TW267244B - - Google Patents

Info

Publication number
TW267244B
TW267244B TW083101470A TW83101470A TW267244B TW 267244 B TW267244 B TW 267244B TW 083101470 A TW083101470 A TW 083101470A TW 83101470 A TW83101470 A TW 83101470A TW 267244 B TW267244 B TW 267244B
Authority
TW
Taiwan
Application number
TW083101470A
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW267244B publication Critical patent/TW267244B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW083101470A 1992-10-30 1994-02-22 TW267244B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96874092A 1992-10-30 1992-10-30

Publications (1)

Publication Number Publication Date
TW267244B true TW267244B (zh) 1996-01-01

Family

ID=25514700

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083101470A TW267244B (zh) 1992-10-30 1994-02-22

Country Status (4)

Country Link
EP (1) EP0600604A1 (zh)
JP (1) JPH06273482A (zh)
KR (1) KR940010259A (zh)
TW (1) TW267244B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102520280A (zh) * 2011-12-08 2012-06-27 台晶(宁波)电子有限公司 多温度点同步动态高温加速老化测试设备

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578934A (en) * 1991-06-04 1996-11-26 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5402077A (en) * 1992-11-20 1995-03-28 Micromodule Systems, Inc. Bare die carrier
US6937044B1 (en) 1992-11-20 2005-08-30 Kulicke & Soffa Industries, Inc. Bare die carrier
JPH07161426A (ja) * 1993-12-03 1995-06-23 Furukawa Electric Co Ltd:The ベアチップバーンインテスト用ソケット及びその製造方法
JP2002243796A (ja) * 2001-01-25 2002-08-28 Promos Technologies Inc 封止材除去されたチップのテスト治具
CN115712056B (zh) * 2023-01-06 2023-04-21 法特迪精密科技（苏州）有限公司 一种芯片温度循环老化测试台、关键座及测试方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573617A (en) * 1967-10-27 1971-04-06 Aai Corp Method and apparatus for testing packaged integrated circuits
EP0107327A1 (en) * 1982-09-17 1984-05-02 Coordinate Probe Card Company Limited Probe device for testing an integrated circuit and method of making same
US5006792A (en) * 1989-03-30 1991-04-09 Texas Instruments Incorporated Flip-chip test socket adaptor and method
US4940935A (en) * 1989-08-28 1990-07-10 Ried Ashman Manufacturing Automatic SMD tester

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102520280A (zh) * 2011-12-08 2012-06-27 台晶(宁波)电子有限公司 多温度点同步动态高温加速老化测试设备

Also Published As

Publication number Publication date
KR940010259A (ko) 1994-05-24
EP0600604A1 (en) 1994-06-08
JPH06273482A (ja) 1994-09-30

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