JPH0871519A - Substrate cleaning device - Google Patents

Substrate cleaning device

Info

Publication number
JPH0871519A
JPH0871519A JP6211337A JP21133794A JPH0871519A JP H0871519 A JPH0871519 A JP H0871519A JP 6211337 A JP6211337 A JP 6211337A JP 21133794 A JP21133794 A JP 21133794A JP H0871519 A JPH0871519 A JP H0871519A
Authority
JP
Japan
Prior art keywords
substrate
cleaning
brush
cleaning liquid
cleaned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6211337A
Other languages
Japanese (ja)
Other versions
JP3537875B2 (en
Inventor
Tsugio Nakamura
次雄 中村
Satoshi Suzuki
聡 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP21133794A priority Critical patent/JP3537875B2/en
Publication of JPH0871519A publication Critical patent/JPH0871519A/en
Application granted granted Critical
Publication of JP3537875B2 publication Critical patent/JP3537875B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern

Landscapes

  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To provide a substrate cleaning device of simple constitution which is capable of cleaning both front and rear surface of a substrate satisfactorily. CONSTITUTION: A substrate W with a lower surface cleaned by a brush module 22 is supported horizontally from below, and then is transported to a spin module 23 in such a maintained position that a cleaning liquid is supplied to the upper surface of the substrate W. Consequently, the front and rear surfaces which are the upper and lower surfaces respectively of the substrate W can be continuously cleaned without interposing a mechanism for reversing the substrate W. In this case, the cleaning liquid is supplied to the substrate W in the brush module 22 and on the transport handle 5, so that the surface of the substrate W is prevented from becoming dry and a water stain residue is also prevented from forming on the surface of the substrate W.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体ウエハ、液晶用
ガラス角型基板、フォトマスク基板、サーマルヘッド用
基板、カラーフィルタ用基板、プリント基板などの各種
の基板を洗浄する基板洗浄装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus for cleaning various substrates such as semiconductor wafers, glass rectangular substrates for liquid crystals, photomask substrates, thermal head substrates, color filter substrates and printed circuit boards.

【0002】[0002]

【従来の技術】従来、基板の表面(所定の薄膜が形成さ
れる面)を洗浄する上述のような洗浄装置として、基板
をその裏面側からスピンチャックによって水平に支持
し、基板を回転させつつ、その表面に洗浄液を供給して
ブラシによって基板表面を摺接したり、もしくは超音波
振動の与えられた洗浄液を基板表面に供給したりするこ
とにより、基板の表面を洗浄するいわゆるスピンスクラ
バは知られている。
2. Description of the Related Art Conventionally, as a cleaning apparatus as described above for cleaning the surface of a substrate (the surface on which a predetermined thin film is formed), the substrate is horizontally supported by a spin chuck from the back side of the substrate while rotating the substrate. A so-called spin scrubber that cleans the surface of a substrate by supplying a cleaning liquid to the surface and slidingly contacting the surface of the substrate with a brush, or by supplying a cleaning liquid to which ultrasonic vibration is applied to the surface of the substrate is known. ing.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うなスピンスクラバでは、基板の裏面を真空吸着もしく
は機械的保持機構により支持しているので、基板の表面
しか洗浄することができずその裏面を洗浄することがで
きない。
However, in such a spin scrubber, since the back surface of the substrate is supported by the vacuum suction or mechanical holding mechanism, only the front surface of the substrate can be cleaned and the back surface thereof is cleaned. Can not do it.

【0004】ここで、基板の表裏両面ともに洗浄するた
めには、上述のようなスピンスクラバを2台並べて設置
するとともにその間に基板の上下を反転させて搬送する
装置を配置し、一方のスピンスクラバで基板表面を洗浄
した後に基板の上下を反転させて他方のスピンスクラバ
に搬入して基板の裏面を洗浄するように構成することが
考えられる。
Here, in order to clean both the front and back surfaces of the substrate, two spin scrubbers as described above are installed side by side, and a device for inverting and transporting the substrate is arranged between them, and one spin scrubber is installed. It is conceivable that after cleaning the front surface of the substrate, the substrate is turned upside down and carried into the other spin scrubber to clean the back surface of the substrate.

【0005】しかしながら、このような構成では、基板
の上下を反転させる装置が必要となるので全体としての
装置構成が複雑となり装置が高価なものとなってしまう
上に、基板の裏面を洗浄するときにはその表面に接触し
て保持することになるので、基板表面を汚してしまうと
いう問題がある。
However, in such a structure, since an apparatus for turning the substrate upside down is required, the overall apparatus structure becomes complicated and the apparatus becomes expensive, and when cleaning the back surface of the substrate. Since it comes into contact with and holds the surface, there is a problem that the surface of the substrate is soiled.

【0006】そこで、本発明は、基板の表面と裏面をと
もに良好に洗浄することが可能でかつそのための構成も
簡単な基板洗浄装置を提供することにある。
Therefore, the present invention is to provide a substrate cleaning apparatus capable of satisfactorily cleaning both the front surface and the back surface of a substrate and having a simple structure for that purpose.

【0007】[0007]

【課題を解決するための手段】上記課題を解決するた
め、請求項1の基板洗浄装置は、基板を洗浄する基板洗
浄装置において、洗浄されるべき基板の表面側を上向き
にして下方から支持し、該基板に洗浄液を供給しつつそ
の下面をブラシによって摺接して基板の下面を洗浄する
下面洗浄手段と、洗浄されるべき基板の表面側を上向き
にして下方から支持し、該基板の上面に洗浄液を供給す
るとともに基板を回転させて基板の上面を洗浄する上面
洗浄手段と、下面洗浄手段によって下面が洗浄された基
板を下方から水平に支持し、該基板に洗浄液を供給しつ
つ上面搬送手段に搬送する搬送手段と、を備えることを
特徴とする。
In order to solve the above-mentioned problems, a substrate cleaning apparatus according to a first aspect of the present invention is a substrate cleaning apparatus for cleaning a substrate, in which a substrate to be cleaned is supported from below with its surface side facing upward. A lower surface cleaning means for cleaning the lower surface of the substrate by supplying a cleaning liquid to the substrate and slidingly contacting the lower surface of the substrate with a brush, and supporting the substrate to be cleaned from below with the front surface side facing upward, on the upper surface of the substrate. An upper surface cleaning unit that supplies the cleaning liquid and rotates the substrate to clean the upper surface of the substrate, and a substrate whose lower surface is cleaned by the lower surface cleaning unit are supported horizontally from below, and the upper surface transfer unit supplies the cleaning liquid to the substrate. And a transporting means for transporting to.

【0008】請求項2の基板洗浄装置は、下面洗浄手段
が、互いに平行に配置されて回転させられることにより
その上に載置された基板を支持して水平方向に搬送する
多数の搬送ローラと、搬送ローラに平行に配置され搬送
ローラによって搬送される基板の下面に摺接するロール
ブラシとを有することを特徴とする。
According to a second aspect of the present invention, there is provided a substrate cleaning apparatus, wherein the lower surface cleaning means is arranged in parallel with each other and is rotated to support a plurality of transfer rollers for supporting the substrate mounted thereon and transferring the substrate in a horizontal direction. And a roll brush that is arranged in parallel with the transport roller and is in sliding contact with the lower surface of the substrate transported by the transport roller.

【0009】請求項3の基板洗浄装置は、下面洗浄手段
が、水平に支持された基板の上面に摺接して基板の上面
を洗浄するブラシをさらに有することを特徴とする。
According to a third aspect of the present invention, there is provided the substrate cleaning apparatus, wherein the lower surface cleaning means further includes a brush for slidingly contacting the upper surface of the horizontally supported substrate to clean the upper surface of the substrate.

【0010】請求項4の基板洗浄装置は、下面洗浄手段
が、水平に支持された基板の上方から基板の上面に向け
て洗浄液を拡散噴射する洗浄液噴射手段を有することを
特徴とする。
A substrate cleaning apparatus according to a fourth aspect of the present invention is characterized in that the lower surface cleaning means has a cleaning liquid spraying means for spraying a cleaning liquid from above the horizontally supported substrate toward the upper surface of the substrate.

【0011】請求項5の基板洗浄装置は、搬送手段が、
水平に支持された基板の上方から基板の上面に向けて洗
浄液を拡散噴射する洗浄液供給手段を有することを特徴
とする。
In the substrate cleaning apparatus of the fifth aspect, the transfer means is
It is characterized in that it has a cleaning liquid supply means for diffusing and spraying the cleaning liquid from above the horizontally supported substrate toward the upper surface of the substrate.

【0012】[0012]

【作用】請求項1及び請求項2の各基板洗浄装置では、
搬送手段が、下面洗浄部によって下面(すなわち基板の
裏面)が洗浄された基板を下方から水平に支持し、その
基板上面(すなわち基板の表面)に洗浄液を供給しつ
つ、上面洗浄部に搬送するので、基板を反転する機構を
設けることなく基板の上下面すなわちその表裏両面を連
続的に洗浄することができる。この際、少なくとも搬送
手段で基板上面(すなわち基板の表面)に洗浄液を供給
するので、基板の表面の乾燥を防止することができ、基
板の表面に水染み残渣ができることを防止することがで
きる。さらに、下面洗浄部、搬送手段及び上面洗浄部で
基板を下方から支持するので、基板の薄膜が形成される
表面が支持のために汚染されるといった事態が生じな
い。
According to the substrate cleaning apparatus of the first and second aspects,
The transfer unit horizontally supports the substrate whose lower surface (ie, the back surface of the substrate) has been cleaned by the lower surface cleaning unit from below, and supplies the cleaning liquid to the upper surface of the substrate (ie, the front surface of the substrate) and transfers it to the upper surface cleaning unit. Therefore, the upper and lower surfaces of the substrate, that is, both the front and back surfaces thereof, can be continuously washed without providing a mechanism for inverting the substrate. At this time, since the cleaning liquid is supplied to at least the upper surface of the substrate (that is, the surface of the substrate) by the transporting means, it is possible to prevent the surface of the substrate from being dried and to prevent water stain residue from forming on the surface of the substrate. Further, since the substrate is supported from below by the lower surface cleaning unit, the transfer means and the upper surface cleaning unit, the surface of the substrate on which the thin film is formed is not contaminated due to the support.

【0013】請求項3の基板洗浄装置では、下面洗浄部
が、水平に支持された基板の上面と摺接可能なブラシを
有するので、薄膜が形成されるべき表面をいったん下面
洗浄手段で洗浄して上面洗浄手段によって洗浄すること
ができるので、薄膜が形成されるべき表面をよりきれい
に洗浄することができる。
In the substrate cleaning apparatus of the third aspect, since the lower surface cleaning section has the brush capable of sliding contact with the upper surface of the horizontally supported substrate, the lower surface cleaning means once cleans the surface on which the thin film is to be formed. Since it can be cleaned by the upper surface cleaning means, the surface on which the thin film is to be formed can be cleaned more cleanly.

【0014】請求項4の基板洗浄装置では、下面洗浄部
が、水平に支持された基板の上方から基板上面(すなわ
ち基板の表面)に向けて洗浄液を拡散噴射する洗浄液噴
射手段を有するので、少量の洗浄液によって基板の表面
の乾燥をより効果的に防止することができる。
According to another aspect of the substrate cleaning apparatus of the present invention, the lower surface cleaning section has the cleaning liquid spraying means for spraying the cleaning liquid from above the horizontally supported substrate toward the upper surface of the substrate (that is, the surface of the substrate). The cleaning liquid can effectively prevent the surface of the substrate from being dried.

【0015】請求項5の基板洗浄装置では、搬送手段
が、支持された基板の上方から基板上面(すなわち基板
の表面)に向けて洗浄液を拡散噴射する洗浄液噴射手段
を有するので、少量の洗浄液によって下面洗浄手段によ
って下面を洗浄された基板を上面洗浄手段に搬送する間
における基板の表面の乾燥をより効果的に防止すること
ができる。
In the substrate cleaning apparatus of the fifth aspect, the transporting means has the cleaning liquid spraying means for diffusing and spraying the cleaning liquid from above the supported substrate to the upper surface of the substrate (that is, the surface of the substrate). It is possible to more effectively prevent the surface of the substrate from being dried while the substrate whose lower surface has been cleaned by the lower surface cleaning means is conveyed to the upper surface cleaning means.

【0016】[0016]

【実施例】図1は、この発明の基板洗浄装置の一実施例
の全体構造を示す図である。この基板洗浄装置は、イン
デクサ部1と、洗浄処理部2と、基板搬送装置3とで構
成されている。
1 is a diagram showing the overall structure of an embodiment of a substrate cleaning apparatus according to the present invention. This substrate cleaning apparatus includes an indexer unit 1, a cleaning processing unit 2, and a substrate transfer device 3.

【0017】インデクサ部1には、基板を複数枚、例え
ば25枚収納可能なカセット4を載置するためのカセッ
ト載置部11が設けられている。このため、図示を省略
するAGV(無人搬送車)により当該装置に搬送されて
きたカセット4が各カセット載置部11に移載される
と、インデクサ部1では3つのカセット4がX方向に一
列に配置されることになり、基板搬送装置3によるカセ
ット4からの基板の取出しおよびカセット4への基板の
収納が可能となる。
The indexer unit 1 is provided with a cassette mounting unit 11 for mounting a cassette 4 capable of storing a plurality of substrates, for example, 25 substrates. Therefore, when the cassettes 4 transported to the apparatus by an AGV (unmanned guided vehicle) (not shown) are transferred to the respective cassette mounting portions 11, the three cassettes 4 are aligned in the X direction in the indexer portion 1. Thus, it is possible to take out the substrate from the cassette 4 and store the substrate in the cassette 4 by the substrate transfer device 3.

【0018】洗浄処理部2は、基板に処理液を供給しな
いでその洗浄処理を行うドライ処理部(符号21の部分
に対応)と、基板に水などの処理液を供給してその洗浄
処理を行うウエット処理部(符号22、23の部分に対
応)とから構成され、インデクサ部1からY方向に一定
間隔だけ離間した状態で、カセット4の配列方向Xとほ
ぼ平行に対向配列されている。前者のドライ処理部であ
るUVモジュール21では、基板表面に紫外線を照射し
て基板表面上の有機物を焼いて灰化する。後者のウエッ
ト処理部は、UVモジュール21直下(−Z方向)に配
置されたブラシモジュール22とブラシモジュール22
の右隣(X方向)に配置されたスピンモジュール23と
から構成され、ブラシモジュール22では、移動または
揺動する基板の裏面側の下面を主にブラシ洗浄処理し、
スピンモジュール23では、回転する基板の表面側の上
面をブラシ洗浄処理する。
The cleaning processing section 2 supplies the processing solution to the substrate without supplying the processing solution to the substrate (corresponding to the portion 21), and supplies the processing solution such as water to the substrate to perform the cleaning processing. And a wet processing unit (corresponding to the portions denoted by reference numerals 22 and 23) for carrying out, and arranged in parallel and opposed to the arrangement direction X of the cassette 4 in a state of being separated from the indexer unit 1 by a certain distance in the Y direction. In the UV module 21, which is the former dry processing unit, the surface of the substrate is irradiated with ultraviolet rays to burn and ash the organic substances on the surface of the substrate. The latter wet processing unit includes a brush module 22 and a brush module 22 arranged immediately below the UV module 21 (-Z direction).
In the brush module 22, the lower surface on the back surface side of the moving or swinging substrate is mainly subjected to a brush cleaning process.
In the spin module 23, the upper surface on the front surface side of the rotating substrate is brush-cleaned.

【0019】なお、ブラシモジュール21からスピンモ
ジュール22への基板の搬送は、X方向に往復動可能で
Y方向に進退自在な搬送手段である搬送ハンド5によっ
て行う。
The transfer of the substrate from the brush module 21 to the spin module 22 is carried out by a transfer hand 5 which is a transfer means capable of reciprocating in the X direction and freely moving back and forth in the Y direction.

【0020】このように構成された基板洗浄装置では、
基板は、例えば以下のようにして洗浄される。まず、カ
セット4中の未処理の基板を基板搬送装置3によってU
Vモジュール21に搬入し、紫外線照射下でオゾンによ
るドライ洗浄処理を行う。次に、UVモジュール21で
のドライ洗浄処理後の基板を基板搬送装置3によってブ
ラシモジュール22に搬入し、ここで基板の裏面である
下面を主にウエット洗浄処理する。次に、ブラシモジュ
ール22でのウエット洗浄処理後の基板を搬送ハンド5
によってスピンモジュール23に搬入し、ここで基板の
表面である上面をウエット洗浄処理する。最後に、スピ
ンモジュール23中のウエット処理後の基板を基板搬送
装置3によって所定のカセット4内に戻す。
In the substrate cleaning apparatus thus constructed,
The substrate is washed, for example, as follows. First, the unprocessed substrate in the cassette 4 is U
It is carried into the V module 21 and subjected to a dry cleaning treatment with ozone under the irradiation of ultraviolet rays. Next, the substrate after the dry cleaning process in the UV module 21 is carried into the brush module 22 by the substrate transfer device 3, and here the lower surface which is the back surface of the substrate is mainly subjected to the wet cleaning process. Next, the substrate after the wet cleaning process in the brush module 22 is transferred by the hand 5
Then, it is carried into the spin module 23, where the upper surface, which is the surface of the substrate, is subjected to wet cleaning processing. Finally, the substrate after the wet processing in the spin module 23 is returned into the predetermined cassette 4 by the substrate transfer device 3.

【0021】図2は、図1の装置の洗浄処理部2の要部
を説明する図である。基板搬入口32から搬入された基
板Wは、図示を省略する昇降機構によって下方(−Z方
向)に一旦降下させられた後、複数の搬送ローラ42に
よって、水平方向(X方向)にその姿勢を保ったままで
一定速度で搬送され、或いは一定周期で揺動される。こ
れらの搬送ローラ42は、互いの回転軸が平行になるよ
うにこれらの回転軸に垂直な方向に一列に配列されてい
る。なお、図示を省略しているが、搬送ローラ42は、
その両端に段付ローラを備え、その小輪で基板Wの両側
端部を下方から支持し、そのガイド輪で基板Wの両側端
部を側方から案内して基板の蛇行を防止する。
FIG. 2 is a diagram for explaining the main part of the cleaning processing unit 2 of the apparatus shown in FIG. The substrate W carried in through the substrate carry-in port 32 is once lowered (downward in the −Z direction) by an elevating mechanism (not shown), and then is moved horizontally (in the X direction) by a plurality of transport rollers 42. While being kept, it is conveyed at a constant speed or is oscillated at a constant cycle. The transport rollers 42 are arranged in a line in a direction perpendicular to the rotation axes so that the rotation axes are parallel to each other. Although not shown, the transport roller 42 is
Stepped rollers are provided at both ends thereof, and the small wheels support both end portions of the substrate W from below, and the guide wheels guide the both end portions of the substrate W from the side to prevent the substrate from meandering.

【0022】搬送ローラ42上を移動する基板Wの下側
には、基板Wの下面(薄膜等が形成されない裏面)に摺
接してこの下面を洗浄する一対のロールブラシ52、5
2がそれぞれ独立して正逆回転自在に設けられている。
なお、各ロールブラシ52の両側の近傍には、ロールブ
ラシ52に洗浄液(例えば純水)を供給するための下面
用ノズル62が配置されている。
A pair of roll brushes 52, 5 for cleaning the lower surface of the substrate W which slides on the lower surface of the substrate W (the back surface on which no thin film or the like is formed) and which cleans the lower surface of the substrate W moving on the transport rollers 42.
2 are independently provided so as to be rotatable forward and backward.
It should be noted that nozzles 62 for the lower surface for supplying a cleaning liquid (for example, pure water) to the roll brush 52 are arranged near both sides of each roll brush 52.

【0023】搬送ローラ42上を搬送される基板Wの上
側には、基板Wの上面(薄膜等が形成される表面)に摺
接してこの上面を補助的に洗浄するロールブラシ72が
正逆回転自在に設けられている。なお、基板Wおよびロ
ールブラシ72の上方には、等間隔で並んだ複数の上面
用ノズル82が配置され、基板Wに向けて洗浄液をスプ
レー噴射(すなわち、拡散しつつ噴射)することによっ
て、基板Wの表面の乾燥を防止して水染みの発生を防止
している。
On the upper side of the substrate W transported on the transport roller 42, a roll brush 72 which is in sliding contact with the upper surface of the substrate W (the surface on which a thin film or the like is formed) and assists in cleaning the upper surface, rotates in the forward and reverse directions. It is provided freely. A plurality of upper surface nozzles 82 arranged at equal intervals are arranged above the substrate W and the roll brush 72, and the cleaning liquid is sprayed (that is, sprayed while being diffused) toward the substrate W, thereby The surface of W is prevented from drying and water stains are prevented.

【0024】ロールブラシ52で下面を洗浄された基板
Wは、その姿勢を保ったままで、ロールブラシ52のな
いモジュール右端部まで水平方向(X方向)に搬送さ
れ、図示を省略する昇降機構によって上方(Z方向)に
上昇させられた後、ブラシモジュール22の基板搬出口
42上に待機する搬送ハンド5に受け渡される。
The substrate W whose bottom surface has been cleaned by the roll brush 52 is conveyed in the horizontal direction (X direction) to the right end of the module without the roll brush 52 while maintaining its posture, and is moved upward by an elevator mechanism (not shown). After being raised in the (Z direction), it is transferred to the transfer hand 5 standing by on the substrate outlet 42 of the brush module 22.

【0025】搬送ハンド5は、ブラシモジュール22で
ウエット洗浄処理された基板Wを、その姿勢を保ったま
まで、ブラシモジュール22からスピンモジュール23
上方まで搬送する。なお、搬送ハンド5の上方には、基
板Wに洗浄液をスプレー供給して基板Wの表面の乾燥を
防止し、基板Wの表面に水染みが発生することを防止す
る複数のノズル25が配置されている。
The transfer hand 5 moves from the brush module 22 to the spin module 23 while keeping the posture of the substrate W which has been subjected to the wet cleaning processing by the brush module 22.
Transport it to the top. A plurality of nozzles 25 are disposed above the transport hand 5 to prevent the surface of the substrate W from being dried by spray-supplying the cleaning liquid to the substrate W and to prevent water stain on the surface of the substrate W. ing.

【0026】スピンモジュール23上方まで搬送された
基板Wは、上昇してきたスピンチャック33に受け渡さ
れる。スピンチャック33上に移載された基板Wの外縁
は、スピンチャック33上に立設されたチャックピン3
3aに係合する。これは、スピンチャック33上での基
板Wの水平方向のずれを防止するためである。スピンチ
ャック33に支持された基板Wは、スピンチャック33
とともに処理位置まで下降する。ここでのウエット洗浄
処理に際しては、基板W上にディスクブラシ43を移動
させて基板Wの上面にディスクブラシ43を当接させ
る。その後、ディスクブラシ43を回転(自転)させな
がら、ディスクブラシ43上方のノズル53から洗浄液
を供給する。この際、ディスクブラシ43を取り付けて
いるアームを回転(公転)させながら、スピンチャック
33を回転させて、ディスクブラシ43がスピンチャッ
ク33上に支持された基板Wの表面全体を摺接するよう
にする。このような基板Wの表面の洗浄が完了すると、
ノズル53から基板Wへの洗浄液の供給を停止させると
ともにディスクブラシ43を基板表面上から退避させ
る。その後、スピンチャック33を高速で回転させてス
ピンチャック33上に支持されている基板Wに付着して
いる洗浄液を遠心力によって振り切って基板を乾燥させ
る。乾燥させられた基板Wは、基板搬送装置3によって
インデクサ部1に配置された所定のカセット4内に搬入
される。
The substrate W transported to above the spin module 23 is transferred to the ascending spin chuck 33. The outer edge of the substrate W transferred onto the spin chuck 33 has a chuck pin 3 which is erected on the spin chuck 33.
3a is engaged. This is to prevent the horizontal displacement of the substrate W on the spin chuck 33. The substrate W supported by the spin chuck 33 is
Along with that, it descends to the processing position. In the wet cleaning process here, the disk brush 43 is moved onto the substrate W and brought into contact with the upper surface of the substrate W. After that, the cleaning liquid is supplied from the nozzle 53 above the disc brush 43 while rotating (rotating) the disc brush 43. At this time, the spin chuck 33 is rotated while rotating (revolving) the arm to which the disk brush 43 is attached so that the disk brush 43 slides on the entire surface of the substrate W supported on the spin chuck 33. . When the cleaning of the surface of the substrate W is completed,
The supply of the cleaning liquid from the nozzle 53 to the substrate W is stopped and the disc brush 43 is retracted from the surface of the substrate. After that, the spin chuck 33 is rotated at a high speed, and the cleaning liquid adhering to the substrate W supported on the spin chuck 33 is shaken off by the centrifugal force to dry the substrate. The dried substrate W is carried into the predetermined cassette 4 arranged in the indexer unit 1 by the substrate transfer device 3.

【0027】なお、スピンモジュール23では、基板W
に対し、ディスクブラシによる洗浄処理の外、基板Wの
表面の膜質、パターンの有無、汚れの度合い等に応じ
て、超音波振動を付与した洗浄液を基板表面に供給する
超音波洗浄処理、洗浄液を高圧で基板表面に供給する高
圧洗浄処理、純水を基板表面に供給する純水リンス処理
などの各種洗浄処理を適宜選択的に施したり、或いはこ
れらの洗浄処理を複数組み合わせて適用することもでき
る。
In the spin module 23, the substrate W
On the other hand, in addition to the cleaning process by the disc brush, the ultrasonic cleaning process and the cleaning liquid are supplied to the substrate surface by applying the cleaning liquid to which ultrasonic vibration is applied according to the film quality of the surface of the substrate W, the presence or absence of the pattern, the degree of contamination, Various cleaning treatments such as a high-pressure cleaning treatment for supplying the substrate surface at a high pressure and a pure water rinsing treatment for supplying pure water to the substrate surface may be appropriately selectively performed, or a combination of these cleaning treatments may be applied. .

【0028】以上説明のように上記実施例の基板洗浄装
置によれば、搬送ハンド5が、ブラシモジュール22に
よって下面の洗浄された基板Wを下方から水平に支持
し、その基板W上面に洗浄液を供給しつつその姿勢を保
ったままでスピンモジュール23に搬送する。したがっ
て、基板Wを反転する機構を介在させないで基板Wの上
下面である表裏面を連続的に洗浄することができる。こ
の際、ブラシモジュール22内と搬送ハンド5上で基板
W上面に洗浄液を供給するので、基板Wの表面の乾燥を
防止することができ、基板Wの表面に水染み残渣ができ
ることを防止することができる。さらに、ブラシモジュ
ール22、スピンモジュール23及び搬送ハンド5で基
板Wを下方から支持し、基板W上面の表面側にはロール
ブラシ72やディスクブラシ43が接触するのみである
ので、基板Wの表面が汚染されにくい。
As described above, according to the substrate cleaning apparatus of the above-described embodiment, the transfer hand 5 horizontally supports the substrate W whose lower surface is cleaned by the brush module 22 from below, and the cleaning liquid is applied to the upper surface of the substrate W. It is conveyed to the spin module 23 while maintaining its posture while being supplied. Therefore, the front and back surfaces of the upper and lower surfaces of the substrate W can be continuously cleaned without interposing a mechanism for reversing the substrate W. At this time, since the cleaning liquid is supplied to the upper surface of the substrate W in the brush module 22 and on the transfer hand 5, it is possible to prevent the surface of the substrate W from being dried and prevent the water stain residue from being formed on the surface of the substrate W. You can Furthermore, since the substrate W is supported from below by the brush module 22, the spin module 23, and the transfer hand 5, and only the roll brush 72 and the disc brush 43 contact the surface side of the upper surface of the substrate W, the surface of the substrate W is Not easily polluted.

【0029】以上、実施例に即してこの発明を説明した
が、この発明は上記実施例に限定されるものではない。
例えば、前段のウエット洗浄処理で、実施例のブラシモ
ジュール22中に設けてある上下ロールブラシ52、8
2の代わりに、ディスクブラシを設けて基板W上下面を
ウエット洗浄処理することもできる。なお、基板Wの裏
面は表面のような凹凸のパターンが形成されていない素
ガラス状態であるので、ロールブラシやディスクブラシ
などのブラシによって摺接してもなんら問題はない。
Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments.
For example, in the wet cleaning process of the first stage, the upper and lower roll brushes 52, 8 provided in the brush module 22 of the embodiment.
Instead of 2, a disk brush may be provided to carry out wet cleaning processing on the upper and lower surfaces of the substrate W. Since the back surface of the substrate W is in the state of a raw glass on which no uneven pattern is formed like the front surface, there is no problem even if it is brought into sliding contact with a brush such as a roll brush or a disc brush.

【0030】また、後段のウエット洗浄処理を行うスピ
ンモジュール23は、ディスクブラシ43のみで基板W
の表面を洗浄するものであってもよい。
The spin module 23, which performs the wet cleaning process in the subsequent stage, uses only the disk brush 43 for the substrate W.
The surface may be washed.

【0031】[0031]

【発明の効果】以上のように、請求項1及び請求項2の
各基板洗浄装置によれば、搬送手段が、下面洗浄部によ
って下面が洗浄された基板を下方から水平に支持して上
面洗浄部に搬送するので、基板を反転する機構を設ける
ことなく基板の上下面すなわちその表裏両面を連続的に
洗浄することができる。この際、少なくとも搬送手段で
基板上面に洗浄液を供給するので、基板の表面の乾燥を
防止することができ、基板の表面に水染み残渣ができる
ことを防止することができる。さらに、下面洗浄部、搬
送手段及び上面洗浄部で基板を下方から支持するので、
基板の表面が支持のために汚染されるといった事態が生
じない。
As described above, according to the substrate cleaning apparatus of the first and second aspects, the transporting means horizontally supports the substrate whose lower surface is cleaned by the lower surface cleaning section from below and cleans the upper surface. Since it is transported to a part, the upper and lower surfaces of the substrate, that is, both the front and back surfaces thereof, can be continuously cleaned without providing a mechanism for inverting the substrate. At this time, since the cleaning liquid is supplied to the upper surface of the substrate by at least the transfer means, it is possible to prevent the surface of the substrate from being dried, and it is possible to prevent water stain residue from forming on the surface of the substrate. Furthermore, since the substrate is supported from below by the lower surface cleaning section, the transfer means, and the upper surface cleaning section,
The situation in which the surface of the substrate is contaminated for supporting does not occur.

【0032】請求項3の基板洗浄装置では、下面洗浄部
が、水平に支持された基板の上面と摺接可能なブラシを
有するので、基板の表面に予備的洗浄を施すことができ
基板の表面を予めよりきれいに洗浄することができる。
In the substrate cleaning apparatus of the third aspect, since the lower surface cleaning section has the brush capable of sliding contact with the upper surface of the horizontally supported substrate, the surface of the substrate can be preliminarily cleaned. Can be washed more cleanly in advance.

【0033】請求項4の基板洗浄装置では、下面洗浄部
が、水平に支持された基板の上方から基板上面に向けて
洗浄液を拡散噴射する洗浄液噴射手段を有するので、基
板の表面の乾燥をより効果的に防止することができる。
In the substrate cleaning apparatus of the fourth aspect, since the lower surface cleaning section has the cleaning liquid spraying means for diffusing and spraying the cleaning liquid from above the horizontally supported substrate toward the upper surface of the substrate, it is possible to further dry the surface of the substrate. It can be effectively prevented.

【0034】請求項5の基板洗浄装置では、搬送手段
が、支持された基板の上方から基板上面に向けて洗浄液
を拡散噴射する洗浄液噴射手段を有するので、基板の表
面の乾燥をより効果的に防止することができる。
In the substrate cleaning apparatus of the fifth aspect, the transport means has the cleaning liquid spraying means for diffusing and spraying the cleaning liquid from above the supported substrate to the upper surface of the substrate, so that the surface of the substrate is more effectively dried. Can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】第1実施例の基板洗浄装置を示す斜視図であ
る。
FIG. 1 is a perspective view showing a substrate cleaning apparatus according to a first embodiment.

【図2】図1の基板洗浄装置の要部の正面図である。FIG. 2 is a front view of a main part of the substrate cleaning apparatus of FIG.

【符号の説明】[Explanation of symbols]

1 インデクサ部 2 洗浄処理部 3 基板搬送装置 5 搬送ハンド 21 UVモジュール 22 ブラシモジュール 23 スピンモジュール 25 ノズル 42 搬送ローラ 43 ディスクブラシ 52、72 ロールブラシ 53 ノズル 62 下面用ノズル 82 上面用ノズル DESCRIPTION OF SYMBOLS 1 Indexer part 2 Cleaning part 3 Substrate transfer device 5 Transfer hand 21 UV module 22 Brush module 23 Spin module 25 Nozzle 42 Transfer roller 43 Disc brush 52, 72 Roll brush 53 Nozzle 62 Lower surface nozzle 82 Upper surface nozzle

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 基板を洗浄する基板洗浄装置において、 洗浄されるべき基板の表面側を上向きにして下方から支
持し、該基板に洗浄液を供給しつつその下面をブラシに
よって摺接して基板の下面を洗浄する下面洗浄手段と、 洗浄されるべき基板の表面側を上向きにして下方から支
持し、該基板の上面に洗浄液を供給するとともに基板を
回転させて基板の上面を洗浄する上面洗浄手段と、 下面洗浄手段によって下面が洗浄された基板を下方から
水平に支持し、該基板に洗浄液を供給しつつ上面搬送手
段に搬送する搬送手段と、を備えることを特徴とする基
板洗浄装置。
1. In a substrate cleaning apparatus for cleaning a substrate, a substrate to be cleaned is supported from below with its front side facing upward, and while supplying a cleaning liquid to the substrate, the lower surface of the substrate is slidably contacted by a brush to form a lower surface of the substrate. A lower surface cleaning means for cleaning the upper surface of the substrate to be cleaned, an upper surface cleaning means for supporting the upper surface of the substrate from above and supplying a cleaning liquid to the upper surface of the substrate and rotating the substrate to clean the upper surface of the substrate. A substrate cleaning apparatus comprising: a substrate, the substrate whose lower surface is cleaned by the lower surface cleaning device, is horizontally supported from below, and is transported to the upper surface transportation device while supplying a cleaning liquid to the substrate.
【請求項2】 下面洗浄手段は、互いに平行に配置され
て回転させられることによりその上に載置された基板を
支持して水平方向に搬送する多数の搬送ローラと、搬送
ローラに平行に配置され搬送ローラによって搬送される
基板の下面に摺接するロールブラシとを有することを特
徴とする請求項1記載の基板洗浄装置。
2. The lower surface cleaning means is arranged in parallel with each other and is rotated to support a plurality of transfer rollers that support a substrate placed thereon and transfer in the horizontal direction, and are arranged in parallel with the transfer rollers. The substrate cleaning apparatus according to claim 1, further comprising a roll brush that is in sliding contact with a lower surface of the substrate that is transported by the transport roller.
【請求項3】 下面洗浄手段は、水平に支持された基板
の上面に摺接して基板の上面を洗浄するブラシをさらに
有することを特徴とする請求項1もしくは請求項2記載
の基板洗浄装置。
3. The substrate cleaning apparatus according to claim 1, wherein the lower surface cleaning means further includes a brush that slidably contacts the upper surface of the horizontally supported substrate to clean the upper surface of the substrate.
【請求項4】 下面洗浄手段は、水平に支持された基板
の上方から基板の上面に向けて洗浄液を拡散噴射する洗
浄液噴射手段を有することを特徴とする請求項1から請
求項3のいずれかに記載の基板洗浄装置。
4. The lower surface cleaning means has a cleaning liquid spraying means for diffusing and spraying a cleaning liquid from above a horizontally supported substrate toward the upper surface of the substrate. The substrate cleaning apparatus according to.
【請求項5】 搬送手段は、水平に支持された基板の上
方から基板の上面に向けて洗浄液を拡散噴射する洗浄液
供給手段を有することを特徴とする請求項1から請求項
4のいずれかに記載の基板洗浄装置。
5. The transporting means has a cleaning liquid supply means for diffusing and spraying a cleaning liquid from above a horizontally supported substrate toward the upper surface of the substrate, as claimed in any one of claims 1 to 4. The substrate cleaning apparatus described.
JP21133794A 1994-09-05 1994-09-05 Substrate cleaning device Expired - Fee Related JP3537875B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21133794A JP3537875B2 (en) 1994-09-05 1994-09-05 Substrate cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21133794A JP3537875B2 (en) 1994-09-05 1994-09-05 Substrate cleaning device

Publications (2)

Publication Number Publication Date
JPH0871519A true JPH0871519A (en) 1996-03-19
JP3537875B2 JP3537875B2 (en) 2004-06-14

Family

ID=16604294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21133794A Expired - Fee Related JP3537875B2 (en) 1994-09-05 1994-09-05 Substrate cleaning device

Country Status (1)

Country Link
JP (1) JP3537875B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179190A (en) * 1999-12-28 2001-07-03 Tokyo Electron Ltd Method and device for cleaning substrate
US6254690B1 (en) 1998-04-07 2001-07-03 Oki Electric Industry Co., Ltd. Semiconductor wafer cleaning method using a semiconductor wafer cleaning device that supports a lower surface of the wafer
CN103041999A (en) * 2013-01-04 2013-04-17 深圳顺络电子股份有限公司 Device and method for cleaning via-hole surface of ceramic raw belt of stacked coil component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6254690B1 (en) 1998-04-07 2001-07-03 Oki Electric Industry Co., Ltd. Semiconductor wafer cleaning method using a semiconductor wafer cleaning device that supports a lower surface of the wafer
JP2001179190A (en) * 1999-12-28 2001-07-03 Tokyo Electron Ltd Method and device for cleaning substrate
CN103041999A (en) * 2013-01-04 2013-04-17 深圳顺络电子股份有限公司 Device and method for cleaning via-hole surface of ceramic raw belt of stacked coil component

Also Published As

Publication number Publication date
JP3537875B2 (en) 2004-06-14

Similar Documents

Publication Publication Date Title
US6874515B2 (en) Substrate dual-side processing apparatus
US6261378B1 (en) Substrate cleaning unit and cleaning method
KR100341011B1 (en) Apparatus and method for washing both surfaces of a substrate
KR19980071710A (en) Double sided cleaning method and double sided cleaning device
JP3236742B2 (en) Coating device
TW200903624A (en) Apparatus for treating substrates
JP4247890B2 (en) Coating nozzle and coating device
JP4022288B2 (en) Substrate processing equipment
JP3730829B2 (en) Development processing method and development processing apparatus
KR100292322B1 (en) Substrate treatment device and substrate transporting method
JP3474495B2 (en) Substrate cleaning method and cleaning apparatus
JPH0871519A (en) Substrate cleaning device
JP2000286320A (en) Substrate transfer apparatus
JP2543007B2 (en) Wafer single wafer cleaning device
JP2003100687A (en) Substrate treating device and its cleaning method
JP4311520B2 (en) Coating processing apparatus and substrate processing apparatus using the same
JPH08139153A (en) Single wafer processing system, wafer transfer system and cassette
JP2000049206A (en) Substrate treating apparatus
JPH10303170A (en) Device and method for cleaning substrate
JP3999540B2 (en) Brush cleaning method and processing system for scrub cleaning apparatus
JP3766177B2 (en) Substrate processing apparatus and substrate cleaning apparatus
JP3677201B2 (en) Cleaning processing equipment
JP3682121B2 (en) Cleaning device
JP3818333B2 (en) Substrate cleaning device
JPH0536659A (en) Substrate cleaning and drying device

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20031224

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040316

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040318

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080326

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090326

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090326

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100326

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100326

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100326

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110326

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110326

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120326

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120326

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120326

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130326

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130326

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130326

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140326

Year of fee payment: 10

LAPS Cancellation because of no payment of annual fees