JPH06273482A - 裸の半導体チップのバーンインおよび試験用キャリアおよびその方法 - Google Patents

裸の半導体チップのバーンインおよび試験用キャリアおよびその方法

Info

Publication number
JPH06273482A
JPH06273482A JP5272594A JP27259493A JPH06273482A JP H06273482 A JPH06273482 A JP H06273482A JP 5272594 A JP5272594 A JP 5272594A JP 27259493 A JP27259493 A JP 27259493A JP H06273482 A JPH06273482 A JP H06273482A
Authority
JP
Japan
Prior art keywords
carrier
socket
chip
bare
burn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5272594A
Other languages
English (en)
Japanese (ja)
Inventor
Anthony M Chiu
エム．チウ アンソニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH06273482A publication Critical patent/JPH06273482A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP5272594A 1992-10-30 1993-10-29 裸の半導体チップのバーンインおよび試験用キャリアおよびその方法 Pending JPH06273482A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96874092A 1992-10-30 1992-10-30
US968740 1992-10-30

Publications (1)

Publication Number Publication Date
JPH06273482A true JPH06273482A (ja) 1994-09-30

Family

ID=25514700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5272594A Pending JPH06273482A (ja) 1992-10-30 1993-10-29 裸の半導体チップのバーンインおよび試験用キャリアおよびその方法

Country Status (4)

Country Link
EP (1) EP0600604A1 (en, 2012)
JP (1) JPH06273482A (en, 2012)
KR (1) KR940010259A (en, 2012)
TW (1) TW267244B (en, 2012)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578934A (en) * 1991-06-04 1996-11-26 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5402077A (en) * 1992-11-20 1995-03-28 Micromodule Systems, Inc. Bare die carrier
US6937044B1 (en) 1992-11-20 2005-08-30 Kulicke & Soffa Industries, Inc. Bare die carrier
JPH07161426A (ja) * 1993-12-03 1995-06-23 Furukawa Electric Co Ltd:The ベアチップバーンインテスト用ソケット及びその製造方法
JP2002243796A (ja) * 2001-01-25 2002-08-28 Promos Technologies Inc 封止材除去されたチップのテスト治具
CN102520280A (zh) * 2011-12-08 2012-06-27 台晶(宁波)电子有限公司 多温度点同步动态高温加速老化测试设备
CN116224038B (zh) * 2023-01-06 2023-11-14 法特迪精密科技（苏州）有限公司 一种芯片温度循环老化测试台的芯片座

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573617A (en) * 1967-10-27 1971-04-06 Aai Corp Method and apparatus for testing packaged integrated circuits
EP0107327A1 (en) * 1982-09-17 1984-05-02 Coordinate Probe Card Company Limited Probe device for testing an integrated circuit and method of making same
US5006792A (en) * 1989-03-30 1991-04-09 Texas Instruments Incorporated Flip-chip test socket adaptor and method
US4940935A (en) * 1989-08-28 1990-07-10 Ried Ashman Manufacturing Automatic SMD tester

Also Published As

Publication number Publication date
EP0600604A1 (en) 1994-06-08
TW267244B (en, 2012) 1996-01-01
KR940010259A (ko) 1994-05-24

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