JPH06260795A - Equipment for positioning backup pin - Google Patents

Abstract

PURPOSE:To obtain an equipment whereby the position of a backup pin which supports the rear surface of a board mounted with an electronic part is determined automatically and is shown an operator, by providing in the equipment a specific part-position storing means, a specific pin-position storing means and specific display means. CONSTITUTION:In an equipment for positioning a backup pin, a part-position storing means 3 for storing the layout position data of an electronic part mounted on the rear surface of a board and a pin-position storing means 3 for storing the layout position data of a backup pin which is opposed to the rear surface of the board are provided respectively. Further, in the equipment, following displaying means 1, 4 are provided. That is, based on the layout position data of the backup pin which is opposed to the rear surface of the board and is stored in the pin-position storing means 3 and based on the layout position data of the electronic part mounted on the rear surface of the board which is stored in the part-position storing means 3, the coordinates of the foregoing two position data are calculated by the means 1 respectively. Then, the layout position data of the backup pin which is opposed to the rear surface of the board and whose calculated coordinate does not coincide with the one of the electronic part is displayed on the displaying picture plane of the displaying means 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup pin positioning device in an electronic component mounting apparatus for mounting electronic components on both sides of a board.

[0002]

2. Description of the Related Art Conventionally, a board supply device for supplying a printed board, a dispenser for attaching or applying paste solder or the like at a predetermined position on the supplied printed board,
Chip component mounting device that mounts electronic components on a board to which the solder or the like is attached or applied, a reflow furnace that fixes the mounted electronic components on a printed circuit board, and a board unit that is completed by fixing the mounted electronic components. There is a board unit manufacturing line including a board housing device for housing a board.

Even in such a board unit manufacturing line, the chip component mounting apparatus is arranged at the correct component mounting position on the printed circuit board which is automatically carried into the apparatus itself by the transport rail.
A large number of chip-shaped electronic components such as C, resistors and capacitors are automatically mounted by the work head.

By the way, there are some chip-shaped electronic parts which are as small as 1.5 mm square.
Many large ones have many lead wires implanted at 0.5 mm intervals around them. As described above, since the shape of the chip-shaped electronic component is fine, in order to accurately mount the electronic component on the correct mounting position on the printed circuit board, the printed circuit board does not bend not only in the vertical lever position but also in the upper and lower positions. It must be fixed exactly. Therefore, below the transport rail of the component mounting device, there is a support device that supports the printed circuit board from below with a plurality of pins in order to correctly fix the upper and lower positions of the printed circuit board to be carried in. The support device usually consists of a backup pin, a backup plate and a lift. This is shown in Fig. 7 (a),
A brief explanation is given in (b). FIG. 1A is a plan view of the supporting device together with a partial plan view of the transport rail 21, and FIG. 1B is a side view of the supporting device as seen from the transport direction.
1 is shown together with the sectional view of FIG. As shown in FIGS. 7A and 7B, when the printed circuit board is not in the processing position, the elevator 23 that supports the backup plate 22 descends and the tip of the backup pin 24 held by the backup plate 22 (the substrate support The edge) is located below the transport rail 21.

As shown in FIGS. 8 (a) and 8 (b), when the printed circuit board 25 is loaded and stopped at the processing position, the elevator 23 moves upward in the direction indicated by the arrow C in FIG. The backup pin 24 inserted and held supports the printed circuit board 25 from below.

By the way, there are a printed circuit board on which electronic components are mounted only on one side and a printed circuit board on which electronic components are mounted on both sides. When electronic components are mounted on both sides, the printed circuit board is loaded with one side having a predetermined electronic component mounted thereon in the previous process and then inverted and the other side facing up. Also in this case,
A printed board having electronic components mounted on the lower surface is supported from below by a supporting device.

As described above, when the electronic components are mounted on both sides of the printed circuit board, in order to support the back surface of the printed circuit board on which the electronic components are already mounted by the backup pins from below, the electronic components already mounted on the printed circuit board must be mounted. It is necessary to arrange backup pins in advance at the backup plate position corresponding to the gap between the component and the electronic component (the surface of the electronic component where the electronic component is not disposed). For this arrangement, when the backup pins are replaced, conventionally, the operator manually replaces the backup pins while comparing the back surface of the printed board on which electronic components are mounted with the backup plate.

[0008]

However, it takes too much time if the operator manually replaces the backup pin in this way while comparing the back surface of the printed circuit board on which electronic components are mounted with the backup plate. Not only does the work efficiency not increase, but there is a problem in that backup pin placement errors are likely to occur, which interferes with the subsequent work that follows.

An object of the present invention is to provide a backup pin positioning device which automatically determines a backup pin position for supporting a back surface of a printed circuit board on which electronic components are mounted and notifies the operator of the backup pin position. .

[0010]

SUMMARY OF THE INVENTION The present invention is premised on a backup pin positioning device for determining the arrangement position of a backup pin for supporting a substrate on the back surface of which components are already mounted from below.

The backup pin positioning device of the present invention stores component position storage means for storing arrangement position data of electronic components mounted on the rear surface of the substrate on the rear surface of the substrate, and arrangement position data corresponding to the rear surface of the substrate for the backup pin. Pin position storage means to be stored, arrangement position data corresponding to the back surface of the back-up board stored by the pin position storage means, and arrangement of mounted electronic components on the back surface of the substrate stored in the component position storage means. 2 based on the installation position data
A display means for calculating one position data coordinate and displaying on the display screen the arrangement position data corresponding to the back surface of the substrate of the backup pin where the calculated coordinates do not overlap.

[0012]

In the backup pin positioning device of the present invention,
By the display means, the arrangement position data corresponding to the back surface of the substrate of the backup pin stored by the pin position storage means and the arrangement position data of the mounted electronic component on the back surface of the substrate stored in the component position storage means are displayed. Based on this, the two position data coordinates are calculated, and the disposition position data corresponding to the back surface of the substrate of the backup pin where the calculated coordinates do not overlap is displayed on the display screen.

With this, it is possible to automatically determine the backup pin position for supporting the back surface of the printed circuit board on which the electronic components are mounted, and notify the operator of the backup pin position.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of the configuration of a central control unit that controls an electronic component mounting apparatus that incorporates a backup pin positioning apparatus according to an embodiment. In the figure, the central control unit has a CPU (central processing unit) 1 for controlling the entire apparatus, and the CPU 1 includes a key input unit 2, a storage unit 3, a display unit 4, a servo motor control unit. 5, and a servo motor drive unit 6 is connected via the servo motor control unit 5, and further an i / o control unit 7, a pulse motor control unit 8, and a pulse motor drive unit via the pulse motor control unit 8. 9 is connected.

The key input section 2 has a keyboard 2a described later, and outputs a key input signal input from the keyboard 2a to the CPU 1. The storage unit 3 is a ROM (Read-
Only-Memory), RAM (Random-Access-Memory), and other memories are provided, and control and processing programs, various processing data, etc. are stored and accessed by the CPU 1. The display unit 4 includes a display device 4a, which will be described later, and displays key input data and processing contents.

The CPU 1 outputs to the servo motor control section 5 a drive signal for moving the work head 14 for mounting the components to be described later on the board back and forth and left and right. The servo motor control unit 5 decodes the drive signal input from the CPU 1 and outputs it to the servo motor drive unit 6. The servo motor drive unit 6 has an input / output port and is connected to an X-axis servo motor 6a and a Y-axis servo motor 6d, which will be described later, and outputs a drive signal input from the servo motor control unit 5 to the X-axis servo motor 6a and Assigned to the Y-axis servomotor 6d.

The CPU 1 also outputs a drive signal for vertically moving or rotating the work head 14 to the pulse motor controller 8. The pulse motor control unit 8 includes the CPU 1
The drive signal input from is decoded and output to the pulse motor drive unit 9. The pulse motor drive unit 9 also has an input / output port and is connected to a pulse motor for vertical movement and a pulse motor for rotation (not shown), and a drive signal input from the pulse motor control unit 8 is supplied to the pulse motor for vertical movement and Assign to the pulse motor for rotation.

Further, the CPU 1 controls the vacuum pump which operates the suction nozzle 14c of the work head 14, a control signal which operates an air cylinder which drives a stopper which stops the substrate, and a substrate from below. A control signal for setting the position of the supporting pin to be supported is output to the i / o control unit 7. The i / o control unit 7 assigns the control signals input from the CPU 1 to a vacuum pump, an air cylinder, a support plate lifter drive unit, and outputs the control signals.

FIG. 2 is a front view of the electronic component mounting apparatus controlled by the central control unit, and FIG. 3 is a plan view thereof. In FIG. 2, an electronic component mounting device (hereinafter, referred to as a main body device) 10 is provided in the inside 1a of the device base 10a.
The central control section shown in FIG. 3 is provided, and a support plate device for supporting the printed circuit board 18 (hereinafter, simply referred to as the board 18) shown in FIG. 3 from below is provided in the inside 11a of the apparatus base 10a.

Various devices are arranged on the upper part of the device base 10a, and a safety cover 10b (2) for isolating these devices from the outside is provided.
The upper part is covered by a dotted line). The safety cover 10b has an opening in the front center, and a liquid crystal display or a CRT (Cathode Ray Tube) is provided on the upper part of the right non-opening wall.
A display device 4a including a display is provided, and a key board 2a is provided below the display device 4a. The keyboard 2a is provided with numerical keys and various command setting keys, and keys are input by an external operation.

At the center of the apparatus base 10a, a pair of fixed and movable parallel substrate guide rails 11 are arranged so as to extend horizontally in the transport direction (X-axis direction) of the substrate 18. The pair of substrate guide rails 11 guide the conveyance of the substrate 18 and position the substrate 18 in the width direction (Y-axis direction). A plurality of conveyor belts (not shown) stretched in a loop are arranged so as to be capable of traveling in contact with the lower sides of the board guide rails 11. The conveyor belts are driven by the belt drive motor 11d shown in FIG. 3 with the side portions of the belt each having a width of several millimeters looking into the substrate transfer path, and the substrate is transferred from the right side to the left side shown by the arrow A in FIG. The substrate 18 is transported while traveling in the direction, and supporting both sides of the back surface of the substrate 18 from below.

On the apparatus base 10a, a pair of left and right extending over the pair of substrate guide rails 11 and extending parallel to the direction (Y-axis direction) perpendicular to the substrate transport direction (X-axis direction). Fixed bases 12 and 12 'are provided. Y-axis rails 12a and 12a 'are laid on the fixed bases 12 and 12', respectively. On the rails 12a, 12a ', a long moving base 13 is slidably supported in the Y-axis direction by ball bearings (not shown) provided at the lower ends of both ends in the longitudinal direction thereof. A work head 14 for mounting components on a board 18 is suspended.

The movable table 13 has a longitudinal direction (X
An X-axis servomotor 6a for moving the work head 14 back and forth in the axial direction is provided. X-axis servo motor 6a
One end of an X-axis drive feed screw 6c is connected to the drive shaft of the above through a coupling 6b, and the X-axis drive feed screw 6c is
The other end is supported by the bearing and screwed with the nut member 14 a of the work head 14.

Therefore, when the X-axis drive servomotor 6a connected to the X-axis drive feed screw 6c rotates forward and backward, the X-axis drive feed screw 6c rotates forward and backward, and this and the nut member 14 are rotated.
The work head 14, which is screwed via a, moves back and forth in the X-axis direction.

The work head 14 is provided with a suction head 14c for transferring components and a substrate recognition camera 14d for confirming the component mounting position of the substrate 18, and inside the apparatus base 1
A flexible communication cable 14b is connected to the central control unit shown in FIG. Working head 14
Is supplied with power and control signals from the central control unit via the communication cable 14b, and transmits image data indicating the position to be worked on the substrate to the central control unit.

Next, as shown in FIG. 3, the fixed base 12 is provided with a Y-axis drive servomotor 6d for driving the movable base 13 in the Y-axis direction, and the fixed bases 12 and 12 'are further provided with: A Y-axis drive feed screw 6f and a Y-axis driven feed screw 6 for transmitting the drive of the servo motor 6d to the moving table 13, respectively.
f'is arranged. The drive shaft of the Y-axis servomotor 6d is connected to one end of the Y-axis drive feed screw 6f via a coupling 6e.

The Y-axis drive feed screw 6f is provided with a toothed pulley 6g having the other end supported by a bearing and fixed to the other end,
The toothed pulley 6g, a toothed belt (not shown) in which one end of the loop meshes with the toothed pulley 6g, and the other toothed pulley 6 meshes with the other end of the loop of the toothed belt.
The toothed pulley 6g 'is connected to the Y-axis driven feed screw 6f' to which the toothed pulley 6g 'is fixed so as to be rotatable in synchronism with each other via g'. The Y-axis drive feed screw 6f and the Y-axis driven feed screw 6f 'are connected to both ends in the longitudinal direction of the movable table 13 via nut members (not shown) screwed to the feed screws.

Therefore, if the Y-axis drive servomotor 6d connected to the Y-axis drive ball screw 6f is rotated in the forward and reverse directions,
The moving base 1 in which the Y-axis drive feed screw 6f and the Y-axis driven feed screw 6f 'rotate synchronously and are screwed with these via a nut member.
3 and thus the work head 14 suspended on it
Moves back and forth in the axial direction.

A positioning pin 11b is supported on the outer side of the board guide rail 11 so as to be slidable in the X-axis direction and rotatable between the Y-axis direction and the Z-axis direction (vertical direction).
The positioning pin 11b is rotated by, for example, a drive device such as an air cylinder so that the front end of the positioning pin 11b advances into the substrate transport path, abuts on the front end of the substrate 18 to be carried in, stops the substrate 18, and near the rear portion of the substrate 18. Standard pin 11c that advanced to
The substrate 18 is pressed against and the substrate 18 is positioned in the X-axis direction.

A component supply corner 15 is provided on the front side of the apparatus base 10a (downward in the figure). A plurality of component supply units (not shown) for supplying components to the work head 14 are detachably attached to the component supply corner 15.

A camera 16 for recognizing a component and a suction nozzle exchanger 17 are provided between the component supply corner 15 and the fixed board guide rail 11 on the front side (lower side in the drawing) of the apparatus base.
However, they are arranged so as to be integrally movable in the X-axis direction by a ball screw and a motor that drives the ball screw.

The camera 16 for recognizing a component is the work head 14.
The suction nozzle 14c shown in FIG. 2 stands by while picking up a component from the component supply corner 15 shown in the same figure by suction and moving to the upper side of the substrate 18, and images the component sucked by the suction nozzle 14c from below. To do.

Next, the processing operation for mounting the components on both sides of the board in the present embodiment having the above-mentioned structure will be described with reference to the flow chart shown in FIG. Note that this process is a process performed by the CPU 1 of the central control unit shown in FIG.

First, a setup change for mounting components on the back surface of the substrate is performed (step S1). This process is a process to prepare for the process to be performed, that is, input of data indicating the type of substrate to be processed and the total number of substrates,
This is a process for confirming the components to be arranged at the component supply corner, setting each control position of the board positioning device, and the like. This process is performed by the keyboard 2a of the key input unit 2 shown in FIGS.
Using the display device 4a of the display unit 4, the operation is performed interactively between the operator and the central control unit.

Then, a program for mounting components on the back surface of the substrate is loaded (step S2). This process is performed by executing a program for mounting components on the back surface of the board corresponding to the type of the board input in the setup change processing from among various programs stored in the external storage device.
This is a process of transferring to the storage unit 3 shown in FIG.

Next, a component mounting process for the board is executed (step S3). This process is performed by loading the substrate 18 by the transport rail 11 shown in FIGS. 2 and 3 and the stopper 11b.
Stop of the board 18 by the X-axis, vertical and vertical positioning with respect to the board 18, suction of the component by the suction nozzle 14c of the work head 14, recognition of the component suction state by the component recognition camera 16 and the work head based on the recognition. 14 position correction, movement of the work head 14 onto the substrate by a program, component mounting position confirmation and correction on the substrate by the substrate recognition camera 14d, component mounting, leaving of the positioning device, and unloading of the component mounted substrate 18 The above-described series of processes is repeatedly performed on a predetermined number of substrates input in the setup change process.

Following the completion of the component mounting process on the back surface of the predetermined number of boards designated by the above input, as will be described in detail later, a setup change for mounting the components on the front surface of the board is performed (step S4), and then Then, the program for mounting the component on the surface of the substrate is loaded (step S5). FIG. 1 shows a program for mounting components on the surface of the board corresponding to the type of the board input in the above-mentioned processing of the setup change from various programs stored in the external storage device or the like. This is a process of transferring and storing the data in the storage unit 3.

Subsequently, a process of mounting components on the surface of the substrate is executed (step S6). This process is also the same as the process of mounting components on the back surface, carrying in and stopping the substrate 18, positioning the substrate 18 in the X and Y axes and in the vertical direction,
Picking up parts by the work head 14, imaging / recognizing the parts picking up state and correcting the position, moving to the board, checking and correcting the parts mounting position, mounting the parts, leaving the positioning device,
In addition, it is a process of carrying out the component-mounted board 18, and the like, and the series of processes is repeated for all the predetermined number of boards input in the process of setup change, and then the process is ended.

Next, the setup change processing for mounting the components on the surface of the board in the above step S4 will be described in more detail with reference to the flowchart of FIG. In the flowchart of the figure, the program for mounting the component on the back surface of the substrate is read (step S41). As a result, the program data indicating the position of the component to be mounted on the back surface of the substrate (that is, the component already mounted on the back surface of the substrate) is read out, and, for example, as shown in FIG. The contour image of the component based on the data is displayed as coordinates on the display screen corresponding to the back surface of the board.

Then, the position data of the backup pin insertion hole of the support plate is read (step S42). As a result, for example, as shown in FIG. 6B, the contour image of the backup pin insertion hole based on the read position data of the backup pin insertion hole is displayed as coordinates on the display screen corresponding to the back surface of the board. To be done.

Next, based on the position data of the above parts and the position data of the backup pin insertion hole, the overlap of the two position data is detected, and when they overlap, the image based on the two position data is crossed on the display screen. It is displayed (step S43). As a result, for example, as shown by the hatched portion in FIG. 6C, it is notified that two overlapping images are overlapped by reverse display or the like.

Then, the contour image of the pin insertion hole based on the position data of the backup pin insertion hole that does not cross the above two position data (has no overlap) is displayed as coordinates on the display screen as an effective insertion hole position. (Step S44). As a result, it is notified that the image of the backup pin insertion hole that does not overlap the mounted component is effective, for example, by blinking.

The operator inserts the backup pins into the insertion holes according to the display on the display screen, completes the insertion / arrangement of the backup pins into all the effective insertion holes displayed on the display screen, and then uses the keyboard 2a. Press the key to complete the backup pin installation work by pressing C in the central control unit.
Notify PU1. As a result, the process for the surface mounting setup change in step S4 is completed.

In the present embodiment, two images having an overlap are reversely displayed so that it is possible to easily compare them with the board on which components are mounted on the back surface, if necessary.
It is possible to display only the image of the backup pin insertion hole that does not have overlap, or instead of displaying the image coordinates, the backup pin insertion hole is given a position number in advance by printing and the position number is displayed on the screen. It can also be displayed in.

[0045]

According to the present invention, it is possible to automatically determine the position of the backup pin that supports the back surface of the substrate on which the electronic component is mounted, and notify the operator.
According to the display on this display screen, the operator only has to insert the backup pin into the insertion hole indicated by the display, and it is possible to replace the backup pin while comparing the backside of the board on which the components are mounted and the support plate. It can be done quickly and work can be done quickly, thus improving work efficiency. In addition, since the position of the effective backup pin insertion hole is clearly indicated, a mistake in arranging the backup pin is eliminated, work in the subsequent stage that follows is not hindered, and work efficiency is improved as a whole.

[Brief description of drawings]

FIG. 1 is a configuration block diagram of a central control unit that controls an electronic component mounting apparatus including a backup pin positioning device according to an embodiment.

FIG. 2 is a front view of an electronic component mounting apparatus controlled by a central control unit.

FIG. 3 is a plan view of an electronic component mounting apparatus.

FIG. 4 is a flowchart illustrating the entire operation of the electronic component mounting apparatus of this embodiment.

FIG. 5 is a flowchart for explaining the surface mounting setup change processing in the flowchart of FIG. 4 in more detail.

6A is a diagram showing a contour image of a component coordinate-displayed on a display screen based on program data indicating an arrangement position, and FIG. 6B is based on backup pin insertion hole position data of a support plate. FIG. 6 is a diagram showing a contour image of a pin insertion hole coordinate-displayed on a display screen, and FIG. 7 (c) is a diagram for notifying display of a portion where the pin insertion hole overlaps a component position and a portion where the pin insertion hole does not overlap.

FIG. 7A is a plan view of a supporting device shown together with a partial plan view of the transfer rail, and FIG. 7B is a side view of the supporting device shown in a transfer direction together with a sectional view of the transfer rail.

8A and 8B are views for explaining the relative relationship between a substrate that has been loaded and stopped at the processing position, and a supporting device that supports the substrate.

[Explanation of symbols]

 1 CPU 1a, 11a Internal part of main body device base 2 Key input part 2a Keyboard 3 Storage part 4 Display part 4a Display device 5 Servo motor control part 6 Servo motor drive part 6a X axis servo motor 6b, 6e Coupling 6c X axis drive Feed screw 6d Y-axis drive servo motor 6f Y-axis drive feed screw 6f 'Y-axis driven feed screw 6g, 6g' Toothed pulley 7 i / o control unit 8 Pulse motor control unit 9 Pulse motor drive unit 10 Main unit 10a Device base Base 10b Safety cover 11 Board guide rail 11b Positioning pin 11c Reference pin 11d Belt drive motor 12, 12 'Fixed base 12a, 12a' Y-axis rail 13 Moving base 14 Working head 14a Nut member 14b Communication cable 14c Adsorption nozzle 14d Board recognition camera 15 Parts supply corner 16 Adsorption Le exchanger 18 substrate

Claims (1)

[Claims] 1. A backup pin positioning device for determining an arrangement position of a backup pin for supporting a board on which a component has been mounted on the back surface from below, wherein arrangement data of an electronic component mounted on the back surface of the board on the back surface of the board. And a pin position storage means for storing arrangement position data corresponding to the back surface of the board of the backup pin, and a back surface of the board of the backup pin stored by the pin position storage means. Two position data coordinates are calculated based on the corresponding arrangement position data and the arrangement position data on the back surface of the board of the mounted electronic component stored in the component position storage means, and the calculated coordinates are overlapped. Display means for displaying the arrangement position data of the backup pin corresponding to the back surface of the substrate which does not become Backup pin positioning device to.