JPH0626344Y2 - 回転体に対する圧縮空気供給機 - Google Patents
回転体に対する圧縮空気供給機Info
- Publication number
- JPH0626344Y2 JPH0626344Y2 JP201990U JP201990U JPH0626344Y2 JP H0626344 Y2 JPH0626344 Y2 JP H0626344Y2 JP 201990 U JP201990 U JP 201990U JP 201990 U JP201990 U JP 201990U JP H0626344 Y2 JPH0626344 Y2 JP H0626344Y2
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- bottle
- air
- zone
- compressed air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 claims description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 27
- 235000006408 oxalic acid Nutrition 0.000 description 18
- 238000005406 washing Methods 0.000 description 15
- 229960002050 hydrofluoric acid Drugs 0.000 description 14
- 238000011282 treatment Methods 0.000 description 13
- 238000001035 drying Methods 0.000 description 8
- 238000010306 acid treatment Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005587 bubbling Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Surface Treatment Of Glass (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP201990U JPH0626344Y2 (ja) | 1990-01-12 | 1990-01-12 | 回転体に対する圧縮空気供給機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP201990U JPH0626344Y2 (ja) | 1990-01-12 | 1990-01-12 | 回転体に対する圧縮空気供給機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0394939U JPH0394939U (enrdf_load_stackoverflow) | 1991-09-27 |
| JPH0626344Y2 true JPH0626344Y2 (ja) | 1994-07-20 |
Family
ID=31505901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP201990U Expired - Lifetime JPH0626344Y2 (ja) | 1990-01-12 | 1990-01-12 | 回転体に対する圧縮空気供給機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0626344Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006091107A (ja) * | 2004-09-21 | 2006-04-06 | Ibigun Shinrin Kumiai | 立看板用フレーム |
-
1990
- 1990-01-12 JP JP201990U patent/JPH0626344Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0394939U (enrdf_load_stackoverflow) | 1991-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4350562A (en) | Method for etching semiconductor wafers on one side | |
| US7353560B2 (en) | Proximity brush unit apparatus and method | |
| US4300581A (en) | Centrifugal wafer processor | |
| JPH0917761A (ja) | 洗浄処理装置 | |
| KR970063586A (ko) | 반도체 웨이퍼 세정장치 | |
| US6824613B2 (en) | Substrate processing apparatus | |
| KR940010225A (ko) | 반도체 웨이퍼의 이면(裏面)세정장치 | |
| CN111036448A (zh) | 一种机电制造用喷漆设备 | |
| TW200307334A (en) | Integrated system for processing semiconductor wafers | |
| JPH10204690A (ja) | 自動ウェーハめっき装置 | |
| CN107799442A (zh) | 基板清洗装置及具备该基板清洗装置的基板处理装置 | |
| JPH0626344Y2 (ja) | 回転体に対する圧縮空気供給機 | |
| KR101760390B1 (ko) | 대상체 내외부면 세정 장치 | |
| JP2001070897A (ja) | 容器の連続洗浄装置 | |
| TWI243420B (en) | Semiconductor wafer cleaning method and apparatus | |
| KR20090012703A (ko) | 기판 세정 장치 및 방법 | |
| JP2509185Y2 (ja) | ガラス壜用フロスト機 | |
| KR100401376B1 (ko) | 도금 장치, 도금 설비 및 이것을 이용한 도금 처리 방법 | |
| JP2004008929A (ja) | 洗浄装置 | |
| KR100752123B1 (ko) | 도금 강판 표면의 수분 제거장치 | |
| CN212069829U (zh) | 自动洗瓶机的冲洗刷设备 | |
| JPS63152123A (ja) | 浸漬式の液処理装置 | |
| CN221133322U (zh) | 一种清洗干燥机构 | |
| JPH1190355A (ja) | 洗浄装置 | |
| CN212916765U (zh) | 一种新型覆膜砂机械用清洗装置 |