JPH06216580A - Component packager - Google Patents

Abstract

PURPOSE:To provide a component mounter which an improve the processing cycle time of mounting and is excellent in reliability of testing lead bends of electronic components. CONSTITUTION:A camera 22, provided at stopping point C of a component- sucking nozzle between a component suction part 11 and a component mounting part 15, picks up leads projecting out of two nearly parallel sides of an electronic component and makes the electronic component rotate by 90 deg. at the next nozzle stopping point D; further, a camera 22 provided at the next nozzle stopping point E picks up leads projecting out of the two other parallel sides the electronic component, and a controller discriminates conditions of lead bend of the electronic component by entry of picked up image from both cameras 22. This enables test of conditions of lead bend of an electronic component without the rise/fall actions of a nozzle, thereby improving mounting tact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a mounting substrate.

[0002]

2. Description of the Related Art With the recent progress in electronics, lighter, thinner, shorter, and smaller products have been further advanced, and finer electronic components have been remarkable. As a result, the electronic component mounting apparatus is required to have high speed and high reliability and high accuracy at the same time. Especially for electronic components with leads such as QFP, it is necessary to check the bending condition of the leads and mount only good products. It is indispensable.

A conventional electronic component mounting apparatus will be described below with reference to FIGS. FIG. 4 shows a schematic configuration of the electronic component mounting apparatus. Reference numeral 1 is a rotary head as a moving device, and a plurality of nozzles 2 functioning as a component attaching / detaching device are attached rotatably around a vertical axis.
The electronic component 8 (see FIG. 6) is sucked and mounted by the nozzle 2. Reference numeral 3 denotes an XY table for fixing the mounted substrate on which the electronic component 8 is mounted and positioning the mounted substrate under the nozzle 2 at the mounting position. Reference numeral 4 denotes a component supply table, in which parts cassettes 5 as a plurality of component supply devices are arranged. By moving the parts supply table 4, a desired parts cassette 5 is positioned below the nozzle 2. A large number of electronic components (QFP and the like) 8 are mounted on the parts cassette 5 in a tape-like state. A controller 7 controls the entire electronic component mounting apparatus.

FIG. 5 shows the structure of the rotary head 1.
The rotary head 1 intermittently rotates by a predetermined angle, and the nozzles 2 are attached to 12 positions corresponding to the stop intervals, and the nozzles 2 stop at positions A to L in parallel. Perform processing.

Next, the processing will be described. Position A in FIG.
The electronic component 8 is sucked by the nozzle 2 in the (component suction unit 11). Next, the state of the electronic component 8 is image-recognized at the position B (component recognition unit 12) to detect the amount of deviation in the X, Y, and θ directions. Then, the component posture detection unit 13 at the position C checks the suction posture of the electronic component 8, and at the same time, in the case of a leaded electronic component 8 such as QFP, the bending of the lead 8a is checked. At the position F (θ rotation part 14), the nozzle 2 is rotated by θ about the vertical axis so that the electronic component 8 is aligned in the mounting direction.
The XY table 3 is rotated, the XY table 3 is positioned at the position G (component mounting portion 15), and the electronic component 8 is mounted by the nozzle 2.

Next, a method of detecting the attitude of the electronic component 8 will be described with reference to FIG. At the posture detection location, the electronic component (QFP) 8 sucked by the nozzle 2 is moved downward a, and the illumination units 16A and 16B and the cameras 17A and 17B are arranged around the lowered position. The illumination units 16A and 16B and the cameras 17A and 17B are arranged and fixed in a direction along the rotation direction b of the rotary head 1 and a direction orthogonal thereto. Electronic parts (QFP) 8
Images are input images 18A, 18B ((a) of FIG. 6,
(See (b)), from which electronic component 8
The quality of the suction posture and the quality of the bent lead state are checked. The input image 18B is an example of a defective product due to bending of the lead.

FIG. 7 shows a flow chart of the operation at the time of checking the quality of the bent lead state. Step # 1
1. Rotate the rotary head 1 at position 1, position C in FIG.
Positioning is performed on the (component attitude detection unit 13). Step # 1
2, the nozzle 2 is lowered, and the illumination unit 16A shown in FIG.
Positioning is performed between 16B and the cameras 17A and 17B.
Next, in steps # 13 and # 14, the cameras 17A and 17B are used.
The quality of the lead bending state of the electronic component 8 is checked based on the input image from. At this time, since the cameras 17A and 17B are fixed in the directions orthogonal to each other on the horizontal plane,
The left side, the right side, the front side, and the rear side of the same electronic component 8 are imaged separately.

[0008]

However, in the electronic component mounting apparatus having the above-mentioned conventional structure, the time for moving the nozzle 2 up and down is required in addition to the time for rotating the rotary head 1, so that the mounting tact cannot be improved. There was a problem. Further, when detecting the posture of a component, not only the rotation of the rotary head 1 but also the raising / lowering operation of the nozzle 2 is required. Therefore, a drive mechanism for raising / lowering must be provided to raise / lower the electronic component at the time of checking the lead bending. There is also a problem in that the position repeatability deteriorates and the reliability of the quality judgment decreases.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an electronic component mounting apparatus which can improve the mounting tact and have a high reliability in the lead bending inspection of electronic components.

[0010]

In order to solve the above problems, the electronic component mounting apparatus of the present invention is such that an electronic component having a substantially rectangular shape and having leads projecting to the four sides is detachable and the electronic component is predetermined. A plurality of component attaching / detaching devices that are rotatable about the axis of the device, and a moving device that moves the plurality of component attaching / detaching devices by a predetermined amount in a predetermined direction. , Each component attaching / detaching device is intermittently moved a plurality of times by a predetermined amount by the moving device, the electronic component is detached from the component attaching / detaching device at a predetermined component detaching position, and the detached electronic component is mounted. In an electronic component mounting apparatus to be mounted on a board, the image pickup unit is oriented in a direction along two substantially parallel sides of the electronic component at one stop position of the component attaching / detaching device between the component engaging position and the component releasing position. Protruding from these two sides An image pickup device for picking up an image of the lead is provided, and the other two parallel sides of the electronic component rotated by a predetermined angle by the component attaching / detaching device at another stop position of the component attaching / detaching device between the component engaging position and the component releasing position. An image pickup device for picking up an image of a lead projecting from the two sides is provided with its image pickup section oriented in the direction of, and means for inputting picked-up images from both of the image pickup devices to determine a lead bending state of an electronic component is provided. It is a thing.

[0011]

With the above structure, the bending of the lead of the electronic component can be checked without raising and lowering the component attaching / detaching device, so that the moving time of the component attaching / detaching device can be eliminated and the electronic component attaching tact time can be improved. . Further, since the lifting operation is not necessary and the driving mechanism for lifting is not required, the accuracy of repeating the position of the electronic component at the time of checking the lead bending does not decrease, and the reliability of the quality judgment does not decrease.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Note that the schematic configuration of the entire electronic component mounting apparatus shown in FIG. 4 is the same as the conventional one except for the rotary head and the vicinity thereof, and those having the same functions are denoted by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 1 and 2, when the nozzles 2 are stopped C and E, the illumination unit 21 and the camera 22 as an image pickup device are provided.
And 1 are arranged so that they do not interfere with the passage of the nozzle 2. The illumination unit 21 and the camera 22 are fixed so as to be oriented in a direction orthogonal to the rotation direction of the rotary head 1, and the mounting height is set to the same height as the electronic component 8 sucked by the nozzle 2. That is, the illumination unit 21 that becomes an obstacle in the rotary movement path of the rotary head 1.
Since there is no camera or camera 22, it is not necessary to move the nozzle 2 up and down while avoiding the passage of the nozzle 2 and the electronic component 8. Also,
At the position D, the θ direction (posture) of the electronic component 8 is rotated by 90 ° by rotating the nozzle 2.

Next, referring to FIG. 3, a control operation when the controller 7 of the electronic component mounting apparatus checks the quality of the lead bending state will be described. First, step #
1, the rotary head 1 is rotated to position C
Positioning is performed on the (component attitude detection unit 23). Then, the electronic component 8 attached to the tip of the nozzle 2 has already been captured by the camera 22.
Since it is located at the height of the
The lead bending is checked only on the left and right sides of (step # 2).

Next, in step # 3, the rotary head 1 is rotated to position it at the position D (θ rotation portion 24), the nozzle 2 is rotated θ, and the sucked electronic component 8 is moved to 90 °.
Rotate (steps # 3 and # 4). Next, in step # 5, the rotary head 1 is rotated and positioned at the position E (component attitude detecting unit 25). Then, in step # 6, as in step # 2, since the electronic component 8 is located at the height of the camera 22, the lead bend is ticked from the input image. At this time, since the component is rotated by 90 ° in step # 4, the sides to be checked are the upper side and the lower side of the electronic component 8 (the remaining two sides of the left side and the right side of the electronic component 8).

Thereafter, the images from both cameras 22 are input to the controller 7 to determine the bent state of the lead of the electronic component 8. As described above, the mounting tact can be improved because the nozzle 2 is not moved up and down while checking the lead bending on all four sides of the electronic component 8. Further, since there is no mechanism for moving the nozzle 2 up and down, the positioning accuracy of the parts at the time of lead bending check is improved, and the reliability of lead bending check is improved.

Although the rotary head 1 for moving the nozzle 2 by a predetermined angle is shown as the moving device in the above embodiment, the present invention can be applied to a system for linearly moving the nozzle 2 or the like by a predetermined distance. Further, any device capable of attaching / detaching the electronic component 3 such as a chuck type means instead of the suction means such as the nozzle 2 may be used.

[0018]

As described above, according to the present invention, an image is picked up at one stop position of the component attaching / detaching device between the component engaging position and the component releasing position in the direction along the two substantially parallel sides of the electronic component. An image pickup device is provided for picking up an image of the lead projecting from the two sides of which the parts are directed, and is rotated by a predetermined angle by the component attaching / detaching device to another stop position of the component attaching / detaching device between the component engaging position and the component releasing position. The electronic parts are provided with an image pickup device whose image pickup parts are oriented in the directions along the remaining two parallel sides of the electronic part and which pick up images of the leads protruding from these two sides, and the picked-up images from both the image pickup devices are input. By providing the means for determining the bent state of the lead, it is possible to eliminate the conventional lifting / lowering operation of the component attaching / detaching device, so that the moving time of the component attaching / detaching device can be eliminated and the electronic component Improved tact time Production is improved. In addition, it is possible to improve the reliability of the product because the accuracy of repeating the position of the electronic component at the time of checking the lead bending is not reduced.

[Brief description of drawings]

FIG. 1 is a schematic plan view near a rotary head of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a component attitude detection unit of the electronic component automatic mounting apparatus.

FIG. 3 is a flowchart for checking whether the lead bending state of the electronic component mounting apparatus is good or bad.

FIG. 4 is a perspective view showing a schematic configuration of an electronic component automatic mounting apparatus.

FIG. 5 is a schematic plan view in the vicinity of a rotary head of a conventional electronic component automatic mounting apparatus.

FIG. 6 is a perspective view of a component attitude detection unit of a conventional electronic component automatic mounting apparatus.

FIG. 7 is a flowchart for checking whether the lead bending state of the conventional electronic component mounting apparatus is good or bad.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 rotary head (moving device) 2 nozzle (parts attaching / detaching device) 7 controller 8 electronic parts 8a lead 11 parts adsorbing part (parts engaging position) 14, 24 θ rotating part 15 parts mounting position (parts releasing position) 21 lighting part 22 Camera (imaging device) 23, 25 Component posture detection unit 24 θ rotation unit A to L Stop position

Claims (1)

[Claims] 1. A plurality of component attaching / detaching devices capable of attaching / detaching an electronic component having a substantially rectangular shape and having leads projecting to the four sides and pivoting the electronic component about a predetermined axis, and the plurality of components. A moving device for moving the attaching / detaching device in a predetermined direction by a predetermined amount, and engaging electronic parts by the component attaching / detaching device at a predetermined component engaging position, and intermittently moving each component attaching / detaching device a plurality of times by the moving device. In the electronic component mounting device that moves a fixed amount at a predetermined component disengagement position to disengage the electronic component from the component dismounting device, and mounts the disengaged electronic component on the mounting substrate, An image pickup device for picking up an image of a lead projecting from the two sides of the electronic component is provided at one stop position of the component attaching / detaching device between the component attaching position and the electronic component. Between parts removal position At other stop points of the parts attaching and detaching device of
An image pickup device is provided for picking up an image of a lead projecting from the two sides of which the image pickup section is directed in a direction along the remaining two parallel sides of the electronic component rotated by the component attaching / detaching device by a predetermined angle. An electronic component mounting apparatus provided with means for inputting a picked-up image and determining a lead bending state of an electronic component.