CN101587850B - Bearing structure and testing device - Google Patents
Bearing structure and testing device Download PDFInfo
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- CN101587850B CN101587850B CN 200810093293 CN200810093293A CN101587850B CN 101587850 B CN101587850 B CN 101587850B CN 200810093293 CN200810093293 CN 200810093293 CN 200810093293 A CN200810093293 A CN 200810093293A CN 101587850 B CN101587850 B CN 101587850B
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- bearing structure
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Abstract
The invention discloses a bearing structure used for bearing a wafer part cut from a wafer and combining a testing device to test the wafer part. The bearing structure comprises a body, a first accommodating tank, a second accommodating tank and a fixing component, wherein the size of the body is equal to that of the wafer; the first accommodating tank is arranged on a first surface of the body and can accommodate the wafer part; the second accommodating tank is arranged on the first surface and connected with the first accommodating tank; and the fixing component is arranged in the second accommodating tank and can clamp the side edge of the wafer part so as to fix the wafer part into the first accommodating tank. The bearing structure can bear and fix the wafer part cut from the wafer, such as a crystal grain, a wafer, a caritive wafer, and the like. When both the bearing structure and the wafer part are put in the testing device, a more precise testing result can be obtained.
Description
Technical field
The present invention relates to a kind of bearing structure and testing apparatus, and especially, the present invention relates to a kind of interosculating the wafer segment (wafer portion) that has cut is made the bearing structure and the testing apparatus of test.
Background technology
In recent years, the development of semiconductor technology makes the modern age electronics industry present tremendous growth, and little living environment, operational environment of living to people is to the research in outer space, all closely bound up with the progress of electronics industry greatly.Therefore, semiconductor technology is the foundation stone of science and technology in modern age.
In semiconductor technology, its primary element is begun by the production of Silicon Wafer (wafer), and utilize treatment technologies such as development, etching and deposition to form various structures at crystal column surface, then cutting crystal wafer to be to form crystal grain (die), encapsulates at last again and becomes semiconductor-based element.After forming various structures on the crystal column surface, wafer can be sent in the testing equipment and be tested, and obtain the electrical characteristic that each crystal grain had on the wafer, improve former technology thus and obtain higher qualification rate.Therefore, wafer sort is the important technology of inspection process in semiconductor technology.
General common wafer sort technology is to utilize testing equipment and probe card (probecard) to come each crystal grain on the test wafer.The detection head of probe card can be provided with metal probe, and this probe can be in order to the scolding tin on the contact wafer (chip), projection or other existing different designs that can be used as the signal transmission, with directly to the wafer input signal and read its output valve.At underproof wafer of testing result or crystal grain, will indicate and screen.To can not proceed packaging technology at the wafer or the crystal grain that carry out the below standard standard of wafer cutting back function.
Yet, still have via crystal grain qualified after the wafer sort or wafer to have problem undesired or that efficient is not good, need this moment detect again to find out abnormal reason to crystal grain or wafer.Because employed testing equipment on the market, for example UF200 or UF2000, and can't test the wafer or the crystal grain that from wafer, have cut out.In the prior art, the test again of wafer that has cut or crystal grain normally is arranged at wafer or crystal grain on the printed circuit board (PCB), tests with testing equipment again.
The employed method of above-mentioned prior art, wherein wafer or crystal grain are arranged on the printed circuit board (PCB), and its test environment will be variant with wafer or crystal grain originally, therefore, the electrical characteristic that is tested out also has difference thereupon, and can't accurately obtain the characteristic of wafer or crystal grain.
Summary of the invention
Therefore, category of the present invention is to provide a kind of bearing structure, can carry out the test partly of wafers such as crystal grain or wafer in conjunction with testing apparatus.
According to a specific embodiment, the wafer segment that bearing structure of the present invention cuts out from wafer in order to carrying, and can test this wafer segment in conjunction with testing apparatus.The bearing structure of this specific embodiment comprises body, first holding tank, second holding tank and fixed component.
In this specific embodiment, the body dimension of bearing structure equates substantially with the size of the wafer that cuts out wafer segment.First holding tank is arranged on first of body, and this first holding tank can be in order to hold wafer segment to be tested.Second holding tank also is arranged on first, and connects first holding tank.Fixed component is arranged in second holding tank, and the side of its wafer segment that can deduct is to be fixed in wafer segment in first holding tank.
According to another specific embodiment, the wafer segment that bearing structure of the present invention cuts out from wafer in order to carrying, and can test this wafer segment in conjunction with testing apparatus.The bearing structure of this specific embodiment comprises body, first holding tank and groove.
In this specific embodiment, the body dimension of bearing structure equates substantially with the size of the wafer that cuts out wafer segment.First holding tank is arranged on first of body, and this first holding tank can be in order to hold wafer segment to be tested.Groove is arranged on second of body, and this second with respect to first.In addition, has the hole that runs through body to the first from second face in the groove.When the bearing structure of this specific embodiment during in conjunction with testing apparatus test wafer part, testing apparatus can produce on bearing structure and attract air pressure to come to attract wafer and wafer segment is fixed in first holding tank from groove and hole.
According to bearing structure of the present invention, further comprise at least one the 3rd holding tank, and this first holding tank and the 3rd holding tank are according to the rule setting and be arranged on this first.
According to bearing structure of the present invention, wherein, this wafer segment is selected from the group of being made up of wafer, crystal grain and incomplete wafer.
Another category of the present invention is to provide a kind of testing apparatus, can be in order to test the wafer segment that cuts out from wafer.
According to a specific embodiment, testing apparatus of the present invention comprises bearing structure and probe member.Wherein bearing structure can be in order to the carrying wafer segment, and can the test wafer part by the probe member.
In this specific embodiment, bearing structure further comprises body, first holding tank, second holding tank and fixed component.The body dimension of bearing structure equates substantially with the size of the wafer that cuts out wafer segment.First holding tank is arranged on first of body, and this first holding tank can be in order to hold wafer segment to be tested.Second holding tank also is arranged on first, and connects first holding tank.Fixed component is arranged in second holding tank, and the side of its wafer segment that can deduct is to be fixed in wafer segment in first holding tank.Fixedly behind the wafer segment, the probe member can be followed the test wafer part to bearing structure.
According to testing apparatus of the present invention, wherein, this bearing structure further comprises groove, be arranged at this body with respect on this first second, and the position of this groove is with respect to this first holding tank.
According to testing apparatus of the present invention, wherein, have in this groove from this second face and run through this body to this hole of first.
According to testing apparatus of the present invention, further comprise: the air pressure producing component to should hole, attracts air pressure to attract and fixes this wafer segment in order to produce.
According to testing apparatus of the present invention, wherein, this bearing structure further comprises at least one the 3rd holding tank, and this first holding tank and the 3rd holding tank are according to the rule setting and be arranged on this first.
According to testing apparatus of the present invention, wherein, this wafer segment is selected from the group of being made up of wafer, crystal grain and incomplete wafer.
According to another specific embodiment, testing apparatus of the present invention comprises bearing structure and probe member.Wherein bearing structure can be in order to carrying and fixing wafer segment, and can the test wafer part by the probe member.With a last specific embodiment difference, be that the bearing structure of this specific embodiment comprises body, first holding tank and groove.
In this specific embodiment, the body dimension of bearing structure equates substantially with the size of the wafer that cuts out wafer segment.First holding tank is arranged on first of body, and this first holding tank can be in order to hold wafer segment to be tested.Groove is arranged on second of body, and this second with respect to first.In addition, has the hole that runs through body to the first from second face in the groove.When the bearing structure of this specific embodiment during in conjunction with testing apparatus test wafer part, testing apparatus can produce on bearing structure and attract air pressure to come to attract wafer and wafer segment is fixed in first holding tank from groove and hole.
According to testing apparatus of the present invention, wherein, this bearing structure further comprises: second holding tank, be arranged on this first, and this second holding tank connects this first holding tank; And fixed component, being arranged in this second holding tank, the deduct side of this wafer segment of this fixed component is to be fixed in this wafer segment in this first holding tank.
According to testing apparatus of the present invention, wherein, this bearing structure further comprises at least one the 3rd holding tank, and this first holding tank and the 3rd holding tank are according to the rule setting and be arranged on this first.
According to testing apparatus of the present invention, wherein, this wafer segment is selected from the group of being made up of wafer, crystal grain and incomplete wafer.
Can be further understood by the following detailed description and accompanying drawings about the advantages and spirit of the present invention.
Description of drawings
Fig. 1 illustrates the schematic diagram according to the bearing structure of a specific embodiment of the present invention.
Fig. 2 A illustrates the front schematic view according to the bearing structure of another specific embodiment of the present invention.
Fig. 2 B illustrates the schematic rear view of the bearing structure of Fig. 2 A.
Fig. 2 C illustrates the generalized section of the bearing structure of Fig. 2 A along hatching A-A.
The bearing structure that Fig. 3 illustrates Fig. 2 C is in conjunction with the fixing schematic diagram of wafer segment of testing apparatus.
Fig. 4 A illustrates the front schematic view according to the bearing structure of another specific embodiment of the present invention.
Fig. 4 B illustrates the schematic rear view of the bearing structure of Fig. 4 A.
Fig. 5 illustrates the schematic diagram according to the testing apparatus of a specific embodiment of the present invention.
Fig. 6 illustrates the schematic diagram according to the testing apparatus of another specific embodiment of the present invention.
Embodiment
Please refer to Fig. 1, Fig. 1 illustrates the schematic diagram according to the bearing structure 1 of a specific embodiment of the present invention.The bearing structure 1 of this specific embodiment can be in order in conjunction with testing apparatus (not shown in FIG.) test wafer part 2; wherein; this wafer segment 2 cuts out from the wafer (not shown in FIG.), and in practice, wafer segment 2 can be wafer, crystal grain or incomplete wafer.As shown in Figure 1, bearing structure 1 comprises body 10, first holding tank 12, second holding tank 14 and fixed component 16.
In this specific embodiment, body 10 has first 100, the first holding tank 12 and second holding tank 14 all is arranged on first 100, and second holding tank 14 connects first holding tank 12.Fixed component 16 is arranged in second holding tank 14, and can the deduct side of wafer segment 2 of fixed component 16, and then wafer segment 2 is fixed in first holding tank 12.
Note that in this specific embodiment the size of body 10 equates with wafer size substantially.Just, in practice, the size of body 10 can equate with 4 inches wafers, 5 inches wafers, 6 inches wafers, 8 inches wafers and 12 inches existing wafers such as wafer substantially, decide according to the size and the acceptable specification of testing apparatus of the wafer that cuts out wafer segment 2.In practice, the outward appearance of body 10 also can be identical with wafer substantially.In addition, in this specific embodiment, first holding tank 12 is positioned at the central part of body 10, yet in practice, first holding tank 12 also can be arranged at first 100 other parts of body 10, and is not subject to this specific embodiment.
In addition, in practice, a plurality of first holding tanks 12 can further be set on first 100 of body 10 and connect second holding tank 14 of these first holding tanks 12 respectively and be arranged at fixed component 16 in second holding tank 14.These first holding tanks 12 can be arranged on first 100, and in practice, arrange the position before first holding tank 12 can not cut on original wafer according to wafer segment 2, or arrange according to the position that the probe of testing apparatus can be aimed at.
In the above-mentioned specific embodiment, after fixed component 16 is fixed in first holding tank 12 with wafer segment 2, testing apparatus can with its probe alignment and contact wafer segment 2 with and on electric terminal (electric contact), further measure the electrical characteristic of wafer segment 2.
Please refer to Fig. 2 A to Fig. 2 C, Fig. 2 A illustrates the front schematic view according to the bearing structure 3 of another specific embodiment of the present invention; Fig. 2 B illustrates the schematic rear view of the bearing structure 3 of Fig. 2 A; Fig. 2 C illustrates the generalized section of the bearing structure 3 of Fig. 2 A along hatching A-A.The bearing structure 3 of this specific embodiment is in order in conjunction with testing apparatus test wafer part 2.Shown in Fig. 2 A to Fig. 2 C, bearing structure 3 comprises body 30, first holding tank 32 and groove 34.
In this specific embodiment, have first 300 and on the body 30, and the size of body 30 equates with the size of the wafer that cuts out wafer segment 2 substantially with respect to first 300 second 302.First holding tank 32 is arranged on first 300, and it can be in order to hold wafer segment 2.In addition, groove 34 is arranged on second 302.Have hole 340 in the groove 34, hole 340 runs through body 30 to first 300 from second 302.
Please refer to Fig. 3, the bearing structure 3 that Fig. 3 illustrates Fig. 2 C is in conjunction with the fixing schematic diagram of wafer segment 2 of testing apparatus 4.As shown in Figure 3, in wafer segment 2 is positioned over first holding tank 32 of bearing structure 3, and bearing structure 3 is together with in the wafer segment 2 built-in test devices 4 during with test wafer part 2, and testing apparatus 4 can cause attraction air pressure to groove 34 and hole 340.If this moment, wafer segment 2 placed on the hole 340, will be attracted air pressure and attract, and then be fixed in first holding tank 32.In practice, attracting air pressure to vacuumize by the groove 34 to bearing structure 3 produces.In addition, in this specific embodiment, a hole 340 is set in the groove 34.Yet in practice, the quantity of hole 340 can not be subject to the cited specific embodiment of this specification, and decides according to user or designer's demand.
In practice, first 300 of body 30 can further be provided with a plurality of first holding tanks 32, and, at second 302 a plurality of grooves 34 that also can be provided with of body 30 with respect to these first holding tanks 32.Similarly, these grooves 34 also can be provided with the hole 340 that runs through body 30.Thus, bearing structure 3 can carry a plurality of wafer segments 2 simultaneously, and when bearing structure 3 was tested in together with a plurality of wafer segment 2 built-in test devices 4, the attraction air pressure that testing apparatus 4 produces can attract and fix these wafer segments 2 simultaneously.
In addition, in practice when above-mentioned testing apparatus 4 produces attraction air pressure, if deposit the hole 340 of not placing wafer segment 2 thereon, can block these holes of not placing wafer segment 2 340 with adhesive tape or other blockage structure for these holes 340, fixing wafer segment 2 to avoid attracting Pneumatic pipe cleaner to cross that these holes of not placing wafer segment 2 340 attract ambient atmos.
In practice, above-mentioned each first holding tank 32 can be according to wafer segment 2 position before the cutting and arranging on wafer originally, or arranges according to the position that the probe of testing apparatus 4 can be aimed at.
Please refer to Fig. 4 A and Fig. 4 B, Fig. 4 A illustrates the front schematic view according to the bearing structure 5 of another specific embodiment of the present invention; Fig. 4 B illustrates the schematic rear view of the bearing structure 5 of Fig. 4 A.The bearing structure 5 of this specific embodiment is in order in conjunction with testing apparatus (not shown in FIG.) test wafer part 2.Shown in Fig. 4 A and Fig. 4 B, bearing structure 5 comprises body 50, first holding tank 52, second holding tank 54, fixed component 56 and groove 58.
In this specific embodiment, body 50 has first 500 and second 502, the first holding tank 52 with respect to first 500 and second holding tank 54 is arranged at respectively on first 500, and second holding tank 54 connects first holding tank 52.Fixed component 56 is arranged in second holding tank 54, and can the deduct side of wafer segment 2 of fixed component 56, and then wafer segment 2 is fixed in first holding tank 52.In addition, in actual applications, fixed component 56 itself can be fixed in the body 50 or second holding tank 54 by modes such as grab or bolt-locks, to avoid the slip of itself.
In addition, in this specific embodiment, groove 58 can be arranged on second 502, and its position is with respect to first holding tank 52.Have hole 580 in the groove 58, it can run through body 50 to first 500 from second 502.In practice, when with bearing structure 5 during together with wafer segment 2 built-in test devices, testing apparatus can produce attraction air pressure, attracts Pneumatic pipe cleaner to cross groove 58 and hole 580 attracts and fixing wafer segment 2.
The bearing structure 5 of above-mentioned specific embodiment, fixed component 56 that can be by being arranged in second holding tank 54 is wafer segment 2 fixedly, and when its built-in test device, the attraction air pressure that testing apparatus produces can attract and further fixing wafer segment 2 by groove 58 and hole 580, and wafer segment 2 can firmly be fixed on the bearing structure 5.
Please refer to Fig. 5, Fig. 5 illustrates the schematic diagram according to the testing apparatus 6 of a specific embodiment of the present invention.The testing apparatus 6 of this specific embodiment is in order to test wafer part 2, and wherein, wafer segment 2 cuts out from the wafer (not shown in FIG.).As shown in Figure 5, testing apparatus 6 comprises bearing structure 60 and probe member 62.
In this specific embodiment, bearing structure 60 can be in order to carrying and fixing wafer segment 2, and bearing structure 60 can comprise body 600, first holding tank 602, second holding tank 604 and fixed component 606.First holding tank 602 and second holding tank 604 are arranged at respectively on first 6000 of body 600, and second holding tank 604 connects first holding tank 602.Fixed component 606 is arranged in second holding tank 604, and can the deduct side of wafer segment 2 of fixed component 606, and then wafer segment 2 is fixed in first holding tank 602.
In this specific embodiment, the size of body 600 equates substantially with the size of the wafer that cuts out wafer segment 2.When bearing structure 60 fixedly behind wafer segment 2 and the built-in test device 6, probe member 62 is coupled to the processing unit (not shown in FIG.) of testing apparatus 6, can be controlled to aim at and contact wafer segment 2 and testing.
In practice, a plurality of first holding tanks 602 and corresponding second holding tank 604 and fixed component 606 can be set on first of bearing structure 60 6000.These first holding tanks 602 can be arranged on first 6000, but and probe member 62 Be Controlled aim at these first holding tanks 602 to test a plurality of wafer segments 2 that are contained in these first holding tanks 602.
Please refer to Fig. 6, Fig. 6 illustrates the schematic diagram according to the testing apparatus 7 of another specific embodiment of the present invention.As shown in Figure 6, the testing apparatus 7 of this specific embodiment is in order to test wafer part 2, and wherein, wafer segment 2 cuts out from the wafer (not shown in FIG.).Testing apparatus 7 comprises bearing structure 70 and probe member 72.
In this specific embodiment, bearing structure 70 can be in order to carrying wafer segment 2, and it comprises body 700, first holding tank 702 and groove 704.Have first 7000 and on the body 700, and the size of body 700 equates with the size of the wafer that cuts out wafer segment 2 substantially with respect to first 7000 second 7002.First holding tank 702 is arranged on first 7000, and it can be in order to hold wafer segment 2.In addition, groove 704 is arranged on second 7002.Have hole 7040 in the groove 704, hole 7040 runs through body 700 to first 7000 from second 7002.
In this specific embodiment, the size of body 700 equates substantially with the size of the wafer that cuts out wafer segment 2.When with bearing structure 70 together with wafer segment 2 built-in test devices 7 after, testing apparatus 7 can produce and attract Pneumatic pipe cleaner to cross groove 704 and hole 7040 attracts and fixing wafer segment 2.Then, probe member 72 can be controlled to aim at wafer segment 2 and test.
Compared with prior art, bearing structure of the present invention can carry and the fixing wafer segments such as crystal grain, wafer or incomplete wafer that cut out from wafer.When with bearing structure during together with wafer segment built-in test device to test, because the body outward appearance and the size of bearing structure equate with wafer substantially, therefore testing apparatus can directly carry out the test of wafer segment on bearing structure, and the test environment before the approaching not cutting crystal wafer of its test environment can obtain more accurate test result.
By above detailed description to preferred specific embodiment, hope can be known description feature of the present invention and spirit more, and is not to come category of the present invention is limited with above-mentioned disclosed preferred specific embodiment.On the contrary, its objective is that hope can be covered by the various changes and the plan of establishment that is equal in the category of claim protection range of the present invention.Therefore, the category of claim protection range of the present invention should be done the broadest explanation according to above-mentioned explanation, thus the plan of establishment that makes it contain all possible change and be equal to.
The main element symbol description
1,3,5,60,70: bearing structure
10,30,50,600,700: body
12,32,52,602,702: the first holding tanks
14,54,604: the second holding tanks
16,56,606: fixed component
100,300,500,6000,7000: first surface
302,502,7002: the second 34,58,704: groove
340,580,7040: hole 2: wafer segment
4,6,7: testing arrangement 62,72: probe member.
Claims (18)
1. bearing structure, the wafer segment that cuts out from wafer in order to carrying, and test described wafer segment in conjunction with testing apparatus, described bearing structure comprises:
Body, the size of described body equates with the size of described wafer;
First holding tank is arranged on first of described body, in order to hold described wafer segment;
Second holding tank is arranged on described first, and described second holding tank connects described first holding tank; And
Fixed component is arranged in described second holding tank, and the deduct side of described wafer segment of described fixed component is to be fixed in described wafer segment in described first holding tank.
2. bearing structure according to claim 1, wherein, described body on described first second, further comprise groove, and the position of described groove is with respect to described first holding tank.
3. bearing structure according to claim 2, wherein, have in the described groove from described second face and run through described body to described first hole, and described testing apparatus can produce and attracts air pressure to come from described groove and described hole attraction and fix described wafer segment.
4. bearing structure according to claim 1 further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.
5. bearing structure according to claim 1, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.
6. bearing structure according to claim 1, wherein, described testing apparatus is with the described wafer segment of probe component testing.
7. bearing structure, the wafer segment that cuts out from wafer in order to carrying, and test described wafer segment in conjunction with testing apparatus, described bearing structure comprises:
Body, the size of described body equate with the size of described wafer, and described body comprises first and with respect to described first second;
First holding tank is arranged on described first, in order to hold described wafer segment; And
Groove is arranged at described second and goes up and with respect to described first holding tank, and has in the described groove from described second face and run through described body to described first hole;
Wherein said testing apparatus can produce and attract air pressure to come from described groove and described hole attraction and fixing described wafer segment.
8. bearing structure according to claim 7 further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.
9. bearing structure according to claim 7, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.
10. testing apparatus, in order to the wafer segment that test cuts out from wafer, described testing apparatus comprises:
Bearing structure comprises:
Body, the size of described body equates with the size of described wafer;
First holding tank is arranged on first of described body, in order to hold described wafer segment;
Second holding tank is arranged on described first, and described second holding tank connects described first holding tank; And
Fixed component is arranged in described second holding tank, and the deduct side of described wafer segment of described fixed component is to be fixed in described wafer segment in described first holding tank; And
The probe member is in order to test described wafer segment.
11. testing apparatus according to claim 10, wherein, described bearing structure further comprises groove, be arranged at described body with respect on described first second, and the position of described groove is with respect to described first holding tank.
12. testing apparatus according to claim 11 wherein, has in the described groove from described second face and runs through described body to described first hole.
13. testing apparatus according to claim 12 further comprises:
The air pressure producing component, corresponding described hole attracts air pressure to attract and fixing described wafer segment in order to produce.
14. testing apparatus according to claim 10, wherein, described bearing structure further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.
15. testing apparatus according to claim 10, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.
16. a testing apparatus, in order to the wafer segment that test cuts out from wafer, described testing apparatus comprises:
Bearing structure comprises:
Body, the size of described body equate with the size of described wafer, and described body comprises first and with respect to described first second;
First holding tank is arranged on described first, in order to hold described wafer segment; And
Groove is arranged at described second and goes up and described relatively first holding tank, and has in the described groove from described second face and run through described body to described first hole;
The air pressure producing component, corresponding described hole attracts air pressure to attract and fixing described wafer segment in order to produce; And
The probe member is in order to test described wafer segment.
17. testing apparatus according to claim 16, wherein, described bearing structure further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.
18. testing apparatus according to claim 16, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810093293 CN101587850B (en) | 2008-05-21 | 2008-05-21 | Bearing structure and testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810093293 CN101587850B (en) | 2008-05-21 | 2008-05-21 | Bearing structure and testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101587850A CN101587850A (en) | 2009-11-25 |
| CN101587850B true CN101587850B (en) | 2011-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200810093293 Expired - Fee Related CN101587850B (en) | 2008-05-21 | 2008-05-21 | Bearing structure and testing device |
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| CN (1) | CN101587850B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103344794B (en) * | 2013-06-24 | 2016-08-24 | 上海华力微电子有限公司 | A kind of Multifunctional semiconductor sample fixture |
| TWI590355B (en) * | 2016-02-25 | 2017-07-01 | 南茂科技股份有限公司 | Wafer testing fixture, wafer dynamic test fixture and wafer testing method |
| CN107039298B (en) * | 2016-11-04 | 2019-12-24 | 厦门市三安光电科技有限公司 | Transfer device, transfer method, manufacturing method, device and electronic apparatus for micro-component |
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|---|---|---|---|---|
| JP2000068018A (en) * | 1998-08-20 | 2000-03-03 | Pfu Ltd | Inspection system for semiconductor package, its control method and its recording medium |
| US6262581B1 (en) * | 1998-04-20 | 2001-07-17 | Samsung Electronics Co., Ltd. | Test carrier for unpackaged semiconducter chip |
| CN1329749A (en) * | 1998-12-04 | 2002-01-02 | 佛姆法克特股份有限公司 | A method and apparatus for transport and tracking of electronic component |
| CN1369906A (en) * | 2001-02-12 | 2002-09-18 | 茂德科技股份有限公司 | Tester of chip without package |
| CN1715941A (en) * | 2004-06-29 | 2006-01-04 | 联华电子股份有限公司 | Chip needle detector |
| CN1731573A (en) * | 2004-08-04 | 2006-02-08 | 探微科技股份有限公司 | Wafer carrier |
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2008
- 2008-05-21 CN CN 200810093293 patent/CN101587850B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6262581B1 (en) * | 1998-04-20 | 2001-07-17 | Samsung Electronics Co., Ltd. | Test carrier for unpackaged semiconducter chip |
| JP2000068018A (en) * | 1998-08-20 | 2000-03-03 | Pfu Ltd | Inspection system for semiconductor package, its control method and its recording medium |
| CN1329749A (en) * | 1998-12-04 | 2002-01-02 | 佛姆法克特股份有限公司 | A method and apparatus for transport and tracking of electronic component |
| CN1369906A (en) * | 2001-02-12 | 2002-09-18 | 茂德科技股份有限公司 | Tester of chip without package |
| CN1715941A (en) * | 2004-06-29 | 2006-01-04 | 联华电子股份有限公司 | Chip needle detector |
| CN1731573A (en) * | 2004-08-04 | 2006-02-08 | 探微科技股份有限公司 | Wafer carrier |
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| Publication number | Publication date |
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| CN101587850A (en) | 2009-11-25 |
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