer part to the surface of the substrate. And a developing device.
【請求項2】 基板表面洗浄液供給手段が現像液を流動
させる板状部材に固定されていることを特徴とする請求
項1記載の現像装置。
2. The developing device according to claim 1, wherein the substrate surface cleaning liquid supply means is fixed to a plate-like member which allows the developing liquid to flow.
【請求項3】 1回の現像に必要な量の現像液を貯留
し、受皿部へ流出せしめる現像液供給手段を備えたこと
を特徴とする請求項1または2記載の現像装置。
3. The developing device according to claim 1, further comprising a developing solution supply means for storing a developing solution in an amount required for one development and allowing the developing solution to flow out to a tray portion.
JP7549193A 1993-04-01 1993-04-01 Developing device and developing method Expired - Fee Related JP3211468B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7549193A JP3211468B2 (en) 1993-04-01 1993-04-01 Developing device and developing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7549193A JP3211468B2 (en) 1993-04-01 1993-04-01 Developing device and developing method

Publications (2)

Publication Number Publication Date
JPH06289625A true JPH06289625A (en) 1994-10-18
JP3211468B2 JP3211468B2 (en) 2001-09-25

Family

ID=13577810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7549193A Expired - Fee Related JP3211468B2 (en) 1993-04-01 1993-04-01 Developing device and developing method

Country Status (1)

Country Link
JP (1) JP3211468B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430461B1 (en) * 1997-08-01 2004-08-09 동경 엘렉트론 주식회사 Solution film forming apparatus and Solution film forming method
US20080163899A1 (en) * 2006-12-20 2008-07-10 Yasushi Takiguchi Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
JP2010012591A (en) * 2008-06-30 2010-01-21 Semes Co Ltd Substrate support unit, single substrate polishing apparatus utilizing the unit, and substrate polishing method utilizing the apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430461B1 (en) * 1997-08-01 2004-08-09 동경 엘렉트론 주식회사 Solution film forming apparatus and Solution film forming method
US20080163899A1 (en) * 2006-12-20 2008-07-10 Yasushi Takiguchi Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
US8578953B2 (en) * 2006-12-20 2013-11-12 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
US9716002B2 (en) 2006-12-20 2017-07-25 Tokyo Electron Limited Substrate cleaning method
JP2010012591A (en) * 2008-06-30 2010-01-21 Semes Co Ltd Substrate support unit, single substrate polishing apparatus utilizing the unit, and substrate polishing method utilizing the apparatus

Also Published As

Publication number Publication date
JP3211468B2 (en) 2001-09-25

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