JPH06283660A - Resin frame for semiconductor device and manufacture of semiconductor device using same - Google Patents

Abstract

PURPOSE:To provide a resin frame for semiconductor devices which can improve the productivity of semiconductor devices and, at the same time, can, prevent the infiltration of a resin when the semiconductor devices are sealed with the resin. CONSTITUTION:A first side rail 12 has a long length. A second side rail 13 also has a long length and is arranged in parallel with the first side rail 12. Package main body sections 20 are arranged in parallel in the length direction of the side rails 12 and 13 between the rails 12 and 13. Connecting sections 26 connect the package main body sections 20 to the side rails 12 and 13. The side rails 12 and 13, package main body sections 20, and connecting sections 26 are integrally formed by punching a synthetic resin plate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin frame for a semiconductor device and a method for manufacturing a semiconductor device using the resin frame.

[0002]

2. Description of the Related Art In recent years, along with the widespread use of surface mount semiconductor devices, for example, a circuit (wiring) is formed on a surface of a synthetic resin, a circuit (wiring) is printed on the surface, and a surface of a substrate provided with external connection terminals for surface mounting A semiconductor device in which a semiconductor chip is mounted and a surface (and a side surface) of a substrate including the semiconductor chip is resin-sealed has been put into practical use. This type of semiconductor device mounts a semiconductor chip on a conventional strip-shaped lead frame,
Unlike a semiconductor device in which the semiconductor chip is resin-sealed, the semiconductor chip is first mounted on each substrate and wire bonding is performed. After that, each substrate is set in a resin-sealing die of a transfer molding device, the semiconductor chip side of the substrate is resin-sealed, and each semiconductor device is completed.

[0003]

However, the above conventional semiconductor device has the following problems. In the manufacturing process of a semiconductor device, one semiconductor chip is mounted on one substrate, but since the semiconductor chip is individually mounted, wire bonding and resin sealing are performed, there is a problem that productivity is poor. Further, when resin-sealing, particularly when resin-sealing the front surface and the side surface of a substrate including a semiconductor chip, the entire substrate must be set in a cavity of a mold. If resin sealing is performed with the entire substrate set in the cavity of the mold, the substrate may move in the cavity due to the resin pressure, and the resin may reach the back side of the substrate. Therefore, in the present invention, in the manufacture of a semiconductor device, the resin frame for a semiconductor device and the semiconductor device using the same, which can improve the productivity and prevent the resin from wrapping around to the back surface of the substrate at the time of resin sealing, are provided. It is intended to provide a manufacturing method.

[0004]

In order to solve the above problems, the present invention has the following constitution. First, the resin frame for a semiconductor device includes a first side rail that is long and
A second side rail formed in a long length and arranged in parallel with the first side rail, and a first side rail and a second side rail between the first side rail and the second side rail.
A plurality of package body portions arranged side by side in the length direction of the side rails, and a plurality of connecting portions that connect each package body portion to the first side rail and the second side rail, The first side rail, the second side rail, the plurality of package body portions, and the plurality of connecting portions are integrally formed by punching out a synthetic resin plate. In the resin frame for a semiconductor device described above, a circuit pattern may be printed on the package body, or a connection terminal for connecting to an external circuit may be provided on the package body. This connection terminal may be provided, for example, on the surface opposite to the surface on which the semiconductor chip is mounted.

According to a method of manufacturing a semiconductor device, a semiconductor chip is mounted on the package body of the resin frame for a semiconductor device in which a circuit pattern is printed on the package body, and the semiconductor chip and the package body are printed. A circuit pattern that is present, the package body is resin-sealed, the connecting portion of the semiconductor device resin frame is cut off, and the resin-sealed package body is the first of the semiconductor device resin frame. It is characterized in that it is separated from the side rail and the second side rail.

[0006]

[Operation] The operation will be described. The semiconductor device resin frame includes a first side rail formed in a long shape and a second side rail formed in a long shape and arranged in parallel with the first side rail.
And a plurality of package main bodies arranged side by side in the length direction of the first side rail and the second side rail between the first side rail and the second side rail, and each package. It is composed of a plurality of connecting portions that connect the main body portion with the first side rail and the second side rail. Therefore, even a frame made of synthetic resin can be sequentially manufactured on the manufacturing line like a conventional metal lead frame. Also, at the time of resin sealing, even if the whole package body is set in the cavity of the mold, the connecting part can be clamped by the mold, and the movement of the package body can be prevented even if resin pressure is applied. Becomes

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. First, FIG. 1 (a partial plan view of the resin frame 10 for a semiconductor device of the embodiment) and FIG. 2 (A in FIG. 1).
The configuration will be described with reference to FIG. Reference numeral 12 denotes a first side rail formed in a long strip shape, which is made of thin synthetic resin. First siderail 1
2 is formed to have an appropriate length in consideration of the size and the like of the molding dies 14 and 16 (see FIG. 3) used in the processing step. Reference numeral 13 denotes a second side rail formed in a long strip shape, which is made of thin synthetic resin. The second side rails 13 are arranged in parallel with the first side rails 12 with a gap. The second side rail 13 is formed to have the same length as the first side rail 12. 1
Reference numeral 8 is a guide hole, which is provided through the first side rail 12 and the second side rail 13 at predetermined intervals. The guide hole 18 is provided in order to position the resin frame 10 by hooking the carrying claw and inserting a positioning pin in the molding dies 14 and 16 in the processing step.

Reference numeral 20 denotes a package body, on which a semiconductor chip 24 (see FIGS. 3 to 5) can be mounted on a chip portion 22 formed at the center of the upper surface. The package body 20 is also made of thin synthetic resin. A plurality of package body parts 20 are arranged in parallel in the length direction of the first side rails 12 and the second side rails 13 at a constant interval between the first side rails 12 and the second side rails 13. . Reference numeral 26 denotes a connecting portion, which connects the four corners of each package body 20 to the first side rail 12 and the second side rail 13. Connection part 26
Is also made of thin synthetic resin. That is, the first side rail 12, the second side rail 13, the package body 20, and the connecting portion 26 are integrally formed by punching a strip-shaped thin synthetic resin plate with a pressing device. A circuit pattern 28 is printed around the chip mounting portion 22 on the upper surface of the package body 20. A large number of circuit patterns 28 are radially arranged on the chip mounting portion 22. The circuit patterns 28 are connected to the electrodes provided on the semiconductor chip 24, respectively.

Reference numeral 30 denotes an external connection terminal, which is provided on the lower surface of the package body 20 so as to project therefrom. Each connection terminal 30
It is connected to the corresponding circuit pattern 28 via the internal wiring 32 formed in the package body 20.
The internal wiring 32 is formed by, for example, drilling a through hole in a predetermined portion of the package body 20 and performing a plating process on the through hole. As the connection terminal 30, a semiconductor device 34 (see FIG. 5) formed by using the resin frame 10 is printed circuit board (not shown).
It is provided to connect to an external circuit on the printed circuit board when it is mounted on. In this embodiment, the connection terminal 30 is provided on the lower surface of the package body 20 in a protruding manner. However, for example, when connecting an outer lead, the position of the connection terminal 30 does not have to be on the lower surface of the package body 20. .

A method of manufacturing the semiconductor device 34 using the above resin frame 10 will be described with further reference to FIGS. First, the semiconductor chip 24 is provided on the upper surface of the chip mounting portion 22 of the package body 20 of the resin frame 10.
Are mounted by an appropriate method (for example, bonding with an adhesive).
Subsequently, each electrode of the semiconductor chip 24 mounted and each circuit pattern 28 printed on the package body 20
And are connected by wire bonding. The resin frame 10 for which wire bonding has been completed is set in the molding dies 14 and 16 of the transfer molding apparatus (see FIG. 3). In this embodiment, the surface and side surfaces of the package body 20 are sealed with resin, and the entire package body 20 on which the semiconductor chip 24 is mounted is set in the cavity 36. At that time, in the cavity recess 38 of the lower mold 16, the recess 4 corresponding to the connection terminal 30 is formed.
0 is provided, and the molten resin 42 cannot enter the lower surface side of the package body 20. Positioning pins 44 are provided upright on the parting surface of the lower mold 16, and the positioning pins 44 are fitted into the guide holes 18 for the positioning holes that are transparently provided in the resin frame 10 to fit the resin frame on the lower mold 16. We have decided 10 positions.

In the state shown in FIG. 3, the molding dies 14 and 1 are used.
6 is the mold closed state. In this embodiment, when the mold is closed, the upper mold 14 and the lower mold 16 sandwich the connecting portion 26. That is,
The upper and lower molds 14 and 1 are shown in FIG.
It is clamped by a protrusion (not shown) provided on the parting surface of 6. As a result, in the mold closed state, the resin frame 10
Is immovable in the molds 14,16. After the resin frame 10 is set, the molds 14 and 1
When the mold 6 is closed (state of FIG. 3), the transfer mold device is activated to move the molten resin 42 from the runner 48 to the gate 5
It is pressure-fed into the cavity 36 via 0 and filled. At that time, as described above, in the resin frame 10, the connecting portion 26 is sandwiched between the upper mold 14 and the lower mold 16, and the molten resin 42 cannot enter the lower surface side of the package body 20. Only the front surface side and the side surface side of the package body 20 are resin-sealed. The range of resin sealing (resin sealing portion) is shown by a chain line 52 in FIG.

Resin 4 sealing each package body 20
After 2 is cured, the mold dies 14 and 16 are opened and the resin frame 10 is taken out. Resin frame 1 taken out
0 is transferred to the trim and forming process, and the connecting portion 26 is cut off at the boundary with each resin sealing portion 52. As a result, the semiconductor device 34 including the resin sealing portion 52 is separated from the first side rail 12 and the second side rail 13. The completed semiconductor device 34 is the semiconductor chip 2
The surface and the side surface of the package body 20 on which the No. 4 is mounted are resin-sealed, and the lower surface is not resin-sealed.
0 stands out. Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. For example, the package body 20 may be formed in multiple layers instead of a single layer. However, it goes without saying that the resin sealing portion 52 may be formed only on the front surface side of the package main body portion 20 and many more modifications can be made without departing from the spirit of the invention.

[0013]

When the resin frame for a semiconductor device and the method for manufacturing a semiconductor device using the same according to the present invention are used, the resin frame for a semiconductor device has a long first side rail and a long side rail. And a second side rail which is formed in parallel with the first side rail and is disposed between the first side rail and the second side rail, and between the first side rail and the second side rail. It is composed of a plurality of package main bodies arranged side by side in the length direction, and a plurality of connecting portions that connect each package main body to the first side rail and the second side rail. Therefore, even a frame made of synthetic resin can be sequentially manufactured on the manufacturing line like a conventional metal lead frame. At that time, there is almost no need to refurbish the conventional production line, which is economically effective. In addition, even when the entire package body is set in the cavity of the mold during resin sealing, the first side rail, the second
Since the side rails and / or connecting parts of can be clamped with a mold and the movement of the package body can be prevented even when receiving resin pressure, it is possible to reliably prevent the resin from wrapping around during resin sealing. It produces a remarkable effect such as being able to.

[Brief description of drawings]

FIG. 1 is a partial plan view showing an embodiment of a resin frame for a semiconductor device according to the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG.

FIG. 3 is a partial cross-sectional view showing a state where a resin frame on which a semiconductor chip is mounted is set in a mold.

FIG. 4 is a partial plan view of a resin frame on which a semiconductor chip is mounted.

FIG. 5 is a cross-sectional view of a completed semiconductor device.

[Explanation of symbols]

 10 Resin Frame for Semiconductor Device 12 First Side Rail 13 Second Side Rail 14 Upper Mold 16 Lower Mold 20 Package Main Body 24 Semiconductor Chip 26 Connecting Portion 28 Circuit Pattern 30 Connection Terminal 34 Semiconductor Device 34

Claims (5)

[Claims] 1. A first side rail formed to be long, a second side rail formed to be long and arranged in parallel with the first side rail, and the first side rail. A plurality of package main bodies arranged side by side in the length direction of the first side rail and the second side rail between the second side rail, and the respective package main bodies and the first side rail, A plurality of connecting portions for connecting the second side rails, wherein the first side rails, the second side rails, the plurality of package main body portions, and the plurality of connecting portions are punched out of a synthetic resin plate to be integrated. A resin frame for a semiconductor device, which is formed on the. 2. The resin frame for a semiconductor device according to claim 1, wherein a circuit pattern is printed on the package body. 3. The resin frame for a semiconductor device according to claim 1, wherein the package body is provided with a connection terminal for connecting to an external circuit. 4. The resin frame for a semiconductor device according to claim 3, wherein the connection terminal is provided on a surface opposite to a surface on which the semiconductor chip is mounted. 5. A semiconductor chip is mounted on a package body of the resin frame for a semiconductor device according to claim 2, the semiconductor chip and a circuit pattern printed on the package body are connected to each other, and the package body is formed. Resin-sealing, and cutting the connecting portion of the resin frame for a semiconductor device to separate the resin-sealed package main body from the first side rail and the second side rail of the resin frame for a semiconductor device. A method for manufacturing a characteristic semiconductor device.