A7 460903 ___B7_. 五、發明說明（1 ) 發明背景 發明領域 廣義而言，本發明與電子總成以及對其的測試有關《> 更明確地說*本發明與晶片從原始晶圓到測試板、印刷電 路扳及/或最終產品之基板的處理及傳送方法及裝’置有關 相關技術描述 業界對晶片封裝的主題已集中焦點熱心硏究了多年。 —項非常有成功希望的技術，包括將小且具有彈性之構件 固定到適當的基底上，並使用這些構伴構成活性元件與其 9 它電路間的有效接觸。在微電子中使用這類彈性連接元件 已是習知的方法|並將簧接觸元件直接製造在半導體裝置 上。一項特別有用處的彈性連接元件包括一個無需支撐的A7 460903 ___B7_. V. Description of the invention (1) Background of the invention In a broad sense, the present invention relates to electronic assemblies and their testing "> More specifically * the present invention relates to wafers from original wafers to test boards , Printed circuit board and / or substrate processing and transfer methods and devices of the final product. Related technology description The industry has focused on the topic of chip packaging and has been enthusiastically studying it for many years. -A highly successful technique that involves fixing small, flexible members to a suitable substrate, and using these partners to form effective contact between the active element and its other circuits. The use of such elastic connection elements in microelectronics is already a well-known method | and spring contact elements are manufactured directly on semiconductor devices. A particularly useful elastic connection element includes a supportless
I 簧接觸元件，一端固定於電子元件上，遠離電子元件的另 一自由端則很容易與第二個電子元件接觸，例如名稱爲 Method for Manufacturing Electrical Contacts，Using a Sacrificial M.ember·’ 美國專利 5，4 7 6，2_ 1 .1 e 其上構裝有簧接觸元件的半導體裝置稱之爲簧式半導 體裝置（springed semiconductor device )。簧式半導體裝 置與連接基板連接的主要方法有兩種。其一是永久性連接 ，例如將簧接觸單元的自由端焊接到連接基底（例如印刷 電路板）上的對應端點。另一是可逆連接，只需簡單地將 本纸張尺度这用中囡國家標準（CNS)A4規格（210 χ 297公« ) — — — — — —-----·1111111 ^ ·11111111 <請先閲讀背面之注意事項再填寫本頁} 經濟部智慧財產局員工消費合作社印裳 經濟部智慧財產局具工消費合作社印¾ ^ β〇9〇 3 Α7 ._ Β7_ 五、發明說明（2 ) 簧式半導體裝置壓向連接基板，即可做到接點與簧接觸單 元之接觸部分間的壓力達接>此種可逆的壓力連接稱之爲 簧式半導體裝置的自插入（self-socketing )。關於半導體 之簧封裝（MicroSpring™接點）的討論可見於1 9 9 8年 3月11曰的美國專利5，829，128，名稱爲， Method of Mounting Resilient Contact Structures to 1' Semiconductor Device· 〃。關於測試使用 MicroSpring™ 接點 之半導體的討論揭示於1 9 9 8年1 2月4日的美國專利 0 9 / 2 0 5 1 5 0 2，名稱爲 ’SocketforMatingwith Electronic Component, Particularly Semi conductor Device with Spring Packaging for Fixturing, Testing, Burning-In or Operating Such a Component/ ，並出_予本發明的受讓人 ο 以壓力連接的簧式半導體裝置可以從連接的基板上取 下，對簧式半導體裝置的更換或升級極爲方便。可逆連接 的簧式半導體裝置可獲致非常有用的目的。這對於將簧式 半導體裝置固定（暫時或永久）到系統的連接基板進行燒 機，或確定簧式半導體裝置是否符合它的規格標準都非常 有用。就如同一般的做法，以簧接觸單元使用壓力連接即 可做到。此類接點的接觸力可以釋放。 在典型的製造方法中，晶圓要接受有限的測試以確認 整體的功能性或晶圓上各個元件的非功能性。具有功能性 的各個半導體元件或晶片接著被封裝以做進一步的燒機及 更廣泛的測試•封裝程序不但昂貴且耗時^ 本纸張又度適用中國國家標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) ---- 訂---------線r A7 4 谷〇9〇3 ___ B7_；_ 五、發明說明（3 ) 使用MicroSpring™接點做連接，雖然晶片還在晶圓上 ，就可以提供完全可測試的晶片。測試晶片的較佳方法之 —是分割它們，接著移動它們通過多多少少典型的測試流 程，與目前在封裝裝置上執行的相同。主要差異是晶片一 旦從晶圓上分割出即已封裝，但目前的測試設備並不適用 此種裝置。 爲做到此點，晶片級的部分或I C晶片一旦從原來的 晶圓上切割下即置入一載具中。接著該載具將晶片傳送到 測試板，例如進行燒機測試。一旦載具中所有的晶片都通 過檢驗，載具接著傳送晶片，並將其安裝到印刷電路板或 最終產品的基板上》 此種載具對使用MicroSpring接點'歲相伺接點的晶片特 別有用。此種載具對於傳統晶片與具有適當連接機構的測 試裝置或最終產品間的接觸也很合用。具有MicroSpring接 點的測試裝置或最終產品特別適合連接傳統晶片。 晶片級的載具具有數項習知技術所沒有的優點。第一 ，可以各別測試每一個晶片，如果測試失敗即可更換。第 二，昂片級的載具可以結合追蹤機制，以追蹤每一艏晶片 ，儲存載具的相關資訊以供監視與追蹤•第三，晶片級的 載具可以很容易地處理大量晶片，以及在傳送、儲存及使 用期間能保護晶片及它們的簧接點。此外，載具可以限制 測試期間對晶片上簧接點的壓縮量，此壓縮量小於晶片在 正式使用期間允許的壓縮量。可以經由設計時決定測試階 段期間對簧接點所允許的最大壓縮以做到對壓縮的限制。 木纸張纥度適用中S國家標準（CNS)A4規格（210 X 297公釐) ^ "" <請先閱讀背面之注意事項再填寫本頁)I Spring contact element, one end is fixed to the electronic component, and the other free end away from the electronic component is easy to contact with the second electronic component, for example, named Method for Manufacturing Electrical Contacts, Using a Sacrificial M.ember · 'US Patent 5, 4 7 6, 2_ 1.1 .1 e The semiconductor device on which the spring contact element is configured is called a spring-type semiconductor device (springed semiconductor device). There are two main methods for connecting the spring-type semiconductor device to the connection substrate. One is a permanent connection, such as soldering the free end of a spring contact unit to a corresponding end on a connection substrate such as a printed circuit board. The other is a reversible connection. Simply use the paper size of this paper to use the Chinese National Standard (CNS) A4 specification (210 χ 297 male «) — — — — — — — — 1111111 ^ · 11111111 < Please read the notes on the back before filling in this page} Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, India. ) The spring-type semiconductor device is pressed against the connection substrate, and the pressure between the contact point and the contact portion of the spring-contact unit is reached> This reversible pressure connection is called self-socketing ). A discussion of semiconductor spring packages (MicroSpring ™ contacts) can be found in US Patent No. 5,829,128, issued March 11, 1988, entitled Method of Mounting Resilient Contact Structures to 1 'Semiconductor Device. Discussion on testing semiconductors using MicroSpring ™ contacts was disclosed in US Patent 0 9/2 0 5 1 5 0 2 on February 4, 1989, entitled 'SocketforMatingwith Electronic Component, Semi Semi conductor Device with Spring Packaging for Fixturing, Testing, Burning-In or Operating Such a Component /, and issued to the assignee of the present invention. Ο A pressure-connected spring-type semiconductor device can be removed from the connected substrate. Replacement or upgrade is extremely convenient. Reversibly connected spring-type semiconductor devices serve very useful purposes. This is useful for fixing (temporarily or permanently) a sprung semiconductor device to the system's connection substrate for burn-in, or to determine whether the sprung semiconductor device meets its specifications. As usual, this can be done with a spring contact unit using a pressure connection. The contact force of such contacts can be released. In a typical manufacturing method, the wafer undergoes limited testing to confirm the overall functionality or non-functionality of individual components on the wafer. Each functional semiconductor element or chip is then packaged for further burn-in and more extensive testing. • The packaging process is expensive and time-consuming. ^ This paper is also compatible with China National Standard (CNS) A4 (210 X 297). Gongai) (Please read the notes on the back before filling in this page) ---- Order --------- line r A7 4 Gu 0009 0 _ B7_; _ 5. Description of the invention (3) Using MicroSpring ™ contacts for connection, although the wafer is still on the wafer, a fully testable wafer can be provided. One of the better ways to test wafers is to split them and then move them through more or less typical test processes, the same as currently performed on packaging devices. The main difference is that the chip is packaged as soon as it is separated from the wafer, but current test equipment is not suitable for such devices. To do this, a wafer-level portion or IC chip is placed in a carrier once it has been cut from the original wafer. The carrier then transfers the wafer to a test board, such as for a burn-in test. Once all the wafers in the carrier have passed the inspection, the carrier then transfers the wafers and mounts them on the printed circuit board or the substrate of the final product. "This carrier is especially useful for wafers that use MicroSpring contact points. it works. This carrier is also useful for contact between conventional wafers and test equipment or end products with appropriate attachment mechanisms. Test setups or end products with MicroSpring contacts are particularly suitable for connection to conventional chips. Wafer-level carriers have advantages not found in several conventional techniques. First, each chip can be tested individually and replaced if the test fails. Second, wafer-level carriers can incorporate a tracking mechanism to track each stack of wafers, and store relevant information of the carrier for monitoring and tracking. • Third, wafer-level carriers can easily handle a large number of wafers, and Protects wafers and their spring contacts during transport, storage and use. In addition, the carrier can limit the amount of compression of the spring contacts on the wafer during the test, which is less than the amount of compression allowed by the wafer during official use. The maximum compression allowed for the spring contact during the test phase can be determined at design time to limit the compression. The paper size of wood paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ^ " " < Please read the precautions on the back before filling this page)
-* I I I I I I 訂·！ — 11! rL 經濟部智慧財產局員工消費合作社印5.Λ 4 6 Ο 9 Ο 3 Α7 ____Β7__ 五、發明說明（4 ) 接著I在實際使用時可以採用不同的限制。此特性將可增 加簧的壽限。 發明槪述 本發明提供一種裝置，在晶片從晶圓分割開後，可以 操作一或多個積體電路（I C )晶片通過測試。本'發明的 —般實施例包括一載具，於傳送、測試及/或最終應用期 間用來支撐晶片。晶片從一開口置入載具內，並放置在襯 於開口底部某些部分的台階上。晶片的簧組件向下延伸經 由開口並通過台階的底側，以允許與測試板、印刷電路板 、或最終封裝基板之接墊間的電氣接觸*將晶片緊固於載 具開口內的方法有數種，包括以一上羞耦合到該載具的上 方，或經由使用載具內的卡荀（snap lock)。一合適的上 蓋具有開口藉以露出晶片的部分背側。允許從上蓋的開口 進到晶片的背側，用以送入冷卻或加溫的氣體，晶片的寘 體監視，以及加入識別標記或追蹤裝置。載具可儲存、移 動或安裝到測試板供測試或印刷電路板供特定用途〃另者 *可先將載具置於板上，再陸續地將晶片與上蓋固定於其 上。 圖式簡單說明 本發明將參考附圖做進一步描述*其中： 圖1 A是本發明之載具模組的横剖面圖，包括一支撐 晶片的載具以及將晶片固定在載具內的上蓋。 本纸張又度適用中國國家標準（CNS)A4規格（210 X 297公釐） {請先閱讀背面之注意事項再填寫本頁) '裝 — III ^ ·11111111 _ 4 6090 3 Α7 ‘ Β7 五、發明說明（5 ) 圖1B及1C說明本發明的特定較佳實施例。 圖1 D說明本發明的另一特定較佳實施例。 <請先閱讀背面之注意事項再填寫本頁) 圖1 E說明包含9個載具的J EDE C托盤，第1 〇 個正被定向加入托盤內* 圖2 A是本發明之載具的第一實施例頂視圖。 圖2 B是本發明之載具的第二實施例頂視圖。、' 圖3 A是本發明之上蓋的第一實施例頂視圖，其內有 開口。 圖3 B是本發明之上蓋的第二實施例頂視圖，其內有 開口 * 圖4是本發明之載具模組另一實施例的橫剖面圖，包 括支撐晶片的載具及扣合到該載具並便晶片在載具內固定 的上蓋。 圖5是圖1A所示之本發明實施例使用支撐架固定於 測試板上的橫剖面圖。 圖6 A是本發明另一實施例使用墊片固定於測試板上 的橫剖面圖。 _ 經濟茚智慧財產曷員X消費合作社印製 圖6 B是本發明另一實施例使用墊片固定於測試板上 的橫剖面圖。 圖7是本發明另一實施例的橫剖面圖，其中載具的每 —個開口內有兩個台階，且上蓋具有一凸出的部分向下延 伸到開口內，以固定載具內的晶片。 圖8是本發明另一實施例的橫剖面圖’其中使用載具 本身的卡筍將晶片固定而不使用上蓋。 本纸張又度適用中囿國家標準（CNS)A4規格（210 =< 297公釐） 4 β〇903 a7 ___ B7_ 五、發明說明（6 ) 圖9 A的橫剖面圖說明藉壓下橫過板後方的臂將本發 明的載具模組與板夾緊的方法。 圖9 Β是本發明另一實施例的橫剖面圖，其中使用一 簧壓式固定臂將載具固定在負荷板上》 圖9 C是本發明另一實施例的橫剖面圖，其中使用一 簧壓式螺拴將載具固定在負荷扳上。 '' 圖9 D說明本發明的一特定較佳實施.例。 圖1 0的橫剖面圖說明將載具模組固定到板上的另一 種方法，其中載具模組先固定於臂上，接著將臂下降到定 位。 圖1 1的橫剖面圖說明將圖8所示的載具模組固定到 板上的方法。 ~ 圖1 2 Α是本發明之載具模組的橫剖面圖，其中板上 的定位孔具有一傾斜的前緣，以更將載具模組滑入定位， Μ使晶片的接觸簧在板上的對應接墊上產生一掃的動作。 圖1 2 Β及1 2 C說明具有簧之測試板的側視及頂視 圖，以及對應的載具、上蓋及晶片》 一_ @1 3 Α是本發明之載具的頂視圖，在載具上包括一 追蹤標籤，以及在晶片上的識別標記- 圖1 3 B是本發明之載具的端視圖，在載具上包括一 追蹤標籤|以及一可連接到電子儲存裝置的連接器。 圖1 3 C顯示用於多載具之托架的斜視圖。 圖1 4是說明追蹤載具及/或單一晶片經過製造、傳 送及最終使用之步驟的流程圖》 氏張又度適用中國國家標準（CNS)A4規格（210 297公t (請先閱讀背面之注意事項再填寫本頁) -广裝---- IT---------線， 經濟部智慧財產局員工消費合作社印製 460903 A7 _ B7_- 五、發明說明（7 ) 8 緊固銷 1 0 載具 1 .1 承板 1 2 晶片 1 3 對正銷 1 4 開口 1 5 孔 1 6 簧組件 1 8 台階. 2 0 上蓋 2 0 A 散熱單元 2 2 鉚釘 2 2 B 扣殼 2 2 A 扣頭 2 4 開口 2 6 支架 3 0 測試板 3 0 A A ^負荷板 3 1 接墊 3 2 定位孔 6 0 墊片 7 0 載具 7 2 第一台階 7 4 第二台階 7 6 開口 7 8 上蓋 7 9 延伸部 8 0 上蓋 8 4 開口 8 2 卡筍 9 0 支架 9 0 B 支柱 9 1 框架 9 2 臂 9 2 A 頂蓋 9 2 B 壓臂 9 3 閂扣 9 4 載具模組 9 6 第二支臂 9 8 卡筍 1 0 4 載具模組 1 0 2 臂 (請先閱讀背面之注意事項再填寫本頁) 圖1 5的流程圖說明製造並接著使用本發明的步驟。 主要元件對照表 ^ΠΓ： 本纸張又度適用中园國家標準（CNSM4規格（210 X 297公釐） 經濟部智慧財產局員工消费合作社印製 460903 五、發明說明（8 ) A7 」__.__B7 1 0 6 第二支架 1 0 8 卡荀 1 1 2 壓臂 1. 1 5 延伸部 1 1 6 第二支架 1 1 8 卡筍 1 2 0 板 1 2 2 定位孔 1 2 3 焊球 1 2 4 斜面前 緣 1 2 5 基板 1 2 6 載具模 組 1 2 7 簧 1 2 8 支撐架 1 3 0 載具 1 3 0 托架 1 3 1 槽 1 3 2 標籤 1 3 4 可程式裝置 1 3 3 連接器 發明詳細說明 描述操作積體電路（I c)晶片通過測試及最終應用 的一種方法及裝置。揭示追蹤晶片的一種方法及裝置。在 以下的詳細描述中，將引述諸多特定細節，以便能更徹底 瞭解本發明。不過，熟悉此方面技術之人士也將明瞭，不 使用這些特定細節本發明仍可實用。在其它的例中，不再 對熟知的裝置、方法、程序及各個元件做詳細描述，以免 糢糊了本發明的態樣。 本發明提供一載具，在I C晶片從原晶圓上切割下後 ，用以傳送及追蹤I C晶片通過測試。一般來說，本發明 的載具是在測試期間用來傳送及支撐晶片，且可以加上標 籤以便追蹤載具及它所載的各個元件。本發明的載具是用 於使用焊簧、入孔銷簧、或壓力簧接點的晶片。測試一旦 ϋ張又度適用中國國家標準<CNS)A4規格（210Χ 297公蹵) :”二 (請先閲讀背面之注意事項再填寫本頁) "ί 裝！_ 訂 I! 460903 A7 B7 五、發明說明（9 ) 完成，載具即被傳送及安裝於印刷電路板上，以構成最終 的基板封裝。 (請先閱讀背面之注^^^項再填寫本頁} 載具也可用於根本沒有簧的晶片，爲測試或與最終應 用產品介接，它包括適當的接觸機制，用以建立與晶片的 電氣接觸，非常類似在本申請案中所詳細描述之矽晶片上 的簧。一較佳的最終應用產品包括相同的簧》 '' 本發明的一般實施例說明於圖1 A »載具或下組件 1 0在晶片1 2的傳送、測試及/或最終應用中用於支撐 晶片1 2。典型上，載具1 0是由有機材料製成，例如聚 .合物，可以使用射模法成形。在一較佳實施例中，使用環 氧樹脂玻璃層板材料，按尺寸切割並機械加工成所要的形 狀。晶片1 2經由開口 1 4置入載具Γ〇內，置於襯在開 口1 4之至少部分底部的台階1 8上。注意，開口 1 4的 側壁最好是斜切面，以便於晶片12塞入開口 14。還須 疰意，置入載具的晶片是封裝前的晶片。亦即，晶片四周 f. 沒有封裝保護晶片。在載具1 0內的測試結束後，載具可 做爲晶片1 2的最終封裝》 < 經濟部智慧財產局員工消費合作钍印製 晶片1 2的簧組件1 6向下延伸通過開口 1 4，以與 測試板、印刷電路板或最終·應用之封裝基板上的接墊進一 步電氣接觸》簧組件1 6延伸經過開口 1 4通過台階18 的底側。簧組件或接點1 6通常是細長的彈性電氣接觸單 元。在19 9 9年2月2日授予丑1(^(126等人，名稱爲、 Method of Making Contact Tip Structure 〃的美國專利 5，8 6 4，9 4 6中，對此種彈性電氣接觸單元有詳細 -12- 本纸張K度適用中國國家標準（CMS)A4規格（210 * 297公爱） 4 60903 Α7 Β7 五、發明說明（1Q) 討論，該項專利授予本發明的受讓人，倂入本文參考。 注意，高度H = H 1 —H2提供簧組件16的最大壓 縮縮極限。Η 1.是從載具1 〇底部到上蓋2 0底部的尺寸 ，它是當簧被壓縮時晶片頂部的位置》Η 2是晶片的厚度 。其它要考慮的因素是某些幾何形狀，簧要接觸位於某些 高於接觸表面上的端點，因此要進入到開口 1 4在本例 中，在決定簧在最大壓縮下的最小長度時，必須考慮端點 的厚度。 換言之，簧不能被壓縮超過高度Η。一般來說，簧組 件有3種高度須特別注意- 1 )新產品或懸空時的高度（ 例如3 0 hi i 1 s ) ，2 )燒機測試時的高度（例如2 8 mils)，以及3 )工作時的高度父例如2 5 m i 1 s )。在測試期間對簧的壓縮愈小愈好，以保持簧的壽命， 亦即，要保持彈性以便在稍後的工作中能有最佳性能。換 言之，在最終操作時要增加對簧組件的壓縮，以確保良好 的電氣接觸，在最終操作前要保持最小壓縮。 圖1 Β及1 C說明圖1 Α之裝置的側視'及頂視分解圖 。圖中顯示2乘4的晶片配置，以及與開口對應的上蓋 2 0 »圖1 D顯示本發明的另一較佳實施例。圖中顯示8 個晶片的1乘8配置。載具10、上蓋20及散熱單元 2 0 A。在此分解圖中•緊固銷8顯示的長度過度放大以 便於說明此分解圖*在實際使用中，緊固銷的長度只需 將上蓋2 0緊固於載具1 0，以及將載具1 0緊固於板 3 0即可β 本纸張&度適用中國囷家標準（CNS>A4規格（210 * 297公釐） (請先閲讀背面之注意事項再填寫本頁) rv 裝·----- 訂--------- 經濟部智慧財產局員工消f合作钍印製 -13 - 460903 A7 B7 五、發明說明（11 ) 圖2A及2 B說明載具1 〇的頂視圖，顯示載具1 〇 內之開口 1 4的兩種配盧例。圖2A的載具1 〇 (對應於 圖1A之載具1〇的橫剖面圖）具有8個開口排列成2列 ，每列各有4個開口 1 4。圖2 B是另一種配置，其中8 個開口 1 4 a在載具1 ·〇 a上一字排開（此頂視圖與圖 1 A之橫剖面圖並不直接對應）。雖然圖2 A及2 Έ所描 繪的載具1 0都是8個開口 1 4按直線方式排列，但這並 非本發明的要求。載具1 0中開口 1 4的實際數量、位置 、排列方向都是設計上的選擇，視很多因素而定。 現請回頭參閱圖1A，上蓋20耦合到載具1 0。如 同載具，上蓋2 0也是使用有機材料射模成形。在一較佳 實施例中，上蓋是以環氧樹脂玻璃層檢機械加工而成。上 蓋也包括一金屬片幫助散熱，也可以在其上加裝散熱組件 ，如風扇等。上蓋也可考慮一固定件。須注意，任何一種 固定件，諸如卡筍、球軸承、固定器、單棒等，都可以附 加到上蓋以將晶片固定在載具內。當晶片放置在載具中時 ，典型上此固定件機械性地緊毗鄰於晶片背側部分表面。 上蓋2 0有兩項主要功能。第一，在傳送期間，上蓋 經濟部智慧財產局員工消費合作钍印製 {請先閱讀背面之注意事項再填寫本頁) * · 20將晶片12固定於載具10的開口14內。第二，測 試或使用期間當晶片1 2被壓縮時，上蓋2 0提供阻力抵 住晶片1 2。此壓縮源自於簧推擠晶片1 2及下方基板（ 如測試板3 0，見圖5 )的力。上蓋2 0可以任何一種機 械方式耦合到載具1 0。如圖1 A所示’使用的是扣殼 2 2 B及扣頭2 2 B。扣頭2 2 B被鉚拉2 2緊固於上蓋 本紙張&度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 經濟部智慧財產局員工消費合作社印製 46〇9〇3 ' A7 __ . B7_. 五、發明說明（12 ) 20。不過|也可以使用螺帽與螺栓或夾子。圖5及圖 6 B包括另一實施例，使用不同型式的卡筍將兩個組件緊 合在一起。只要確保暫時性的連接，載具1 0與上蓋2 0 的耦合方法並不重要，暫時連接在本發明的絕大多數（並 非全部）例子中都很管用。暫時連接容許事後某時將上蓋 2 0移去，例如在測試或使用後取出晶片1 2，或'允許取 出並更換某特定晶片1 2，或允許更換上蓋2 0本身。 上蓋2 0也具有開口 2 4，它露出晶片1 2背側的一 部分。在圖1 A中，一個開口 2 4露出該處晶片1 2大半 的背側|因此它大約是在晶片12與載具開口14的中央 。圖3 A是上蓋2 0的頂視圖，顯示長方形的開口 2 4位 於每一個晶片1 2的上方。不過需注薏，開口 2 4並不一 定需要是長方形或每一個晶片上一個開口。例如圖3 B所 示另一種上蓋2 0 a的實施例，其中，載具1 〇內每一個 ’晶片1 2的上方是兩個橢圓形開口 2 4 a。 雖然上蓋2 0並不一定需要開口 *它可以是實心的片 狀材料*但開口提供本發明之載具數項優點。第一，開口 2 4允許控制溫度的氣體直接送到晶片1 2的背側。在燒 機測試期間，控制溫度的氣體有助於將晶片1 2保持在所 要的固定溫度•最主要的是，此允許改變晶片1 2的溫度 *藉以評估在不同工作溫度下的性能。可以按測試目的所 需，將k氣直接送到晶片1 2的背側第二，開口 2 4允 許對待測的晶片做附加的耦合。例如，可以使用熱電耦監 測每一個晶片的溫度*或使用其它的耦合做測試，或操作 本紙張反度適用中國國家標準（CNS)A4規格（210 X 297公釐) ·化： <請先閱讀背面之注意事項再填寫本頁) ' ί 1 ϋ ϋ ί-ίτ-w, *1 H ϋ n ϋ n I ' 經濟邨智慧財產局具工消f.合作社印製 ό 60903 Α7 ___Β7__ 五、發明說明（13 ) 期間的其它量測，如電阻。第三，開口 2 4提供進入到每 —個晶片1 2背側的入口，按需要加入識別標記I D (見 圖1 3 ) *例如，可在晶片1 2上加註墨點標記以顯示測 試失敗的晶片。也可以加註顯示測試結果的標記，例如直 接標註速度等級。也可以加註產品識別資訊，如製造商、 批號等。此外，也可以在每一個晶片背部印上條碼或其它 的機器可讀取碼以供追蹤每一個晶片1 2 ,或在晶片上放 置內有密碼的磁條.（見下文對追蹤的詳細討論）。 現請回頭參閱圖1 A，使用扣合的方式耦合載具1 〇 及上蓋2 0 *同時也做爲支撐架26。在一較佳例中，支 撐架2 6是將扣2 2 B緊固於載具1 0之緊定銷的一部分 。支撐架可以設計在載具1 0內，或Μ緊固於載具上》 支撐架2 6從載具1 0的底部向下延伸超過簧組件 1 6，以在傳.送、儲存或處理期間保護簧組件1 6。例如 ，如果載具1 0在測試前可能先放置在平台上，支撐架 2 6即可防止簧組件1 6被壓縮。注意，如果載具1 0與 上蓋2 0間耦合的方法不是使用如圖1 Α所示的扣及鉚釘 2 2 ,例如使用螺絲，它不延伸通過兩個組件，或是使用 卡筍，在製程期間，可以將支撐架加到載具上，或將支撐 架做成載具的一部分。圖4說明當載具與上蓋使用卡筍耦 合時，將支撐架直接製造在載具上以提供簧的保護》 支撐架也具有非常重要的第二功能，即有助於載具正 確地定位於測試板上。測試期間，載具1 0將如圖5所示 般地固定於測試板3 0上。簧組件1 6將與測試板3 0上 本紙張又度適用中國國家標萃（CNS)A4規格（210 * 297公爱) · 16 - .(請先閱讀背面之注意事項再填寫本頁》 裝 • n vk f-* I I I I I I Order! — 11! RL Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5.Λ 4 6 Ο 9 Ο 3 Α7 ____ Β7__ 5. Description of the invention (4) Then I can use different restrictions in actual use. This feature will increase the life of the spring. SUMMARY OF THE INVENTION The present invention provides a device that can operate one or more integrated circuit (IC) wafers to pass a test after the wafer is separated from the wafer. The present invention's general embodiment includes a carrier to support the wafer during transport, testing, and / or end use. The wafer is placed into the carrier from an opening and placed on a step lining some portions of the bottom of the opening. The spring assembly of the wafer extends down through the opening and through the bottom side of the step to allow electrical contact with the test board, printed circuit board, or pads of the final package substrate. There are several ways to secure the wafer in the opening of the carrier This includes coupling to the top of the vehicle with a top handle, or by using a snap lock inside the vehicle. A suitable cover has an opening through which a portion of the backside of the wafer is exposed. It is allowed to enter the back side of the wafer from the opening of the upper cover for feeding cooling or warming gas, monitoring the placement of the wafer, and adding identification marks or tracking devices. The carrier can be stored, moved, or mounted on a test board for testing or a printed circuit board for a specific purpose. * Otherwise, the carrier can be placed on the board first, and then the chip and the upper cover can be fixed to it. Brief Description of the Drawings The present invention will be further described with reference to the accompanying drawings * of which: Figure 1A is a cross-sectional view of a carrier module of the present invention, including a carrier supporting a wafer and an upper cover for fixing the wafer in the carrier. This paper is again applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) {Please read the notes on the back before filling this page) 'Packing — III ^ · 11111111 _ 4 6090 3 Α7' Β7 V. DESCRIPTION OF THE INVENTION (5) FIGS. 1B and 1C illustrate a specific preferred embodiment of the present invention. FIG. 1D illustrates another specific preferred embodiment of the present invention. < Please read the notes on the back before filling this page) Figure 1 E illustrates the J EDE C pallet containing 9 carriers, and the 10th is being oriented into the pallet * Figure 2 A is the carrier of the present invention First embodiment top view. Fig. 2B is a top view of a second embodiment of the carrier of the present invention. Fig. 3A is a top view of the first embodiment of the upper cover of the present invention, which has an opening therein. Fig. 3B is a top view of the second embodiment of the upper cover of the present invention, which has an opening therein * Fig. 4 is a cross-sectional view of another embodiment of the carrier module of the present invention, including a carrier supporting a wafer and snap-fitting The carrier is an upper cover for fixing the chip in the carrier. Fig. 5 is a cross-sectional view of the embodiment of the present invention shown in Fig. 1A, which is fixed to a test board using a support frame. Fig. 6A is a cross-sectional view of another embodiment of the present invention using a gasket to fix a test board. _ Printed by Economic Ind Intellectual Property Agent X Consumer Cooperative Figure 6B is a cross-sectional view of another embodiment of the present invention using a gasket fixed on a test board. FIG. 7 is a cross-sectional view of another embodiment of the present invention, in which there are two steps in each opening of the carrier, and the upper cover has a protruding portion extending downward into the opening to fix the wafer in the carrier. . Fig. 8 is a cross-sectional view of another embodiment of the present invention 'in which the wafers of the carrier itself are used to fix the wafer without using the upper cover. This paper is again applicable to the China National Standard (CNS) A4 specification (210 = < 297 mm) 4 β〇903 a7 ___ B7_ V. Description of the invention (6) Figure 9 A cross-sectional view showing the horizontal direction under pressure Method for clamping the carrier module and the board of the present invention by an arm behind the board. FIG. 9B is a cross-sectional view of another embodiment of the present invention, in which a spring-loaded fixing arm is used to fix the carrier to the load plate. FIG. 9C is a cross-sectional view of another embodiment of the present invention, in which a A spring-loaded bolt secures the carrier to the load plate. '' Figure 9D illustrates a particular preferred embodiment of the present invention. The cross-sectional view of FIG. 10 illustrates another method of fixing the carrier module to the board, in which the carrier module is first fixed on the arm, and then the arm is lowered into position. FIG. 11 is a cross-sectional view illustrating a method of fixing the carrier module shown in FIG. 8 to a board. ~ Figure 1 2 A is a cross-sectional view of the carrier module of the present invention, wherein the positioning hole on the board has an inclined leading edge to slide the carrier module into position, and the contact spring of the wafer is on the board. A sweeping motion is generated on the corresponding pad. Figures 1 2 B and 1 2 C illustrate a side view and a top view of a test board with a spring, and the corresponding carrier, cover and wafer. "_ _ @ 1 3 Α is a top view of the carrier of the present invention. It includes a tracking label and an identification mark on the wafer-Fig. 1 3B is an end view of the carrier of the present invention, including a tracking label on the carrier and a connector that can be connected to the electronic storage device. Figure 1 3C shows a perspective view of a bracket for a multiple carrier. Figure 14 is a flow chart illustrating the steps of manufacturing, transferring and final use of the tracking vehicle and / or single chip. "Zhang Zhang also applies the Chinese National Standard (CNS) A4 specification (210 297 g t (please read the back Please fill in this page again for the matters needing attention) -Broadcasting ---- IT --------- line, printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 460903 A7 _ B7_- V. Description of Invention (7) 8 Tight Fixing pin 1 0 Carrier 1.1 Support plate 1 2 Wafer 1 3 Alignment pin 1 4 Opening 1 5 Hole 1 6 Spring assembly 1 8 Step. 2 0 Cover 2 0 A Radiator 2 2 Rivet 2 2 B Buckle shell 2 2 A buckle 2 4 opening 2 6 bracket 3 0 test board 3 0 AA ^ load board 3 1 pad 3 2 positioning hole 6 0 gasket 7 0 carrier 7 2 first step 7 4 second step 7 6 opening 7 8 Top cover 7 9 Extension 8 0 Top cover 8 4 Opening 8 2 Cards 9 0 Stand 9 0 B Pillar 9 1 Frame 9 2 Arm 9 2 A Top cover 9 2 B Press arm 9 3 Latch 9 4 Carrier module 9 6 Second arm 9 8 Card shoot 1 0 4 Carrier module 1 0 2 arm (Please read the precautions on the back before filling this page) Figure 1 5 Process The figure illustrates the steps of manufacturing and then using the present invention. Main component comparison table ^ ΠΓ: This paper is again applicable to the National Park Standard (CNSM4 specification (210 X 297 mm). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Description of the invention (8) A7 "__.__ B7 1 0 6 Second bracket 1 0 8 Card holder 1 1 2 Press arm 1. 1 5 Extension 1 1 6 Second bracket 1 1 8 Card shoot 1 2 0 Plate 1 2 2 Positioning hole 1 2 3 Solder ball 1 2 4 Oblique front edge 1 2 5 Base plate 1 2 6 Carrier module 1 2 7 Spring 1 2 8 Support frame 1 3 0 Carrier 1 3 0 Bracket 1 3 1 Slot 1 3 2 Tag 1 3 4 Programmable device 1 3 3 Connector invention detailed description Describes a method and device for operating integrated circuit (IC) chips that pass the test and final application. Reveals a method and device for tracking chips. Details are as follows In the description, many specific details will be cited in order to understand the present invention more thoroughly. However, those skilled in the art will also understand that the present invention can still be used without these specific details. In other examples, well-known devices, methods, programs, and individual components are not described in detail, so as not to obscure the aspect of the present invention. The invention provides a carrier, which is used to transfer and track the IC chip passing the test after the IC chip is cut from the original wafer. Generally, the carrier of the present invention is used to transport and support the wafer during testing, and can be labeled to track the carrier and the various components it carries. The carrier of the present invention is a wafer using a solder spring, a pin spring, or a pressure spring contact. Once tested, the Chinese national standard < CNS) A4 specification (210 × 297 cm) will be applied once again: "Second (please read the precautions on the back before filling this page) " 装 I! 460903 A7 B7 V. Description of the invention (9) After completion, the carrier will be transferred and installed on the printed circuit board to form the final substrate package. (Please read the note on the back ^^^ before filling this page} The carrier can also be used for A wafer without a spring at all, for testing or interfacing with an end-use product, it includes a suitable contact mechanism to establish electrical contact with the wafer, very similar to the spring on a silicon wafer described in detail in this application. The preferred end-use product includes the same spring. "" A general embodiment of the invention is illustrated in Figure 1A. The carrier or lower component 10 is used to support the wafer during wafer 12 transfer, testing, and / or end application. 1 2. Typically, the carrier 10 is made of an organic material, such as a polymer. It can be formed by injection molding. In a preferred embodiment, an epoxy glass laminate material is used and cut according to size. And machined into the desired shape. 12 is placed in the carrier Γ0 through the opening 14 and placed on a step 18 lining at least part of the bottom of the opening 14. Note that the side wall of the opening 14 is preferably a chamfered surface to facilitate the insertion of the wafer 12 Opening 14. Please also be careful, the wafer placed in the carrier is the wafer before packaging. That is, the wafer f. There is no package to protect the wafer. After the test in the carrier 10 is completed, the carrier can be used as the wafer 1 2 Final Package "< Consumer cooperation with employees of the Intellectual Property Bureau of the Ministry of Economy 钍 Printed wafers 1 2 Spring components 16 extend downward through the openings 14 to connect with test boards, printed circuit boards or final application packaging substrates The pads further make electrical contact "The spring assembly 16 extends through the opening 14 through the bottom side of the step 18. The spring assembly or contact 16 is usually an elongated elastic electrical contact unit. Granted on February 2, 19, 1999 1 (^ (126, et al., U.S. Patent No. 5, 8 6 4, 9 4 6 named Method of Making Contact Tip Structure ，) has detailed information on this kind of flexible electrical contact unit. -12- This paper is suitable for K degrees China National Standard (CMS) A4 Specification (210 * 297 Public Love) 4 60903 Α7 Β 7. V. Description of the Invention (1Q) Discussion, this patent is granted to the assignee of the present invention, and is incorporated herein by reference. Note that the height H = H 1-H2 provides the maximum compression limit of the spring assembly 16. 从 1. is from The dimension from the bottom of the carrier 10 to the bottom of the upper cover 20, which is the position of the top of the wafer when the spring is compressed. Η 2 is the thickness of the wafer. Other factors to consider are certain geometries, and the spring is in contact with certain heights. The end point on the contact surface, so to enter the opening 14 In this example, the thickness of the end point must be considered when determining the minimum length of the spring under maximum compression. In other words, the spring cannot be compressed beyond the height Η. Generally speaking, there are 3 kinds of heights of spring components, which need special attention-1) the height of the new product or when suspended (for example, 30 hi i 1 s), 2) the height of the burn-in test (for example, 2 8 mils), and 3 ) Height parent when working, for example 2 5 mi 1 s). During the test, the compression of the spring should be as small as possible to maintain the life of the spring, that is, to maintain the elasticity so as to have the best performance in later work. In other words, increase the compression of the spring assembly during final operation to ensure good electrical contact, and maintain minimum compression before final operation. Figures 1 B and 1 C illustrate a side view and an exploded view of the device of Figure 1 A. The figure shows a 2 by 4 chip configuration, and an upper cover corresponding to the opening 2 0 »FIG. 1D shows another preferred embodiment of the present invention. The figure shows a 1 by 8 configuration for 8 wafers. The carrier 10, the upper cover 20 and the heat dissipation unit 20 A. In this exploded view • The length shown by the fastening pin 8 is exaggerated to explain this exploded view * In actual use, the length of the fastening pin only needs to fasten the upper cover 20 to the carrier 10, and the carrier 1 0 fastened to the board 3 0 β This paper & degree applies Chinese standard (CNS > A4 size (210 * 297 mm) (Please read the precautions on the back before filling in this page) rv Loading · ----- Order --------- Printed by the staff of the Intellectual Property Bureau of the Ministry of Economic Affairs -13-460903 A7 B7 V. Description of the invention (11) Figure 2A and 2B description vehicle 1 〇 The top view shows two types of arrangement examples of openings 14 in the vehicle 10. The vehicle 10 in FIG. 2A (corresponding to the cross-sectional view of the vehicle 10 in FIG. 1A) has 8 openings arranged in 2 Columns, each with 4 openings 1 4. Figure 2B is another configuration in which 8 openings 1 4 a are lined up on the carrier 1 · 〇a (this top view is in cross section with Figure 1 A The figures do not correspond directly.) Although the carriers 10 depicted in FIGS. 2A and 2 (b) are all 8 openings 14 arranged in a straight line, this is not a requirement of the present invention. The openings 14 of the carrier 10 Actual quantity, bits The arrangement and orientation are design choices, depending on many factors. Now please refer back to Figure 1A, the upper cover 20 is coupled to the carrier 10. Like the carrier, the upper cover 20 is also formed by injection molding of organic materials. In the preferred embodiment, the upper cover is machined by epoxy glass inspection. The upper cover also includes a metal sheet to help dissipate heat, and a heat dissipation component, such as a fan, can also be installed on it. The upper cover can also consider a fixing member. It should be noted that any kind of fixing members, such as card shoots, ball bearings, holders, single rods, etc., can be attached to the upper cover to fix the wafer in the carrier. When the wafer is placed in the carrier, typically this fixing member It is mechanically closely adjacent to the surface of the back side of the chip. The cover 20 has two main functions. First, during the transmission, the cover of the Intellectual Property Bureau of the Ministry of Economic Affairs's consumer cooperation prints {Please read the notes on the back before filling (This page) * · 20 The wafer 12 is fixed in the opening 14 of the carrier 10. Second, when the wafer 12 is compressed during testing or use, the upper cover 20 provides resistance against the wafer 12. This compression results from the force that the spring pushes the wafer 12 and the underlying substrate (such as the test plate 30, see Figure 5). The upper cover 20 can be mechanically coupled to the vehicle 10 in any one of a number of ways. As shown in Fig. 1A ', a buckle case 2 2 B and a buckle 2 2 B are used. The buckle 2 2 B is riveted 2 2 and fastened to the cover paper & degree Applies to Chinese National Standard (CNS) A4 (210 X 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 'A7 __. B7_. V. Description of the invention (12) 20. However, | nuts and bolts or clips can also be used. Figures 5 and 6 B include another embodiment, using two types of card shoots to tighten the two components. Together, as long as the temporary connection is ensured, the coupling method of the vehicle 10 and the upper cover 20 is not important, and the temporary connection is useful in most (not all) examples of the present invention. The temporary connection allows some after the fact The upper cover 20 is removed, such as removing the wafer 12 after testing or use, or 'allowing to remove and replace a specific wafer 12 or allowing the upper cover 20 to be replaced. The upper cover 20 also has an opening 24, which is exposed. Part of the back side of wafer 1 2. In Figure 1 A, an opening 2 4 exposes the back side of most of the wafer 12 there | so it is approximately at the center of wafer 12 and carrier opening 14. Figure 3 A is the top cover 2 0 top view showing rectangular openings 2 4 located on each crystal 1 2 above. However, it should be noted that the opening 2 4 does not necessarily need to be rectangular or an opening on each wafer. For example, another embodiment of the upper cover 20 a shown in FIG. 3B is shown, in which the carrier is within 10 Above each 'wafer 1 2 are two oval openings 2 4 a. Although the upper cover 20 does not necessarily need an opening * it may be a solid sheet material *, but the opening provides several advantages of the carrier of the present invention. First, the opening 24 allows the temperature-controlled gas to be sent directly to the back side of the wafer 12. During the burn-in test, the temperature-controlled gas helps to maintain the wafer 12 at the desired fixed temperature. Most importantly, this Allows to change the temperature of wafer 12 to evaluate the performance at different operating temperatures. K gas can be sent directly to the back side of wafer 12 as required for test purposes. The opening 2 4 allows additional wafers to be tested. For example, you can use thermocouples to monitor the temperature of each chip *, or use other couplings for testing, or operate this paper. The inverse of the paper is in accordance with China National Standard (CNS) A4 (210 X 297 mm). Please read first (Please fill in this page again before filling in this page) 'ί 1 ϋ ϋ ί-ίτ-w, * 1 H ϋ n ϋ n I' Economic Village Intellectual Property Bureau's workmanship f. Printed by cooperatives 60903 Α7 ___ Β7__ 5. Description of the invention (13) Other measurements during the period, such as resistance. Third, the opening 24 provides an entrance to the back of each wafer 12 and adds an identification mark ID (see FIG. 13) as needed. * For example, an ink dot mark can be added to the wafer 12 to indicate that the test failed. Of wafers. You can also add a mark that shows the test result, such as directly marking the speed level. You can also add product identification information, such as manufacturer, lot number, etc. In addition, a bar code or other machine-readable code can be printed on the back of each wafer for tracking each wafer 12 or a magnetic strip with a password is placed on the wafer. (See the detailed discussion of tracking below) . Please refer back to FIG. 1A, and use the fastening method to couple the carrier 10 and the upper cover 20 * as the support frame 26 at the same time. In a preferred example, the support bracket 26 is a part of the dowel pin that fastens the buckle 2 2 B to the carrier 10. The support frame can be designed in the vehicle 10 or fastened to the vehicle. The support frame 26 extends downward from the bottom of the vehicle 10 beyond the spring assembly 16 for transmission, storage, or handling. Protective spring assembly 1 6. For example, if the vehicle 10 may be placed on the platform before testing, the support frame 26 can prevent the spring assembly 16 from being compressed. Note that if the method of coupling between the carrier 10 and the upper cover 20 is not using a buckle and a rivet 22 as shown in FIG. 1A, for example, using a screw, it does not extend through the two components, or using a bamboo shoot, during the manufacturing process In the meantime, the support frame can be added to the carrier, or the support frame can be made a part of the carrier. Figure 4 illustrates that when the carrier is coupled with the upper cover, the support frame is directly manufactured on the carrier to provide spring protection. The support frame also has a very important second function, which is to help the vehicle be positioned correctly Test board. During the test, the carrier 10 will be fixed on the test board 30 as shown in FIG. 5. The spring assembly 16 will be compatible with the Chinese National Standard Extract (CNS) A4 specification (210 * 297 public love) and paper on the test board 30. 16-. • n vk f
f. y •n ί ϋ n 一6J ϋ n u n n n n I 460903 A7 _;_B7____ 五、發明說明（14 ) <請先閱讀背面之注$項再填寫本頁) 的接墊3 1接觸。當載具1 0安裝到測試板3 0上時，確 定每一個簧組件1 6與湔試板3 0上之接墊3 1對齊接觸 非常重要》爲做到此點*測試板3 0上的定位孔3 2要與 支撐架26 —致。按此方法，當載具10安裝到測試板 3 0上時，支撐架2 6即插到定位孔3 2中，簧組件1 6 即可與測試板3 0上表面的接墊3 1接觸。如圖5'之實施 例的情況，測試板3 0具有孔3 2，它比晶片最終封裝中 之最終基板上的孔淺。按此方法，測試時簧被壓縮的程度 就可以比最終使用時少。如同圖2 A及2 B所示，在一較 佳實施例中，使用3或更多個定位孔及對應的支撐架，按 此方法，只允許唯一的正確對齊及固定。須注意，圖2 A 及2 B中雖然只顯示了 3個支撐架2谷，但視需要很容易 增加•在某特定實施例中，如圖1B及1C所示，2個偏 '斜的定位孔足以準直。對正銷1 3緊固於測試板3 0 —側 的承板11。載具及上蓋內的孔15與對正銷13準直。 適度的偏斜，操作者就容易使載具正確地對準。雖然.載具 可以插在正對面的對正銷上，但很明顯載具會與夾具間產 生偏f4，因此它容易正確地對準。 經濟部智慧財產局員工消费合作社印裂 圖1 E顯示標準的J EDEC托盤，其中有9個已裝 有載具的槽以及一個空槽。圖中顯示一個載具10正準備 塞入托盤中。 雖然以使用支撐架較佳，但本發明並不限只能使用支 撐架》例如圖6A及6 B所示，可以使用墊片6 0以防止 簧組件被壓縮到最大極限。在測試期間使用墊片但在使用 1本纸張&度適用+國國家標準（CNS)A4規格（210*297公爱） -17-""~ 經濟部智慧財產局貝工消費合作社印則衣 460903 . A7 __B7_ 五、發明說明（15 ) 晶片期間不使用墊片，以使測試期間對簧的壓縮比使用時 小。當以墊片6 0取代支撐架，當將載具安裝到板上時， 就需要另一裝置輔助載具的定位與對準。例如，標準的準 直技術諸如可以使用分光鏡識別簧與端點的位置，並將它 們精確地接觸在一起。 本發明的第二實施例如圖7所示。在第二實施例中| 載具7 0具有第一台階7 2、第二台階7 4及開口 7 6。 晶片1 2放入開口 7 6由第一台階7 2支撐》上蓋7 8具 有一延伸部7 9，向下放入開口 7 6並靠在第二台階7 4 上。按此方法，延伸部7 9用來固定載具7 0中的晶片 12，並施予晶片1 2之簧接點壓縮力。不過，須注意， 本實施例可進一步修改，可以不需要巢二台階，改爲延伸 部7 9直接靠在晶片1 2的背側。在本發明的一實施例中 ，不同的角落具有不同高度的延伸部*以使測試期間對簧 的壓縮小於使用期間。 本發明的第三實施例如圖8所示。圖8所示的載具裝 置僅只有載具而無上蓋•上蓋8 0在開口 8 4內具有卡筍 8 2固定晶片1 2 »卡筍是固定夾的形狀，直接耦合於載 具上。當晶片1 2進入開口 8 4時，卡筍張開以允許晶片 12通過。當晶片12完全進入開口 84，卡筍82回到 它原來位置，並將晶片1 2固定在定位。也可以使用處理 設備將卡筍保持在 ' 張開#的位置以便於晶片進入載具， 再使卡筍回到 ' 關閉#位置，以保持晶片固定。本實施例 的優點是可以省去製程中幾個步驟及數項零件。不過，由 • * 本纸i Κ度適用中囤國家標準（CNS)A4規格（210 X 297公釐) -18- (請先閱讀背面之注意事項再填寫本頁》 r、、ili — 1 訂 *! A7 B7 460903 五、發明說明（16〉 於晶片1 2的背側沒有完整的支撐，當施加壓縮力時，矽 晶片1 2可能會被彎曲而受損。測試晶片的特殊選擇、晶 片的尺寸、簧力、材料強度等，都將影響此種設計的適用 性。 一旦這些不同的實施例定位於板上時，載.具模組（包 括載具、晶片及上蓋）必須與板耦合固定。有數種方法可 以做到所要的耦合。在很多實施例中的耦合並非永久性的 ’以使載具模組可以被釋放及移開。須注意，單個或多個 載具都可以安裝到一個扳上。 將載具模組耦合到板上的一較佳實施例是如圖9 A所 描繪的蛤殼式。支架9 0位於板的一側。與支架9 0以鉸 鏈連接而轉動的臂9 2橫過載具模組谷4的背側。一旦載 具模組放置到板上，即降下臂9 2，使其橫靠在載具模組 9 4的背側。臂9 2 —旦降下，即扣到位於載具模組9 4 另一側之第二支臂9 6的扣鉤9 8上，臂2 0即被固定。 臂9 2相對於載具模組9 4的尺寸以及此種臂的使用數量 純由設計來決定，主要視載具模組9 4的尺寸來決定。正 如例$示，一支臂9 2固定一個載具模組9 4，而不同的 臂9 2可以固定數個載具模組。 現請參閱圖9 Β，一鉸鏈上蓋將晶片固定在負荷板上 。框架9 1包括一容納晶片1 2晶片的開口，其結構非常 像前所討論的載具，例如圖7所示。頂蓋9 2Α以鉸鏈與 框架9 1連接並可旋轉在開位置時，很容易將晶片1 2 置入β在閤位置時，它固定晶片12。它是被閂扣93緊 本纸張叉度適用中國國家標準（CNS)A4規格（210 * 297公爱） -19 (請先閱讀背面之注意事項再填寫本頁} 裝f. y • n ί 一 n 6J ϋ n u n n n n I 460903 A7 _; _ B7____ V. Description of the invention (14) < Please read the note on the back before filling in this page) 1). When the carrier 10 is mounted on the test board 30, it is very important to make sure that each spring component 16 is aligned with the pad 3 1 on the test board 30. To achieve this, the test board 30 The positioning holes 32 should coincide with the supporting frame 26. According to this method, when the carrier 10 is mounted on the test board 30, the support frame 26 is inserted into the positioning hole 32, and the spring assembly 16 can contact the pad 31 on the upper surface of the test board 30. As in the case of the embodiment of FIG. 5 ', the test board 30 has holes 32, which are shallower than the holes in the final substrate in the final package of the wafer. In this way, the spring can be compressed to a lesser degree during testing than when it is finally used. As shown in Figs. 2A and 2B, in a preferred embodiment, three or more positioning holes and corresponding supporting frames are used. According to this method, only a single correct alignment and fixing is allowed. It should be noted that, although only three support frames 2 valleys are shown in Figs. 2A and 2B, it is easy to add as needed. In a specific embodiment, as shown in Figs. 1B and 1C, two skewed positioning The holes are sufficient for collimation. The alignment pins 1 3 are fastened to the carrier plate 11 on the test plate 3 0 side. The holes 15 in the carrier and the upper cover are aligned with the alignment pins 13. With moderate deflection, the operator can easily align the carrier correctly. Although the .vehicle can be inserted on the facing pin, it is obvious that the carrier will produce deviation f4 from the fixture, so it is easy to align correctly. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Figure 1 E shows a standard J EDEC pallet, which has 9 slots with a carrier and an empty slot. The figure shows a carrier 10 being prepared to be tucked into a tray. Although it is better to use a support frame, the present invention is not limited to using a support frame. For example, as shown in Figs. 6A and 6B, a gasket 60 can be used to prevent the spring assembly from being compressed to the maximum limit. Use gaskets during the test but use 1 paper & degree applicable + National Standard (CNS) A4 specification (210 * 297 public love) -17- " " ~ Shelley Consumer Cooperative, Intellectual Property Bureau, Ministry of Economy Seal clothing 460903. A7 __B7_ 5. Description of the invention (15) No gasket is used during the wafer, so that the compression of the spring during the test is smaller than that when used. When the support frame is replaced with a gasket 60, when the carrier is mounted on the board, another device is needed to assist the positioning and alignment of the carrier. For example, standard collimation techniques such as the use of a spectroscope to identify the position of the spring and the endpoint and bring them into precise contact. A second embodiment of the present invention is shown in FIG. 7. In the second embodiment, the carrier 70 has a first step 72, a second step 74, and an opening 76. The wafer 1 2 is placed in the opening 7 6 and is supported by the first step 7 2. The upper cover 7 8 has an extending portion 7 9. The wafer 7 is placed downwardly into the opening 7 6 and rests on the second step 7 4. According to this method, the extension portion 79 is used to fix the wafer 12 in the carrier 70, and a spring contact compression force is applied to the wafer 12. However, it should be noted that this embodiment may be further modified, and the nest two steps may not be needed, and the extension portion 79 may be directly leaned on the back side of the wafer 12 instead. In an embodiment of the present invention, different corners have extensions with different heights * so that the compression of the spring during the test is less than during use. A third embodiment of the present invention is shown in FIG. 8. The carrier device shown in FIG. 8 has only the carrier without an upper cover. The upper cover 80 has a bamboo shoot in the opening 8 4 and a fixed wafer 1 2 »The bamboo shoot is a shape of a fixing clip, which is directly coupled to the carrier. When the wafer 12 enters the opening 84, the card is opened to allow the wafer 12 to pass. When the wafer 12 fully enters the opening 84, the card 82 is returned to its original position, and the wafer 12 is fixed in position. You can also use processing equipment to keep the card shoots in the 'Open #' position to allow the wafer to enter the carrier, and then return the card shoots to the 'Close #' position to keep the wafer fixed. The advantage of this embodiment is that several steps and several parts in the manufacturing process can be omitted. However, • * This paper is suitable for China National Standard (CNS) A4 specifications (210 X 297 mm) -18- (Please read the precautions on the back before filling out this page "r 、、 ili — 1 order *! A7 B7 460903 V. Description of the invention (16) There is no complete support on the back side of the wafer 12. When a compressive force is applied, the silicon wafer 12 may be bent and damaged. The special selection of the test wafer, the wafer's Size, spring force, material strength, etc. will affect the applicability of this design. Once these different embodiments are positioned on the board, the carrier module (including the carrier, the chip and the cover) must be coupled to the board and fixed There are several ways to achieve the desired coupling. In many embodiments the coupling is not permanent so that the vehicle module can be released and removed. It should be noted that a single or multiple vehicles can be mounted to one A preferred embodiment for coupling the carrier module to the board is the clamshell type as depicted in Figure 9 A. The bracket 90 is located on one side of the board. The arm is connected to the bracket 90 to rotate by hinges. 9 2 crosses the back side of the vehicle module valley 4. Once the vehicle module Place it on the board, lower the arm 9 2 so that it lies against the back side of the carrier module 9 4. Once the arm 9 2 is lowered, it will buckle to the second branch on the other side of the carrier module 9 4 On the hook 9 8 of the arm 9 6, the arm 20 is fixed. The size of the arm 9 2 relative to the carrier module 9 4 and the number of such arms used are solely determined by design, mainly depending on the carrier module 9 The size of 4 is determined. As shown in the example, one arm 9 2 fixes one carrier module 9 4, and different arms 9 2 can fix several carrier modules. Now refer to FIG. 9 Β, a hinged upper cover The wafer is fixed on the load plate. The frame 91 includes an opening for receiving the wafer 12 and the structure is very similar to that of the carrier discussed previously, for example, as shown in Fig. 7. The top cover 9 2A is hinged to the frame 91 and connected. When it can be rotated in the open position, it is easy to put the wafer 1 2 into the beta position. When it is in the closed position, it fixes the wafer 12. It is fastened by the latch 93. The paper fork is suitable for the Chinese National Standard (CNS) A4 specification (210 * 297 public love) -19 (Please read the precautions on the back before filling this page}
-ϋ ϋ i n n n 一-eJ n n I n n I 經濟邨智慧財產局貝工湞费合作社印製 經濟部智慧財產局員工消费合作社印製 460903 A7 -_B7 ___ 五、發明說明（17 ) 固在閤位置。框架9 1可以永久或半永久的方式固定於板 3 0，例如以螺絲從板3 0 (未顯示）的背側鎖住。這對 初期硏究階段之少量晶片的測試特別有用。 圖9 C說明另一種將載具緊固到板上的方法。每一個 支柱9 0 B支撐一個壓臂9 2 B，臂臂向下旋轉將載具緊 固到板30。壓臂92B在扭力簧（未顯示）的張力下， 保持對載具的壓力。簧力要足以將載具保持在定位，但當 操作員要將載具放置到板上時，需能被其所扳動》 如圖10所示，從圖中可淸楚看出，不是先將載具模 組1 0 4定位/安裝到板3 0上。在本實施例中，是先以 某種非永久性的機構裝置將載具模組1 0 4安裝到臂 1 0 2上，再將載具模組1 0 4降下置到相對於板3 0的 正確位置，且臂1 0 2進入第二支架1 0 6的卡筍1 0 8 並被其緊固地扣住。 上述設計可以利用圖8所示的第三實施例（即使用卡 筍而非上蓋固定晶片）加以修改。圖1 1顯示臂1 1 2具 有與開口 8 4配合的延伸部1 1 5。當晶片被壓縮時，延 伸部11 5提供所需的支撐芨抵抗力，並防止由於彎曲導 致損壞。如同前述的蛤殼型式，降下臂1 1 2直至它進入 第二支架1 1 6的卡筍1 1 8並被其緊固地扣住》 在本發明的各實施例中還可加入另一特徵，當載具模 組安裝於測試板上時，允許簧接點在接墊上能有掃的動作 。當連接任何兩個電氣元件時，最好是其中一個能相對於 另一個移動，俾能做到兩者間的滑動接觸。此動作可以淸 本纸張义度適用中國國家標準（CNS)A4規格（210 * 297公釐) -20- <請先閲讀背面之注意事項再填窝本頁) 裝------- - 訂--------- 460903 A7 _______ B7__ 五、發明說明（18 ) 除有礙於良好電氣連接的碎屑。因此，使焊簧在測試期間 '具有掃動的能力，對良好的接觸有重大俾益。 測試期間，以壓力連接時，掃動是簧的典型天性，但 以焊接時簧就不須要掃動。壓力連接之簧的形狀最好具有 能直接壓向支撐基板的幾何形狀（如果基板的z軸是在它 的X Y平面上），這將致使簧的接觸部位側向移動/，亦即 ，以XY分量移動。這將導致橫過端點表面的掃動，端點 表面多少是個平面。對焊接的簧或用於銷-入-孔連接法 的簧而言，較佳的簧形是在壓縮後不需要太多或任何XY 方向的移動。 圖1 2 A說明得到掃動作的方法之一。在本實施例中 ，對板1 2 0上的定位孔1 2 2稍做餐改/使其具有一傾 斜的前緣1 2 4。當載具模組1 2 6放置在定位孔1 2 2 的前緣1 2 4上並下降，在到達定位孔1 2 2的固定位置 前，支撐架1 2 8是在斜前緣1 2 4的斜面上滑動。載具 模組1 2 6的此滑動致使接觸的簧掃過板1 2 0上的接墊 。掃動致使簧接點與接墊間能有較佳的電氣連接 另一實施例（未顯示）是使用不同的定位孔，它在板 的平面上實質呈現一圖案，它允許載具相對於板移動*當 載具與板接觸時，載具在定位孔內移動以產生掃的動作。 當使用夾具定位載具時，可以將側向移動規割成裝載程序 中的一部分。 到目前爲止*討論的重點是具有簧之晶片的載具。不 過，相同的原理也可應用於具有簧單元的測試板或最終封 ^纸張义度適用中囿國家標準（CNS)A4規格（210*297公爱) * 21 -~~ (請先閲讀背面之注意事項再填寫本頁} -- — It! ^ - I I 11 ml 經濟部智慧財產局貝工消費合作社印製 _ 460903 A7 ___B7__ 五、發明說明（19 ) 裝裝置。現請參閲圖12B及12C，與圖1B及1C相 較，可以將簧準備於負荷板3 0 A上。對在此種板上置簧 的較佳方法，在名稱爲'^ Sockets for Electronic Components and Method of Connecting to Electronic components ’ 的美國 專利5，772，45 1中有詳細描述。該專利掛述在適 當的基板上固定彈性接點的方法。在簧之對側的基1板上可 包括接點（如焊球），並可回流連接到基板（如印刷電路 板）上的端點。使用這種組件，基板1 2 5可備有能定位 到半導體晶片上之接觸端點的簧1 2 7。一實施例是將焊 球123置於基板125的一側，對面是簧127。焊球 可以固定到板的端點上，例如以回流的方法。簧可與晶片 接觸以進測試或晶片的其它操作。當肴需要時，基板 1 2 5可從板上取下，以便更換、修理或其它目的。加高 支撐架2 6·的高度以設定測試期間正確的張力。同樣地， 如果將相同的載具用到最終產品，也可使用如圖1 2 B所 示的簧連接，以適當的支撐架做正確的連接。 晶片可放置於載具內並做本揭示中所描述的管理。按 此方$，傳統沒有簧的晶片，也可按上述有簧之晶片相同 的方法操作、測試及使用。 本發明可經由使用追蹤裝置獲進一步增進。如圖13 A所示，例如*可以將追蹤機制加到載具1 3 0。識別標 記I D可以加到放置於載具1 3 0內之晶片1 2的背側。 能在任何時間追蹤到放置於載具1 3 0內之晶片1 2的歷 史，將可提供數項習知技術所沒有的優點》經由在載具上 • -r 本紙張尺度適用中國國家g準（CNS)A4規格（210 * 297公釐）~~^2 - (請先閱讀背面之注意事項再填寫本頁) 裝訂_[------ί 經濟部智慧財產局員工消费合作社印34 480903 A7 •__B7__ 五、發明說明（2G) 放置追蹤標籤並記錄與每一個放入及/或從載具中取出之 晶片的相關資訊，在任柯時間使用者都可取得晶片上的資 訊，包括它所來自的特定晶圓，以及晶圓的製造批號，甚 至可包括特定的製造商。雖然目前具有晶圓級的追蹤能力 ，但目前尙無晶片級的追蹤能力。不過，經由將標籤放置 於本發明的載具上，即可保有晶片級的資訊。 ’' 如圖1 3 Β所示，將追蹤標籤放置於載具的側邊較爲 有利，因爲即使當蓋住上蓋仍能看見。此外，還有另一方 法，載具可以配置可程式的裝置，例如E E P R Ο Μ。如 圖13Β所示，連接到EEPROM。 首先，將追縱標籤或識別碼加到載具（見圖1 4的流 程圖）。不過，須注意，也可以在晶>f放入載具後再加上 追蹤標籤》切割晶圓。當每一個晶片放入載具時，與該晶 片有關的資訊也被儲存到載具上的追蹤標籤內*資訊包括 (但不限於）用於識別晶片產生自某特定晶圓的資訊，識 別某特定半導體晶圓在某特定晶圓批中的資訊，識別晶圓 來自某特定晶圓製造批的資訊，以及晶片在晶圓上之位置 的資1^。追蹤標籤包括條碼或儲存在記億體裝置中的碼， 諸如在載具上的磁性媒體或半導體記憶體裝置。 在特定的較佳實施例中，此方法更爲有用。如尋常執 行晶圓探測。故障的部分甚至基本測試都加以註記。負責 修改的元件，在此時對故障部分進行修改。例如*很多記 憶體元件在製造時都有備用的子單元。在初步測試時先識 別子單元是通過或故障，且自動設備可以選擇適合的功能 本纸張&度適ffl中國國家標準（CNS)A4規格（210 * 297公釐)-23- ------：------r'、裝--------訂！！_ 線cr (請先閱讀背面之;i意事項再填寫本頁) A7 4 6 0 9 0 3 B7 ____ 五、發明說明（21 ) 單元群，因此，整體元件的功能正常》在這些部分上可以 追蹤到任何資訊量，從僅註記故障到詳細記錄那一個元件 的那一單元發現有功能，以及任何其它對製造有用的資訊 。如另外一例，在很多製造情況，測試單元是製造在半導 體晶圓上其它不使用的部分。這些區域包括刻線區或靠近 晶圓邊緣未使用的部分。有關於這些測試單元的資訊，可 以連同在晶圓上所發現之元件的資訊一起保留在資料庫中 〇 在製造半導體的極多製程步驟中，晶圓上不同的區域 可能會出現某些程度的變異。極端地仔細可使此種變異減 至最小，但晶圓中不同區域的某些部分還是會有輕微差異 。從晶片離開晶圓即追蹤各個晶片本尊，並接受測試及其 它使用，即可重建晶圓圖，即可顯示晶圓上任何區域之某 指定晶片以及它鄰近晶片的任何測試結果。晶圓批間的變 真也可經由此偵測與評估。直到目前，在複雜及大量製造 的環境中做此種追蹤宑常困難。 在製程中，這些資訊極具價値。收集自測試的資訊立 刻可^製造的樓層所用β在自動化系統中，可以建立觸發 製程即將偏離規格之警告的門檻，可立刻通知製造工廠。 當使用目前的系統時，此回授系統至.少具有兩大優點。第 —，由於幾乎可在晶圓分割後立刻開始測試，因此從製造 完成到獲得第一手測試結果間的延遲最少。雖然需要短短 的幾天，但與目前之製程動輒數天，典型上需要數週相較 ，這僅是很短的時間而已β第二個最大優點是可以追蹤每 本纸張义度適用中國囷家標準（CNS)A4規格（210 X 297公爱) -24- (請先閱讀背面之注意事項再填寫本頁) 卜)裝·· —-----訂--------- 經濟耶智慧財產局員工消f合作社印製 460903 A7 B7 五、發明說明<22 ) —個晶片本身，可以重建晶片圖。顯示與晶圓上與位置相 關之任何類型變異的測試結果，此資訊對製造而言極具價 値，可使製造期間晶圓上所有區域都保持一致性。快速的 時間反應（快速的回授迴路）對評估初期的樣品製造及稍 後大批.製造時的適當修改特別具有價値。 現再回到較佳實施例，在測試及初步的元件修理後I 自動設備切割晶圓β抓取設備將所選擇的晶片放置到載具 中。有關於特定晶.片在特定晶圓上之特定位置的資訊被追 蹤，並做爲製造的資料庫》例如，一組8個晶片可以放置 入圖2 Α的載具中。經由追蹤載具內獨佔的位置，就足以 在製造資料庫中追蹤載具的I D資訊，以及每一個晶片在 載具中的位置。 。 標記載具的方法很多，如上所述》—種特別佳的標記 是條碼或其它的機器可讀碼，印製在載具的邊緣，即使當 上蓋蓋住載具，仍能爲自動抓取裝置或操作員讀取的位置 。另一種較佳的標記爲載具內的EEPROM裝置。自動 抓取裝置可以將重要資訊輸入E E P ROM，也可從 E E P ROM中讀取資訊。這只是簡單地將獨有的識別碼 連結到製造資料庫中。 可以將載具群置於托盤中。標記托盤的方法與載具相 同。較高階的組織十分實用，例如將托盤群組到推車中。 視載具中的晶片數量及大小而定，一片晶圓分割出的晶片 •可分裝在少數幾個托盤的載具中，例如5到1 0個。視 所生產之產品的大小、晶圓的批量（例如2 5片）而定， 本纸張尤度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝！|訂·1!1 參」- 經濟部智慈財產局員工消费合作社印製 460903 Α7 Β7 五、發明說明（23 ) 可以分裝到1 25到2 5 0個托盤中。 現請參閱圖1 3 C，’托架1 3 0配置有一連串的槽 1 3 1，每一個槽可容納一個載具。托架1 3 0的前緣包 括標籤1 32。托架上有可程式裝置1 34 ,以 EE PROM爲佳，具有連接器1 3 3，很容易與自動處 理設備連接。如有需要，標籤可供作業員或掃描機讀取， 可程式的連接允許電子追蹤裝置存取。 識別標記也可加到每一個晶片本身。典型上，此種識 別標記是在晶片裝入載具後’經由載具的開口加到晶片背 側（簧接點的對側），或可在晶片裝入載具前施加。晶片 上的識別標記可以包括墨點，用以標示測試成功或失敗， 獨有或半獨有識別碼或條碼，保有更多與該特定晶片歷史 有關之特殊資訊，或其它有用的資訊。如一例，在一批中 連續的晶片可標以序號、獨有的識別資訊。不同的批可以 使用相同的識別資訊，但必需能以其它方法區分批的不同 *如製造時間、在載具外的某位置等。例如，可以使用 1 6位元的資訊來追蹤一批中的晶片，較大批的產品則需 要使用較多的位元來識別。 本發明的裝置可以使用很多種方法（例見圖15的流 程圖）。例如，晶片可裝入載具中並以固定裝置將其緊固 於載真中構成一載具模組。接著將此載具模組定位於板上 ，並例如以夾子將其緊定於板上。另者載具模組可先組裝 於夾子或耦合機構上1接著放置於板上，並與板緊固/鎖 定》或者|可先將載具安裝於板上，接著將晶片裝入及緊 衣纸張又度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁)-ϋ ϋ i n n n a -eJ n n I n n I Printed by the Cooperative Cooperative of the Intellectual Property Bureau of the Economic Village Printed by the Co-operative Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 460903 A7 -_B7 ___ 5. The description of the invention (17) is fixed in place The frame 91 may be fixed to the plate 30 in a permanent or semi-permanent manner, for example, screwed from the back side of the plate 30 (not shown). This is particularly useful for testing a small number of wafers in the early research phase. Figure 9C illustrates another method of securing the carrier to the board. Each support 9 0 B supports a pressure arm 9 2 B, which rotates downward to secure the carrier to the plate 30. The pressure arm 92B maintains the pressure on the carrier under the tension of a torsion spring (not shown). The spring force should be sufficient to keep the carrier in position, but when the operator wants to place the carrier on the board, it must be able to be pulled by it. "As shown in Figure 10, it can be clearly seen from the figure that Position / mount the carrier module 104 on the board 30. In this embodiment, the carrier module 1 0 4 is first mounted on the arm 10 2 with some non-permanent mechanism and then the carrier module 1 0 4 is lowered and placed relative to the board 3 0 The correct position, and the arm 102 enters the card shoot 108 of the second bracket 106 and is fastened by it. The above design can be modified by using the third embodiment shown in FIG. 8 (that is, using a bamboo shoot instead of an upper cover to fix the wafer). Figure 11 shows that the arm 1 1 2 has an extension 1 1 5 which cooperates with the opening 8 4. When the wafer is compressed, the extension 115 provides the required support and resistance and prevents damage due to bending. As with the previous clamshell version, lower the arm 1 1 2 until it enters the card shoot 1 1 8 of the second bracket 1 1 6 and is fastened by it ". Another feature can be added to the embodiments of the present invention When the carrier module is installed on the test board, the spring contact is allowed to have a sweeping action on the contact pad. When connecting any two electrical components, it is best if one of them can move relative to the other, so that sliding contact between the two can be achieved. This action can be applied to the Chinese paper (CNS) A4 specification (210 * 297 mm). -20- < Please read the precautions on the back before filling this page.) ---------------- Order --------- 460903 A7 _______ B7__ 5. Description of the invention (18) In addition to debris that hinders good electrical connection. Therefore, making the weld spring 'sweep' during the test has a significant benefit to good contact. During the test, sweeping is typical of springs when connected by pressure, but springs do not need to be swept when welding. The shape of the pressure-connected spring preferably has a geometry that can be pressed directly against the support substrate (if the z-axis of the substrate is on its XY plane), which will cause the contact portion of the spring to move laterally, ie, XY Component shift. This will cause a sweep across the endpoint surface, which is more or less a plane. For welded springs or springs used in the pin-in-hole connection method, the preferred spring shape does not require much or any movement in the XY direction after compression. Figure 1 2 A illustrates one of the methods for obtaining a sweep action. In this embodiment, the positioning holes 1 2 2 on the plate 1 2 0 are modified slightly so that they have a slanted leading edge 1 2 4. When the carrier module 1 2 6 is placed on the leading edge 1 2 4 of the positioning hole 1 2 2 and lowered, before reaching the fixed position of the positioning hole 1 2 2, the support frame 1 2 8 is at the oblique leading edge 1 2 4 Sliding on the slope. This sliding of the carrier module 1 2 6 causes the contact spring to sweep over the pads on the plate 1 2 0. Sweeping results in a better electrical connection between the spring contact and the pad. Another embodiment (not shown) uses different positioning holes, which essentially present a pattern on the plane of the board, which allows the carrier relative to the board Movement * When the carrier is in contact with the board, the carrier moves in the positioning hole to generate a sweeping action. When using a clamp to position the carrier, the lateral movement gauge can be cut into part of the loading procedure. The focus of discussion so far has been on carriers with spring wafers. However, the same principle can also be applied to test boards with spring units or final seals. The meaning of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 * 297 public love) * 21-~~ (Please read the note on the back first Please fill in this page again for matters}-— It! ^-II 11 ml Printed by Shelley Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs _460903 A7 ___B7__ V. Description of the Invention (19) Installation device. Please refer to Figures 12B and 12C. Compared to Figures 1B and 1C, the spring can be prepared on the load plate 30 A. The preferred method of placing the spring on this plate is named '^ Sockets for Electronic Components and Method of Connecting to Electronic components' This is described in detail in U.S. Patent 5,772,45 1. This patent describes a method of fixing elastic contacts on a suitable substrate. The base 1 on the opposite side of the spring may include contacts (such as solder balls), It can be reflowed to an end point on a substrate (such as a printed circuit board). Using this component, the substrate 1 2 5 can be provided with a spring 1 2 7 that can be positioned at a contact end point on a semiconductor wafer. One embodiment is to The solder ball 123 is placed on one side of the substrate 125, and the opposite is a spring 127 The solder ball can be fixed to the end of the board, for example by reflow. The spring can be in contact with the wafer for testing or other operations on the wafer. When necessary, the substrate 1 2 5 can be removed from the board for replacement. , Repair, or other purposes. Increase the height of the support frame 2 6 · to set the correct tension during the test. Similarly, if the same carrier is used in the final product, a spring connection as shown in Figure 1 2 B can also be used The correct connection is made with a proper support frame. The wafer can be placed in the carrier and managed as described in this disclosure. In this way, the traditional wafer without spring can also be used in the same way as the above-mentioned spring wafer Operation, testing, and use. The present invention can be further enhanced by using a tracking device. As shown in Figure 13 A, for example, * the tracking mechanism can be added to the vehicle 1 3 0. The identification mark ID can be added to the vehicle 1 3 The back side of the wafer 12 in 0. The history of the wafer 12 placed in the carrier 130 can be traced at any time, which will provide several advantages that are not known in the conventional technology. ”On the carrier • -r This paper size applies to China g quasi (CNS) A4 specification (210 * 297 mm) ~~ ^ 2-(Please read the precautions on the back before filling out this page) Binding _ [------ ί Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Print 34 480903 A7 • __B7__ 5. Description of the invention (2G) Place a tracking label and record the relevant information about each chip placed and / or removed from the carrier. The user can obtain the information on the chip at any time. Including the specific wafer it came from, the manufacturing lot number of the wafer, and even the specific manufacturer. Although it currently has wafer-level tracking capabilities, there is currently no wafer-level tracking capability. However, by placing a tag on the carrier of the present invention, wafer-level information can be retained. ′ 'As shown in Figure 1 3B, it is advantageous to place the tracking label on the side of the vehicle, because it can still be seen even when the cover is closed. In addition, there is another method, the vehicle can be equipped with a programmable device, such as E E P R OM. As shown in Figure 13B, it is connected to the EEPROM. First, add a tracking tag or identification code to the vehicle (see the flowchart in Figure 14). However, it should be noted that it is also possible to cut the wafer by adding a tracking label after the crystal > f is placed in the carrier. When each chip is placed in the carrier, the information related to the chip is also stored in the tracking label on the carrier * The information includes (but is not limited to) the information used to identify the wafer generated from a specific wafer, identifying a certain wafer Information of a specific semiconductor wafer in a specific wafer lot, information identifying the wafer from a specific wafer manufacturing lot, and information on the position of the wafer on the wafer. Tracking tags include bar codes or codes stored in memory devices, such as magnetic media or semiconductor memory devices on a carrier. This method is more useful in certain preferred embodiments. Perform wafer probing as usual. The faulty part and even the basic test are noted. The component responsible for the modification, at this time the faulty part is modified. For example * Many memory components have spare subunits at the time of manufacture. In the initial test, first identify the sub-unit is passed or failed, and the automatic equipment can choose the appropriate function. This paper & degree ffl Chinese National Standard (CNS) A4 specification (210 * 297 mm) -23- ---- -: ------ r ', equipment -------- Order! !! _ Line cr (please read the back of the page first; I will fill in this page first) A7 4 6 0 9 0 3 B7 ____ V. Description of the invention (21) Unit group, therefore, the function of the overall component is normal. On these parts, you can Track any amount of information, from just the failure to the unit where the component was recorded in detail, and any other useful information for manufacturing. As another example, in many manufacturing situations, the test cell is manufactured on the semiconductor wafer other unused parts. These areas include ruled areas or unused portions near the edge of the wafer. Information about these test units can be kept in the database along with information about components found on the wafer. In the many manufacturing process steps of manufacturing semiconductors, different areas on the wafer may appear to some extent variation. Extreme care can minimize this variation, but there will still be slight differences in parts of different areas of the wafer. After leaving the wafer from the wafer, you can track each wafer's deity and undergo testing and other uses. The wafer map can be reconstructed, which can display a specified wafer in any area on the wafer and any test results of its neighboring wafers. Changes between wafers can also be detected and evaluated. Until now, such tracking has been difficult in complex and mass-manufactured environments. This information is extremely valuable during the manufacturing process. The information collected from the self-test can be used immediately on the floors that can be manufactured. In the automation system, a threshold can be established to trigger a warning that the process is about to deviate from the specifications, and the manufacturing plant can be notified immediately. When using the current system, this feedback system has at least two major advantages. First, because testing can begin almost immediately after wafer singulation, there is minimal delay between manufacturing completion and first-hand test results. Although it takes only a few days, compared with the current process, which usually takes several days, it typically takes several weeks. This is only a short time. The second biggest advantage is that you can track the meaning of each paper. Standard (CNS) A4 specification (210 X 297 public love) -24- (Please read the precautions on the back before filling in this page) bu) installed ·· ------ order --------- Employees of the Economic and Intellectual Property Bureau printed 460903 A7 B7. Fifth, the invention description < 22)-a chip itself, you can reconstruct the chip map. Test results showing any type of variation on the wafer that are related to position. This information is extremely valuable for manufacturing and allows consistency across all areas on the wafer during manufacturing. The fast time response (fast feedback loop) is particularly valuable for sample manufacturing at the initial stage of evaluation and later for large batches. Proper modification during manufacturing is especially valuable. Now returning to the preferred embodiment, after testing and preliminary component repair, the automatic equipment cuts the wafer and the β grabbing equipment places the selected wafer into the carrier. Information about specific locations of specific wafers on specific wafers is tracked and used as a manufacturing database. For example, a set of 8 wafers can be placed in the carrier of Figure 2A. By tracking the exclusive position in the carrier, it is sufficient to track the ID information of the carrier in the manufacturing database and the position of each chip in the carrier. . There are many ways to mark a vehicle, as described above—A particularly good mark is a bar code or other machine-readable code, printed on the edge of the vehicle. Even when the cover covers the vehicle, it can still be an automatic grasping device. Or the position read by the operator. Another preferred label is the EEPROM device in the vehicle. The automatic grabbing device can input important information into E E PRO ROM and read information from E E PRO ROM. This simply links the unique identification code to the manufacturing database. The carrier group can be placed in a tray. The method of labeling pallets is the same as for vehicles. Higher-level organizations are useful, such as grouping trays into carts. Depending on the number and size of the wafers in the carrier, a wafer divided into one wafer can be divided into carriers with a few trays, such as 5 to 10. Depending on the size of the product and the batch size of the wafer (for example, 25 pieces), this paper is especially suitable for China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back first) Fill out this page again) | Order · 1! 1 Participation "-Printed by the Consumer Cooperatives of the Intellectual Property Office of the Ministry of Economic Affairs 460903 Α7 Β7 V. Description of Invention (23) It can be divided into 1 25 to 250 trays. Now referring to FIG. 1C, the bracket 1 3 0 is provided with a series of slots 1 31, and each slot can accommodate a carrier. The leading edge of bracket 1 30 includes label 1 32. There is a programmable device 1 34 on the bracket, preferably EE PROM, with a connector 1 3 3, which is easy to connect with automatic processing equipment. If required, the tags can be read by the operator or scanner, and a programmable connection allows access by the electronic tracking device. Identification marks can also be added to each wafer itself. Typically, this identification mark is added to the back of the wafer (opposite to the spring contact) through the opening of the carrier after the wafer is loaded into the carrier, or it can be applied before the wafer is loaded into the carrier. The identification mark on the wafer can include ink dots to indicate the success or failure of the test, a unique or semi-unique identification code or bar code, to retain more special information related to the history of that particular wafer, or other useful information. For example, consecutive wafers in a batch can be labeled with serial numbers and unique identification information. Different batches can use the same identification information, but they must be able to distinguish the batches by other methods * such as manufacturing time, a location outside the vehicle, etc. For example, 16 bits of information can be used to track wafers in a batch. Larger batches of products require more bits to identify. The apparatus of the present invention can use a variety of methods (for example, see the flowchart of Figure 15). For example, a wafer can be loaded into a carrier and fastened to the carrier with a fixing device to form a carrier module. The carrier module is then positioned on the board, and is fastened to the board with a clip, for example. Alternatively, the carrier module can be assembled on the clip or coupling mechanism 1 and then placed on the board, and fastened / locked with the board "or | the carrier can be installed on the board first, and then the chip can be loaded and tightly fitted. The paper is again applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)
> n n n n ϋ n^OJ 經濟部智慧財產局員工消費合作社印製 -26- 4 60903 A7 _._ B7_ 五、發明說明（24 ) 固於其內。在載具模組的組裝及將其安裝於測試板或最終 封裝基板上之後的步驟還有其它變化。本發明並不要求在 本發明之後的各步驟需按某特定的序順進行。 (請先閱讀背面之注意事項再填寫本頁) .:'\ · t 丨丨— 丨^► -!11„ 經濟部智慧財產局員工消費合作钍印製 ^27 本纸張又度適用中國國家標準（CNS)A4規格（210 X 297公釐）> n n n n ϋ n ^ OJ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -26- 4 60903 A7 _._ B7_ 5. The invention description (24) is fixed in it. There are other changes in the steps after the carrier module is assembled and mounted on a test board or final package substrate. The present invention does not require that the steps following the present invention be performed in a specific order. (Please read the precautions on the back before filling this page).: '\ · T 丨 丨 — 丨 ^ ►-! 11 „Consumption cooperation by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs 钍 27 This paper is applicable to China Standard (CNS) A4 specification (210 X 297 mm)