JP2000054132A - Cvd device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vapor deposition device capable of continuous forming film for a long time, improving the productivity and capable of uniformizing the distribution of the film thickness. SOLUTION: A deposition preventing tape 15 covering the exposed part of a cooling roll 12 and both end edges of a base material tape 11 running along the circumferential face of the cooling roll 12 is run together with the substrate tape 11. The deposition preventing tape 15 is composed of a composite material composed of a metal previously formed on the base material tape 11 and a high polymer film, and the roughness of the surface to be exposed to plasma is set to 1 to 100 μm. By providing such composition, the distribution of the film thickness of the material film to be formed on the base material tape 11 can be made uniform, the peeling and falling of depositions deposited on the deposition preventing tape 15 can be suppressed, and the deposition of dust or the like on the surface of the base material tape 11 can be prevented. In this way, continuous film formation for a long time is made possible, and the productivity can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a CVD apparatus,
More specifically, a CV for forming a material on a surface of a substrate by a chemical vapor deposition method while running the substrate in a strip shape.
D apparatus.

[0002]

2. Description of the Related Art Conventionally, as a means for forming a material film on the surface of a long base material, there is a take-up type CVD apparatus using a plasma CVD method. In this apparatus, as shown in FIGS. 5 to 7, a film 2 serving as a base material is suspended from a cooling roll 1, and a plasma source 3 is disposed below the cooling roll 1.
The film is formed continuously. Normal plasma C
In the VD apparatus, the plasma source 3 has a plasma generation opening larger than the width of the film 2 in order to make the film thickness uniform. Further, from the viewpoint of the running property of the film 2, the width of the film needs to be smaller than the width of the cooling roll 1. Therefore, in order to prevent the material from adhering to the surface of the cooling roll 1 exposed from the widthwise edge portion of the film 2 to the outside, the fixed mask 4 covers from the edge of the cooling roll 1 to the edge portion of the film 2. I have.

[0003]

However, when a film is formed by a CVD apparatus having such a structure, the amount of material adhering to the surface of the fixed mask 4 increases, and the adhering matter grows rapidly to form a film. There are problems such as hindrance and dust generation due to the fall of the attached matter. Therefore, frequent maintenance of the fixed mask 4 is inevitable, and the processing length for continuously forming a film is limited. In the maintenance of the fixed mask 4, it is necessary to break the vacuum in the apparatus, release the chamber, remove the deposit on the fixed mask 4, and bring the predetermined vacuum again. Therefore, the operation rate of the device,
There is a problem that productivity is reduced. In addition, the installation of the fixed mask 4 causes a problem that the gas flow slightly changes and the film thickness distribution becomes non-uniform.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and has been devised so as to effectively solve the problems. It is possible to form a film continuously for a long time, and to improve productivity. It is an object of the present invention to provide a CVD apparatus (evaporation apparatus) capable of making the film thickness distribution uniform.

[0005]

According to the first aspect of the present invention,
A CV in which a long strip-shaped substrate is run in a vacuum chamber, and a material film is continuously formed by chemical vapor deposition on a surface of the substrate.
In the D apparatus, a long anti-adhesive material composed of a composite material of a material and a polymer film that has been previously formed on the surface of the base material,
It is characterized in that it travels together with the base material so as to cover a portion where film formation is unnecessary.

[0006] The invention according to claim 2 is the invention according to claim 1.
The VD apparatus is characterized in that the surface of the surface of the adhesion-preventing material in contact with the plasma has a surface roughness of 1 to 100 nm.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, details of a CVD apparatus according to the present invention will be described based on embodiments shown in the drawings. FIG. 1 is a front view of the CVD apparatus of the present embodiment, FIG. 2 is a side view, and FIG.
Is a sectional view of a main part.

The CVD apparatus according to the present embodiment includes a cooling roll 12 for running a long strip-shaped base tape 11 as a base material in a vacuum chamber (not shown), and a plasma source disposed below the cooling roll 12. 14, and a long anti-adhesion tape 15 as an anti-adhesive material is covered by the cooling roll 1 so as to cover the unnecessary area of the base tape 11 and the exposed portion of the cooling roll 12
2 and run. In the figure, reference numeral 16 denotes a guide roll of the base tape 11, and reference numeral 17 denotes a guide roll of the protection tape 15. And the adhesion tape 15
Is one guide roll 17 from the mask supply roll 18.
And is wound around the mask winding roll 19 via the other guide roll 17. Although not shown, an inlet for introducing a CVD source gas and an exhaust outlet for discharging excess gas are provided in the vacuum chamber.

The width dimension of the cooling roll 12 is
The base tape 11 is set to be longer than the width dimension of No. 1 so that the base tape 11 runs in the center of the cooling roll 12 in the width direction. In addition, two anti-adhesion tapes 15 are prepared in parallel at a predetermined interval. As shown in FIG. 2, each of the adhesion-preventing tapes 15 covers both edges in the width direction, which are portions where the film formation of the base tape 11 is unnecessary, and is not covered with the base tape 11 of the cooling roll 12. It is set to cover the exposed part.

Particularly, in the present embodiment, the adhesion-preventing tape 15 is formed of a composite material of a material (metal) previously formed on the base tape 11 and a polymer film, and has a surface exposed to plasma. The roughness was set in the range of 1-100 nm.

In this embodiment, since both edges of the base tape 11 on the surface of the cooling roll 12 are suppressed by the adhesion tape 15, there is no gap between the base tape 11 and the adhesion tape 15. The film thickness distribution of the material film formed on the base tape 11 can be made uniform without slightly changing the flow of the source gas or the like. In addition, since the anti-adhesion tape 15 is a composite material of a material formed in advance on the base tape 11 and a polymer film, it is possible to prevent the adhered substance adhering to the anti-adhesion tape 15 from peeling off. Further, the roughness of the surface of the anti-adhesion tape 15 exposed to plasma is 1 to 100 nm.
By setting the range, the peeling and falling off of the attached matter can be further suppressed in addition to the action of the composite material.

[0012] Further, by running the adhesion-preventing tape 15, the staying time of the adhesion-preventing tape 15 in a place where the adhesion is severe is limited, and the attached matter does not grow significantly. The traveling speed of the adhesion tape 15 at this time includes the traveling speed of the base tape 11 in the CVD process, the amount of material adhered from the plasma source that determines the film thickness, the amount of adhered matter allowed by the adhesion tape 15, Set appropriately according to the configuration of the device.

With respect to the material and structure of the above-mentioned adhesion-preventing tape 15, when the running speed is relatively slow and the running speed can be made the same as that of the base tape 11, a metal tape can be used. If the difference occurs, the base tape 11 may be cut off. Therefore, it is necessary to use a polymer film (polymer tape) or a composite material of a polymer film and a metal from the viewpoint of running properties.

However, when a composite material of a polymer film and a metal is used, the film forming rate may be lower than in the case of using only the polymer film. The reason is not clear, but probably when using a polymer film for the adhesion tape,
Since the plasma concentrates on the metal thin film on the base film, the deposition rate increases, and when a composite material of a polymer film and a metal is used for the anti-adhesion tape, the plasma also spreads to the anti-adhesion tape side. It is considered that the film formation rate has dropped.

Therefore, the present inventor has disclosed in Japanese Patent Application No. 10-745.
No. 84 filed for the use of a polymer film. After that, the present inventors examined various films, and it was found that when a polymer film was used, the film formation rate was increased but the film thickness distribution was sometimes deteriorated. In order to improve this, it has been found that it is necessary to make the plasma uniform, and for that, it is necessary to use a composite of the same metal and polymer film as the base film.

However, if the anti-adhesion tape 15 is made of a composite material, the adhered substance is more likely to be peeled off and dropped than the polymer film alone. In particular, this effect was remarkable when the surface roughness of the adhesion-preventing tape 15 made of a composite material was smaller than 1 nm.
Further, when the surface roughness exceeds 100 nm, the adhesion-preventing tape 15 meanders during running while the peeling of the deposits is small, and it is difficult to realize good running properties. Therefore, the surface roughness of the anti-adhesion tape 15 exposed to the plasma is 1 to 100.
It is effective to set the range to nm.

Although the embodiment has been described above, the CVD apparatus of this embodiment can be applied to, for example, the manufacture of a magnetic recording medium (evaporated tape). From the demands of reliability such as durability, running performance, and weather resistance,
A DLC (diamond-like carbon) film is provided on the surface as a protective film.

Next, in the configuration of the present embodiment, the diameter of the cooling roll 12 is 600 mm, the width is 300 mm, the width of the base tape 11 is 250 mm, and the film width is 20 mm.
The following experiment was conducted using 0 mm, a plasma source width of 300 mm, a 13.56 MHz RF power source as a plasma source, and methane gas as a source gas.

(Experiment 1) The thickness of the base tape 11 was 5
A film was formed by depositing cobalt (Co) to a thickness of 0.2 μm on a PET film having a thickness of 0.2 μm while introducing oxygen gas, and the film thickness was approximately 1 at a running speed of 50 m / min.
The DLC film was formed under the condition of 0 nm. Under these conditions, a polymer film (10 μm thick PE) was used as the adhesion-preventing tape 15.
T) only, the same metal as that previously formed on the base tape 11 (cobalt vapor-deposited while introducing oxygen gas) and a polymer film (10 μm thick P
Film formation was performed using a composite material with ET), and the film thickness distribution in the width direction of the base tape 11 was determined by cross-sectional observation using an electron microscope. The measurement results are as shown in the graph of FIG. From these results, it can be seen that the film formation rate is increased by using only the polymer film, but the drop at the edge of the film is large and the film thickness distribution is poor. On the other hand, when the deposition tape 15 made of a composite material of the material (Co) and the polymer film previously formed on the base tape 11 is used, the film forming rate at the center is only the polymer film. Although it is inferior to the above, there is no drop at the edge of the film and the film thickness distribution is uniform. From these facts, by using the same metal as the material previously formed on the base tape 11 as a composite material of the polymer film and the adhesion-preventing tape 15, the film thickness distribution becomes uniform and the yield is improved. Can be confirmed.

(Experiment 2) Experiment 1
Using the composite material of the material metal previously formed on the base tape 11 and the polymer film used in the above, the surface roughness Ra of the surface in contact with the plasma was changed, and the state of the anti-adhesion tape 15 was observed. The feed speed of the anti-adhesion tape 15 is 5 m /
Minutes. The results are as shown in Table 1 below.

[0021]

[Table 1] As can be seen from the above results, the surface roughness Ra of the surface of the adhesion-preventing tape 15 exposed to the plasma was particularly preferably 1 nm to 100 nm. In addition, the adhered material is peeled off using the base tape 1
It was found that carbon dust adhered to No. 1 and reduced the yield, but could be improved by controlling the surface roughness of the adhesion-preventing tape 15.

[0022]

As is apparent from the above description, according to the first aspect of the present invention, the film thickness can be made uniform without a drop in the film thickness at both ends in the width direction of the base tape. For this reason, it is possible to improve the production yield when the material film is formed on the base tape.

According to the second aspect of the present invention, it is possible to prevent the adhered matter of the adhesion-preventing tape from peeling off during running, and thus prevent the adhered matter from being transferred to and adhered to the surface of the base tape. As a result, a material film can be satisfactorily formed on the base tape. For this reason, it is possible to form a film on the base tape continuously for a long time, and there is an effect of improving productivity.

[Brief description of the drawings]

FIG. 1 is a front view schematically showing an embodiment of a CVD apparatus according to the present invention.

FIG. 2 is a side view of the CVD apparatus of the embodiment.

FIG. 3 is a sectional view of a main part of the CVD apparatus of the embodiment.

FIG. 4 is a graph showing the results of Experiment 1.

FIG. 5 is a front view of a conventional CVD apparatus.

FIG. 6 is a side view of a conventional CVD apparatus.

FIG. 7 is a sectional view of a main part of a conventional CVD apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Base tape 12 Cooling roll 14 Plasma source 15 Anti-adhesion tape 16 Guide roll 17 Guide roll 18 Mask supply roll 19 Mask take-up roll

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4K029 AA11 AA25 BA06 BA34 BB03 CA01 HA03 HA04 JA10 KA03 4K030 BA28 BB14 CA07 CA17 DA05 GA01 GA14 HA04 KA26 KA46 KA49 5D112 AA22 FA09 FB24 5E049 AA04 HC03

Claims (2)

[Claims] 1. A long strip-shaped substrate is run in a vacuum chamber,
In a CVD apparatus for continuously forming a film by chemically vapor-depositing a material film on the surface of a base material, a composite material of a polymer film and a material previously formed on the surface of the base material is used. A CVD apparatus characterized in that a scale-preventive material is caused to travel together with the substrate so as to cover a portion where film formation is unnecessary. 2. The CVD apparatus according to claim 1, wherein a surface roughness of the surface of the adhesion-preventing material in contact with the plasma is 1 to 10
A CVD apparatus having a thickness of 0 nm.