JPH0621254U - Semiconductor component mounting structure - Google Patents

Abstract

(57) [Summary] [Purpose] To achieve sufficient heat dissipation and reduce size. [Structure] A heat dissipation plate 30 is arranged on the lower surface side of the printed board 26, and an opening 27 is formed in the printed board 26. Inside the opening 27, a heat dissipation auxiliary material 28 is interposed between the semiconductor component 21 and the heat dissipation plate 30. Insert the screw 24 into the hole 23 of the semiconductor component 21 and the hole 29 of the heat dissipation auxiliary member 28,
The screw 24 is screwed into the screw hole 31 of the heat sink 30. As a result, the semiconductor component 21 allows the heat dissipation plate 3 to pass through the heat dissipation auxiliary material 28.
It is attached to 0.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor component mounting structure for mounting a semiconductor component, which is a heat generating element such as a power element used in a power source section or the like, to a radiator plate.

[0002]

[Prior art]

 For example, as a semiconductor component mounting structure for mounting a semiconductor component, which is a heat generating element such as a power element used in a power source section or the like, to a heat dissipation plate, there is a structure described in, for example, Japanese Utility Model Publication No. 3-77453. FIGS. 4 and 5 show the conventional semiconductor component mounting structure disclosed in Japanese Utility Model Laid-Open No. 3-77453, in which heat generated from a semiconductor component 2 of a type in which a planar electrode 4 is exposed on a side surface is generated from a conductive material. The heat is dissipated to the heat dissipation plate electrode 1 via the mounting plate 10.

That is, as shown in FIGS. 4 and 5, the semiconductor component 2 is formed with a hole 8 into which the screw 6 is inserted, and the surface of the rear surface of the semiconductor component is excluded except for the peripheral portion of the hole 8. The electrode 4 is formed. A resin mold part 3 is formed on the entire surface of the semiconductor component 2 excluding the planar electrodes 4. Further, an external connection terminal 5 is vertically provided from the lower surface of the semiconductor component 2. Further, the metal mounting plate 10 interposed between the planar electrode 4 of the semiconductor component 2 and the heat dissipation plate electrode 1 is formed smaller than the planar electrode 4, and the planar electrode 4 is a resin molded portion. Even if the mounting plate 10 is formed in a concave shape, the mounting plate 10 is surely brought into contact with the planar electrode 4.

When mounting the semiconductor component 2, a mounting plate 10 made of a conductive material is brought into contact with the heat dissipation plate electrode 1, and a screw 6 is attached in a state where the planar electrode 4 of the semiconductor component 2 is brought into contact with the mounting plate 10. Is inserted into the hole 8 of the semiconductor component 2 and the hole 11 of the mounting plate 10 via the washer 7, and is screwed into the screw hole 9 of the heat dissipation plate electrode 1 to integrally fix the three members. As described above, in the conventional example, the conductive mounting plate 10 smaller than the planar electrode 4 is interposed between the radiator plate electrode 1 and the planar electrode 4 of the semiconductor component 2. Even if the electrode 4 is formed in a concave shape from the resin mold portion 3, the planar electrode 4 and the heat radiating plate electrode 1 are securely connected by the mounting plate 10 so that a stable conductive state can be obtained. .

[0005]

[Problems to be solved by the device]

 However, such a conventional example has the following problems. That is, in the conventional example described in Japanese Utility Model Laid-Open No. 3-77453, the semiconductor component 2 is fixed to the radiator plate electrode 1 via the mounting plate 10, and the heat generated from the semiconductor component 2 is released from the heat sink plate electrode. It radiates heat to 1. Then, the terminal 5 of the semiconductor component 2 is connected to another electronic circuit. In this case, the terminal 5 is connected to the lead wire or directly connected to the pattern of the printed circuit board by soldering or the like. It will be. However, when the heat sink plate electrode 1 to which the semiconductor component 2 is fixed and the printed circuit board that is connected to the terminal 5 of the semiconductor component 2 via the lead wire are separately arranged, the size of the printed circuit board may be different. In addition, there is a problem in that the heat dissipation plate electrode 1 is additionally required and the size becomes large.

FIG. 6 shows another conventional example. In this conventional example, the heat dissipation plate 12 to which the semiconductor component 2 is fixed is arranged on the printed circuit board 13. That is, the heat dissipation plate 12 is placed on the printed circuit board 13, the semiconductor component 2 is placed on the heat dissipation plate 12, and the semiconductor component 2, the heat dissipation plate 12 and the printed circuit board 13 are clamped and fixed by the screw 6 and the nut. . The method of fixing the semiconductor component 2 can be applied to both the case where the back surface has a planar electrode as in the prior art example and the case where the entire surface is molded resin. In such a conventional example, since the heat dissipation plate 12 is mounted on the printed circuit board 13, the size is increased by the size of the heat dissipation plate 12. Moreover, since the heat dissipation plate 12 is mounted on the printed circuit board 12, the heat dissipation area is reduced. However, there was a problem that there was a limit and heat could not be dissipated sufficiently.

The present invention has been made in view of the above points, and provides a semiconductor component mounting structure capable of sufficiently radiating heat and aiming at downsizing.

[0008]

[Means for Solving the Problems]

 The present invention is a semiconductor component mounting structure in which a semiconductor component having lead terminals connected to a printed circuit board is fixed to a heat dissipation plate, and heat generated from the semiconductor component is dissipated to the heat dissipation plate. A heat dissipation plate is arranged on the lower surface side, an opening is formed at a position corresponding to a semiconductor component of the printed circuit board, a metal heat dissipation auxiliary member is arranged in the opening, and the heat dissipation auxiliary member is the semiconductor It is inserted between the parts and the heat sink.

[0009]

[Action]

 According to the present invention, by disposing the heat dissipation plate on the lower surface side of the printed circuit board through the heat dissipation auxiliary material, the heat dissipation plate can be made sufficiently large to sufficiently dissipate the heat from the semiconductor components. Only the plate and plus α increase, and unlike the conventional case where the area of the heat sink becomes large, the entire size can be made smaller (thinner). Further, since the lower surface side of the printed substrate is an idle space, it is possible to effectively utilize the wasted space and achieve miniaturization.

[0010]

【Example】

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a semiconductor device of the present invention mounted, FIG. 2 is a cutaway perspective view, and FIG. 3 is an exploded perspective view. 1 to 3, a semiconductor component 21 such as a power element used in a power source or the like is formed in a rectangular shape, and the entire surface is resin-molded. Further, three lead terminals 22 for external connection are provided so as to project from one end surface of the semiconductor component 21. A hole 23 into which a fixing screw 24 is inserted is formed in the end of the semiconductor component 21 opposite to the lead terminal 22.

The lead terminal 22 of the semiconductor component 21 is mounted on the circuit pattern on the upper surface of the printed circuit board 26 by soldering or the like, and is bent at about 90 ° in the middle of the lead terminal 22. The semiconductor component 21 is placed on the printed circuit board 26 so as to lie down. The printed board 26 is provided with an opening 27 for disposing a heat dissipation auxiliary material 28 described later.

On the lower surface side of the printed circuit board 26, there is disposed a heat dissipation plate 30 made of, for example, a metal such as an aluminum plate. The heat dissipation plate 30 has a screw hole into which the screw 24 is screwed. 31 is threaded. The printed circuit board 26 is provided with the opening 27 as described above at a position corresponding to the semiconductor component 21 when the semiconductor component 21 is tilted down. In the opening 27, for example, an aluminum plate or the like is provided. The heat dissipation auxiliary material 28 formed of the metal is arranged. The heat dissipation auxiliary member 28 is interposed between the semiconductor component 21 and the heat dissipation plate 30 and serves to dissipate (transfer) heat generated by the semiconductor component 21 to the heat dissipation plate 30. In addition, a hole 29 through which the screw 24 is inserted is bored in the heat dissipation auxiliary member 28. The size of the heat dissipation auxiliary member 28 has a safety standard so that the semiconductor component 21 can sufficiently dissipate heat to the heat dissipation plate 30 side.

Next, a method of attaching the semiconductor component 21 to the heat sink 30 will be described. As shown in FIGS. 1 to 3, the screw 24 through the washer 25 is inserted into the hole 23 of the semiconductor component 21 and the hole 29 of the heat dissipation auxiliary member 28, and the screw 24 is screwed into the screw hole 31 of the heat dissipation plate 30. To wear. As a result, the semiconductor component 21 is attached and fixed to the heat dissipation plate 30 via the heat dissipation auxiliary material 28, as shown in FIG. At this time, the lead terminals 22 of the semiconductor component 21 are fixed to the printed board 26. Here, the printed circuit board 26 and the heat dissipation plate 30 may be fixed with screws or the like. Alternatively, a metal case bottom plate may be used as the heat dissipation plate 30, and the semiconductor component 21 may be directly attached to the case bottom plate via the heat dissipation auxiliary material 28.

Although the semiconductor component 21 is used in the power source section as described above, the present invention can be applied to a single semiconductor element of the power source section, an IC such as a regulator, or the If it is required, it can be applied not only to the power supply unit but also to any electronic circuit or the like. Further, in the above-described embodiment, the case where the number of semiconductor components 21 is one has been described, but when a plurality of semiconductor components 21 are installed in parallel on one heat dissipation plate 30, the opening 27 of the print substrate 26 is used. The heat dissipation auxiliary member 28 may be appropriately lengthened in the lateral direction, and the heat dissipation auxiliary member 28 may be interposed between the semiconductor component 21 and the heat dissipation plate 30 as one component.

[0015]

[Effect of device]

 According to the present invention, a semiconductor component having lead terminals connected to a printed circuit board is fixed to a heat radiating plate, and heat generated from the semiconductor component is radiated to the heat radiating plate. A heat radiating plate is provided on the lower surface side of the printed circuit board, an opening is formed at a position corresponding to a semiconductor component of the printed circuit board, and a metal heat radiating aid is placed in the opening, and the heat radiating aid is It is interposed between the semiconductor component and the heat sink, and by disposing the heat sink on the lower surface side of the printed circuit board via a heat dissipation auxiliary material, the heat sink can be made sufficiently large and the semiconductor component The heat can be dissipated sufficiently, and the thickness of the heat sink is increased by plus α, and the area of the heat sink is increased. You can Further, since the lower surface side of the printed circuit board is an idle space, it is possible to effectively utilize the wasted space and achieve miniaturization.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which a semiconductor component according to an embodiment of the present invention is attached to a heat dissipation plate via a heat dissipation auxiliary material.

FIG. 2 is a cutaway perspective view of an embodiment of the present invention.

FIG. 3 is an exploded perspective view of an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a state in which a semiconductor component of a conventional example is attached to a heat dissipation plate.

FIG. 5 is an exploded perspective view of a conventional example.

FIG. 6 is a perspective view of a main part when another conventional heat dissipation plate is arranged on a printed circuit board.

[Explanation of symbols]

 21 semiconductor component 22 lead terminal 26 printed circuit board 27 opening 28 heat dissipation auxiliary material 30 heat dissipation plate

Claims (1)

[Scope of utility model registration request] 1. A semiconductor component mounting structure in which a semiconductor component to which lead terminals are connected on a printed circuit board is fixed to a heat radiating plate, and heat generated from the semiconductor component is radiated to the heat radiating plate. A heat dissipation plate is disposed on the lower surface side, an opening is formed at a position corresponding to a semiconductor component of the printed circuit board, a metal heat dissipation auxiliary member is disposed in the opening, and the heat dissipation auxiliary member is the semiconductor device. A semiconductor component mounting structure characterized by being interposed between a component and a heat sink.