KR100248498B1 - A mold for forming semiconductor package and forming method thereof - Google Patents

Abstract

The present invention relates to a mold for resin-molding a semiconductor package in a substrate on which a gate slot for inducing a flow of a molding resin is formed, and a method for forming a semiconductor package using the same.

According to the present invention, a plurality of chip pads 20 having semiconductor chips 103 attached thereto are formed on an upper surface thereof, and a resin passage extending from the outer end thereof to a portion close to the resin molding part 101 for each chip pad 20. In the semiconductor package molding mold for resin molding the semiconductor chip 103 of the substrate 10 having the gate slot 30 formed thereon, the gate of the mold is disposed on the resin supply port 78 or the runner 80. The first gate 50 and the second gate 60 disposed on the side of the cavity 74, and between the first gate 50 and the second gate 60 of the substrate 10. A mold for forming a semiconductor package is provided, characterized in that a gate blocking portion 76 is formed facing the gate slot 30.

In addition, there is provided a semiconductor package molding method in which the substrate 10 having the gate slot 30 formed therein is injected into the mold and resin molding is performed, and the degating process is omitted and the individual semiconductor chips are separated and cut.

Description

Mold for molding semiconductor package and forming method of semiconductor package using same

The present invention relates to a mold for forming a semiconductor package and a method for forming a semiconductor package using the same, and more particularly, a mold for resin molding a semiconductor package on a substrate on which a gate slot for inducing a flow of a molding resin is formed and a semiconductor package using the same. It relates to a molding method of.

The general semiconductor package manufacturing process includes a die bonding process for attaching a semiconductor chip to a substrate, a molding process for molding the semiconductor chip into a molding resin to protect the electrical connection between the semiconductor chip and the substrate, and the molded semiconductor chip. It consists of a singulation process to separate each into individual chips. In the case of a BGA (Ball Grid Array) type semiconductor circuit board, the substrate to which the semiconductor chip is attached may be formed by adhering a plurality of resin thin plates to have a predetermined thickness, and the semiconductor chips may be electrically connected to each other between the multilayers. A circuit pattern is formed. In this case, a plurality of chip pads to which semiconductor chips are attached are formed on an upper surface of the substrate, and resin passages are formed at one side of each chip pad to allow molding resin to flow therein. It is connected to the end and formed.

1 is a plan view showing a conventional substrate, Figure 2 is a cross-sectional view showing a mold for resin molding. As shown in FIG. 1, a plurality of semiconductor chip packages 101 are molded on the upper surface of the substrate 100 formed by bonding a resin thin plate in multiple layers, and a gate of a mold is formed on one side of the semiconductor chip package 101. Resin passage 102 corresponding to the substrate 100 is formed to extend to the outer end of the substrate (100). After attaching the semiconductor chip 103 to the substrate, as shown in FIG. 2, the substrate 100 is fastened between the upper and lower molds 70 and 72 and the plunger 84 is operated to operate the gate 73. When the molten resin 82 is injected through the semiconductor chip is molded by the molding resin. At this time, the molding resin flows along the resin passage 102 and after the semiconductor chip is molded, a part of the molding resin remains and adheres to the resin passage. The remaining molding resin as described above is a bad factor in the semiconductor chip package, it should be separated (degating).

However, there was a problem in that the interlaminar peeling occurred when the remaining molding resin was removed from the resin passageway 102 of the substrate, and in order to solve such a problem, gold plating was conventionally performed on the resin passageway 102 of the substrate 100. Therefore, a method of allowing the remaining molding resin to be easily separated, that is, degated, has been introduced. However, when gold plating the resin passage 102 of the substrate corresponding to the gate in this way, the plating equipment and manpower according to a series of gold plating process is required, there is a problem that the process is cumbersome and the cost increases.

The present invention devised to solve the conventional problems as described above is a mold for forming a semiconductor package of a new structure using a substrate formed with a gate slot to reduce the cost of the semiconductor molding process and improve productivity and a semiconductor using the same It is to provide a molding method of the package.

To this end, the present invention uses a substrate having a gate slot formed on the resin passage extending from the outer end of the substrate to a portion close to the resin molding portion of the semiconductor chip, the middle of the gate of the molding die corresponding to the gate slot By forming a gate blocking portion for blocking a gate in the semiconductor package, a mold for a semiconductor package molding having a new structure capable of omitting a degating operation and a molding method using the same are provided.

1 is a configuration diagram of a conventional ball grid array semiconductor package

2 is a cross-sectional view of a molding die for a conventional semiconductor package

3 is a configuration diagram of a semiconductor package to which the present invention is applied

4 is a cross-sectional view of a mold for forming a semiconductor package according to the present invention.

5 is a bottom view of the upper mold of the mold;

6 is a block diagram of an individual semiconductor package manufactured according to the present invention

<Description of the code | symbol about the principal part of drawing>

10.Substrate 20.Chip Pad

30. Gate Slot 50. First Gate

60. Crab 2 Gate 70. Pictograph

72. Bottom 74. Cavity

76. Gate breaker 78. Resin supply port

80.Runner 100.Substrate

101. Semiconductor chip package 102. Resin channel

103. Semiconductor chip 104. Wire

According to the present invention, a plurality of chip pads 20 having semiconductor chips 103 attached thereto are formed on an upper surface thereof, and a resin passage extending from the outer end thereof to a portion close to the resin molding part 101 for each chip pad 20. In the semiconductor package molding mold for resin molding the semiconductor chip 103 of the substrate 10 having the gate slot 30 formed thereon, the gate of the mold is disposed on the resin supply port 78 or the runner 80. The first gate 50 and the second gate 60 disposed on the side of the cavity 74, and between the first gate 50 and the second gate 60 of the substrate 10. A mold for forming a semiconductor package is provided, characterized in that a gate blocking portion 76 is formed facing the gate slot 30.

In addition, according to the present invention, the die bonding step of attaching the semiconductor chip 103 on the chip pad 20 of the substrate 10 having the gate slot 30, the semiconductor chip 20 and the substrate 10 Wire-bonding step of electrically connecting the contact of the contact point, and the first gate 50 and the second gate 60 in communication with the cavity 74 and the gate 78 or the runner 80 to which the gate is supplied with resin The substrate 10 is fastened to the substrate 10 on the molds 70 and 72 having the gate blocking portion 76 formed between the first gate 50 and the second gate 60. Molten resin is injected through the 50 and the gate slot 30 and the second gate 60 in order to mold the resin; and welding solder balls for input / output terminals on the bottom of the substrate 10; Skip and separate the individual semiconductor packages from the substrate 10 by omitting the gating step Provided is a method for molding a semiconductor package, comprising a singulation step.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention;

Figure 3 is a plan view showing a substrate applied to the present invention, Figure 4 is a cross-sectional view of a mold for resin molding according to the present invention, Figure 5 is a bottom view of the upper mold of the mold, Figure 6 is produced in accordance with the present invention Is a schematic diagram of individual semiconductor packages.

As shown in FIG. 3, in the substrate 10 applied to the present invention, the resin passage 102 includes rectangular gate slots 30 spaced apart at predetermined intervals from one side of each chip pad 20. It is formed through and spaced apart at regular intervals along the outer end of the substrate (10). The position of the inner end of the gate slot 30 does not extend to the resin molding portion 101, but to a portion adjacent to the outer side of the resin molding portion 101.

Meanwhile, in the mold according to the present invention, as shown in FIGS. 4 and 5, the gate is separated into the first gate 50 and the second gate 60. The first gate 50 is disposed on the resin supply port 78 and the runner 80 side of the upper die (cavity block) 70, and the second gate 60 is disposed on the cavity 74 side. A gate blocking portion 76 is formed between the first gate 50 and the second gate 60 to extend to the bottom of the upper die. This gate blocking portion 76 is positioned to correspond to the gate slot 30 of the substrate 10 lying on the lower mold 72. According to this structure, the resin of the resin supply port 78 flows through the first gate 50 and is blocked at the gate blocking portion 76 to bypass the gate slot 30 to pass through the second gate 60. It is introduced into the bitty 74 to form the resin molding 101.

FIG. 6 shows resin substrate of the substrate 10 having the gate slot 30 formed thereon using a mold according to the present invention, and then welds solder balls (not shown) to the bottom of the substrate 10 and the substrate 10. ) Shows a semiconductor package separated by individual chips by cutting the frame portion, wherein the resin remains in the second gate 60 part on one side of the resin molding part 101 and the gate slot 30 cut in the singulation step. It is shown that water 60a remains.

As described above, when the semiconductor package is formed using the mold according to the present invention, even if a separate degating step is omitted, the resin remaining on the first gate 50 and most of the resin remaining on the gate slot 30 are separated from each other. The resin 60a, which is removed in the cutting and separating process (singulation process) and which remains in the second gate 60, is small in size and can be used as it is. Therefore, the degating process for removing resin residues remaining on the gate of the substrate 100 can be completely omitted as in the prior art, so that the semiconductor manufacturing process can be shortened and productivity can be improved to reduce costs. Will be.

As described above, according to the present invention, a gate slot is formed on a resin path by separating a gate of a mold into a first gate and a second gate, and forming a gate blocking portion that blocks the gate between the first gate and the second gate. In the case of resin molding by fastening the formed substrates, the degating process can be omitted, and accordingly, there is no need to separately conduct gold plating or separate processing on the resin passage to facilitate degating. It is possible to improve productivity by drastically improving the production process.

Claims (2)

A plurality of chip pads 20 to which semiconductor chips 103 are attached are formed on an upper surface thereof, and gate slots are formed on a resin path that extends from an outer end thereof to a portion close to the resin molding part 101 for each chip pad 20. In the mold for molding a semiconductor package for resin molding the semiconductor chip 103 of the substrate 10 having the substrate 30 formed thereon, the gate of the mold is a first gate disposed on the resin supply port 78 or the runner 80. 50 and a second gate 60 disposed on the cavity 74 side, and the gate slot 30 of the substrate 10 is disposed between the first gate 50 and the second gate 60. Mold for forming a semiconductor package, characterized in that the gate blocking portion (76) formed to face. A die bonding step of attaching the semiconductor chip 103 to the chip pad 20 of the substrate 10 having the gate slot 30 formed thereon, and electrically connecting the semiconductor chip 20 to the contacts of the substrate 10. The wire bonding step, and the gate is separated into a first gate 50 communicating with the port 78 or the runner 80 to which the resin is supplied, and a second gate 60 communicating with the cavity 74 and the first The substrate 10 is fastened to the first gate 50 and the gate slot by fastening the substrate 10 on the molds 70 and 72 having the gate blocking portion 76 formed between the gate 50 and the second gate 60. 30) and molten resin is sequentially injected through the second gate 60, and resin molding is performed; welding solder balls for input / output terminals on the bottom surface of the substrate 10; and the substrate eliminating the degating process. A singulation step of cutting and separating the individual semiconductor packages from (10) The method for forming a semiconductor package, characterized in that that.

Images