JPH0624919Y2 - 外部メモリのローディング装置 - Google Patents
外部メモリのローディング装置Info
- Publication number
- JPH0624919Y2 JPH0624919Y2 JP9751288U JP9751288U JPH0624919Y2 JP H0624919 Y2 JPH0624919 Y2 JP H0624919Y2 JP 9751288 U JP9751288 U JP 9751288U JP 9751288 U JP9751288 U JP 9751288U JP H0624919 Y2 JPH0624919 Y2 JP H0624919Y2
- Authority
- JP
- Japan
- Prior art keywords
- tray
- cover
- external memory
- spring
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000015654 memory Effects 0.000 title claims description 81
- 230000007935 neutral effect Effects 0.000 claims description 19
- 230000005611 electricity Effects 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 230000010365 information processing Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9751288U JPH0624919Y2 (ja) | 1988-07-23 | 1988-07-23 | 外部メモリのローディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9751288U JPH0624919Y2 (ja) | 1988-07-23 | 1988-07-23 | 外部メモリのローディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0218171U JPH0218171U (en, 2012) | 1990-02-06 |
| JPH0624919Y2 true JPH0624919Y2 (ja) | 1994-06-29 |
Family
ID=31323033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9751288U Expired - Lifetime JPH0624919Y2 (ja) | 1988-07-23 | 1988-07-23 | 外部メモリのローディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0624919Y2 (en, 2012) |
-
1988
- 1988-07-23 JP JP9751288U patent/JPH0624919Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0218171U (en, 2012) | 1990-02-06 |
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