JPH06246669A - Workpiece transfer feeder for semiconductor device - Google Patents

Abstract

PURPOSE:To hold a workpiece without giving unreasonable force by providing a constitution such that a sucker jig for sucking the workpiece is stored in a guide frame provided with a magnet in the inside, so as to transfer feed the workpiece, held by the guide frame, sucked by the sucker jig. CONSTITUTION:When a workpiece 10 for a semiconductor device mounted on a jig is conveyed to a lower part of a guide frame 1 by a conveyer, the guide frame 1 is lowered down by a robot arm, and by magnetic force of a permanent magnet 11 mounted on the guide frame 1, external leads 12 are pulled near and held in the guide frame 1. The workpiece 10 highly accurately positioned because the guide frame 1 is formed highly accurately corresponding to a pellet bonding part. Next, a sucker jig 2 is brought into contact with an upper surface of the workpiece 10, and by exhausting the jig from a vacuum suction hole 14, the workpiece 10 is held to the sucker jig 2. In this condition, the robot arm is driven, and the workpiece 10 is conveyed to a prescribed position in the next process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus, and more particularly, an iron lead is connected to a ceramic base by glass, and a pellet mounted on the ceramic base and an external lead are connected by wire bonding. The present invention relates to a technique effectively applied to a transfer device that transfers a work to a next sealing process or the like by a jig.

[0002]

2. Description of the Related Art In the process of manufacturing a semiconductor device, there are a method of sealing by molding with a plastic resin and a method of sealing a cap and a base of a ceramic package with an adhesive. Among them, in the case of using a ceramic package, the cap and the base package are adhered and sealed with an adhesive such as Au-Sn or glass. At present, glass is often used as an inexpensive sealing method. For the glass-sealed type, each lead frame is attached to the ceramic base with glass, wire bonding is performed between the semiconductor chip attached to the ceramic base and the lead, and the ceramic base and cap are hermetically sealed with glass. To do.

The final sealing in such a process is
Lead frame mounting and pellet bonding,
A semiconductor device work made of wire-bonded ceramic base is transferred to a sealing furnace and a cap is attached, but positioning is an important issue for this transfer, and in general, positioning is performed manually. It is generally mounted on a device.

"VLSI technology", pages 610 to 61, showing a semiconductor manufacturing process by glass sealing.
Page 5, June 1, 1985, S. M. Translated by Sea, edited by Yoshiyuki Takeishi and 2 others.

[0005]

However, in the above-mentioned means, since the work for the semiconductor device is manually transferred, the lead frame may be directly grasped by the tweezers. In such a case, there was a problem that stress was applied to a certain lead frame portion, cracks were generated in the glass portion to which the lead frame was attached, and tweezers contacted the wire to cause wire touch failure. . There is also a problem that the positioning accuracy varies depending on the operator.

An object of the present invention is to solve the above-mentioned problems and to provide a carrier device in which glass cracks and wire touches do not occur.

[0007]

The typical ones of the inventions disclosed in the present application will be described below.

That is, in the semiconductor device work transfer device, the work held by the guide frame is composed of a guide frame having a magnet inside and a suction jig for sucking the work stored in the frame. It is a work transfer device for a semiconductor device that is sucked by a suction jig and is transferred to a desired position.

[0009]

According to the above-mentioned means, it becomes possible to suspend and hold the work housed in the frame by the magnetic force, and the pressure is not applied to a certain lead frame, and the glass crack is not generated. Further, the guide frame enables positioning of the work to be sucked by the suction jig, and the positioning accuracy of the work to be transferred is significantly improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of an essential part showing a semiconductor device work according to an embodiment of the present invention, and FIGS. 2 to 4 are suction jigs for transferring a semiconductor device work according to an embodiment of the present invention. FIG. 5 is a cross-sectional side view of a main part for explaining suction and discharge to and from, and FIG. 5 is a schematic diagram for explaining a suction state of a work held by a guide frame.

The present embodiment will be described below.

The target semiconductor device work in this embodiment is a ceramic base on which a lead frame already formed in a desired shape, for example, a J-bend type, is attached, pellet-bonded, and wire-bonded. Is.

As shown in FIG. 1, the main part of this embodiment comprises a guide frame 1 and a suction jig 2 for holding the semiconductor device work 10 by vacuum suction arranged in the guide frame 1. . The guide frame 1 is attached to a holding plate 5 attached to a robot arm (not shown) via a holding portion 3 and a slide mechanism 6. Also, the suction jig 2
The exhaust pipe 7 is attached to the upper surface thereof. Further, the robot arm (not shown) is moved to hold the semiconductor device work 10 held in the holding hole 9 formed in the work jig 8 by vacuum suction.

The vacuum suction jig 2 has a vacuum cavity and is in contact with the periphery of the work so as not to come into contact with the wire bonded on the upper surface of the semiconductor device work 10.

As described above, although not shown, the holding plate 5 is attached to an arm of a robot or the like, is movable, and is transferred to, for example, a sealing furnace for attaching a ceramic cap to a ceramic base. .

Next, the operation of the transfer device will be described with reference to FIGS.

First, the semiconductor device work 10 placed on the jig 8 is transported to the lower portion of the guide frame 1 by a transport device (not shown). Thereafter, the guide frame 1 is lowered by the operation of a robot arm (not shown), and the external lead 12 is attracted by the magnetic force of the permanent magnet 11 mounted in the guide frame 1 and held in the guide frame 1. At this time, since the guide frame 1 is formed with a margin with respect to the work 10 including the external leads 12 of the semiconductor device work 10, no undue stress is applied to the leads 12 in the guide frame. It will be held.

Next, the suction jig 2 is pressed into contact with the upper surface of the work 10 held by magnetic force, and then the suction jig 2 is exhausted from the vacuum suction hole 14 formed inside through the exhaust pipe 7. Held in.
At this time, since the guide frame 1 is accurately formed at the position of the pellet bonding portion to be attached, the semiconductor device work 10 is accurately positioned.

Next, the workpiece 1 for semiconductor device is attached to the suction jig 2.
While 0 is held, a robot arm (not shown) moves to transfer the semiconductor device work 10 to a desired position in the sealing furnace in the sealing step which is the next step.

After that, the suction jig 2 is the work 1 for semiconductor device.
After adsorbing 0 and descending and placing it at a desired position, the vacuum evacuation is stopped and the work 10 is separated from the transfer device.

Next, a cap is attached in a sealing furnace,
A semiconductor device is obtained through general steps.

Although the present invention has been described above with respect to the background technology of the present application, the present application is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. There is no end.

That is, although the QFJ-G work for a semiconductor device has been described in this embodiment, other work may be used, and a permanent magnet is used as the magnet provided in the guide frame, but an electromagnet is used. Anything is fine.

[0024]

The effects of the typical ones of the inventions disclosed in the present application will be described as follows.

That is, since the guide frame holds the external lead without applying unreasonable force, unnecessary stress is not applied to the external lead, so that the glass to which the external lead is connected is not cracked. Further, since the semiconductor device work held by the guide frame can be positioned, the work efficiency in the next process is improved.

[Brief description of drawings]

FIG. 1 is a schematic perspective view for explaining transfer of a semiconductor device work that is an embodiment of the present invention.

FIG. 2 is a cross-sectional side view of essential parts for explaining suction and discharge of a work for a semiconductor device to a suction jig, which is an embodiment of the present invention.

FIG. 3 is a cross-sectional side view of essential parts for explaining suction and discharge of a work for a semiconductor device to a suction jig that is an embodiment of the present invention.

FIG. 4 is a cross-sectional side view of essential parts for explaining suction and discharge of a work for a semiconductor device to a suction jig that is an embodiment of the present invention.

FIG. 5 is a schematic diagram for explaining a suction state of a work held by a guide frame.

[Explanation of symbols]

1. ． Guide frame, 2. ． Adsorption jig, 3. ． Slide plate,
4. ． Support portion, 5. ． Holding plate, 6. ． Holding part, 7. ． Exhaust pipe, 8. ． Jig, 9. ． Holding hole, 10. ． Work for semiconductor device, 11. ． Magnet, 12. ． External lead, 1
3. ． Wire, 14. ． Vacuum exhaust hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromi Kosaka 15 Asahidai, Moroyama-cho, Iruma-gun, Saitama Prefecture Inside Higashi Tobu Semiconductor Co., Ltd.

Claims (1)

[Claims] 1. A transfer device for a semiconductor device work, comprising:
A guide frame having a magnet inside and a suction jig for sucking the work housed in the frame are provided. The work held by the guide frame is sucked by the suction jig and transferred to a desired position. Characteristic semiconductor device work transfer device.