JPH06228751A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To solve the deterioration in quality due to the peeling and falling of the vapor deposited material which is stuck and deposited on other than the base plate in the winding type vacuum deposition device and to provide the vacuum deposition device having the quality stability excellent in a lengthwide direction. CONSTITUTION:The mechanism carrying a high polymer molded material base plate 1, the mask 7 intercepting the part of vapor stream moving towards the base plate 1 from an evaporating source, the anti-sticking plate 8 preventing the sticking of an evaporating material to the mask 7 and the mechanism carrying the anti-sticking plate 8 are provided in a vacuum tank, the anti-sticking plate 8 is disposed at the position where the evaporating material does not stick to the mask 7, and by being coiled in an appropriate speed to a takeup shaft so that the evaporating material stuck and deposited on the plate becomes more than a peeling and falling level, the vacuum deposition device which does not cause the deterioration in the quality due to the peeling and falling of the evaporating material which is stuck and deposited on other part than the base plate is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum vapor deposition apparatus for continuously forming a thin film on a polymer substrate.

[0002]

2. Description of the Related Art In recent years, the application range of thin films has been expanding due to the demand of the times such as resource saving and miniaturization.

In oblique vapor deposition or the like, which is often used for imparting optical and magnetic anisotropy, only a part of the vaporized material can be deposited on the substrate, and it is used as a mask for blocking vapor flow. A large amount of the evaporated material is deposited and deposited, and the material deposited on the mask is peeled off, dropped, or the like to make the quality unstable, and attempts have been made to improve the quality. For example, Japanese Patent Publication No. 2-3235
No. 0 publication.

A conventional vapor deposition apparatus will be described below.
FIG. 3 shows the structure of a conventional vacuum vapor deposition apparatus. In FIG. 3, 1 is a polymer substrate, 2 is a heat-resistant container, 3 is an evaporation material, 4 is a rotary support, 5 is an electron beam, 6 is a vapor flow,
7 is a mask, 11 is an anti-collection plate for recovery, 12 is a chain, 1
3 and 14 are sprockets.

The operation of the vacuum vapor deposition apparatus configured as described above will be described below. First, the vaporized material 3 is heated by the accelerated electron beam 5 to generate the vapor flow 6. This vapor is partially adhered to the moving substrate 1 which is blocked by the mask 7 which limits the incident angle to the substrate 1 which is often used in the manufacture of magnetic tape. In addition, the other part of the vapor adheres to and is deposited on the collection-prevention plate 11. The plate-shaped evaporation material attached and deposited on the collection-prevention plate 11 is dropped and collected by moving the collection-prevention plate 11 by the chain 12 as necessary.

[0006]

However, in the above-mentioned conventional structure, the adhesion state of the plate-like evaporation material adhered and deposited on the collection deposition preventive plate 11 is not completely uniform, and the thickness is not completely uniform. In addition, even if stress or impact force was applied at the time of recovery, it was not completely peeled off and a part of the surface remained. In the collection-prevention plate 11 where a part of the evaporation material remains, the adhesion state and the uniformity of the thickness become more incomplete, and by repeating the collection operation, the evaporation source is easily separated from the easily separated part. When the portion is not in the collecting operation, the deposited evaporation material is peeled off and falls into the heat-resistant container 2, and the evaporation material 3 scatters and adheres to the substrate 1 in large particles. For example, in a recording medium such as a vapor-deposited magnetic tape. There was a problem that dropouts, which are missing signals, increased abnormally. Frequently repeating the collection operation to prevent the evaporation material 3 from scattering causes an increase in the amount of the evaporation material that adheres to and deposits on the mask 7, and like the vapor deposition apparatus without the collection deposition preventive plate 11, the mask is used. There is a problem that the evaporation material adhered and deposited on 7 peels off and hangs down, the incident angle of the vapor flow 6 on the substrate 1 changes, and the evaporation material adhered and deposited falls off and the above-mentioned dropout abnormally increases.

[0007] The present invention solves the problems of the conventional steam, and an object of the present invention is to provide a long-winding vacuum deposition apparatus having stable quality in the longitudinal direction.

[0008]

In order to achieve this object, a vacuum vapor deposition apparatus of the present invention comprises a mechanism for transporting a polymer molded product substrate in a vacuum chamber, a vapor flow from an evaporation source toward the substrate. It has a structure that includes a mask that blocks a portion, an adhesion-preventing plate that prevents the evaporation substance from adhering to the mask, and a mechanism that conveys the adhesion-preventing plate.

[0009]

With this configuration, by winding the deposition-inhibitory plate, new surfaces of the deposition-inhibitory plate appear one after another, and the state of attachment of the evaporation material to the deposition-inhibition plate can be made constant, and the deposition-inhibition plate is wound. By controlling the take-up speed, the thickness of the evaporation material can be suppressed to the extent that the evaporation material does not peel off from the deposition preventive plate, and the evaporation material can be prevented from peeling off.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows the structure of the vacuum vapor deposition apparatus of the present invention. In FIG. 1, 1 is a polymer substrate, 2 is a heat-resistant container, 3 is an evaporation material, 4 is a rotary support, 5 is an electron beam, 6 is a vapor flow, 7 is a mask, 8 is a deposition plate, and 9 is deposition. A plate supply shaft 10 is a deposition-protection plate winding shaft.

The operation of the vacuum vapor deposition apparatus constructed as above will be described. First, the vaporized material 3 is heated by the accelerated electron beam 5 to generate the vapor flow 6. This vapor is partially blocked by the mask 7 that limits the incident angle to the substrate 1 which is often used in the manufacture of magnetic tape, and partially adheres to the substrate 1 moving along the rotary support 4.
Further, the other part of the vapor adheres to and deposits on the deposition preventive plate 8. The deposition preventive plate 8 is wound around the supply shaft 9 and arranged at a position where the vaporized material does not adhere to the mask 7, and is wound around the take-up shaft at an appropriate speed so that the vaporized material deposited and deposited does not exceed the amount of peeling off. Taken.

The vacuum vapor deposition apparatus according to this embodiment was compared with the conventional vacuum vapor deposition apparatus by making a trial vapor deposition magnetic tape suitable for high density recording. In this embodiment, a stainless steel plate having a thickness of 0.15 mm is used as the adhesion-preventing plate and has a thickness of 0.05 m /
Moved at the speed of a minute. In the comparative example, the collecting operation is performed every 10 minutes, and the thickness is 7 μm and the length is 10 along the rotary support.
10 000m polyethylene terephthalate film
It is moved at a speed of 0 m / min, and a thickness of 0.2 μm made of Co80% -Ni20% on the substrate at an incident angle of 60 degrees or more.
The trial production of forming the magnetic layer of was performed five times consecutively. For the evaluation, after tape-forming the sample, the dropout of the entire length was examined using an 8 mm VTR, and both were compared. The dropout was measured when the output dropped by 16 dB and the time was 15 μS or more. FIG. 4 shows the result of examining the dropout.
The dropout shows the total number per 100 m of tape.

As is apparent from FIG. 4, the vapor deposition apparatus according to this embodiment has an excellent effect in terms of longitudinal stability of quality. Further, the used deposition preventive plate was peeled off most of the evaporation material by applying an appropriate stress, and could be reused as an evaporation material again, which was effective in terms of resource saving.

As described above, according to the present embodiment, by providing the plate for preventing the evaporation material from adhering to the transportable mask, it is possible to provide a roll-up type vacuum vapor deposition apparatus with stable quality in the longitudinal direction. it can.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a configuration diagram of a vacuum vapor deposition apparatus showing a second embodiment of the present invention. In FIG. 2, FIG.
The difference from the configuration is that the mask 7 is not provided.

The operation of the vacuum vapor deposition apparatus configured as described above will be described below. First, the vaporized material 3 is heated by the accelerated electron beam 5 to generate a vapor flow 6 and adhere to the substrate 1. It is necessary to limit the incident angle of the vapor flow 6 to the substrate 1, and the incident angle is limited by disposing the deposition preventing plate 8 at an appropriate position.

As described above, the vacuum vapor deposition apparatus can be simplified by using both the mask for limiting the incident angle and the deposition preventive plate.

Although the anti-adhesion plate is a stainless steel plate in the first embodiment, it is selected from the viewpoints of adhesiveness to the evaporation material and heat resistance. Further, by using the same material as the vapor deposition material 3 for the deposition-preventing plate 8, it is possible to directly use the evaporation material deposited on the deposition-preventing plate 8 as a next evaporation material without performing a recovery operation, and to effectively use resources. Be peeled off. Further, if the deposition-preventing plate 8 and the evaporation material 3 are made of the same material and the deposition-preventing plate 8 is not wound around the winding shaft 10 and is sequentially sent to the collection zone of the heat-resistant container having the collection zone as shown in FIG. It can also serve as the supply of evaporation material.

[0020]

INDUSTRIAL APPLICABILITY As described above, according to the present invention, a mechanism for conveying a molded polymer substrate in a vacuum chamber, a mask for blocking a part of the vapor flow from the evaporation source toward the substrate, and a substance for evaporation to the mask. By providing a deposition-preventing plate that prevents adhesion and a mechanism that conveys the deposition-preventing plate, the quality in the longitudinal direction is stable without the deterioration of quality due to peeling and dropping of the evaporated material that has adhered and deposited on other than the substrate,
In addition, it is possible to realize an excellent vacuum vapor deposition apparatus in which the evaporation material deposited and deposited on a portion other than the substrate can be easily collected and resources can be effectively used.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a vacuum vapor deposition device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a vacuum vapor deposition device according to a second embodiment of the present invention.

FIG. 3 is a block diagram of a conventional vacuum vapor deposition device.

FIG. 4 is a graph of measurement results of dropouts of the present invention and a comparative example.

[Explanation of symbols]

 1 Polymer Substrate 2 Heat-Resistant Container 3 Evaporation Material 4 Rotating Support 5 Electron Beam 6 Vapor Flow 7 Mask 8 Adhesion Plate 9 Adhesion Plate Supply Shaft 10 Adhesion Plate Wind-up Shaft 11 Recovery Attachment Plate 12 Chain 13 , 14 sprockets

Claims (2)

[Claims] 1. A vacuum chamber is provided with a mechanism for transporting a polymer molded product substrate, a deposition preventive plate for blocking a part of a vapor flow from an evaporation source toward the substrate, and a mechanism for transporting the deposition preventive plate. Characteristic vacuum vapor deposition equipment. 2. The vacuum vapor deposition apparatus according to claim 1, further comprising a mask for limiting an incident angle of a vapor flow from the evaporation source toward the substrate.