JPH0621273U - Hybrid integrated circuit device - Google Patents

Abstract

(57) [Abstract] [Purpose] Increase the mounting area of parts on the electric circuit wiring board,
The object is to enable mounting on a mother board even with a narrow pitch of 1.8 mm or less. [Constitution] In a hybrid integrated circuit device in which components and the like are mounted on an electric circuit wiring board, a state where the components are mounted only on one side of the wiring board at both ends of the substrate and the mounting component surface of the substrate is on the upper side. In such a manner that the clip-shaped leads extend vertically upward, a board on which mounting components are mounted on both surfaces separately from the mounting board is mounted, and the upper ends of the leads of the clip leads are passed through both ends of the board and solder or the like. A hole that can be electrically connected is provided, and when both boards are combined, the mounting component surface has three layers, and the upper board has a structure that does not fall below due to the thick portion of the clip lead. ,
A hybrid integrated circuit device in which a connection of a hybrid integrated circuit formed by stacking the two substrates to another mother substrate is surface-mounted by using a clip lead portion attached to the lower substrate as an electrode portion.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to the structure of a hybrid integrated circuit.

[0002]

[Prior art]

 FIG. 5 is a cross-sectional view showing a conventional embodiment, in which a component 2 is mounted on one side of an electric circuit wiring board 1, superposed, and attached by a clip lead 3. The attachment to the mother board is performed by inserting the terminal portion of the clip lead 3 into the hole of the mother board and attaching it to the land.

[0003]

[Problems to be solved by the device]

 In the prior art, the area of wiring is doubled by stacking two electric circuit wiring boards, but the area where components can be mounted does not increase. Further, since the mounting on the mother substrate is performed by making holes, there is a drawback that the mounting becomes difficult when the pitch is narrower than 1.8 mm. In order to solve these problems, the present invention aims to increase the mounting area of parts so that even a narrow pitch of 1.8 mm or less can be mounted on a mother board.

[0004]

[Means for Solving the Problems]

 In a hybrid integrated circuit device, the first board is mounted so that the clip-shaped leads extend vertically upward on the two opposite sides of the board on which the components are mounted on only one side of the wiring board. With a structure that combines with a second board on which mounting components are mounted, the second board has a hole through which the upper part of the lead of the clip lead of the first board can pass and which can be electrically connected by soldering, Combine both boards. The connection of the hybrid integrated circuit formed by stacking the two substrates to another mother substrate is used by using the clip lead portion attached to the lower substrate as an electrode portion.

[0005]

As described above, the present invention has a structure in which the mounting component surface has three layers, and the upper board is structured so as not to fall further down due to the thick portion of the clip lead, and the two boards are stacked. The connection of the combined integrated circuit to another mother substrate is surface-mounted by using the clip lead portion attached to the lower substrate as an electrode portion.

[0006]

【Example】

 According to the present invention, by utilizing the skirt portion of the clip lead in this way, two stacked mounting boards are provided with a space to enable three-layer mounting, and the electrode portion of the clip is the electrode for surface mounting. By making it possible to perform surface mounting, it is possible to mount on a mother board at a pitch of 1.8 mm or less. At this time, the connection between the upper substrate and the clip lead, which are superposed on each other, is performed by connecting the upper surface and the lower surface alternately. An embodiment of the present invention will be described below. FIG. 1 shows a first electrical circuit wiring board, that is, a component 1 mounted on a substrate 1 and ordinary DIL-type clip leads 3 attached in an upside-down direction. Eutectic solder is used for connection. Next, as shown in FIG. 2, the clip lead 3 is inserted into the double-sided mounting substrate 5 provided with the holes and the connection lands 4 so that the clip lead 3 of FIG. Lower the skirt 6 and attach the solder 8. Solder connection between the double-sided mounting substrate 5 and the clip lead 3 is performed only on the upper surface and only on the lower surface as shown in FIG. FIG. 4 is a cross-sectional view showing an example in which the hybrid integrated circuit of the embodiment of the present invention configured as shown in FIGS. 1 to 3 is surface-mounted on the mother board 7. Unnecessary parts on the upper surface of the clip lead may be cut.

[0007]

[Effect of device]

 According to the present invention, it is possible to realize a hybrid integrated circuit in which a large mounting area of components can be taken and which can be easily surface-mounted with a narrow pitch.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a perspective view of an embodiment of the present invention.

FIG. 3 is a sectional view of an embodiment of the present invention.

FIG. 4 is a sectional view of an embodiment of the present invention.

FIG. 5 is a sectional view of a conventional example.

[Explanation of symbols]

 1 Electric Circuit Wiring Board 2 Parts 3 Clip Lead 4 Mounting Hole and Land 5 Double-sided Mounting Wiring Board 6 Clip Lead Skirt 7 Mother Board 8 Solder

Claims (1)

[Scope of utility model registration request] 1. A hybrid integrated circuit device comprising an electronic circuit wiring board on which electronic components, electrical components, mechanical components, etc. are mounted, the substrate being mounted on both sides of the substrate on which the components are mounted on only one side of the wiring board. With the mounting component surface facing upward, the mounting leads are mounted on both sides separately from the mounting substrate so that the clip-shaped leads extend vertically upward, and the above-mentioned clip lead By providing a hole through which the upper part of the lead can pass and which can be electrically connected by soldering, etc., and combining the both boards, the mounting component surface becomes three layers, and the upper board has a thicker portion of the clip lead. The structure is such that it does not fall down, and the connection of the hybrid integrated circuit formed by stacking the two substrates to another mother substrate is performed by using the clip lead portion attached to the lower substrate as the electrode portion. , table A hybrid integrated circuit device characterized by surface mounting.