JPH06252111A - Ceramic plate for grinding semiconductor wafer - Google Patents

Abstract

PURPOSE:To provide a ceramic plate for grinding semiconductor wafers which is not required to be abandoned nor exchanged even when bar codes become unreadable due to contamination or damage of a bar code printing surface. CONSTITUTION:Since a long rectangular recessed section 2 is provided on the surface of a plate main body 1 with an opening edge 2a which is inclined toward the center of the section 2 and a bar code carrying plate on which a bar codes plate 4 is coated with a coating body 3 made of a transparent resin having a corrosion and heat resistances is put in the section 2 in a removable state against the elasticity of projections 6 formed on the peripheral part of the coating body 3, the bar code carrying plate can be removed from the plate main body 1 after using the plate and no acid nor alkaline solution is left at the plate 5 mounting section after the plate 5 is removed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic plate (hereinafter referred to as an end plate) for adhering and supporting a wafer in a polishing process for a semiconductor wafer such as silicon.

[0002]

2. Description of the Related Art When polishing a semiconductor wafer, a plurality of semiconductor wafers are adhered to and supported by a disk-shaped plate, and pressed against a rotating lower surface plate having an abrasive cloth adhered thereto for polishing. A bar code for identification is attached to the plate. Conventionally, the attachment of the bar code is performed by inserting a disk-shaped bar code carrying plate such as transparent glass or sapphire printed with a bar code into a circular shallow recess provided in the center of the plate, and attaching it to a frit glass. It is made by welding powder to the plate.

In the polishing process of a semiconductor wafer, it is exposed to a strong alkaline polishing liquid for a long time, and in the cleaning process, it is exposed to a highly corrosive acid such as dilute hydrofluoric acid. The part is eroded, dust and the like are accumulated in the part, and acid, alkaline solution, etc. remain. Furthermore, there is a possibility that acid, alkali, etc. may enter the recessed portion into which the barcode carrying plate is fitted from the eroded portion, and stain the barcode printed surface.

In the above-mentioned conventional plate, when the bar code carrying plate is damaged or dirty and the bar code reading becomes difficult, the bar code carrying plate cannot be replaced. It was uneconomical to exchange for something. Also, when welding the bar code carrying plate with the frit glass powder, the temperature is about 600 ° C.
However, the plate is vulnerable to thermal shock and may be damaged if heated rapidly to 600 ° C. In order to avoid this, the temperature may be raised gently, but if the temperature is raised gently, it takes a long time for welding, which causes an increase in cost.

[0005]

SUMMARY OF THE INVENTION The present invention has been made based on the above-mentioned circumstances, and the member carrying the bar code can be replaced, or the member can be easily attached to the plate in a short time. Provide a plate that can be performed.

[0006]

In the ceramic plate for wafer polishing of the present invention, (1) a shallow concave portion is formed on the surface of the plate body, and the concave portion has a transparent transparent acid-resistant and alkali-resistant bar code plate. A bar code carrying plate coated with a cover made of a material is inserted and supported, or (2) a bar code is provided on a plate made of an acid resistant and alkali resistant material such as transparent glass or sapphire. The bar code-carrying plate obtained by printing is fixed to a shallow recess provided in the plate body by adhesion with an acid-resistant, alkali-resistant, room-temperature curing adhesive such as polyimide.

[0007]

In the ceramic plate for wafer polishing according to (1) of the present invention having the above-mentioned structure, since the bar code carrying plate is detachable, it can be detached from the plate body after the plate is used. No acid, alkali, etc. will remain on the plate mounting part.
In the ceramic plate for wafer polishing of the above (2), since the barcode carrying plate is adhered and fixed to the plate body with an acid-resistant, alkali-resistant, and room-temperature-curable adhesive such as polyimide, acid, alkali There is no erosion of the adhesive part due to the like, and thus the bar code printed part is not soiled. In addition, (1),
In any of the wafer polishing ceramic plates described in (2), since the bar code carrier plate is not exposed to a high temperature when mounted, there is no problem due to thermal shock.

[0008]

1 is a cross-sectional view of the essential parts of an embodiment of the present invention, FIG.
[FIG. 3] is a plan view of a bar code carrying plate in the above embodiment. In FIG. 1, a rectangular recess 2 is provided in the center of the plate body 1. The opening edge 2a of the recess 2 is inclined 2 to 3 ° toward the inside of the recess 2. Also,
The depth of the recess 2 is about 5 mm. Further, a bar code carrying plate 5 formed by covering a bar code plate 4 on which a bar code is printed with a cover 3 made of a transparent material having high heat resistance and corrosion resistance such as polypropylene and Teflon is fitted into the recess 2. It is supported. The cover 3 has substantially the same shape and size as the opening of the recess 2 on the surface of the plate body 1, and a plurality of protrusions 6 are formed on the edge thereof.

The bar code carrying plate 5 is pushed into the recess 2 against the elasticity of the projection 6 by bringing the projection 6 into contact with the opening edge 2a of the recess 2. As a result, the bar code carrying plate 5 has the elasticity of the protrusion 6 and the recess 2 of the opening edge 2a.
Is supported in the recess 2 by the inclination toward the inside.

In the plate of the present invention having the above structure,
The bar code carrying plate 5 can be easily attached to the plate body 1 by pushing it into the concave portion 2 against the elasticity of the protrusions 6 on the periphery thereof, and can be easily removed by lifting it against the elasticity. . Therefore, the barcode carrying plate can be replaced, and when it becomes difficult to read the barcode due to damage or stain, it is only necessary to replace the barcode carrying plate, and the entire plate is discarded or replaced. No need.

Further, since the bar code carrying plate is covered with the cover made of a material having high heat resistance and corrosion resistance, it is not damaged by alkali, acid, heat or the like.
Further, since the barcode carrying plate can be easily attached and detached, if it is removed after use, there is no possibility that alkali, acid, etc. will remain on the attachment portion of the barcode carrying plate.

FIG. 3 in which the same parts as those in FIGS. 1 and 2 are designated by the same reference numerals is a sectional view of another embodiment of the present invention, and FIG. 4 is a perspective view thereof. In these drawings, a circular shallow recess 7 is concentrically provided in the center of the plate body 1, and the recess 7 is a disc-shaped bar code made of transparent glass, sapphire, etc. The carrier plate 8 is fitted with the bar code printing surface facing down. The gap between the circular concave portion 7 and the barcode carrying plate 8 is set to about 10 μm, and an acid- and alkali-resistant adhesive 9 that is room temperature curable, such as polyimide resin, is filled in the gap to form a barcode. The carrier plate 8 is fixed to the recess 7.

In the embodiment having the above-mentioned structure, since the bar code carrying plate is adhesively fixed by the resin which is hardened at room temperature, it is not necessary to heat the bar code carrying plate to attach it to the plate, which causes a problem due to thermal shock. Since this is not the case, the above-mentioned attachment can be performed easily and in a short time, and the cost of the plate can be reduced and the yield can be improved. Further, since the polyimide resin is rich in acid resistance and alkali resistance, the bonded portion is not corroded. Therefore, the bar code cannot be read due to the erosion of the bar coat printing surface due to the invasion of acid or alkali from the eroded portion.

The present invention is not limited to the above embodiment. For example, in the embodiment shown in FIG. 1, instead of the rectangular recess 2 having the overhanging opening edge 2a on the plate body 1, an opening edge 2b perpendicular to the plate surface of the plate body 1 is provided as shown in FIG. 5 (a). The recessed portion 2 has the shape shown in FIG.
As shown in FIG. 3, instead of the protrusion 6, a curved spring 6 ′ having a large deflection may be provided on the periphery of the cover 3.
Further, in each of the above-described embodiments, the barcode carrying plate may have any suitable shape other than the illustrated shape.

[0015]

As is apparent from the above, in the semiconductor wafer polishing ceramic plate of the present invention, the bar code carrying plate has a coating body made of a transparent material such as polypropylene or Teflon having high heat resistance and corrosion resistance. It is detachably attached to the plate or is fixed to the plate with an acid- and alkali-resistant, room temperature-curable adhesive such as polyimide resin.
Since the barcode-carrying plate which is detachably mounted can be detached from the plate after the use of the plate, acid, alkali, etc. do not remain in the barcode-carrying plate mounting portion. Further, when the adhesive is fixed to the concave portion of the plate with an adhesive such as polyimide having high acid resistance and alkali resistance, the bonded portion is not corroded by acid, alkali, etc., and is not eroded by the corroded portion. There is no risk of erosion or stain on the bar code printed surface.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part of an embodiment of the present invention.

FIG. 2 is a plan view of a barcode carrying plate in the embodiment.

FIG. 3 is a sectional view of another embodiment of the present invention.

FIG. 4 is a perspective view thereof.

5A is a cross-sectional view of a main part of a modified example of the embodiment shown in FIG. 1, and FIG. 5B is a plan view of a barcode carrying plate in the modified example.

[Explanation of symbols]

 1 ... Plate main body 2, 7 ... Recess 2a ... Opening edge 3 ...... Cover 4 ... Bar code plate 5, 8 ... Bar code carrying plate 6 ... Projection 9 ... Adhesive

Claims (4)

[Claims] 1. A bar code carrying plate formed by forming a shallow recess on the surface of a plate body, and covering the bar code plate with a cover made of a transparent material having acid resistance, alkali resistance and elasticity. A ceramic plate for polishing a semiconductor wafer, which is supported. 2. The semiconductor wafer polishing according to claim 1, wherein an opening edge of the recess is inclined inward, and a plurality of protrusions which are substantially perpendicular to the peripheral edge are provided on the peripheral edge of the cover. Ceramic plate. 3. The semiconductor wafer polishing according to claim 1, wherein the opening edge of the recess is perpendicular to the plate body plate surface, and a plurality of curved springs having a large amount of bending are provided on the peripheral edge of the cover. Ceramic plate. 4. Acid resistance such as transparent glass or sapphire,
A barcode-carrying plate made by printing a barcode on a plate made of an alkali-resistant material is fixed to the shallow recesses provided in the plate body with an acid- and alkali-resistant adhesive that cures at room temperature, such as polyimide. A ceramic plate for polishing semiconductor wafers.