JPH06120319A - Semiconductor manufacture device - Google Patents

Abstract

PURPOSE:To elevate the maintenance property without flawing the surface of a product. CONSTITUTION:This is a semiconductor manufacture device which includes, within a carry system, two stripes of walking beams arranged in parallel, and each walking beam is composed of a mother material 4 processed of stainless material and a beam member 5 consisting of alumina, ceramics, plastic, or the like attached freely to the surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a peripheral technique for handling semiconductor wafers, and more particularly to a technique effective when applied to an apparatus employing a walking beam used for transporting a semiconductor wafer or a wafer chuck used for holding a semiconductor wafer. It is a thing.

[0002]

2. Description of the Related Art A walking beam is used as a jig for transporting a semiconductor wafer in a semiconductor device manufacturing apparatus, particularly in a manufacturing apparatus for performing integrated processing (thin film forming apparatus, etching apparatus, etc.).

FIG. 6 is a perspective view showing a conventional walking beam.

The conventional walking beam 1 has two parallel belt-shaped convex portions, and a groove is formed in the central portion thereof. The semiconductor wafer 2 is transported in a state of being placed in surface contact on a strip-shaped convex portion as shown in FIG. 7, and finally carried into an SOG (spin-on-glass) coating bake device or the like.

[0005]

According to the study by the present inventors, a conventional carrying technique for carrying a semiconductor wafer on a walking beam having a flat surface and arranged in parallel in a rail shape is a walking beam made of stainless steel. Is easily deformed by heat, the surface of the semiconductor wafer is rubbed during transportation,
As shown in FIG. 8, in addition to scratches 3 and the like on the surface of the semiconductor wafer 2, the semiconductor wafer 2 rubs against a stainless steel material for a satin finish, causing heavy metal contamination.

Further, since the walking beam, the chuck, the pin portion, and the like are integrated with the main body, there is the inconvenience that all must be removed during maintenance, and there is also the problem that reassembly takes time.

The above problems similarly occur in the spin chuck that holds the semiconductor wafer.

Although it has been considered to solve the problems such as metal contamination by using a walking beam as a plastic or ceramic material, the mechanical strength (including plastic deformation with time) is low or the cost is high. New problems also arise.

Therefore, an object of the present invention is to provide a technique capable of improving the maintainability without scratching the surface of the product.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, in a semiconductor manufacturing apparatus provided with a walking beam composed of two convex portions arranged in parallel, each of the convex portions includes a base material having mechanical strength,
A beam member detachably attached to the surface of the base material is used.

[0013]

According to the above-mentioned means, the portion in contact with the semiconductor wafer has a structure in which it is in point-contact with each other, and this portion can be exchanged. As a result, the replaceable portion (beam member) can be removed from the base material portion during cleaning or wear, and the workability can be improved and the cost can be reduced.

[0014]

[Embodiment 1] FIG. 1 shows a first semiconductor manufacturing apparatus according to the present invention.
It is a perspective view showing an example.

The walking beam according to the present invention is shown in FIG.
As shown in FIG. 2, two prism-shaped base materials 4 made of a material having excellent mechanical strength and corrosion resistance (for example, stainless steel) are arranged in parallel, and a beam member 5 is screwed on each base material 4. The beam member 5 is fixed by a stopper or the like, and a large number of pin-shaped projections 6 are provided on the surface of the beam member 5 as shown in FIG. 2 so that the contact area with the semiconductor wafer 2 can be reduced.

The beam member 5 is cleaned with hydrofluoric acid (for example, S
(Adopted by OG coating device) and cheaper material such as plastic, alumina, ceramic, S
IC (ceramic material composed of silicon and carbon) or the like is used.

Since this beam member 5 is attached to the base material 4 having sufficient mechanical strength, no mechanical strength is required.

All the protrusions 6 have the same height (for example,
It is desirable that the distance is about 1 mm) and the semiconductor wafer is provided at intervals so that it is supported by at least three points. The projection 6 can be formed integrally with the beam member 5 as shown in FIG.

With the above structure, the projection 6 contacts the semiconductor wafer 2 in a point contact manner, and the contact area between the walking beam side and the semiconductor wafer 2 is drastically reduced. Reduce. As a result, the product yield is improved.

When the projection 6 is worn out and the walking beam needs to be replaced, the beam member 5 is removed from the base material 4 and a new beam member 5 is attached to complete the work. Therefore, it is not necessary to disassemble the whole as in the conventional case, so that the working time becomes extremely short and the preparation time can be shortened. Further, since the beam member 5 can be removed, cleaning can be easily performed.

[0021]

Second Embodiment FIG. 3 shows a second semiconductor manufacturing apparatus according to the present invention.
It is a perspective view showing an example.

In this embodiment, as shown in FIG. 3, the surface of the walking beam 1 is a pin 7 having the same function as the protrusion 6.
It is characterized by the configuration in which is planted by a separate member. here,
Although the pin 7 is provided on the walking beam 1 shown in FIG. 6, the pin 7 may be used instead of the protrusion 6 of FIG. The pin 7 can be made of various materials such as metal and non-metal depending on the purpose.

According to this embodiment, the effect of reducing flaws is equivalent to that of the above-mentioned embodiment, but the maintainability and the cleaning performance are inferior when the pin 7 is directly provided on the walking beam 1. However, on the beam member 5, the pin 7
When the protrusions 6 are provided instead of the protrusions 6, it is possible to obtain the same effects on the maintainability and the washability.

[0024]

Third Embodiment FIG. 4 shows a third semiconductor manufacturing apparatus according to the present invention.
It is sectional drawing which shows an Example.

The present embodiment is intended for a spin chuck for placing and rotating a semiconductor wafer. The spin chuck main body 8 is made wearable by exchanging the suction portion 9 in contact with the semiconductor wafer 2. In addition to coping with the replacement at the time, a protrusion 10 is provided on the surface of the suction portion 9 similarly to the beam member 5 so that the semiconductor wafer and the spin chuck are in point contact with each other.

In this case, the height of the protrusion 10 is 0.7, for example.
The height is set to about 2 mm so that all the protrusions 10 have the same height. The central portion of the spin chuck body 8 is hollow, and this hollow portion communicates with a vacuum pump (not shown) so that the semiconductor wafer mounted on the spin chuck can be held and fixed by vacuum suction.

The material of the adsorption part 9 is, for example, fluororesin,
Plastic or the like is used, and the protrusion 10 can be formed by integral processing. Then, the suction portion 9 is fixed to the spin chuck body portion 8 by screwing or the like.
It may be one sheet, or may be divided into three as shown in FIG. 5 (here, it is divided into three, but it may be divided into two or more than three).

According to the configuration of the third embodiment, the semiconductor wafer 2
When it is necessary to wear or wash the part in contact with the suction part 9, only the suction part 9 can be removed or replaced, and the device preparation time can be shortened and the cost can be reduced.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in FIG. 2, the projection 6 is needle-shaped (dotted), but the present invention is not limited to this. For example, a circle having a relatively large diameter, a line, an ellipse,
It is possible to make it into an X shape.

[0031]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

That is, a semiconductor manufacturing apparatus provided with a walking beam composed of two protrusions arranged in parallel, each of the protrusions being a base material having mechanical strength,
Since the beam member detachably attached to the surface of the base material is provided, the cost can be reduced while improving the workability.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a semiconductor manufacturing apparatus according to the present invention.

2 is a cross-sectional view of the embodiment of FIG.

FIG. 3 is a perspective view showing a second embodiment of the semiconductor manufacturing apparatus according to the present invention.

FIG. 4 is a sectional view showing a third embodiment of the semiconductor manufacturing apparatus according to the present invention.

5 is a front view showing a modification of the embodiment of FIG.

FIG. 6 is a perspective view showing a conventional walking beam.

FIG. 7 is a cross-sectional view showing how the semiconductor wafer is transported by the walking beam shown in FIG.

FIG. 8 is a bottom view of a semiconductor wafer showing generation of flaws in a conventional walking beam.

[Explanation of symbols]

 1 Walking Beam 2 Semiconductor Wafer 3 Defect 4 Base Material 5 Beam Member 6 Protrusion 7 Pin 8 Spin Chuck Main Body 9 Adsorption Part 10 Protrusion

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Yusuke Yamazaki Inventor Yusuke Yamazaki 3-3, Fujibashi, Ome City, Tokyo 2 Inside Hitachi Tokyo Electronics Co., Ltd.

Claims (5)

[Claims] 1. A semiconductor manufacturing apparatus having a walking beam composed of two protrusions arranged in parallel, wherein each of the protrusions has a base material having mechanical strength, and the base material. And a beam member detachably attached to the surface of the semiconductor manufacturing apparatus. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the material of the beam member is alumina or ceramic. 3. The semiconductor manufacturing apparatus according to claim 1, wherein a projection-shaped body for mounting the semiconductor wafer in a point contact state is provided on the surface of the semiconductor wafer to be transported. 4. A semiconductor manufacturing apparatus comprising a wafer chuck for vacuum-sucking a semiconductor wafer, the main body being connected to a rotation drive unit, the main body being detachably attached to the main body, and the wafer being pointed to the wafer. A semiconductor manufacturing apparatus comprising: a suction unit that is in contact with each other. 5. The semiconductor manufacturing apparatus according to claim 4, wherein the suction portion is made of plastic or fluororesin.